JP4622595B2 - Exposure apparatus and device manufacturing method - Google Patents

Exposure apparatus and device manufacturing method Download PDF

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JP4622595B2
JP4622595B2 JP2005069018A JP2005069018A JP4622595B2 JP 4622595 B2 JP4622595 B2 JP 4622595B2 JP 2005069018 A JP2005069018 A JP 2005069018A JP 2005069018 A JP2005069018 A JP 2005069018A JP 4622595 B2 JP4622595 B2 JP 4622595B2
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substrate
liquid lq
liquid
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exposure apparatus
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JP2006253456A (en
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勝志 中野
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株式会社ニコン
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  The present invention relates to an exposure apparatus that exposes a substrate through a liquid and a device manufacturing method.

In a photolithography process that is one of the manufacturing processes of microdevices such as semiconductor devices and liquid crystal display devices, an exposure apparatus that projects and exposes a pattern formed on a mask onto a photosensitive substrate is used. The exposure apparatus includes a mask stage that can move while holding a mask, and a substrate stage that can move while holding a substrate. The mask optical system projects a mask pattern while sequentially moving the mask stage and the substrate stage. Through the projection exposure. In the manufacture of microdevices, miniaturization of patterns formed on a substrate is required in order to increase the density of devices. In order to meet this demand, it is desired to further increase the resolution of the exposure apparatus. As one of means for realizing the high resolution, the optical path space of the exposure light between the projection optical system and the substrate is filled with liquid as disclosed in Patent Document 1 below, and the projection optical system An immersion exposure apparatus has been devised that exposes a substrate through a liquid.
International Publication No. 99/49504 Pamphlet

  By the way, in the exposure apparatus, it is required to increase the moving speed of the substrate (substrate stage) for the purpose of improving device productivity. However, when the substrate (substrate stage) is moved at high speed, it becomes difficult to satisfactorily hold the liquid in the optical path space, and for example, the liquid filled in the optical path space may leak. If the liquid leaks, there will be inconveniences such as corrosion or failure of peripheral members / equipment. In addition, when the leaked liquid becomes droplets and remains on the substrate, the remaining liquid (droplet) is vaporized, which may cause inconvenience that a liquid adhesion mark (so-called watermark) is formed on the substrate. There is also sex. In addition, exposure including the pattern overlay accuracy etc. on the substrate due to thermal deformation of the substrate and the substrate stage due to the heat of vaporization of the leaked liquid and the environment (humidity, cleanliness, etc.) where the exposure apparatus is placed fluctuates. There is a risk that accuracy may be deteriorated and various measurement accuracy using an interferometer or the like may be deteriorated. Further, when the substrate is wetted by the leaked liquid, the liquid may also adhere to the transport system that holds the wet substrate, and damage may be increased.

  The present invention has been made in view of such circumstances, and an exposure apparatus capable of preventing or suppressing leakage of a liquid filled in an optical path space of exposure light, and a device manufacturing method using the exposure apparatus The purpose is to provide.

  In order to solve the above-described problems, the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, the liquid (LQ) is supplied in the exposure apparatus that exposes the substrate (P) by irradiating the substrate (P) with the exposure light (EL) through the liquid (LQ). A supply port (12), a recovery port (22) for recovering the liquid (LQ) provided outside the supply port (12) with respect to the optical path space (K1), and a recovery port with respect to the optical path space (K1) An exposure apparatus (EX) provided outside the (22) and provided with an ejection port (32) for ejecting the liquid (LQ) is provided.

  According to the first aspect of the present invention, it is possible to prevent leakage of the liquid filled in the optical path space of the exposure light by ejecting the liquid from the ejection port.

  According to the second aspect of the present invention, a device manufacturing method using the exposure apparatus (EX) of the above aspect is provided.

  According to the second aspect of the present invention, a device can be manufactured using an exposure apparatus in which leakage of the liquid filled in the optical path space is prevented.

  According to the present invention, the leakage of the liquid filled in the optical path space of the exposure light can be prevented or suppressed, and the exposure accuracy and measurement accuracy can be maintained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

<First Embodiment>
FIG. 1 is a schematic block diagram that shows an exposure apparatus according to the first embodiment. In FIG. 1, an exposure apparatus EX exposes a mask stage MST that is movable while holding a mask M, a substrate stage PST that is movable while holding a substrate P, and a mask M that is held by the mask stage MST. The operation of the illumination optical system IL that illuminates with EL, the projection optical system PL that projects and exposes the pattern image of the mask M illuminated with the exposure light EL onto the substrate P held on the substrate stage PST, and the overall operation of the exposure apparatus EX. And a control device CONT for overall control. The control device CONT is connected to a storage device MRY that stores various types of information related to exposure processing, and is connected to an input device INP that can input various types of information related to exposure processing to the control device CONT.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and substantially widen the depth of focus. A liquid immersion mechanism 1 is provided for filling the optical path space K1 of the exposure light EL on the image plane side of the PL with the liquid LQ. The liquid immersion mechanism 1 is provided in the vicinity of the optical path space K1, and includes a nozzle member 70 having a supply port 12 for supplying the liquid LQ to the optical path space K1 and a recovery port 22 for recovering the liquid LQ, and the first supply pipe 13. The first liquid supply device 11 that supplies the liquid LQ to the supply port 12 and the liquid recovery device 21 that recovers the liquid LQ via the recovery port 22 and the recovery pipe 23 are provided. As will be described in detail later, a flow path (supply flow path) 14 that connects the supply port 12 and the first supply pipe 13 is provided inside the nozzle member 70, and the recovery port 22 and the recovery pipe 23 are provided. A flow path (recovery flow path) 24 is provided. The nozzle member 70 is formed in an annular shape so as to surround the first optical element LS1 closest to the image plane of the projection optical system PL among the plurality of optical elements constituting the projection optical system PL.

  Further, the exposure apparatus EX of the present embodiment locally places the immersion area LR of the liquid LQ that is larger than the projection area AR and smaller than the substrate P on a part of the substrate P including the projection area AR of the projection optical system PL. A local liquid immersion method is used. The exposure apparatus EX is disposed on the image plane side of the projection optical system PL and the first optical element LS1 closest to the image plane of the projection optical system PL while at least transferring the pattern image of the mask M to the substrate P. The optical path space K1 of the exposure light EL between the substrate P is filled with the liquid LQ, and the exposure light EL that has passed through the mask M is irradiated onto the substrate P through the projection optical system PL and the liquid LQ filled in the optical path space K1. Thus, the pattern image of the mask M is projected and exposed onto the substrate P. The control device CONT supplies a predetermined amount of the liquid LQ using the first liquid supply device 11 of the liquid immersion mechanism 1 and recovers the predetermined amount of the liquid LQ using the liquid recovery device 21, thereby liquid in the optical path space K1. Filled with LQ, a liquid LQ immersion region LR is locally formed on the substrate P.

  In the following description, the case where the optical path space K1 is filled with the liquid LQ with the projection optical system PL and the substrate P facing each other is mainly described. However, an object other than the substrate P ( The same applies to the case where the optical path space K1 is filled with the liquid LQ with the upper surface 94) of the substrate stage PST facing the projection optical system PL, for example.

  In addition, the exposure apparatus EX includes a liquid ejecting mechanism 3 that ejects the liquid LQ. The liquid ejecting mechanism 3 includes an ejection port 32 that ejects the liquid LQ and a second liquid supply device 31 that supplies the liquid LQ to the ejection port 32 via the second supply pipe 33. Yes. As will be described in detail later, a flow path (supply flow path) 34 that connects the injection port 32 and the second supply pipe 33 is provided inside the nozzle member 70. The recovery port 22 is provided outside the supply port 12 with respect to the optical path space K1, and the ejection port 32 is provided further outside the recovery port 22 with respect to the optical path space K1.

  In the present embodiment, the exposure apparatus EX uses a scanning exposure apparatus (so-called scanning stepper) that exposes a pattern formed on the mask M onto the substrate P while moving the mask M and the substrate P synchronously in the scanning direction. An example will be described. In the following description, the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction (non-scanning direction), the X-axis, and A direction perpendicular to the Y-axis direction and coincident with the optical axis AX of the projection optical system PL is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a substrate in which a photosensitive material (photoresist) is coated on a base material such as a semiconductor wafer, and the “mask” includes a reticle on which a device pattern to be projected in a reduced scale is formed on the substrate. .

  The exposure apparatus EX includes a base BP provided on the floor surface and a main column 9 provided on the base BP. The main column 9 is formed with an upper step 7 and a lower step 8 that protrude inward. The illumination optical system IL illuminates the mask M held on the mask stage MST with the exposure light EL, and is supported by a support frame 10 fixed to the upper part of the main column 9.

The illumination optical system IL includes an exposure light source, an optical integrator that equalizes the illuminance of the light beam emitted from the exposure light source, a condenser lens that collects the exposure light EL from the optical integrator, a relay lens system, and the exposure light EL. A field stop for setting an illumination area on the mask M is provided. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. The exposure light EL emitted from the illumination optical system IL is, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp. Alternatively, vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F 2 laser light (wavelength 157 nm) is used. In this embodiment, ArF excimer laser light is used.

  In the present embodiment, the first liquid supply device 11 and the second liquid supply device 31 supply the same liquid LQ. Pure water is used as the liquid LQ. Pure water can transmit not only ArF excimer laser light but also far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) emitted from mercury lamps and KrF excimer laser light (wavelength 248 nm). It is.

  Mask stage MST is movable while holding mask M. Mask stage MST holds mask M by vacuum suction (or electrostatic suction). A plurality of gas bearings (air bearings) 85 which are non-contact bearings are provided on the lower surface of the mask stage MST. Mask stage MST is supported in a non-contact manner on the upper surface (guide surface) of mask stage surface plate 2 by air bearing 85. In the central part of the mask stage MST and the mask stage surface plate 2, openings for allowing the pattern image of the mask M to pass are formed. The mask stage surface plate 2 is supported on the upper step 7 of the main column 9 via a vibration isolator 86. That is, the mask stage MST is supported by the upper step 7 of the main column 9 via the vibration isolator 86 and the mask stage surface plate 2. The anti-vibration device 86 vibrationally separates the mask stage surface plate 2 and the main column 9 so that the vibration of the main column 9 is not transmitted to the mask stage surface plate 2 that supports the mask stage MST.

  The mask stage MST is an optical axis AX of the projection optical system PL on the mask stage surface plate 2 in a state where the mask M is held by driving of a mask stage driving device MSTD including a linear motor controlled by the control device CONT. Can move two-dimensionally in a plane perpendicular to the plane, that is, in the XY plane, and can rotate in the θZ direction slightly. A movable mirror 81 is provided on the mask stage MST. A laser interferometer 82 is provided at a position facing the moving mirror 81. The position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured in real time by the laser interferometer 82. The measurement result of the laser interferometer 82 is output to the control device CONT. The control device CONT drives the mask stage driving device MSTD based on the measurement result of the laser interferometer 82, and controls the position of the mask M held on the mask stage MST.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and is composed of a plurality of optical elements, which are held by a lens barrel PK. . In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Of the plurality of optical elements constituting the projection optical system PL, the first optical element LS1 closest to the image plane of the projection optical system PL is exposed from the lens barrel PK.

  A flange PF is provided on the outer periphery of the lens barrel PK that holds the projection optical system PL, and the projection optical system PL is supported by the lens barrel surface plate 5 via the flange PF. The lens barrel surface plate 5 is supported on the lower step portion 8 of the main column 9 via a vibration isolator 87. That is, the projection optical system PL is supported by the lower step portion 8 of the main column 9 via the vibration isolator 87 and the lens barrel surface plate 5. Further, the lens barrel base plate 5 and the main column 9 are vibrationally separated by the vibration isolator 87 so that the vibration of the main column 9 is not transmitted to the lens barrel base plate 5 that supports the projection optical system PL. .

  The substrate stage PST has a substrate holder PH that holds the substrate P, and is movable while supporting the substrate holder PH. The substrate holder PH holds the substrate P by, for example, vacuum suction. A recess 93 is provided on the substrate stage PST, and a substrate holder PH for holding the substrate P is disposed in the recess 93. The upper surface 94 of the substrate stage PST other than the recesses 93 is a flat surface that is substantially the same height (level) as the surface of the substrate P held by the substrate holder PH. There may be a slight step between the surface of the substrate P held by the substrate holder PH and the upper surface 94 of the substrate stage PST.

  A plurality of gas bearings (air bearings) 88 which are non-contact bearings are provided on the lower surface of the substrate stage PST. Substrate stage PST is supported in a noncontact manner on the upper surface (guide surface) of substrate stage surface plate 6 by air bearing 88. The substrate stage surface plate 6 is supported on the base BP via a vibration isolator 89. Further, the vibration isolator 89 prevents the vibration of the base BP (floor surface) and the main column 9 from being transmitted to the substrate stage surface plate 6 that supports the substrate stage PST. (Floor surface) is separated vibrationally.

  The substrate stage PST is in the XY plane on the substrate stage surface plate 6 with the substrate P held via the substrate holder PH by the drive of the substrate stage driving device PSTD including a linear motor controlled by the control device CONT. Can move two-dimensionally and can rotate in the θZ direction. Furthermore, the substrate stage PST is also movable in the Z-axis direction, the θX direction, and the θY direction. Therefore, the surface of the substrate P held on the substrate stage PST is movable in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. A movable mirror 83 is provided on the side surface of the substrate stage PST. A laser interferometer 84 is provided at a position facing the moving mirror 83. The two-dimensional position and rotation angle of the substrate P on the substrate stage PST are measured in real time by the laser interferometer 84. The exposure apparatus EX also includes an oblique incidence type focus / leveling detection system that detects surface position information of the surface of the substrate P held by the substrate stage PST. The measurement result of the laser interferometer 84 is output to the control device CONT. The detection result of the focus / leveling detection system is also output to the control device CONT. The control device CONT drives the substrate stage drive device PSTD based on the detection result of the focus / leveling detection system, and controls the focus position (Z position) and the tilt angle (θX, θY) of the substrate P, thereby controlling the substrate P And the position of the substrate P in the X-axis direction, the Y-axis direction, and the θZ direction based on the measurement result of the laser interferometer 84. Take control.

  In the present embodiment, the focus / leveling detection system for detecting the surface position information of the surface of the substrate P held by the substrate stage PST is outside the ejection port 32 with respect to the optical path space K1. Surface position information is detected. Specifically, the focus / leveling detection system detects surface position information of the substrate P on the surface of the substrate P outside the ejection port 32 with respect to the optical path space K1 without using the liquid LQ in the optical path space K1. Therefore, the detection light is irradiated. FIG. 1 shows the irradiation position of the detection light La by the focus / leveling detection system, and the detection light La is irradiated on the surface of each substrate P on both sides of the optical path space K1 in the scanning direction (X-axis direction). It has become so. Of course, as disclosed in Japanese Patent Laid-Open No. 2000-323404, a focus / leveling detection system is provided at a position sufficiently away from the projection optical system PL, and the surface position information of the substrate P is not passed through the liquid LQ. It may be detected.

  The first liquid supply device 11 of the liquid immersion mechanism 1 includes a tank that stores the liquid LQ, a pressure pump, a filter unit that removes foreign matter in the supplied liquid LQ, a temperature adjustment device that adjusts the temperature of the supplied liquid LQ, and A degassing device for degassing the supplied liquid LQ is provided. FIG. 1 shows a temperature control device 11A and a deaeration device 11B as an example. One end of the first supply pipe 13 is connected to the first liquid supply device 11, and the other end of the first supply pipe 13 is connected to the nozzle member 70. The liquid supply operation of the first liquid supply device 11 is controlled by the control device CONT. Note that the tank, pressurization pump, filter unit, temperature control device, deaeration device, etc. of the first liquid supply device 11 do not have to be all provided in the exposure apparatus EX, and the factory where the exposure apparatus EX is installed. Such facilities may be substituted.

  Further, in the middle of the first supply pipe 13, a flow rate called a mass flow controller that controls the amount per unit time of the liquid LQ that is sent from the first liquid supply device 11 and supplied to the image plane side of the projection optical system PL. A controller 19 is provided. Control of the liquid supply amount by the flow rate controller 19 is performed under the command signal of the control device CONT.

  The liquid recovery device 21 of the liquid immersion mechanism 1 includes a vacuum system such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, a tank that stores the recovered liquid LQ, and the like. One end of a recovery tube 23 is connected to the liquid recovery device 21, and the other end of the recovery tube 23 is connected to a nozzle member 70. The liquid recovery operation of the liquid recovery device 21 is controlled by the control device CONT. The vacuum system, the gas-liquid separator, the tank, etc. of the liquid recovery apparatus 21 do not have to be all provided in the exposure apparatus EX, and equipment such as a factory in which the exposure apparatus EX is installed may be substituted. .

  The second liquid supply device 31 of the liquid ejection mechanism 3 includes a tank that stores the liquid LQ, a pressure pump, a filter unit that removes foreign matter in the supplied liquid LQ, a temperature adjustment device that adjusts the temperature of the supplied liquid LQ, and A degassing device for degassing the supplied liquid LQ is provided. FIG. 1 shows a temperature control device 31A and a deaeration device 31B as an example. One end of the second supply pipe 33 is connected to the second liquid supply device 31, and the other end of the second supply pipe 33 is connected to the nozzle member 70. The liquid supply operation of the second liquid supply device 31 is controlled by the control device CONT. The tank, pressurization pump, filter unit, temperature control device, deaeration device, etc. of the second liquid supply device 31 do not have to be all provided in the exposure apparatus EX, and the factory where the exposure apparatus EX is installed. Such facilities may be substituted.

  The liquid ejecting mechanism 3 is provided in the middle of the flow path of the second supply pipe 33 and adjusts the amount per unit time of the liquid LQ supplied from the second liquid supply device 31 to the ejection port 32 of the nozzle member 70. A possible adjustment device 38 is provided. As the adjusting device 38, for example, the above-described mass flow controller can be used. The control device CONT can adjust the amount per unit time of the liquid LQ ejected from the ejection port 32 by adjusting the liquid supply amount per unit time to the ejection port 32 using the adjusting device 38. Here, in the following description, the amount of the liquid LQ ejected from the ejection port 32 is appropriately referred to as an “ejection amount”.

  Further, the control device CONT can adjust the flow rate of the liquid LQ ejected from the ejection port 32 by adjusting the liquid supply amount per unit time to the ejection port 32 using the adjustment device 38. In the present embodiment, the flow rate of the liquid LQ ejected from the ejection port 32 is adjusted so as to be sufficiently larger than the flow rate of the liquid LQ supplied from the supply port 12.

  Further, as described above, in the present embodiment, the first liquid supply device 11 and the second liquid supply device 31 send out the same liquid LQ, which is sent out from the first liquid supply device 11 and from the supply port 12. The temperature of the supplied liquid LQ and the temperature of the liquid LQ sent from the second liquid supply device 31 and ejected from the ejection port 32 are set to substantially the same value.

  Further, the dissolved gas concentration of the liquid supplied from the supply port 12 and the dissolved gas concentration of the liquid injected from the injection port 32 are set to substantially the same value (5 ppm or less), and bubbles in the optical path of the exposure light EL are set. Occurrence and decrease in transmittance are suppressed.

  The nozzle member 70 is supported by a support mechanism 91, and the support mechanism 91 is connected to the lower step portion 8 of the main column 9. The main column 9 that supports the nozzle member 70 via the support mechanism 91 and the lens barrel surface plate 5 that supports the lens barrel PK of the projection optical system PL via the flange PF include the vibration isolator 87. Through vibrations. Therefore, the vibration generated in the nozzle member 70 is prevented from being transmitted to the projection optical system PL. Further, the main column 9 and the substrate stage surface plate 6 supporting the substrate stage PST are vibrationally separated via a vibration isolator 89. Therefore, vibration generated by the nozzle member 70 is prevented from being transmitted to the substrate stage PST via the main column 9 and the base BP. Further, the main column 9 and the mask stage surface plate 2 supporting the mask stage MST are vibrationally separated via a vibration isolator 86. Therefore, vibration generated by the nozzle member 70 is prevented from being transmitted to the mask stage MST via the main column 9.

  Next, the nozzle member 70 will be described with reference to FIGS. 2 is a partially cutaway view of a schematic perspective view showing the vicinity of the nozzle member 70, FIG. 3 is a perspective view of the nozzle member 70 viewed from below, FIG. 4 is a side sectional view parallel to the YZ plane, and FIG. 5 is an XZ plane. FIG.

  The nozzle member 70 is provided in the vicinity of the first optical element LS1 closest to the image plane of the projection optical system PL. The nozzle member 70 is an annular member, and is disposed so as to surround the first optical element LS1 above the substrate P (substrate stage PST). The nozzle member 70 has a hole 70H in which the projection optical system PL (first optical element LS1) can be disposed at the center thereof. The nozzle member 70 is configured by combining a plurality of members, and is formed in a substantially circular shape in plan view as a whole. The nozzle member 70 may be configured by a single member.

  The inner side surface 70T of the hole 70H of the nozzle member 70 is formed in a mortar shape so as to face the side surface LT of the first optical element LS1 of the projection optical system PL and along the side surface LT of the first optical element LS1. . Specifically, the side surface LT of the first optical element LS1 and the inner side surface 70T of the nozzle member 70 are inclined so that the distance (distance) from the substrate P decreases from the outside to the inside of the optical path space K1. . A predetermined gap G1 is provided between the inner surface 70T of the nozzle member 70 and the side surface LT of the first optical element LS1. By providing the gap G1, the vibration generated in the nozzle member 70 is prevented from being directly transmitted to the projection optical system PL (first optical element LS1) side.

  The nozzle member 70 has a bottom plate portion 70D disposed between the lower surface T1 of the first optical element LS1 of the projection optical system PL and the substrate P (substrate stage PST) in the Z-axis direction. An opening 74 through which the exposure light EL passes is formed at the center of the bottom plate portion 70D. The opening 74 is formed larger than the projection area AR irradiated with the exposure light EL. In the present embodiment, the opening 74 is formed in a substantially cross shape in plan view. The opening 74 is not limited to a cross shape, but may be a rectangular shape combined with the projection area AR. The bottom plate portion 70D is provided so as not to contact the lower surface T1 of the first optical element LS1 and the substrate P (substrate stage PST). A space having a predetermined gap G2 is provided between the lower surface T1 of the first optical element LS1 and the upper surface of the bottom plate portion 70D. In the following description, the space inside the nozzle member 70 including the space between the lower surface T1 of the first optical element LS1 and the upper surface of the bottom plate portion 70D is appropriately referred to as “internal space G2.”

  Of the nozzle member 70, the lower surface 75 facing the surface of the substrate P held by the substrate stage PST is a flat surface parallel to the XY plane. The lower surface 75 of the nozzle member 70 includes the lower surface of the bottom plate portion 70D. Here, since the surface of the substrate P held on the substrate stage PST is substantially parallel to the XY plane, the lower surface 75 of the nozzle member 70 faces the surface of the substrate P held on the substrate stage PST, and The structure is provided so as to be substantially parallel to the surface of the substrate P.

  The nozzle member 70 includes a supply port 12 that supplies the liquid LQ and a recovery port 22 that recovers the liquid LQ. Further, the nozzle member 70 includes a supply channel 14 connected to the supply port 12 and a recovery channel 24 connected to the recovery port 22. Although not shown or simplified in FIGS. 2 to 5, the supply flow path 14 is connected to the other end of the first supply pipe 13, and the recovery flow path 24 is the other end of the recovery pipe 23. Connected.

  The supply flow path 14 is formed by a slit-like through hole that penetrates the inside of the nozzle member 70 along the inclination direction. The supply channel 14 is inclined so that the distance (distance) from the substrate P becomes smaller from the outside to the inside of the optical path space K1, and in this embodiment, the supply channel 14 is provided substantially parallel to the inner side surface 70T. Yes. In the present embodiment, the supply flow paths 14 are provided on both sides in the Y-axis direction with respect to the optical path space K1 (projection area AR). And the upper end part of the supply flow path (through-hole) 14 and the other end part of the 1st supply pipe | tube 13 are connected, and, thereby, the supply flow path 14 passes through the 1st supply pipe | tube 13, and the 1st liquid supply apparatus 11 is connected. Connected to. On the other hand, the lower end part of the supply flow path 14 is connected to the internal space G2 between the first optical element LS1 and the bottom plate part 70D, and the lower end part of the supply flow path 14 serves as the supply port 12. The supply ports 12 are provided at predetermined positions on both sides in the Y-axis direction across the optical path space K1 outside the optical path space K1 of the exposure light EL. The supply port 12 can supply the liquid LQ to the internal space G2.

  The nozzle member 70 includes a discharge port 16 that discharges (exhausts) the gas in the internal space G2 to the external space (atmospheric space) K3, and a discharge flow path 15 that connects to the discharge port 16. The discharge passage 15 is formed by a slit-like through hole that penetrates the inside of the nozzle member 70 along the tilt direction. The discharge flow path 15 is inclined so that the distance (distance) from the substrate P becomes smaller from the outside to the inside of the optical path space K1, and in this embodiment, the discharge flow path 15 is provided substantially parallel to the inner side surface 70T. Yes. In the present embodiment, the discharge channels 15 are provided on both sides in the X-axis direction with respect to the optical path space K1 (projection area AR). And the upper end part of the discharge flow path (through-hole) 15 is connected to the external space (atmospheric space) K3, and is in an open state. On the other hand, the lower end portion of the discharge flow channel 15 is connected to the internal space G2 between the first optical element LS1 and the bottom plate portion 70D, and the lower end portion of the discharge flow channel 15 serves as the discharge port 16. The discharge ports 16 are provided at predetermined positions on both sides in the X-axis direction across the optical path space K1 outside the optical path space K1 of the exposure light EL. The discharge port 16 is connected to the gas in the internal space G2, that is, the gas around the image plane of the projection optical system PL. Therefore, the gas in the internal space G2 can be discharged (exhausted) to the external space (atmospheric space) K3 from the upper end of the discharge flow path 15 through the discharge port 16. Note that the upper end of the exhaust flow path 15 connected to the internal space G2 may be connected to a suction device to forcibly discharge the gas in the internal space G2.

  The bottom plate portion 70D has a function as a guide member that guides the flow of the liquid LQ supplied from the supply port 12. The bottom plate portion 70D guides the liquid LQ supplied from the supply port 12 to flow toward or near the position where the discharge port 16 is provided.

  The nozzle member 70 has a space 24 that opens downward. The collection port 22 is configured by an opening of the space 24. Further, the recovery flow path is constituted by the space portion 24. The space portion 24 is provided outside the supply flow path 14 and the discharge flow path 15 with respect to the optical path space K1. A part of the recovery flow path (space part) 24 and the other end of the recovery pipe 23 are connected on the side surface of the nozzle member 70.

  The recovery port 22 is provided at a position facing the surface of the substrate P above the substrate P held by the substrate stage PST. The surface of the substrate P held on the substrate stage PST is separated from the recovery port 22 provided in the nozzle member 70 by a predetermined distance. The recovery port 22 is provided outside the supply port 12 with respect to the optical path space K1 on the image plane side of the projection optical system PL, and is formed in an annular shape so as to surround the optical path space K1 (projection area AR) and the supply port 12. Has been. That is, the recovery port 22 is provided outside the supply port 12 with respect to the optical path space K1. In the present embodiment, the recovery port 22 is formed in an annular shape in plan view. The recovery port 22 is not limited to an annular shape in plan view, and may be, for example, a rectangular shape in plan view.

  The nozzle member 70 includes a porous member 25 having a plurality of holes disposed so as to cover the recovery port 22. In the present embodiment, the porous member 25 is composed of a mesh member having a plurality of holes. As the porous member 25, for example, a mesh member in which a honeycomb pattern composed of a plurality of substantially hexagonal holes is formed, a mesh member in which a large number of holes are formed in a plate-like member such as titanium, or a porous member made of ceramics can be used. It is.

  The porous member 25 has a lower surface 25B facing the substrate P held by the substrate stage PST. The lower surface 25B facing the substrate P of the porous member 25 is substantially flat. The porous member 25 is provided in the recovery port 22 so that the lower surface 25B thereof is substantially parallel to the surface of the substrate P (that is, the XY plane) held by the substrate stage PST. Further, the porous member 25 has a lower surface 25B and the lower surface 75 of the nozzle member 70 that are substantially at the same position (height) in the Z-axis direction, and the lower surface 25B and the lower surface 75 of the nozzle member 70 are continuous. In addition, the recovery port 22 is provided. The liquid LQ is recovered through the porous member 25 disposed in the recovery port 22.

  Next, the liquid ejecting mechanism 3 will be described. The nozzle member 70 includes an ejection port 32 that ejects the liquid LQ. The nozzle member 70 has a lower surface 75 that faces the surface of the substrate P above the substrate P held by the substrate stage PST, and the ejection port 32 is provided on the lower surface 75. Accordingly, the ejection port 32 is provided at a position facing the surface of the substrate P above the substrate P held by the substrate stage PST. The surface of the substrate P held on the substrate stage PST and the ejection port 32 provided on the lower surface 75 of the nozzle member 70 are separated from each other by a predetermined distance.

  The ejection port 32 is provided outside the recovery port 22 with respect to the optical path space K1 on the image plane side of the projection optical system PL, and is annular so as to surround the optical path space K1 (projection area AR) and the recovery port 22. Is provided. In the present embodiment, the injection port 32 is formed in an annular shape in plan view, and is formed in a slit shape having a predetermined slit width D1 (see FIG. 4). The injection port 32 is not limited to an annular shape in a plan view, and may be an annular shape in a plan view, for example.

  The nozzle member 70 has a supply flow path 34 that supplies the liquid LQ to the ejection port 32. The supply channel 34 is provided inside the nozzle member 70, and the lower end portion thereof is connected to the injection port 32. The other end of the second supply pipe 33 is connected to a part of the supply flow path 34.

  The supply flow path 34 has a first flow path part 34A connected to the injection port 32 and a second flow path part 34B including a buffer space 37 larger than the first flow path part 34A. The second flow path portion 34B is provided outside the first flow path portion 34A with respect to the optical path space K1, and is connected to the second supply pipe 33. The first flow path portion 34A has an inclined region and a horizontal region provided outside the inclined region with respect to the optical path space K1. The inclined region of the first flow path portion 34A is inclined so that the distance (distance) from the substrate P gradually decreases from the outside to the inside of the optical path space K1, that is, as the optical path space K1 is approached. And the lower end part of the inclination area | region of 34 A of 1st flow-path parts is the injection nozzle 32. FIG. In the present embodiment, the inclined region of the first flow path portion 34A is inclined at a predetermined angle (for example, about 30 °) with respect to the surface (XY plane) of the substrate P held by the substrate stage PST. The horizontal region of the first flow path part 34A is provided substantially parallel to the XY plane, and connects the upper end part of the inclined area of the first flow path part 34A and the buffer space 37 of the second flow path part 34B. Yes.

  The inclined area of the first flow path portion 34A is a slit-shaped flow path formed in an annular shape in a cross-sectional view along the XY plane so as to correspond to the injection port 32 formed in an annular slit shape. The width of the flow path in the vicinity of the upper end portion of the inclined region is wide and is provided so as to gradually narrow toward the injection port 32. The lower end portion of the inclined area is a slit-like flow path having a uniform width substantially the same as the slit width D1 of the injection port 32. The buffer space 37 is a space that is provided outside the horizontal region of the first flow path portion 34A with respect to the optical path space K1, and is formed in an annular shape so as to surround the horizontal region of the first flow path portion 34A. It has a width D2 (see FIG. 4) that is sufficiently larger than the width of the flow path portion 34A.

  That is, the supply flow path 34 is provided on the downstream side of the flow path with respect to the second flow path portion 34B including the buffer space 37 having the width D2 in the Z-axis direction, and is smaller than the width D2. The first flow path portion 34A having a width is provided. The first flow path portion 34A is configured to be narrower than the buffer space 37 provided on the upstream side of the flow path.

  The other end of the second supply pipe 33 is connected to the second flow path part 34 </ b> B including the buffer space 37. In the present embodiment, a plurality of connection positions of the second flow path portion 34B of the supply flow path 34 and the second supply pipe 33 are set at substantially equal intervals in the circumferential direction (θZ direction) on the side surface of the nozzle member 70. The other end of the second supply pipe 33 is connected to each of the plurality of connection positions. In the drawing, the connection positions of the supply flow path 34 with the second supply pipe 33 are shown as four positions, but may be set at any plural positions such as eight positions. The ejection port 32 and the second liquid supply device 31 are connected via a supply flow path 34 and a second supply pipe 33.

  The liquid LQ delivered from the second liquid supply device 31 flows into the second flow path part 34B including the buffer space 37 in the supply flow path 34 via the second supply pipe 33, and then the second flow path part 34B. And it is supplied to the injection port 32 through the first flow path part 34A. The liquid LQ supplied from the supply flow path 34 including the second flow path portion 34B and the first flow path portion 34A to the ejection port 32 is ejected from the ejection port 32 to the outside of the nozzle member 70.

  At this time, since the width of the inclined region of the first flow path portion 34A gradually decreases toward the injection port 32, the inclination of the first flow path portion 34A via the buffer space 37 of the second flow path portion 34B. The liquid LQ that has flowed into the upper end of the region flows toward the injection port 32 while increasing the flow rate by the nozzle effect, and is ejected from the injection port 32 at a predetermined flow rate.

  The inclined region of the first flow path part 34A is inclined at a predetermined angle (about 30 °) so that the distance (distance) from the substrate P gradually decreases as the optical path space K1 is approached. The injection port 32 provided at the lower end of the inclined area 34A injects the liquid LQ in the inclined direction toward the optical path space K1.

  Further, the buffer space 37 disperses and equalizes the energy (pressure, flow velocity) of the liquid LQ supplied from the second liquid supply device 31 via the second supply pipe 33, and the first flow path portion extends from the buffer space 37. The amount (flow velocity) per unit time of the liquid LQ flowing into 34A is made uniform at each position of the first flow path portion 34A that is a slit-shaped flow path. By providing the buffer space 37, the liquid ejection mechanism 3 causes the liquid LQ supplied to the ejection port 32 via the second flow path portion 34B and the first flow path portion 34A including the buffer space 37 to be slit-shaped. It is possible to eject almost uniformly from the ejection port 32. That is, when the buffer space 37 is not provided, the amount of the liquid LQ per unit time that flows through the first flow path portion 34A is the other position near the position where the other end of the second supply pipe 33 is connected. Since it increases, the injection amount (flow velocity) per unit time of the liquid LQ injected at each position of the slit-like injection port 32 formed to have a predetermined length may be non-uniform. However, by providing the buffer space 37 to disperse and equalize the energy of the liquid LQ supplied from the second supply pipe 33, each position of the slit-like injection port 32 is provided via the first flow path portion 34A. The flow rate (flow velocity) of the supplied liquid LQ can be made uniform, and the liquid LQ is ejected at a substantially uniform ejection amount at each position of the annular slit-shaped ejection port 32.

  In addition, since the second liquid supply device 31 includes the deaeration device 31B, the liquid ejection mechanism 3 reduces the gas component in the liquid LQ ejected from the ejection port 32 using the deaeration device 31B. be able to.

  FIG. 6 is a schematic configuration diagram illustrating an example of a deaeration device 31 </ b> B provided in the second liquid supply device 31. Note that the degassing device 11B provided in the first liquid supply device 11 also has the same configuration as the degassing device 31B of the second liquid supply device 31. In FIG. 6, the deaeration device 31 </ b> B includes a housing 171 and a hollow fiber bundle 172 accommodated inside the housing 171 via a space 173. The hollow fiber bundle 172 is obtained by bundling a plurality of straw-shaped hollow fiber membranes 174 in parallel to each other. Each hollow fiber membrane 174 is formed of a material having high hydrophobicity and excellent gas permeability (for example, poly-4-methylpentene 1). Vacuum cap members 175 a and 175 b are fixed to both ends of the housing 171, and sealed spaces 176 a and 176 b are formed outside both ends of the housing 171. The vacuum cap members 175a and 175b are provided with deaeration ports 177a and 177b connected to a vacuum pump (not shown). Further, sealing portions 178a and 178b are formed at both ends of the housing 171 so that only both ends of the hollow fiber bundle 172 are connected to the sealed spaces 176a and 176b. A vacuum pump is connected to the deaeration ports 177a and 177b, and the control device CONT can bring the inside of each hollow fiber membrane 174 into a reduced pressure state by driving the vacuum pump. In addition, a tube 179 is provided inside the hollow fiber bundle 172 for flowing in the liquid LQ that has not been deaerated. The pipe 179 is provided with a plurality of liquid supply holes 180, and the liquid LQ is supplied from the liquid supply hole 180 to the space 181 surrounded by the sealing portions 178 a and 178 b and the hollow fiber bundle 172. When the supply of the liquid LQ from the liquid supply hole 180 to the space 181 is continued, the liquid LQ flows outward so as to cross the layers of the hollow fiber membranes 174 bundled in parallel and comes into contact with the outer surface of the hollow fiber membranes 174. . As described above, since each of the hollow fiber membranes 174 is formed of a material having high hydrophobicity and excellent gas permeability, the liquid LQ does not enter the inside of the hollow fiber membranes 174, and each hollow fiber membrane 174 And move to a space 173 outside the hollow fiber bundle 172. On the other hand, the gas (molecules) dissolved in the liquid LQ moves (is absorbed) to the inside of each hollow fiber membrane 174 because the inside of the hollow fiber membrane 174 is in a reduced pressure state (about 20 Torr). . As described above, the gas component removed (degassed) from the liquid LQ while traversing the layer of the hollow fiber membrane 174 is desorbed from both ends of the hollow fiber bundle 172 through the sealed spaces 176a and 176b as indicated by arrows 183. The air is discharged from the air ports 177a and 177b. The degassed liquid LQ is supplied to the second supply pipe 33 (ejection port 32) via the liquid outlet 182 provided in the housing 151. In the present embodiment, the degassing device 31B performs degassing so that the dissolved gas concentration of the liquid LQ is 5 ppm or less.

  Next, a method for exposing the pattern image of the mask M onto the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  In order to fill the optical path space K1 of the exposure light EL with the liquid LQ, the control device CONT drives each of the first liquid supply device 11 and the liquid recovery device 21. The liquid LQ delivered from the first liquid supply device 11 under the control of the control device CONT flows through the first supply pipe 13 and then is projected from the supply port 12 via the supply flow path 14 of the nozzle member 70. It is supplied to the internal space G2 between the first optical element LS1 and the bottom plate portion 70D of the optical system PL. By supplying the liquid LQ to the internal space G2, the gas portion existing in the internal space G2 is discharged to the outside through the discharge port 16 and the opening 74. Therefore, when the supply of the liquid LQ to the internal space G2 is started, it is possible to prevent a problem that gas remains in the internal space G2, and a gas part (bubbles) is generated in the liquid LQ in the optical path space K1. Can be prevented.

  The liquid LQ supplied to the internal space G2 flows into the space between the lower surface 75 and the substrate P (substrate stage PST) through the opening 74 of the nozzle member 70, and fills the optical path space K1. At this time, the liquid recovery device 21 driven under the control of the control device CONT recovers a predetermined amount of the liquid LQ per unit time. The liquid LQ in the space between the lower surface 75 of the nozzle member 70 and the substrate P flows into the recovery channel 24 via the recovery port 22 of the nozzle member 70, flows through the recovery pipe 23, and then enters the liquid recovery device 21. Collected.

  Here, the liquid LQ supplied from the supply port 12 to the internal space G2 is guided to the inner surface of the opening 74 formed in the bottom plate portion 70D and enters the optical path space K1 (projection area AR) of the exposure light EL. Then, even if a gas portion (bubble) is generated in the liquid LQ, the bubble is caused to flow out of the exposure light EL by the flow of the liquid LQ. The light can be discharged outside the optical path space K1. In the present embodiment, the bottom plate portion 70D causes the liquid LQ to flow toward the discharge port 16, so that gas portions (bubbles) existing in the liquid LQ enter the external space K3 via the discharge port 16. It is discharged smoothly. Further, the liquid immersion mechanism 1 suppresses the generation of eddy currents in the optical path space K1 of the exposure light EL by flowing the liquid LQ while being guided by the inner surface of the opening 74.

  As described above, the control device CONT uses the liquid immersion mechanism 1 to supply a predetermined amount of the liquid LQ to the optical path space K1 and collect a predetermined amount of the liquid LQ on the substrate P, whereby the projection optical system PL and the substrate The optical path space K <b> 1 with P is filled with the liquid LQ, and the liquid immersion area LR of the liquid LQ is locally formed on the substrate P. The control device CONT, while the optical path space K1 is filled with the liquid LQ, moves the projection optical system PL and the substrate P while moving the projection optical system PL and the liquid LQ in the optical path space K1. Through the projection exposure.

  The control device CONT drives the second liquid supply device 31 of the liquid ejecting mechanism 3 when supplying the liquid LQ from the supply port 12. The control device CONT continues the liquid ejecting operation of the ejection port 32 during the scanning exposure of the substrate P. In other words, the control device CONT uses the liquid immersion mechanism 1 to perform the liquid LQ supply operation and the recovery operation while the liquid LQ is being supplied and recovered, or even if the supply operation and the recovery operation are stopped. While the LR is being formed, the driving of the second liquid supply device 31 of the liquid ejecting mechanism 3 is continued.

  As described above, the exposure apparatus EX of the present embodiment is a scanning exposure apparatus that performs exposure while relatively moving the projection optical system PL and the substrate P. Specifically, the exposure apparatus EX projects and exposes the pattern image of the mask M onto the substrate P while moving the mask M and the substrate P in the X-axis direction (scanning direction) with respect to the projection optical system PL. In such a scanning exposure apparatus, for example, as the scanning speed (scanning speed) increases, the liquid LQ cannot be sufficiently recovered through the recovery port 22, and the liquid LQ filled in the optical path space K1. May leak outside the recovery port 22 with respect to the optical path space K1. For example, from the initial state shown in the schematic diagram of FIG. 7A, the substrate P is scanned and moved by a predetermined distance in the + X direction with respect to the liquid immersion region LR at a predetermined speed, and as shown in FIG. It is assumed that the interface LG between the liquid LQ in the immersion region LR and the outer space moves. When the scanning speed is increased, the moving speed of the liquid interface LG may increase, or the shape of the interface LG may change greatly, and the liquid LQ may leak out of the recovery port 22. In particular, the liquid LQ is more likely to leak to the front side in the movement direction of the substrate P (the + X side in FIG. 7).

  In the present embodiment, the control device CONT performs the ejection operation of the liquid LQ via the ejection port 32, so that the optical path of the exposure light EL between the projection optical system PL and the substrate P by the force of the ejected liquid LQ. Leakage of the liquid LQ filled in the space K1 and enlargement of the liquid immersion area LR are prevented.

  FIG. 8 is an enlarged schematic view of a main part for explaining the operation of the liquid ejecting mechanism 3. As shown in FIG. 8, the control device CONT drives the second liquid supply device 31 so as to confine the liquid LQ (immersion region LR) inside the recovery port 22 formed so as to surround the optical path space K1. In addition, the liquid LQ is ejected from the ejection port 32 provided outside the recovery port 22 with respect to the optical path space K1.

  Specifically, the control device CONT drives the second liquid supply device 31 to deliver a predetermined amount of the liquid LQ per unit time. The liquid LQ delivered from the second liquid supply device 31 flows into the second flow path portion 34B of the supply flow path 34 of the nozzle member 70 via the second supply pipe 33. The liquid LQ that has flowed into the second flow path portion 34B flows into the first flow path portion 34A via the buffer space 37 of the second flow path portion 34B, and is ejected at the lower end of the first flow path portion 34A. It is supplied to the mouth 32. As described above, since the buffer space 37 is provided in the middle of the supply flow path 34, the liquid LQ supplied to the slit-like injection port 32 via the supply flow path 34 including the buffer space 37 is ejected. Jetted from each position of the mouth 32 substantially uniformly. Moreover, since the width of the flow path in the inclined region of the first flow path portion 34A gradually decreases toward the injection port 32, the liquid LQ is injected from the injection port 32 at a high flow rate.

  The ejection port 32 ejects the liquid LQ onto the substrate P in an inclined direction toward the optical path space K1, and in the present embodiment, a region of the substrate P facing the recovery port 22, that is, the substrate The liquid LQ is ejected toward a region immediately below the recovery port 22 in P. Here, since the interface LG between the liquid LQ in the liquid immersion region LR and the space outside the liquid LQ is formed between the recovery port 22 and the substrate P, the liquid LQ ejected from the ejection port 32 is the liquid immersion region. It hits the interface LG of the LR liquid LQ (the lower end of the interface LG). Thereby, even if the liquid LQ filled in the optical path space K1 (interface LG of the liquid LQ) tries to move to the outside of the optical path space K1, the liquid LQ ejected from the ejection port 32 includes the optical path space K1. The leakage of the liquid LQ to the outside of the predetermined space can be prevented. Here, the predetermined space is a space on the image plane side of the projection optical system PL, and includes a space inside the recovery port 22 with respect to the optical path space K1.

  That is, when the substrate P moves in a predetermined direction (for example, + X direction), the liquid LQ is likely to leak to the front side (+ X side) in the movement direction of the substrate P, but the movement of the substrate P with respect to the optical path space K1. By the liquid LQ ejected from the ejection port 32 on the front side (+ X side) in the direction, the momentum in the reverse direction can be given to the liquid LQ to be leaked. In other words, by ejecting the liquid LQ from the front side in the leakage direction with respect to the liquid LQ to be leaked, it is possible to give a momentum in the reverse direction to the liquid LQ. Thereby, the leakage of the liquid LQ filled in the optical path space K1 can be prevented.

  Further, since the substrate P is stepped and moved in the Y-axis direction, the liquid LQ may leak in the Y-axis direction during the stepping movement, but the ejection port 32 is formed in an annular shape so as to surround the optical path space K1. Therefore, the momentum in the reverse direction is given to the liquid LQ to be leaked by the liquid LQ ejected from the ejection port 32 on the front side (for example, + Y side) of the movement direction of the substrate P with respect to the optical path space K1. it can.

  The liquid LQ ejected vigorously from the ejection port 32 toward the optical path space K1 is recovered from the recovery port 22 together with the liquid LQ filled in the optical path space LQ without leaking outside the recovery port 22. Is done.

  Further, the control device CONT adjusts the injection condition of the injection port 32 according to the exposure condition. In the present embodiment, exposure is performed while relatively moving the projection optical system PL and the substrate P. However, the control device CONT moves the projection optical system PL and the substrate P (substrate stage PST) relative to each other. The flow rate (pressure, energy) of the liquid LQ ejected from the ejection port 32 is adjusted according to the speed. The controller CONT uses the adjusting device 38 to adjust the amount of liquid supplied per unit time to the ejection port 32 via the supply flow path 34, whereby the liquid LQ ejected from the ejection port 32 toward the optical path space K1. Adjust the flow rate.

  Specifically, the control device CONT makes the flow rate of the liquid LQ ejected from the ejection port 32 larger than the moving speed of the substrate P with respect to the projection optical system PL. For example, as shown in the schematic diagram of FIG. 9A, when the substrate P is moving in the + X direction at the speed V1 with respect to the projection optical system PL (optical path space K1), it is injected from the injection port 32. The flow rate VL1 of the liquid LQ is controlled to be larger than the velocity V1 of the substrate P. Preferably, it is desirable to control the velocity component VL1x of the liquid LQ ejected from the ejection port 32 in the moving direction of the substrate P (that is, the X-axis direction) to be larger than the velocity V1 of the substrate P. Thereby, even when the substrate P moves, the leakage of the liquid LQ from the optical path space K1 can be satisfactorily prevented.

  Further, as shown in the schematic diagram of FIG. 9B, when the substrate P is moving in the + X direction at a speed V2 slower than the speed V1 with respect to the projection optical system PL, it is ejected from the ejection port 32. The flow rate of the liquid LQ is controlled to a flow rate VL2 lower than the flow rate VL1. Even in this case, the flow velocity VL2 of the liquid LQ ejected from the ejection port 32 is controlled to be larger than the moving velocity V2 of the substrate P.

  As described above, by making the flow rate of the liquid LQ ejected from the ejection port 32 higher than the moving speed of the substrate P with respect to the projection optical system PL, the leakage of the liquid LQ can be satisfactorily prevented. Further, by appropriately adjusting the flow rate of the liquid LQ ejected from the ejection port 32 according to the moving speed of the substrate P, the flow of the liquid LQ filled in the optical path space K1 is disturbed by the ejected liquid LQ, or the optical path space. Inconveniences such as formation of bubbles in the liquid LQ of K1 and leakage of the liquid LQ can be prevented. That is, for example, when a liquid LQ having a high flow velocity (a large momentum) is ejected to the optical path space K1 while the substrate P is moving at a relatively low speed V2 in a predetermined direction (for example, + X direction), the liquid LQ is ejected. There is a high possibility that the flow of the liquid LQ in the optical path space K1 is disturbed by the liquid LQ, or bubbles are formed in the liquid LQ in the optical path space K1. In the present embodiment, since the liquid LQ is ejected from the ejection port 32 formed in an annular shape so as to surround the optical path space K1, the liquid LQ is ejected when the liquid LQ having an excessive flow velocity is ejected. Due to the force of the liquid LQ, the flow of the liquid LQ in the optical path space K1 is disturbed, bubbles are formed in the liquid LQ in the optical path space K1, the substrate P is deformed / displaced, vibration is generated, Liquid LQ may leak. Further, in a state where the substrate P is moved in a predetermined direction (for example, the + X direction) at a relatively low speed V2, the flow velocity is high from the front side (+ X side) in the movement direction of the substrate P with respect to the optical path space K1 (the momentum amount). When the (large) liquid LQ is ejected, the liquid LQ filled in the optical path space K1 may leak out from the rear side (−X side) of the movement direction of the substrate P by the force of the ejected liquid LQ. Therefore, the above-described inconvenience can be prevented by adjusting the flow rate of the liquid LQ ejected from the ejection port 32 according to the relative moving speed of the projection optical system PL and the substrate P.

  Further, when scanning exposure of the substrate P, the substrate P (substrate stage PST) moves in the order of, for example, an acceleration section, a steady section (constant speed section), and a deceleration section. The flow velocity of the liquid LQ ejected from the ejection port 32 can be adjusted according to the acceleration section, the steady section, and the deceleration section of (PST).

  As described above, the projection optical system PL and the substrate in a state where the optical path space K1 is filled with the liquid LQ by ejecting the liquid LQ to the optical path space K1 from the ejection port 32 provided outside the recovery port 22. Even when P is relatively moved, leakage of the liquid LQ filled in the optical path space K1 can be prevented. That is, in the present embodiment, since the liquid LQ having a sufficient momentum is applied to the interface LG of the liquid LQ in the immersion region LR, the leakage of the liquid LQ can be satisfactorily prevented. Further, by ejecting the liquid LQ toward the optical path space K1, the size and shape of the liquid immersion area LR can be maintained in a desired state, and the entire exposure apparatus EX can be made compact.

  Further, since the ejection port 32 is formed in a slit shape, the liquid LQ to be ejected can be formed in a slit shape in a sectional view. Therefore, the position of the liquid LQ to be ejected can be easily controlled, and the momentum of the liquid LQ to be ejected can be sufficiently increased.

  Moreover, since this embodiment is a structure which prevents the leakage of the liquid LQ with which the optical path space K1 was filled using the liquid LQ injected from the injection port 32, the structure which prevents the leakage of the liquid LQ by injecting gas and Unlikely, vaporization of the liquid LQ can be suppressed. Therefore, it is possible to prevent inconveniences such as the temperature of the substrate P being fluctuated by the heat of vaporization caused by the vaporization of the liquid LQ and the environment in which the exposure apparatus EX is fluctuated.

  Further, since the ejection port 32 ejects the liquid LQ in the inclined direction toward the optical path space K1, the liquid LQ can be confined inside the recovery port 22 formed so as to surround the optical path space K1. Further, since the ejection port 32 is provided at a position facing the substrate P, the liquid LQ ejected from the ejection port 32 can be smoothly applied to the interface LG of the immersion region LR or the surface of the substrate P. Further, since the ejection port 32 ejects the liquid LQ toward the region of the substrate P facing the recovery port 22, the liquid LQ is ejected to the interface LG of the liquid immersion region LR formed immediately below the recovery port 22. Further, it is possible to satisfactorily prevent leakage of the liquid LQ from the region directly below the recovery port 22 to the outside. In addition, by ejecting the liquid LQ toward the region of the substrate P facing the recovery port 22, inconveniences such as disturbance of the flow of the liquid LQ filled in the optical path space K1 due to the ejected liquid LQ are prevented. Can do. Further, as described above, by adjusting the flow rate of the liquid LQ ejected from the ejection port 32 according to the moving speed of the substrate P, the flow of the liquid LQ filled in the optical path space K1 is disturbed, or the liquid LQ is Inconvenience such as leakage can be prevented.

  Further, since the ejection port 32 is formed in an annular shape so as to surround the optical path space K1, the liquid LQ can be ejected toward the optical path space K1 from all directions outside the optical path space K1. Leakage can be prevented more reliably. Further, since the supply flow path 34 for supplying the liquid LQ to the ejection port 32 has the buffer space 37, the liquid LQ can be ejected uniformly from the slit-shaped ejection port 32.

  Further, since the liquid ejecting mechanism 3 includes the deaeration device 31B that reduces the gas component in the liquid LQ ejected from the ejection port 32, the sufficiently degassed liquid LQ is filled in the optical path space K1. The liquid LQ can be injected. Therefore, even if the liquid LQ ejected from the ejection port 32 and the liquid LQ filled in the optical path space K1 are mixed, the inconvenience that bubbles (gas components) are formed in the liquid LQ on the optical path space K1 is prevented. can do.

  Further, as described above, when the focus / leveling detection system is configured to detect the surface position information of the substrate P without passing through the liquid LQ in the optical path space K1 outside the ejection port 32 with respect to the optical path space K1, By preventing leakage of the liquid LQ to the outside of the ejection port 32 by the liquid LQ ejected from the ejection port 32, the detection accuracy of the focus / leveling detection system can be maintained.

  In the present embodiment, the ejection port 32 ejects the liquid LQ toward the region of the substrate P facing the recovery port 22 (the region directly below the recovery port 22). The liquid LQ may be ejected toward the space between the two. For example, the ejection port 32 may eject the liquid LQ toward the region of the substrate P facing the lower surface 75 of the nozzle member 70 inside the recovery port 22 with respect to the optical path space K1. Even in this case, leakage of the liquid LQ filled in the optical path space K1 can be prevented. The ejection angle (direction) of the liquid LQ ejected from the ejection port 32 is optimally set so as not to disturb the flow of the liquid LQ filled in the optical path space K1 and to prevent the liquid LQ from leaking out of the optical path space K1. Is done.

  In the present embodiment, the control device CONT may stop the ejection of the liquid LQ from the ejection port 32 when the substrate stage PST is not moving. In other words, the control device CONT may eject the liquid LQ from the ejection port 32 only when the substrate stage PST is driven. Of course, regardless of the driving of the substrate stage PST, during the operation of supplying and collecting the liquid LQ with respect to the optical path space K1 using the liquid immersion mechanism 1, the control device CONT uses the liquid LQ from the ejection port 32. May be injected.

<Second Embodiment>
Next, a second embodiment will be described. The characteristic part of the second embodiment is that the injection condition of the injection port 32 is adjusted according to the contact angle condition between the film member formed on the liquid contact surface on the substrate P and the liquid LQ. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 10A is an example of a cross-sectional view of the substrate P. In FIG. 10A, the substrate P includes a base material 100 and a film member 101 provided on the upper surface 100 </ b> A of the base material 100. The base material 100 includes a semiconductor wafer. The film member 101 is formed of a photosensitive material (photoresist), and covers a region that occupies most of the central portion of the upper surface 100A of the base material 100 with a predetermined thickness. In FIG. 10A, the photosensitive material (film member) 101 at the peripheral edge of the upper surface 100A of the substrate 100 is removed. In FIG. 10A, a film member (photosensitive material) 101 is provided on the uppermost layer of the substrate P, and this film member 101 serves as a liquid contact surface in contact with the liquid LQ during immersion exposure.

  FIG. 10B is a diagram showing another example of the substrate P. In FIG. 10B, the substrate P has a second film member 102 that covers the surface of the film member 101. The second film member 102 is formed of a protective film called a top coat film. In FIG. 10B, a second film member (protective film) 102 is provided on the uppermost layer of the substrate P, and the second film member 102 has a liquid contact surface that contacts the liquid LQ during immersion exposure. Become.

  The exposure apparatus EX of the present embodiment sequentially exposes a plurality of types of substrates P having different types (physical properties) of film members forming a liquid contact surface. In the storage device MRY, information related to the ejection conditions of the ejection ports 32 for performing immersion exposure of a plurality of types of substrates P is stored in advance. Specifically, in the storage device MRY, the affinity between the liquid member LQ and the film member formed on the liquid contact surface that contacts the liquid LQ on the substrate P during the immersion exposure, and the jet corresponding to the affinity A plurality of relationships with the injection conditions of the mouth 32 are stored as map data. Here, the information regarding the affinity between the film member and the liquid LQ includes information regarding the contact angle (including the dynamic contact angle and the static contact angle) between the film member and the liquid LQ.

  When performing the immersion exposure processing, information on the film member of the substrate P to be exposed is input to the control device CONT via the input device INP. The information relating to the input membrane member includes information (contact angle condition) relating to the contact angle between the membrane member and the liquid LQ. The control device CONT responds to the input information (contact angle condition) on the membrane member, and stores the contact angle between the membrane member and the liquid LQ, which is stored in advance in the storage device MRY, and the ejection port corresponding to the contact angle. With reference to the relationship (map data) with the 32 injection conditions, the optimum injection condition for the substrate P to be exposed is selected and determined.

  Here, the ejection conditions of the ejection port 32 include the flow velocity of the liquid LQ ejected from the ejection port 32 toward the optical path space K1 (the ejection amount of the liquid LQ per unit time). The control device CONT adjusts the flow rate of the liquid LQ ejected from the ejection port 32 using the adjusting device 38 according to the contact angle condition between the membrane member and the liquid LQ. Specifically, when the contact angle between the membrane member and the liquid LQ is small, the membrane member has lyophilicity (hydrophilicity) with respect to the liquid LQ. When the liquid LQ is supplied onto P (film member), the liquid LQ tends to wet and spread, so that the possibility of leakage to the outside of the optical path space K1 (recovery port 22) increases. Therefore, when forming the liquid immersion region LR on this membrane member, the adjusting device 38 increases the flow rate of the liquid LQ ejected from the ejection port 32. By doing so, leakage of the liquid LQ can be prevented by the force of the jetted liquid LQ.

  On the other hand, when the contact angle between the film member and the liquid LQ is large, the film member has liquid repellency (water repellency) with respect to the liquid LQ. When the liquid LQ is supplied onto the membrane member), the liquid LQ does not spread excessively. Therefore, when supplying the liquid LQ to the membrane member, the adjusting device 38 reduces the flow rate of the liquid LQ ejected from the ejection port 32. By doing so, the liquid LQ filled in the optical path space K1 is disturbed by the ejected liquid LQ, the liquid LQ is easily leaked, or the substrate P is deformed due to the force of the ejected liquid LQ. -Inconveniences such as displacement and vibration can be prevented.

  As described above, in the present embodiment, the optimum liquid ejection condition (liquid LQ ejected from the ejection port 32) corresponding to the contact angle between the film member formed on the liquid contact surface on the substrate P and the liquid LQ. Is obtained in advance, and information relating to the optimum liquid ejection condition is stored in the storage device MRY. The control device CONT stores a plurality of stored liquid jets based on information about the film member of the substrate P to be exposed (input information about the contact angle between the film member and the liquid LQ) input via the input device INP. The optimum liquid ejecting condition is selected and determined from the conditions, and the substrate P is exposed while preventing the liquid LQ from leaking by performing immersion exposure of the substrate P based on the determined liquid ejecting condition. Good exposure can be achieved.

  In addition, although the case where the kind of film | membrane member on the board | substrate P was changed was demonstrated here, the kind (physical property) of the liquid LQ may be changed. Even in such a case, the control device CONT can adjust the flow rate of the liquid ejected from the ejection port 32 according to the affinity between the film member on the substrate P and the liquid LQ using the adjustment device 38.

  Note that the immersion region LR may be formed on an object different from the substrate P, such as the upper surface 94 of the substrate stage PST, so that not only the substrate P but also the condition of the object surface on which the immersion region LR is formed ( The flow rate of the liquid LQ ejected from the ejection port 32 may be adjusted using the adjusting device 38 according to the contact angle or the like.

  As described above, the contact angle between the liquid LQ and the membrane member includes a static contact angle and a dynamic contact angle, and the control device CONT considers both the static contact angle and the dynamic contact angle. Thus, the injection condition of the injection port 32 can be adjusted. On the other hand, as described with reference to FIG. 7 and the like, when the main cause of the leakage of the liquid LQ in the optical path space K1 is the relative movement between the projection optical system PL and the substrate P, the control device CONT The injection condition of the injection port 32 can be adjusted mainly in consideration of the dynamic contact angle (receding angle) between the liquid LQ and the membrane member.

<Third Embodiment>
Next, a third embodiment will be described. A characteristic part of the present embodiment is that the ejection port 32 is provided so as to be able to eject the liquid LQ from a plurality of directions with respect to the optical path space K1, and the ejection port depends on the moving direction of the substrate P with respect to the projection optical system PL. The direction in which the liquid LQ is ejected from 32 is adjusted.

  FIG. 11 is a view of the nozzle member 70 according to the third embodiment as viewed from below (−Z side). As shown in FIG. 11, in the present embodiment, a plurality of injection ports 32 (32 </ b> A to 32 </ b> D) are provided so as to surround the optical path space K <b> 1 and the recovery port 22. In the present embodiment, four injection ports 32A to 32D are provided. Each of the injection ports 32A to 32D has a substantially arc shape in plan view, and is formed in a slit shape having a predetermined length. Of the four injection ports 32A to 32D, the first injection port 32A is arranged on the + X side with respect to the optical path space K1, the second injection port 32B is arranged on the + Y side with respect to the optical path space K1, and the third injection port 32C is arranged on the −X side with respect to the optical path space K1, and the fourth injection port 32D is arranged on the −Y side with respect to the optical path space K1. Therefore, the first ejection port 32A can eject the liquid LQ from the + X side toward the −X direction with respect to the optical path space K1, and the second ejection port 32B from the + Y side to the −Y direction with respect to the optical path space K1. The liquid LQ can be ejected toward the optical path space K3, the third ejection port 32C can eject the liquid LQ toward the + X direction from the -X side to the optical path space K1, and the fourth ejection port 32D is directed to the optical path space K1. The liquid LQ can be ejected from the −Y side in the + Y direction. Further, the liquid ejecting mechanism 3 can independently perform the liquid ejecting operations by the first to fourth ejection ports 32A to 32D. Then, the control device CONT selects an ejection port for ejecting the liquid LQ from the four ejection ports 32A to 32D according to the moving direction of the substrate P with respect to the projection optical system PL, and the liquid LQ from only the selected ejection port. Inject.

  FIG. 12 is a diagram schematically showing the positional relationship between the projection optical system PL and the ejection port 32 and the substrate P when exposure is performed while relatively moving the projection optical system PL and the substrate P. In FIG. 12, on the substrate P, a plurality of shot areas S1 to S21 where the pattern of the mask M is exposed are set in a matrix. The control device CONT sequentially exposes each of the shot areas S1 to S21 while relatively moving the optical axis AX of the projection optical system PL and the substrate P as indicated by an arrow y1 in FIG. As described above, the control device CONT exposes the substrate P with respect to the projection optical system PL while moving in the respective directions of the X axis direction, the Y axis direction, and the X axis (Y axis). .

  FIG. 13 is a schematic diagram for explaining the operation of the exposure apparatus EX according to the present embodiment. In the present embodiment, the storage device MRY stores in advance information relating to movement conditions when exposure is performed while relatively moving the projection optical system PL and the substrate P. Specifically, in the storage device MRY, the relative movement direction of the projection optical system PL and the substrate P when the respective shot areas S1 to S21 are subjected to immersion exposure, and the ejection ports 32 corresponding to the movement direction are provided. The relationship with the injection conditions is stored.

  Here, the ejection condition of the ejection port 32 in the present embodiment includes the direction in which the liquid LQ is ejected from the ejection port 32 (32A to 32D) with respect to the optical path space K1. The control device CONT selects the ejection port for ejecting the liquid LQ from the plurality of ejection ports 32A to 32D according to the moving direction of the substrate P with respect to the projection optical system PL, thereby causing the liquid LQ to be supplied to the optical path space K1. Adjust the jetting direction. Specifically, the control device CONT ejects the liquid LQ from the ejection ports provided on the front side in the movement direction of the substrate P among the plurality of ejection ports 32A to 32D.

  For example, as shown in FIG. 13A, when the substrate P is moved in the + X direction with respect to the projection optical system PL, the control device CONT is provided on the + X side of the optical path space K1. The liquid LQ is ejected from the one ejection port 32A, and the ejection of the liquid LQ from the other ejection ports 32B, 32C, 32D is stopped. Thus, even if the liquid LQ in the optical path space K1 leaks to the + X side as the substrate P moves to the + X side, the reverse direction (by the force of the liquid LQ ejected from the first ejection port 32A ( (X direction) momentum can be applied, and leakage of the liquid LQ can be prevented.

  On the other hand, as shown in FIG. 13B, when the substrate P is moved in the −X direction with respect to the projection optical system PL, the control device CONT is provided on the −X side of the optical path space K1. The liquid LQ is ejected from the third ejection port 32C, and the ejection of the liquid LQ from the other ejection ports 32A, 32B, 32D is stopped. By doing so, even if the liquid LQ in the optical path space K1 leaks to the −X side as the substrate P moves to the −X side, the reverse is caused by the force of the liquid LQ ejected from the third ejection port 32C. The momentum in the direction (+ X direction) can be given, and leakage of the liquid LQ can be prevented.

FIG. 14 is a schematic diagram for explaining the relationship between the movement direction of the substrate P and the ejection ports selected according to the movement direction. As shown by the arrow y P of FIG. 14 (A), when moving the substrate P in the + X direction, as described with reference to FIG. 13 (A), the control unit CONT, the first injection port 32A From which liquid LQ is ejected. Further, as shown in FIG. 14B, when the substrate P moves in the + Y direction, the control device CONT ejects the liquid LQ from the second ejection port 32B provided on the front side in the movement direction of the substrate P. To do. Further, as shown in FIG. 14C, when the substrate P moves in the + Y-side tilt direction with respect to the + X direction, the control device CONT is provided in the first direction provided in the moving direction of the substrate P. The liquid LQ is ejected from each of the ejection port 32A and the second ejection port 32B. Further, as shown in FIG. 14D, when the substrate P moves in the tilt direction on the −Y side with respect to the + X direction, the control device CONT is provided on the front side in the movement direction of the substrate P. The liquid LQ is ejected from each of the first ejection port 32A and the fourth ejection port 32D. Further, as shown in FIG. 14E, when the substrate P moves in the inclination direction on the −Y side with respect to the −X direction, the control device CONT is provided on the front side in the movement direction of the substrate P. The liquid LQ is ejected from each of the third ejection port 32C and the fourth ejection port 32D. Further, as shown in FIG. 14F, when the substrate P moves in the inclination direction on the + Y side with respect to the −X direction, the control device CONT is provided on the front side in the movement direction of the substrate P. The liquid LQ is ejected from each of the second ejection port 32B and the third ejection port 32C.

  As described above, the leakage of the liquid LQ is satisfactorily suppressed by adjusting the direction in which the liquid LQ is ejected from the ejection port 32 according to the moving direction of the substrate P with respect to the optical path space K1 (projection optical system PL). be able to. Then, by ejecting the liquid LQ to the optical path space K1 from the front side in the movement direction of the substrate P, a momentum to the rear side in the movement direction of the substrate P is given to the liquid LQ filled in the optical path space K1, The leakage of the liquid LQ can be prevented satisfactorily. Further, by preventing the liquid LQ from being ejected from the rear side in the movement direction of the substrate P, it is possible to prevent inconveniences such as the flow of the liquid LQ filled in the optical path space K1 and the leakage of the liquid LQ. it can. In addition, by not ejecting the liquid LQ excessively, it is possible to prevent inconveniences such as the substrate P being deformed / displaced due to the force of the liquid LQ to be ejected or vibrations.

  In the present embodiment, the flow rate of the liquid LQ ejected from each of the ejection ports 32A to 32D can be adjusted according to the moving speed of the substrate P. For example, by storing in advance in the storage device MRY information regarding the moving speed of the substrate P (including the scanning speed in the X-axis direction and the stepping speed in the Y-axis direction) in addition to the moving direction of the substrate P. The control device CONT adjusts the direction in which the liquid LQ is ejected by selecting the ejection port that ejects the liquid LQ from among the plurality of ejection ports 32A to 32D based on the stored information, and the selected ejection port It is possible to adjust the flow rate of the liquid LQ ejected from the liquid. In addition, by providing the sensor which can detect the moving direction and moving speed of the board | substrate P (substrate stage PST), the control apparatus CONT is based on the detection result of the sensor among several injection opening 32A-32D. By selecting an ejection port for ejecting the liquid LQ, the direction in which the liquid LQ is ejected can be adjusted, and the flow rate of the liquid LQ ejected from the selected ejection port can be adjusted. Further, when scanning exposure of the substrate P, the substrate P (substrate stage PST) moves in the order of, for example, an acceleration section, a steady section (constant speed section), and a deceleration section. The flow velocity of the liquid LQ ejected from the ejection port 32 can be adjusted according to the acceleration section, the steady section, and the deceleration section of (PST).

  In the present embodiment, the number of the injection ports 32 is four, that is, the first to fourth injection ports 32A to 32D. Of course, any plural (for example, eight) can be provided.

  In the present embodiment, when the liquid LQ is ejected from a specific ejection port (for example, 32A) selected according to the moving direction of the substrate P among the plurality of ejection ports, the other ejection ports (32B , 32C, 32D), the liquid LQ is stopped from being ejected. However, if the liquid LQ does not leak and the flow of the liquid LQ in the optical path space K1 is not disturbed, a predetermined flow velocity is obtained from another ejection port. The liquid LQ may be ejected at (flow rate).

<Fourth embodiment>
Next, a fourth embodiment will be described with reference to FIG. In FIG. 15, on the lower surface 75 of the nozzle member 70, an inner injection port 32E provided on the outer side of the recovery port 22 with respect to the optical path space K1, and an outer side of the inner injection port 32E with respect to the optical path space K1. The outer injection port 32F is provided. The inner ejection port 32E ejects the liquid LQ toward a space between the recovery port 22 and the substrate P or a predetermined region facing the recovery port 22 in the substrate P, and the outer recovery port 32F Of these, the liquid LQ is provided to be ejected toward a region that is outside the region where the liquid LQ is ejected from the inner ejection port 32 </ b> E and is opposed to the recovery port 22. As described above, the liquid ejecting mechanism 3 may eject the liquid LQ onto the interface LG of the liquid LQ in the liquid immersion region LR at different positions with respect to the Z-axis direction.

<Fifth Embodiment>
Next, a fifth embodiment will be described with reference to FIG. In FIG. 16, on the upper surface of the nozzle member 70, an inner peripheral wall 71 formed so as to surround the projection optical system PL, and provided outside the inner peripheral wall 71 with respect to the projection optical system PL, the projection optical system An outer peripheral wall portion 72 provided so as to surround the PL and the inner peripheral wall portion 71 is provided. The nozzle member 70 can hold the liquid LQ in a space 70 </ b> G surrounded by the upper surface, the inner peripheral wall portion 71 and the outer peripheral wall portion 72. In addition, the liquid immersion mechanism 1 includes a liquid recovery mechanism 190 that can recover the liquid LQ held in the space 70G. The liquid recovery mechanism 190 includes a liquid recovery unit 191 including a vacuum system capable of sucking and recovering the liquid LQ, and a recovery pipe 192 having one end connected to the liquid recovery unit 191 and the other end disposed in the space 70G. ing. The controller CONT can recover the liquid LQ held in the space 70G via the recovery pipe 192 by driving the liquid recovery unit 191.

  The liquid immersion mechanism 1 of the present embodiment fills the optical path space K1 with the liquid LQ, and also supplies the liquid LQ to the space that forms the gap G1 between the side surface LT of the projection optical system PL and the inner side surface 70T of the nozzle member 70. The liquid LQ is supplied and recovered to the extent that it is filled. Further, the liquid immersion mechanism 1 supplies and recovers the liquid LQ to such an extent that the liquid LQ filled in the space forming the gap G1 passes through the upper surface of the inner peripheral wall 71 and flows out into the space 70G. That is, the liquid immersion mechanism 1 fills the space forming the optical path space K1 and the gap G1 with the liquid LQ at least during the exposure of the substrate P, and also fills the liquid LQ filled with the space forming the optical path space K1 and the gap G1. Is overflowed from the inner peripheral wall portion 71 into the space 70G. The liquid recovery mechanism 190 is provided so as to overflow the inner peripheral wall 71 from the space forming the gap G1 and recover the liquid LQ filled in the space 70G.

  The control device CONT uses the liquid immersion mechanism 1 to continuously supply the liquid LQ to the optical path space K1 so that the liquid LQ in the space forming the gap G1 always overflows into the space 70G. The height of the liquid level can be maintained almost constant. Therefore, the pressure of the liquid LQ filled in the space forming the gap G1 and the optical path space K1 connected to the space can be maintained substantially constant. Therefore, even if the liquid LQ ejected from the ejection port 32 is added to the liquid LQ that fills the optical path space K1, the liquid LQ flows out to the space 70G via the inner peripheral wall portion 71, so the pressure of the liquid LQ in the optical path space K1 Can be maintained substantially constant. Therefore, it is possible to prevent the occurrence of inconvenience such as displacement or deformation of the substrate P and the first optical element LS1 due to the pressure fluctuation of the liquid LQ in the optical path space K1.

<Sixth Embodiment>
Next, a sixth embodiment will be described with reference to FIG. As shown in FIG. 17, the ejection direction of the liquid LQ ejected from the ejection port 32 may be bent halfway. In order to bend the ejection direction of the liquid LQ ejected from the ejection port 32, for example, by providing a protrusion that serves as a flow resistance on the lower surface 75 of the nozzle member 70 on the optical path space K1 side from the ejection port 32, The injection direction of the liquid LQ can be bent. Alternatively, the jet direction of the liquid LQ can be bent by electric power or magnetic force. Or the injection direction of the liquid LQ can also be bent by spraying gas on the injected liquid LQ.

  Alternatively, as shown in the schematic diagram of FIG. 18, on the lower surface 75 of the nozzle member 70, an inner injection port 32G provided outside the recovery port 22 with respect to the optical path space K1, and an inner injection port with respect to the optical path space K1. An outer injection port 32H provided further outside than 32G is provided to inject the liquid LQ at a first flow rate from the inner injection port 32G, and a second flow rate that is faster than the first flow rate from the outer injection port 32H. The liquid LQ ejected at the first flow velocity and the liquid LQ ejected at the second flow velocity are merged to bend the liquid LQ ejected from the outer ejection port 32H. You can also. When the liquid LQ ejected at a slow flow rate (first flow rate) is merged onto the liquid LQ ejected at a fast flow rate (second flow rate), the liquid LQ ejected at a fast flow rate (second flow rate) At the junction with the liquid LQ ejected at a low flow velocity (first flow velocity), a moment is generated in the liquid LQ ejected at a high flow velocity (second flow velocity), and the flow of the liquid LQ ejected at a high flow velocity The liquid LQ jetted at a high flow rate is bent toward the liquid LQ jetted at a low flow rate. Therefore, the injection direction of the liquid LQ injected from the outer injection port 32H can be bent.

  Leakage of the liquid LQ can be better suppressed by reducing the angle θ between the injection direction of the liquid LQ ejected from the ejection port 32 and the surface of the substrate P as much as possible, but the ejection of the liquid LQ ejected from the ejection port 32 By bending the direction in the middle, even when the ejection port 32 is provided at a position close to the optical path space K1, the angle θ between the ejection direction of the liquid LQ near the interface LG of the liquid LQ and the surface of the substrate P is reduced. be able to. Accordingly, it is possible to satisfactorily prevent the liquid LQ from leaking while reducing the size of the nozzle member 70 and thus reducing the overall size of the exposure apparatus EX.

  Further, by appropriately adjusting the angle θ between the jet direction of the liquid LQ ejected from the jet port 32 and the surface of the substrate P, the position at which the liquid LQ is sprayed onto the substrate P can be appropriately adjusted. For example, in FIG. 18 described above, the liquid LQ is sprayed onto the substrate P by adjusting at least one of the flow rate of the liquid LQ ejected from the inner ejection port 32G and the flow rate of the liquid LQ ejected from the outer ejection port 32H. The position can be adjusted. By adjusting the position at which the liquid LQ is sprayed on the substrate P, even if the contact angle condition of the substrate P with the liquid LQ changes, the desired position (in the immersion region LR of the liquid LQ formed on the substrate P ( For example, the liquid LQ ejected from the ejection port 32 can be applied to the lower end portion of the interface LG of the liquid LQ in the immersion region LR. That is, as described with reference to FIG. 10 and the like, the contact angle with the liquid LQ of the substrate P changes according to the film (resist, topcoat film) coated on the base material 100 of the substrate P. In accordance with the contact angle of the substrate P with the liquid LQ, the position of the lower end portion of the interface LG of the liquid immersion region LR formed on the substrate P with respect to the optical path space K1 varies. Specifically, as shown in FIG. 19A, when the contact angle between the substrate P and the liquid LQ is large, the lower end portion of the interface LG may be provided at a position close to the optical path space K1. . In such a case, at least one of the flow velocity of the liquid LQ ejected from the inner ejection port 32G and the flow velocity of the liquid LQ ejected from the outer ejection port 32H is appropriately adjusted, and the ejection direction of the liquid LQ ejected from the ejection port By adjusting the above, the liquid LQ ejected from the ejection port can be applied to the lower end portion of the interface LG of the liquid immersion region LR. On the other hand, as shown in FIG. 19B, when the contact angle of the substrate P with the liquid LQ is small, the lower end portion of the interface LG may be provided at a position far from the optical path space K1. In such a case, at least one of the flow velocity of the liquid LQ ejected from the inner ejection port 32G and the flow velocity of the liquid LQ ejected from the outer ejection port 32H is appropriately adjusted, and the ejection direction of the liquid LQ ejected from the ejection port By adjusting the above, the liquid LQ ejected from the ejection port can be applied to the lower end portion of the interface LG of the liquid immersion region LR.

<Seventh embodiment>
Next, a seventh embodiment will be described with reference to FIG. The characteristic part of the present embodiment is that the injection port 32 for injecting the liquid LQ is provided in the second nozzle member 30 different from the nozzle member 70. In FIG. 20, the second nozzle member 30 is a member different from the nozzle member 70, is provided in the vicinity of the nozzle member 70, and is provided outside the nozzle member 70 with respect to the optical path space K1. The second nozzle member 30 is an annular member, and is disposed so as to surround the optical path space K1 and the nozzle member 70 above the substrate P (substrate stage PST). An ejection port 32 is provided on the lower surface 35 of the second nozzle member 30 that faces the substrate P (substrate stage PST).

  The second nozzle member 30 is supported by a second support mechanism 92, and the second support mechanism 92 is connected to the lower step portion 8 of the main column 9. The nozzle member 70 supported by the first support mechanism 91 and the second nozzle member 30 supported by the second support mechanism 92 are separated from each other. The second support mechanism 92 includes a driving device 95 that drives the second nozzle member 30. The drive device 95 is capable of moving the second nozzle member 30 supported by the second support mechanism 92 in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions.

  The operation of the driving device 95 is controlled by the control device CONT. The control device CONT can adjust the position and posture (tilt) of the second nozzle member 30 supported by the second support mechanism 92 by driving the drive device 95. Further, since the second nozzle member 30 is driven by the driving device 95, the ejection port 32 provided in the second nozzle member 30 is filled with the recovery port 22 provided in the nozzle member 70 and the optical path space K1. It is movable with respect to the interface LG of the liquid LQ.

  Further, the exposure apparatus EX includes a nozzle position detection device 96 that detects the positional relationship between the main column 9 and the second nozzle member 30. In the present embodiment, the nozzle position detection device 96 includes a plurality of laser interferometers, and the plurality of laser interferometers are fixed at predetermined positions of the main column 9. Each of the plurality of predetermined positions of the second nozzle member 30 is provided with a reflection surface 97 for a laser interferometer that constitutes the nozzle position detection device 96. The control device CONT is based on the detection result of the nozzle position detection device 96 having a plurality of interferometers, and the main column 9 relating to directions of six degrees of freedom (X-axis, Y-axis, Z-axis, θX, θY, and θZ directions). The position of the second nozzle member 30 with respect to can be obtained.

  Further, the control device CONT can monitor the position of the second nozzle member 30 relative to the main column 9 based on the detection result of the nozzle position detection device 96, and is driven based on the detection result of the nozzle position detection device 96. By driving the device 95, the second nozzle member 30 can be positioned at a desired position with respect to the main column 9. When the surface position information of the surface of the substrate P is detected by the focus / leveling detection system, the control device CONT determines the surface of the substrate P relative to the main column 9 based on the detection result of the focus / leveling detection system. Position information can be obtained. Therefore, the control device CONT can control the positional relationship between the second nozzle member 30 and the surface of the substrate P, and consequently the positional relationship between the ejection port 32 and the surface of the substrate P, with the main column 9 as a reference.

  As described above, the second nozzle member 30 different from the nozzle member 70 may be provided, and the injection port 32 for injecting the liquid LQ to the second nozzle member 30 may be provided.

  In the present embodiment, the drive device 95 for adjusting the position of the second nozzle member 30 is mounted, but the drive device 95 is omitted and the second nozzle member 30 is fixed to the main column 9. You may make it support.

  In the first to seventh embodiments described above, the injection amount per unit time of the liquid LQ ejected from the ejection port 32 may be larger than the liquid supply amount per unit time supplied from the supply port 12. However, it may be less or almost the same amount. The ejection amount per unit time of the liquid LQ ejected from the ejection port 32 can be appropriately adjusted according to the exposure conditions including the movement condition of the substrate P, the contact angle condition, and the like.

  In the first to seventh embodiments described above, a second recovery port for recovering the liquid LQ, which is different from the recovery port 22, may be provided outside the ejection port 32 with respect to the optical path space K1.

  In the first to seventh embodiments described above, the first liquid supply device 11 and the second liquid supply device 31 are provided separately, but the liquid immersion mechanism 1 and the liquid ejection mechanism 3 are one liquid. A supply device may also be used.

  As described above, in the first to seventh embodiments, the nozzle member 70 (or the second nozzle member 30) having the ejection port 32 functions as a seal mechanism that encloses the liquid LQ inside the recovery port 22, The leakage of the liquid LQ to the outside of the recovery port 22 can be prevented or suppressed.

  In each of the above-described embodiments, the liquid immersion mechanism 1 is provided so as to recover only the liquid LQ via the recovery port 22. Hereinafter, the principle of the liquid recovery operation by the liquid immersion mechanism 1 will be described with reference to FIG. FIG. 21 is an enlarged cross-sectional view of a part of the porous member 25 and is a schematic diagram for explaining the liquid recovery operation performed through the porous member 25.

  In FIG. 21, the recovery port 22 is provided with a porous member 25. A substrate P is provided below the porous member 25. A gas space and a liquid space are formed between the porous member 25 and the substrate P. More specifically, a gas space is formed between the first hole 25Ha of the porous member 25 and the substrate P, and a liquid space is formed between the second hole 25Hb of the porous member 25 and the substrate P. Yes. A recovery flow path (flow path space) 24 is formed on the upper side of the porous member 25.

The pressure in the space K3 between the first hole 25Ha of the porous member 25 and the substrate P (pressure on the lower surface of the porous member 25H) is Pa, and the pressure in the flow path space 24 above the porous member 25 (upper surface of the porous member 25). ) Is Pc, the hole diameters (diameters) of the holes 25Ha and 25Hb are d, the contact angle of the porous member 25 (inner surface of the hole 25H) with the liquid LQ is θ, and the surface tension of the liquid LQ is γ, The liquid immersion mechanism 1 of this embodiment is
(4 × γ × cos θ) / d ≧ (Pa−Pc) (1)
It is set to satisfy the conditions. In the above formula (1), the hydrostatic pressure of the liquid LQ on the upper side of the porous member 25 is not taken into consideration for the sake of simplicity.

In this case, the contact angle θ of the porous member 25 (the inner surface of the hole 25H) with the liquid LQ is
θ ≤ 90 ° (2)
It is necessary to satisfy the conditions.

  When the above conditions are satisfied, even when a gas space is formed below the first hole 25Ha (substrate P side) of the porous member 25, the gas in the space K3 below the porous member 25 passes through the hole 25Ha. The movement (intrusion) into the flow path space 24 above the porous member 25 is prevented. That is, the pore diameter d of the porous member 25, the contact angle (affinity) θ of the porous member 25 with the liquid LQ, the surface tension γ of the liquid LQ, and the pressures Pa and Pc are optimized so as to satisfy the above conditions. Thus, the interface between the liquid LQ and the gas can be maintained inside the first hole 25Ha of the porous member 25, and the gas can be prevented from entering the channel space 24 from the space K3 via the first hole 25Ha. Can do. On the other hand, since the liquid space is formed below the second hole 25Hb (substrate P side) of the porous member 25, only the liquid LQ can be recovered through the second hole 25Hb.

  In the present embodiment, the pressure Pa of the lower space K3 of the porous member 25, the hole diameter d, the contact angle θ of the porous member 25 (the inner surface of the hole 25H) with the liquid LQ, and the surface tension of the liquid (pure water) LQ. γ is substantially constant, and the liquid immersion mechanism 1 controls the suction force of the liquid recovery device 21 to adjust the pressure Pc in the flow path space 24 above the porous member 25 so as to satisfy the above condition.

  In the above equation (1), as the absolute value of (Pa−Pc) is larger, that is, as the absolute value of ((4 × γ × cos θ) / d) is larger, the pressure Pc that satisfies the above condition is satisfied. Therefore, it is desirable that the hole diameter d is as small as possible and the contact angle θ of the porous member 25 with the liquid LQ is as small as possible. In the present embodiment, the porous member 25 is lyophilic with respect to the liquid LQ, and has a sufficiently small contact angle θ.

  Thus, in this embodiment, the pressure difference (the pressure difference between the upper surface and the lower surface of the porous member 25) between the upper space 24 and the lower space K3 of the porous member 25 in a state where the porous member 25 is wet. By controlling to satisfy the above conditions, only the liquid LQ is recovered from the holes 25H of the porous member 25. Thereby, generation | occurrence | production of the vibration resulting from attracting | sucking the liquid LQ and gas together can be suppressed.

  As described above, the liquid LQ in the present embodiment is composed of pure water. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. .

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be about 1.44, and ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL. On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution can be obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

  In the present embodiment, the first optical element LS1 is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, such as aberration (spherical aberration, coma aberration, etc.) are adjusted by this optical element. Can do. The optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a plane parallel plate that can transmit the exposure light EL.

  Note that when the pressure between the first optical element LS1 at the tip of the projection optical system PL generated by the flow of the liquid LQ and the substrate P is large, the optical element is not exchangeable, and the optical is controlled by the pressure. The element may be firmly fixed so as not to move.

  In the present embodiment, the space between the projection optical system PL and the surface of the substrate P is filled with the liquid LQ. However, for example, the liquid with the cover glass made of a plane-parallel plate attached to the surface of the substrate P is used. The structure which satisfy | fills LQ may be sufficient.

  In the projection optical system of the above-described embodiment, the optical path space on the image plane side of the optical element at the tip is filled with liquid, but as disclosed in International Publication No. 2004/019128, the optical at the tip is used. It is also possible to employ a projection optical system in which the optical path space on the mask side of the element is filled with liquid.

The liquid LQ of the present embodiment is water, but may be a liquid other than water. For example, when the light source of the exposure light EL is an F 2 laser, the F 2 laser light does not pass through water. The liquid LQ may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F 2 laser light. In this case, the lyophilic treatment is performed by forming a thin film with a substance having a molecular structure having a small polarity including fluorine, for example, at a portion in contact with the liquid LQ. In addition, as the liquid LQ, the liquid LQ is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention can also be applied to a twin stage type exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 10-163099, Japanese Patent Application Laid-Open No. 10-214783, and Japanese Translation of PCT International Publication No. 2000-505958.

  Further, as disclosed in JP-A-11-135400 and JP-A-2000-164504, a measurement stage equipped with a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and various photoelectric sensors. The present invention can also be applied to an exposure apparatus including the above.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  In the above-described embodiment, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive substrate is used. As disclosed in US Pat. No. 6,778,257, an electronic mask that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed may be used.

  Further, as disclosed in International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line-and-space pattern on a substrate P by forming interference fringes on the substrate P. The present invention can also be applied.

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. To ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 22, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows the exposure apparatus which concerns on 1st Embodiment. It is a partially broken figure of the schematic perspective view which expanded the principal part of the exposure apparatus which concerns on 1st Embodiment. It is the perspective view which looked at FIG. 2 from the lower side. FIG. 3 is a side sectional view parallel to the YZ plane of FIG. 2. FIG. 3 is a side sectional view parallel to the XZ plane of FIG. 2. It is a figure which shows an example of a deaeration apparatus. It is a schematic diagram for demonstrating the behavior of the liquid accompanying a movement of a board | substrate. It is the schematic diagram which expanded the principal part for demonstrating operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a figure for demonstrating 2nd Embodiment, Comprising: It is a sectional side view which shows a board | substrate. It is a figure which shows the principal part of the exposure apparatus which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating operation | movement of the exposure apparatus which concerns on 3rd Embodiment. It is a figure which shows the principal part of the exposure apparatus which concerns on 4th Embodiment. It is a figure which shows the principal part of the exposure apparatus which concerns on 5th Embodiment. It is a figure which shows the principal part of the exposure apparatus which concerns on 6th Embodiment. It is a figure which shows the principal part of the exposure apparatus which concerns on 6th Embodiment. It is a figure which shows the principal part of the exposure apparatus which concerns on 6th Embodiment. It is a figure which shows the principal part of the exposure apparatus which concerns on 7th Embodiment. It is a figure for demonstrating the principle of the liquid collection | recovery operation | movement by a liquid immersion mechanism. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid immersion mechanism, 3 ... Liquid injection mechanism, 12 ... Supply port, 22 ... Recovery port, 31B ... Deaeration device, 32 ... Injection port, 34 ... Supply flow path, 34A ... 1st flow path part, 34B ... 1st 2 channel sections, 37 ... buffer space, 70 ... nozzle member, 100 ... substrate, 101 ... film member, 102 ... second film member, CONT ... control device, EL ... exposure light, EX ... exposure device, K1 ... optical path Space, LQ ... Liquid, P ... Substrate, PL ... Projection optical system

Claims (16)

  1. In an exposure apparatus that exposes the substrate by irradiating the substrate with exposure light through a liquid,
    A supply port for supplying the liquid;
    A recovery port that is provided outside the supply port with respect to the optical path space and recovers the liquid;
    An exposure apparatus including an ejection port that is provided outside the recovery port with respect to the optical path space and ejects liquid.
  2.   The exposure apparatus according to claim 1, wherein the ejection port is provided at a position facing the substrate, and ejects liquid in an inclined direction toward the optical path space.
  3.   The exposure apparatus according to claim 1, wherein the recovery port is provided at a position facing the substrate, and the ejection port ejects a liquid between the recovery port and the substrate.
  4.   The exposure apparatus according to claim 1, wherein the recovery port is provided at a position facing the substrate, and the ejection port ejects liquid toward a region of the substrate facing the recovery port.
  5.   The exposure apparatus according to claim 1, wherein the ejection port is provided so as to surround the optical path space.
  6. A flow path for supplying a liquid to the ejection port;
    The said flow path has a 1st flow path part connected to the said injection port, and a 2nd flow path part containing the buffer space larger than the said 1st flow path part. Exposure equipment.
  7.   The exposure apparatus according to claim 1, wherein the ejection port is formed in a slit shape having a predetermined length.
  8.   The exposure apparatus according to claim 1, further comprising a deaeration device that reduces a gas component in the liquid ejected from the ejection port.
  9.   The exposure apparatus as described in any one of Claims 1-8 provided with the control apparatus which adjusts the injection conditions of the said injection opening according to exposure conditions.
  10. The exposure condition includes a moving condition when performing exposure while moving the substrate,
    The exposure apparatus according to claim 9, wherein the control device adjusts the ejection condition according to the movement condition.
  11. The moving condition includes a relative moving speed between the projection optical system and the substrate,
    The exposure apparatus according to claim 10, wherein the control device adjusts a flow rate of the liquid ejected from the ejection port according to the moving speed.
  12.   The exposure apparatus according to claim 11, wherein the control device makes a flow rate of the liquid ejected from the ejection port larger than the moving speed.
  13. The movement condition includes a relative movement direction of the projection optical system and the substrate,
    The ejection port can eject liquid from a plurality of directions with respect to the optical path space;
    The exposure apparatus according to claim 10, wherein the control device adjusts a direction in which the liquid is ejected from the ejection port according to the movement direction.
  14. The exposure conditions include a contact angle condition between a film member formed on the liquid contact surface on the substrate and the liquid,
    The exposure apparatus according to claim 9, wherein the control device adjusts the ejection condition according to the contact angle condition.
  15.   The exposure apparatus according to claim 1, wherein the liquid ejection operation of the ejection port is continued during exposure of the substrate.
  16. The device manufacturing method using the exposure apparatus as described in any one of Claims 1-15.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1966652B1 (en) * 2005-12-22 2011-06-29 Freescale Semiconductor, Inc. Immersion lithography apparatus and method of performing immersion lithography
US7701551B2 (en) 2006-04-14 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8004651B2 (en) * 2007-01-23 2011-08-23 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
SG159467A1 (en) * 2008-09-02 2010-03-30 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method
NL2003333A (en) * 2008-10-23 2010-04-26 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2003820A (en) * 2008-12-22 2010-06-23 Asml Netherlands Bv Fluid handling structure, table, lithographic apparatus, immersion lithographic apparatus, and device manufacturing methods.
JP2010205914A (en) * 2009-03-03 2010-09-16 Nikon Corp Exposure device, exposure method, and method for manufacturing device
NL2009472A (en) * 2011-10-24 2013-04-25 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
CN104035290B (en) * 2014-06-24 2015-11-25 浙江大学 One kind of gas sealed immersion lithography machine and two liquid recovery apparatus for porous
CN104614949B (en) * 2015-02-10 2016-06-29 河南理工大学 A super-resolution high aspect ratio structures and methods nanolithography

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012228A (en) * 2003-06-19 2005-01-13 Asml Holding Nv Immersion photolithographic system and method of using microchannel nozzle
JP2005019864A (en) * 2003-06-27 2005-01-20 Canon Inc Exposure device and method
JP2005026334A (en) * 2003-06-30 2005-01-27 Nikon Corp Stage apparatus and charged particle beam exposure device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110104084A (en) * 2003-04-09 2011-09-21 가부시키가이샤 니콘 Immersion lithography fluid control system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012228A (en) * 2003-06-19 2005-01-13 Asml Holding Nv Immersion photolithographic system and method of using microchannel nozzle
JP2005019864A (en) * 2003-06-27 2005-01-20 Canon Inc Exposure device and method
JP2005026334A (en) * 2003-06-30 2005-01-27 Nikon Corp Stage apparatus and charged particle beam exposure device

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