JP4479269B2 - Exposure apparatus and device manufacturing method - Google Patents

Description

  The present invention relates to an exposure apparatus and a device manufacturing method for exposing a substrate by irradiating the substrate with exposure light via a projection optical system and a liquid.

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. In recent years, in order to cope with higher integration of device patterns, higher resolution of the projection optical system is desired. The resolution of the projection optical system becomes higher as the exposure wavelength used is shorter and the numerical aperture of the projection optical system is larger. Therefore, the exposure wavelength used in the exposure apparatus is shortened year by year, and the numerical aperture of the projection optical system is also increasing. The mainstream exposure wavelength is 248 nm of the KrF excimer laser, but the 193 nm of the shorter wavelength ArF excimer laser is also being put into practical use. Also, when performing exposure, the depth of focus (DOF) is important as well as the resolution. The resolution R and the depth of focus δ are each expressed by the following equations.
R = k ₁ · λ / NA (1)
δ = ± k ₂ · λ / NA ² (2)
Here, λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, and k ₁ and k ₂ are process coefficients. From the equations (1) and (2), it can be seen that the depth of focus δ becomes narrower when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to increase the resolution R.

If the depth of focus δ becomes too narrow, it becomes difficult to match the substrate surface with the image plane of the projection optical system, and the focus margin during the exposure operation may be insufficient. Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, a liquid immersion method disclosed in Patent Document 1 below has been proposed. In this immersion method, a space between the lower surface of the projection optical system and the substrate surface is filled with a liquid such as water or an organic solvent to form an immersion region, and the wavelength of exposure light in the liquid is 1 / n of that in air. (Where n is the refractive index of the liquid, which is usually about 1.2 to 1.6), the resolution is improved, and the depth of focus is expanded about n times.
International Publication No. 99/49504 Pamphlet

  By the way, if the pressure of the liquid filled between the projection optical system and the substrate is not maintained at a desired pressure, for example, the projection optical system in contact with the substrate, the substrate stage, or the liquid in accordance with the fluctuation of the liquid pressure. A part of the optical system (such as an optical element closest to the image plane) is slightly deformed, and the exposure and measurement accuracy may be deteriorated due to the deformation. When the liquid pressure fluctuates, part of the projection optical system in contact with the liquid (such as the optical element closest to the image plane) vibrates and the pattern image projected on the substrate deteriorates, The measurement accuracy via the projection optical system and the liquid deteriorates.

  The present invention has been made in view of such circumstances, and provides an exposure apparatus capable of preventing deterioration in exposure accuracy and measurement accuracy due to liquid pressure, and a device manufacturing method using the exposure apparatus. Objective.

In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 8 shown in the embodiment.
The exposure apparatus (EX) of the present invention forms a liquid immersion area (AR2) of the liquid (LQ) between the projection optical system (PL) and the substrate (P), and the projection optical system (PL) and the liquid (LQ). In the exposure apparatus that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL) through a liquid crystal (LQ), the liquid (LQ) among a plurality of optical members constituting the projection optical system (PL). It is provided so as to surround the side surface (2T) of the optical member (2) in contact with the side surface of the holding member (PK) that holds the optical member (2), and at least of the liquid supply port (13) or the liquid recovery port (23) A liquid (LQ) having an annular member (70) having either one of them and entering the gap (G) between the side surface of the optical member (2) or the holding member (PK) and the annular member (70) is predetermined. The pressure of the liquid (LQ) in the liquid immersion area (AR2) so as not to enter more than the height of the liquid And adjusting the.

  According to the present invention, by adjusting the pressure of the liquid in the liquid immersion area, for example, deformation (distortion) of an optical member in contact with the liquid in the substrate, the substrate stage, or the projection optical system can be prevented. . Further, by adjusting the pressure of the liquid in the liquid immersion region to suppress the pressure fluctuation, it is possible to prevent the substrate, the substrate stage, or the optical member from vibrating. In particular, by adjusting the pressure of the liquid in the liquid immersion region so that the liquid that has entered the gap between the side surface of the optical member or the holding member and the annular member does not enter more than a predetermined height, the side surface of the optical member The force received from the liquid can be reduced, and distortion and deformation of the optical member can be prevented. Therefore, high exposure accuracy and measurement accuracy can be obtained.

  The device manufacturing method of the present invention uses the above-described exposure apparatus (EX). According to the present invention, it is possible to prevent deterioration in exposure accuracy and measurement accuracy due to the pressure of the liquid in the immersion region, and thus it is possible to manufacture a device having desired performance.

  According to the present invention, it is possible to prevent deterioration in exposure accuracy and measurement accuracy due to the pressure of the liquid in the immersion region, and thus it is possible to manufacture a device having desired performance.

The exposure apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic block diagram showing an embodiment of the exposure apparatus of the present invention.
In FIG. 1, an exposure apparatus EX includes a mask stage MST that supports a mask M, a substrate stage PST that supports a substrate P, and an illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light EL. A projection optical system PL that projects and exposes the pattern image of the mask M illuminated by the exposure light EL onto the substrate P supported by the substrate stage PST, and a control device CONT that controls the overall operation of the exposure apparatus EX. I have.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and substantially increase the depth of focus. A liquid supply mechanism 10 for supplying the liquid LQ to the substrate P, and a liquid recovery mechanism 20 for recovering the liquid LQ on the substrate P. The exposure apparatus EX, while transferring at least the pattern image of the mask M onto the substrate P, is applied to a part on the substrate P including the projection area AR1 of the projection optical system PL by the liquid LQ supplied from the liquid supply mechanism 10. An immersion area AR2 that is larger than the projection area AR1 and smaller than the substrate P is locally formed. Specifically, the exposure apparatus EX employs a local liquid immersion method in which the liquid LQ is filled between the optical element 2 at the image plane side end portion of the projection optical system PL and the surface of the substrate P disposed on the image plane side. The pattern of the mask M is projected onto the substrate P by irradiating the substrate P with the liquid LQ between the projection optical system PL and the substrate P and the exposure light EL that has passed through the mask M via the projection optical system PL. Exposure.

  Further, as will be described in detail later, the exposure apparatus EX includes a pressure adjustment mechanism 90 that adjusts the pressure of the liquid LQ supplied from the liquid supply mechanism 10. The pressure adjustment mechanism 90 includes a pressure adjustment liquid supply unit 91 that can further add the liquid LQ to the liquid LQ supplied from the liquid supply mechanism 10, and a pressure adjustment liquid recovery unit 92 that can recover a part of the liquid LQ. It has. The operation of the pressure adjustment mechanism 90 is controlled by the control device CONT.

  In the present embodiment, the exposure apparatus EX is a scanning exposure apparatus (so-called so-called exposure apparatus EX) that exposes the pattern formed on the mask M onto the substrate P while synchronously moving the mask M and the substrate P in different directions (reverse directions) in the scanning direction. A case where a scanning stepper) is used will be described as an example. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, the synchronous movement direction (scanning direction) between the mask M and the substrate P in the plane perpendicular to the Z-axis direction is the X-axis direction, A direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is defined as a Y-axis direction. In addition, the rotation (inclination) directions around the X axis, the Y axis, and the Z axis are the θX, θY, and θZ directions, respectively.

The illumination optical system IL illuminates the mask M supported by the mask stage MST with the exposure light EL, and the exposure light source, and an optical integrator and an optical integrator for uniformizing the illuminance of the light beam emitted from the exposure light source A condenser lens that collects the exposure light EL from the light source, a relay lens system, a variable field stop that sets the illumination area on the mask M by the exposure light EL in a slit shape, and the like. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm), or the like is used. In this embodiment, ArF excimer laser light is used.

  In the present embodiment, pure water is used as the liquid LQ. Pure water is not only ArF excimer laser light, but also far ultraviolet light (DUV light) such as ultraviolet emission lines (g-line, h-line, i-line) emitted from mercury lamps and KrF excimer laser light (wavelength 248 nm). Can also be transmitted.

  The mask stage MST is movable while holding the mask M. For example, the mask M is fixed by vacuum suction (or electrostatic suction). The mask stage MST can be moved two-dimensionally in the plane perpendicular to the optical axis AX of the projection optical system PL, that is, the XY plane, and can be slightly rotated in the θZ direction by a mask stage driving device MSTD including a linear motor or the like. The mask stage MST is movable at a scanning speed specified in the X-axis direction, and the movement stroke in the X-axis direction is such that the entire surface of the mask M can cross at least the optical axis AX of the projection optical system PL. have.

  A movable mirror 31 is provided on the mask stage MST. A laser interferometer 32 is provided at a position facing the moving mirror 31. The position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured in real time by the laser interferometer 32, and the measurement result is a control device. Output to CONT. The control device CONT controls the position of the mask M supported by the mask stage MST by driving the mask stage drive device MSTD based on the measurement result of the laser interferometer 32.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and includes a plurality of optical elements (optical members, lenses) 2 provided at the front end portion on the substrate P side. These optical elements are supported by a lens barrel PK. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4 or 1/5. Note that the projection optical system PL may be either an equal magnification system or an enlargement system.

The optical element 2 at the tip of the projection optical system PL of the present embodiment is exposed from the lens barrel PK, and the liquid LQ in the liquid immersion area AR2 comes into contact therewith. The optical element 2 is made of meteorite. Fluorite surface or because _{MgF 2,} Al ₂ O 3, the surface adhered with SiO ₂ or the like has a high affinity for water, be substantially entire surface contact with the liquid LQ of the liquid contact surface 2A of the optical element 2 it can. That is, in the present embodiment, the liquid (water) LQ having high affinity with the liquid contact surface 2A of the optical element 2 is supplied, so that the adhesion between the liquid contact surface 2A of the optical element 2 and the liquid LQ is high. And the optical path between the optical element 2 and the substrate P can be reliably filled with the liquid LQ. The optical element 2 may be quartz having a high affinity for water. Further, the liquid contact surface 2A of the optical element 2 may be subjected to a hydrophilization (lyophilic process) to further increase the affinity with the liquid LQ.

  The substrate stage PST is movable while holding the substrate P, and includes an XY stage 51 and a Z tilt stage 52 mounted on the XY stage 51. The XY stage 51 is supported in a non-contact manner above the upper surface of the stage base SB via a gas bearing (air bearing) which is a non-contact bearing (not shown). The XY stage 51 (substrate stage PST) is supported in a non-contact manner with respect to the upper surface of the stage base SB, and is in a plane perpendicular to the optical axis AX of the projection optical system PL by the substrate stage driving device PSTD including a linear motor and the like. That is, it can move two-dimensionally in the XY plane and can rotate in the θZ direction. A Z tilt stage 52 is mounted on the XY stage 51, and a substrate P is held on the Z tilt stage 52 by, for example, vacuum suction or the like via a substrate holder (not shown). The Z tilt stage 52 is movably provided in the Z-axis direction, the θX direction, and the θY direction. The substrate stage driving device PSTD is controlled by the control device CONT.

  A movable mirror 33 is provided on the substrate stage PST (Z tilt stage 52). A laser interferometer 34 is provided at a position facing the movable mirror 33. The two-dimensional position and rotation angle of the substrate P on the substrate stage PST are measured in real time by the laser interferometer 34, and the measurement result is output to the control device CONT. The controller CONT positions the substrate P supported by the substrate stage PST by driving the substrate stage driving device PSTD including a linear motor or the like based on the measurement result of the laser interferometer 34.

  Further, the exposure apparatus EX includes a focus / leveling detection system (80) described later for detecting the position of the surface of the substrate P supported by the substrate stage PST. The light reception result of the focus / leveling detection system is output to the control device CONT. The control device CONT can detect the position information of the surface of the substrate P in the Z-axis direction and the tilt information of the substrate P in the θX and θY directions based on the detection result of the focus / leveling detection system. The Z tilt stage 52 controls the focus position and tilt angle of the substrate P to adjust the surface of the substrate P to the image plane of the projection optical system PL by the auto focus method and the auto leveling method. Positioning is performed in the X-axis direction and the Y-axis direction. Needless to say, the Z tilt stage and the XY stage may be provided integrally.

  In the vicinity of the substrate stage PST, a substrate alignment system (not shown) for detecting an alignment mark on the substrate P or a reference mark provided on the substrate stage PST (Z tilt stage 52) is provided. A mask alignment system (not shown) for detecting a reference mark on the substrate stage PST (Z tilt stage 52) via the mask M and the projection optical system PL is provided in the vicinity of the mask stage MST. The mask alignment system constitutes an alignment system of a so-called TTM (through-the-mask) system (also referred to as a TTR (through-the-reticle) system). As the configuration of the substrate alignment system, for example, the one disclosed in JP-A-4-65603 can be used, and as the configuration of the mask alignment system, for example, disclosed in JP-A-7-176468. Can be used.

  A plate member 56 is provided on the substrate stage PST (Z tilt stage 52) so as to surround the substrate P held by the substrate stage PST. The plate member 56 is an annular member and is disposed outside the substrate P. The plate member 56 has a flat surface (flat portion) 57 having substantially the same height (level) as the surface of the substrate P held by the substrate stage PST. The flat surface 57 is disposed around the outside of the substrate P held by the substrate stage PST.

  The plate member 56 is formed of a material having liquid repellency such as polytetrafluoroethylene (Teflon (registered trademark)). Therefore, the flat surface 57 has liquid repellency. For example, the flat surface 57 may be made liquid-repellent by forming the plate member 56 with a predetermined metal and applying a liquid-repellent treatment to at least the flat surface 57 of the metal plate member 56. As the liquid repellent treatment of the plate member 56 (flat surface 57), for example, a fluorine-based resin material such as polytetrafluoroethylene, an acrylic resin material, a silicon-based resin material or the like is applied, or the above-described liquid repellent treatment is performed. A thin film made of a liquid material is attached. Further, the film for surface treatment may be a single layer film or a film composed of a plurality of layers. As the liquid repellent material for making it liquid repellent, a material that is insoluble in the liquid LQ is used. Further, the application area of the liquid repellent material may be applied to the entire surface of the plate member 56, or may be applied to only a part of the area requiring liquid repellency such as the flat surface 57, for example. You may do it.

  Since the plate member 56 having the flat surface 57 that is substantially flush with the surface of the substrate P is provided around the substrate P, even when the edge region E of the substrate P is subjected to immersion exposure, the plate member 56 is provided outside the edge portion of the substrate P. Since there is almost no step portion, the liquid LQ can be held under the projection optical system PL, and the liquid immersion area AR2 can be satisfactorily formed on the image plane side of the projection optical system PL. Further, by making the flat surface 57 liquid repellent, the liquid LQ is prevented from flowing out to the outside of the substrate P (outside the flat surface 57) during immersion exposure, and the liquid LQ is smoothly recovered even after immersion exposure. Thus, the liquid LQ can be prevented from remaining on the flat surface 57.

  The liquid supply mechanism 10 is for supplying a predetermined liquid LQ to the image plane side of the projection optical system PL, and includes a liquid supply unit 11 capable of delivering the liquid LQ and one end of the liquid supply unit 11. Supply pipes 12 (12A, 12B) to be connected are provided. The liquid supply unit 11 includes a tank that stores the liquid LQ, a pressure pump, and the like. When forming the liquid immersion area AR2 on the substrate P, the liquid supply mechanism 10 supplies the liquid LQ onto the substrate P.

  The liquid recovery mechanism 20 is for recovering the liquid LQ on the image plane side of the projection optical system PL, and has a liquid recovery part 21 that can recover the liquid LQ and one end connected to the liquid recovery part 21. The recovery pipe 22 (22A, 22B) is provided. The liquid recovery unit 21 includes, for example, a vacuum system (a suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, and a tank that stores the recovered liquid LQ. As a vacuum system, a vacuum system in a factory where the exposure apparatus EX is disposed may be used without providing the exposure apparatus EX with a vacuum pump. In order to form the immersion area AR2 on the substrate P, the liquid recovery mechanism 20 recovers a predetermined amount of the liquid LQ on the substrate P supplied from the liquid supply mechanism 10.

  A liquid recovery port 61 constituting a second liquid recovery mechanism 60 that recovers the liquid LQ that has flowed out of the substrate P is provided outside the plate member 56 in the Z tilt stage 52. The liquid recovery port 61 is an annular groove formed so as to surround the plate member 56, and a liquid absorbing member 62 made of a sponge-like member, a porous body, or the like is disposed therein. The liquid absorbing member 62 is replaceable. In addition, one end of a recovery channel formed inside the substrate stage PST is connected to the liquid recovery port 61, and the other end of the recovery pipe is a second liquid recovery unit (sometimes provided outside the substrate stage PST). Are also connected). The second liquid recovery unit, like the liquid recovery unit 21, is a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, and a tank that stores the recovered liquid LQ. It has.

  By providing the second liquid recovery mechanism 60, even if the liquid LQ flows out to the outside of the substrate P and the plate member 56, the outflowing liquid LQ can be recovered, and the substrate due to vaporization of the outflowing liquid LQ. It is possible to prevent the occurrence of inconvenience such as an environmental change where P is placed. The second liquid recovery mechanism 60 (second liquid recovery unit) may be configured to spill the liquid LQ recovered by the liquid absorbing member 62 outside the substrate stage PST by its own weight without providing a vacuum system. Furthermore, without providing the second liquid recovery unit including the vacuum system, only the liquid absorbing member 62 is disposed on the substrate stage PST, and the liquid absorbing member 62 that has absorbed the liquid LQ is periodically (eg, for each lot). It is good also as a structure exchanged. In this case, the substrate stage PST varies in weight depending on the liquid LQ, but the stage positioning accuracy can be maintained by changing the stage control parameter according to the weight of the liquid LQ collected by the liquid absorbing member 62.

  A flow path forming member 70 is disposed in the vicinity of the optical element 2 at the end of the projection optical system PL. The flow path forming member 70 is an annular member provided so as to surround the optical element 2 above the substrate P (substrate stage PST). The flow path forming member 70 can be formed of, for example, aluminum, titanium, stainless steel, duralumin, and an alloy containing these. Alternatively, the flow path forming member 70 may be configured by a transparent member (optical member) having light permeability such as glass (quartz).

  The flow path forming member 70 includes a liquid supply port 13 (13A, 13B) provided above the substrate P (substrate stage PST) and disposed so as to face the surface of the substrate P. In the present embodiment, the flow path forming member 70 has two liquid supply ports 13A and 13B. The liquid supply ports 13A and 13B are provided on the lower surface 70A of the flow path forming member 70.

  Further, the flow path forming member 70 has supply flow paths 14 (14A, 14B) corresponding to the liquid supply ports 13 (13A, 13B) therein. One end portions of the supply flow paths 14A and 14B are connected to the supply portion 11 via supply tubes 12A and 12B, respectively, and the other end portions are connected to the liquid supply ports 13A and 13B, respectively.

  In the middle of the supply pipes 12A and 12B, flow controllers 16A and 16B called mass flow controllers that are sent from the liquid supply unit 11 and control the amount of liquid supplied per unit time to the liquid supply ports 13A and 13B are provided. It has been. Control of the liquid supply amount by the flow rate controller 16 (16A, 16B) is performed under a command signal of the control device CONT.

  Furthermore, the flow path forming member 70 includes a liquid recovery port 23 provided above the substrate P (substrate stage PST) and disposed so as to face the surface of the substrate P. In the present embodiment, the flow path forming member 70 has two liquid recovery ports 23A and 23B. The liquid recovery ports 23A and 23B are provided on the lower surface 70A of the flow path forming member 70.

  Further, the flow path forming member 70 has a recovery flow path 24 (24A, 24B) corresponding to the liquid recovery port 23 (23A, 23B) therein. One end portions of the recovery flow paths 24A and 24B are connected to the liquid recovery portion 21 via recovery tubes 22A and 22B, respectively, and the other end portions are connected to the liquid recovery ports 23A and 23B, respectively.

  In the present embodiment, the flow path forming member 70 constitutes a part of each of the liquid supply mechanism 10 and the liquid recovery mechanism 20. The liquid supply ports 13A and 13B constituting the liquid supply mechanism 10 are provided at respective positions on both sides in the X-axis direction across the projection area AR1 of the projection optical system PL, and the liquid constituting the liquid recovery mechanism 20 The recovery ports 23A and 23B are provided outside the liquid supply ports 13A and 13B of the liquid supply mechanism 10 with respect to the projection area AR1 of the projection optical system PL.

  The operations of the liquid supply unit 11 and the flow rate controller 16 are controlled by the control device CONT. When supplying the liquid LQ onto the substrate P, the control device CONT delivers the liquid LQ from the liquid supply unit 11 and is provided above the substrate P via the supply pipes 12A and 12B and the supply flow paths 14A and 14B. The liquid LQ is supplied onto the substrate P from the liquid supply ports 13A and 13B. At this time, the liquid supply ports 13A and 13B are arranged on both sides of the projection optical system PL with the projection area AR1 interposed therebetween, and the liquid LQ is supplied from both sides of the projection area AR1 via the liquid supply ports 13A and 13B. It can be supplied. Further, the amount per unit time of the liquid LQ supplied from the liquid supply ports 13A and 13B onto the substrate P can be individually controlled by the flow rate controllers 16A and 16B provided in the supply pipes 12A and 12B, respectively. It is.

  The liquid recovery operation of the liquid recovery unit 21 is controlled by the control device CONT. The control device CONT can control the liquid recovery amount per unit time by the liquid recovery unit 21. The liquid LQ on the substrate P recovered from the liquid recovery ports 23A and 23B provided above the substrate P is recovered through the recovery channels 24A and 24B of the channel forming member 70 and the recovery tubes 22A and 22B. Collected by the unit 21.

  In the present embodiment, the supply pipes 12A and 12B are connected to one liquid supply section 11. However, a plurality (two in this case) of liquid supply sections 11 corresponding to the number of supply pipes are provided, and the supply pipe 12A is provided. , 12B may be connected to each of the plurality of liquid supply sections 11. Further, the recovery pipes 22A and 22B are connected to one liquid recovery part 21, but a plurality (two in this case) of liquid recovery parts 21 corresponding to the number of recovery pipes are provided, and each of the recovery pipes 22A and 22B is provided. May be connected to each of the plurality of liquid recovery sections 21.

The liquid contact surface 2A of the optical element 2 of the projection optical system PL and the lower surface (liquid contact surface) 70A of the flow path forming member 70 are lyophilic (hydrophilic). In the present embodiment, the liquid contact surfaces of the optical element 2 and the flow path forming member 70 are subjected to lyophilic treatment, and the liquid contact surfaces of the optical element 2 and the flow path forming member 70 are changed by the lyophilic treatment. It is lyophilic. In other words, at least the liquid contact surface of the surface of the member facing the exposed surface (surface) of the substrate P held by the substrate stage PST is lyophilic. Since the liquid LQ in the present embodiment is water having a large polarity, as a lyophilic treatment (hydrophilic treatment), for example, a thin film is formed of a substance having a molecular structure with a large polarity such as alcohol, whereby the optical element 2 and the flow path Hydrophilicity is imparted to the liquid contact surface of the forming member 70. That is, when water is used as the liquid LQ, it is preferable to provide a liquid contact surface with a highly polar molecular structure such as an OH group. Alternatively, MgF ₂ , Al ₂ O ₃ , SiO ₂ or the like may be provided on the liquid contact surface.

  In the present embodiment, the lower surface (surface facing the substrate P) 70A of the flow path forming member 70 is a substantially flat surface. However, the lower surface 70A of the flow path forming member 70 is liquid with respect to the projection optical system PL. In a region outside the recovery port 23 (23A, 23B), a surface inclined with respect to the XY plane, specifically, toward the surface of the substrate P toward the outside with respect to the projection region AR1 (immersion region AR2). You may provide the inclined surface (trap surface) which has the predetermined length which inclines so that it may leave | separate (toward upward). By doing so, the liquid LQ between the projection optical system PL and the substrate P accompanying the movement of the substrate P is captured by the trap surface even if it tries to flow outside the lower surface 70A of the flow path forming member 70. The outflow of the liquid LQ can be prevented. Here, the trap surface is treated with a lyophilic solution to make it lyophilic, thereby protecting the photosensitive material from a film applied to the surface of the substrate P (photosensitive material film such as photoresist, antireflection film or liquid). The liquid LQ that has flowed out of the liquid recovery port 23 is captured by the trap surface.

  On the substrate stage PST (Z tilt stage 52), a reference member is disposed at a predetermined position outside the plate member 56 around the substrate P. The reference member is provided with a reference mark detected by the substrate alignment system and a reference mark detected by the mask alignment system in a predetermined positional relationship. Further, the upper surface of the reference member is substantially flat and may be used as a reference surface for a focus / leveling detection system. Further, the upper surface of the reference member is provided at substantially the same height (level) as the surface of the substrate P and the surface (flat surface) 57 of the plate member 56.

  Further, on the Z tilt stage 52 (substrate stage PST), an illuminance unevenness sensor as disclosed in, for example, Japanese Patent Laid-Open No. 57-117238 is disposed as an optical sensor at a predetermined position outside the plate member 56. ing. The illuminance unevenness sensor includes an upper plate having a rectangular shape in plan view. The upper surface of the upper plate is substantially flat, and is provided at substantially the same height (level) as the surface of the substrate P and the surface (flat surface) 57 of the plate member 56. A pinhole portion through which light can pass is provided on the upper surface of the upper plate. Of the upper surface, the portion other than the pinhole portion is covered with a light shielding material such as chromium.

  Also, an aerial image measurement sensor as disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-14005 is provided as an optical sensor at a predetermined position outside the plate member 56 on the Z tilt stage 52 (substrate stage PST). It has been. The aerial image measurement sensor includes an upper plate having a rectangular shape in plan view. The upper surface of the upper plate is substantially flat and may be used as a reference surface for a focus / leveling detection system. The upper surface of the upper plate is provided at substantially the same height (level) as the surface of the substrate P and the surface (flat surface) 57 of the plate member 56. A slit portion through which light can pass is provided on the upper surface of the upper plate. Of the upper surface, the portion other than the slit portion is covered with a light shielding material such as chrome.

  Although not shown, an irradiation amount sensor (illuminance sensor) as disclosed in, for example, Japanese Patent Application Laid-Open No. 11-16816 is also provided on the Z tilt stage 52 (substrate stage PST). The upper surface of the upper plate of the irradiation amount sensor is provided at substantially the same height (level) as the surface of the substrate P and the surface (flat surface) 57 of the plate member 56.

  The exposure apparatus EX in the present embodiment projects and exposes a pattern image of the mask M onto the substrate P while moving the mask M and the substrate P in the X-axis direction (scanning direction). A pattern image of a part of the mask M is projected into the projection area AR1 via the liquid LQ in the area AR2 and the projection optical system PL, and is synchronized with the movement of the mask M in the −X direction (or + X direction) at the velocity V. Then, the substrate P moves in the + X direction (or −X direction) with respect to the projection area AR1 at the speed β · V (β is the projection magnification). A plurality of shot areas are set on the substrate P. After the exposure to one shot area is completed, the next shot area is moved to the scanning start position by the stepping movement of the substrate P. The scanning exposure process is sequentially performed on each shot area while moving the substrate P by the scanning method.

  The projection area AR1 of the projection optical system PL is set in a rectangular shape in plan view with the Y-axis direction as the long direction and the X-axis direction as the short direction. In addition, it is preferable that the width | variety of the flat surface 57 currently formed in the annular | circular shape among the plate members 56 is formed at least larger than the projection area | region AR1. Thereby, when the edge region E of the substrate P is exposed, the exposure light EL is not irradiated to the outside of the plate member 56. Furthermore, the width of the flat surface 57 is preferably larger than the liquid immersion area AR2 formed on the image plane side of the projection optical system PL. Thus, when the edge area E of the substrate P is subjected to immersion exposure, the immersion area AR2 is disposed on the flat surface 57 of the plate member 56 and is not disposed outside the plate member 56. The occurrence of inconvenience such as the liquid LQ flowing out of the plate member 56 can be prevented.

  FIG. 2 is a schematic perspective view showing the flow path forming member 70. As shown in FIG. 2, the flow path forming member 70 is an annular member provided so as to surround the optical element 2 at the terminal end of the projection optical system PL, and has a projection optical system PL (optical element) at the center thereof. 2) is provided with a hole portion 70B.

  The exposure apparatus EX includes a focus / leveling detection system 80 that detects surface position information of the surface of the substrate P held by the substrate stage PST. The focus / leveling detection system 80 is a so-called oblique incidence type focus / leveling detection system, and includes a light projecting unit 81 that irradiates the substrate P with the detection light La from an oblique direction via the liquid LQ in the liquid immersion area AR2. And a light receiving unit 82 that receives the reflected light of the detection light La reflected by the substrate P. As the configuration of the focus / leveling detection system 80, for example, the one disclosed in JP-A-8-37149 can be used.

  Concave portions 75 and 76 that are recessed toward the central side (projection optical system PL side) are respectively formed on the side surfaces on the −Y side and the + Y side of the flow path forming member 70. One recess 75 is provided with a first optical member 83 capable of transmitting the detection light La emitted from the light projecting portion 81 of the focus / leveling detection system 80, and the other recess 76 is detected on the substrate P. A second optical member 84 capable of transmitting the light La is provided. The first optical member 83 and the second optical member 84 constitute part of the optical system of the focus / leveling detection system 80 and part of the flow path forming member 70. In other words, in this embodiment, a part of the flow path forming member 70 also serves as a part of the focus / leveling detection system 80.

  The flow path forming member 70 including the first optical member 83 and the second optical member 84 is supported in a state separated from the optical element 2 at the tip of the projection optical system PL.

  The light projecting unit 81 and the light receiving unit 82 are respectively provided on both sides of the projection area AR1 of the projection optical system PL. In the example illustrated in FIG. 2, the light projecting unit 81 and the light receiving unit 82 are provided at positions separated from the projection region AR1 on the ± Y side with respect to the projection region AR1. The light projecting unit 81 of the focus / leveling detection system 80 irradiates the surface of the substrate P with the detection light La at a predetermined incident angle θ with respect to the optical axis AX of the projection optical system PL. The detection light La emitted from the light projecting unit 81 passes through the first optical member 83 and is irradiated onto the substrate P at an incident angle θ from an oblique direction via the liquid LQ on the substrate P. The reflected light of the detection light La reflected on the substrate P passes through the second optical member 84 and is then received by the light receiving unit 82. Here, the light projecting unit 81 of the focus / leveling detection system 80 irradiates the substrate P with a plurality of detection lights La. As a result, the focus / leveling detection system 80 can obtain the focus positions at, for example, a plurality of points (each position) in a matrix form on the substrate P, and based on the obtained focus positions at the plurality of points. Thus, position information in the Z-axis direction on the surface of the substrate P and inclination information in the θX and θY directions of the substrate P can be detected.

  The control device CONT drives the Z tilt stage 52 of the substrate stage PST via the substrate stage drive device PSTD based on the detection result of the focus / leveling detection system 80, thereby holding the substrate held on the Z tilt stage 52. The position of P in the Z-axis direction (focus position) and the position in the θX and θY directions are controlled. In other words, the Z tilt stage 52 operates based on a command from the control device CONT based on the detection result of the focus / leveling detection system 80, and controls the focus position (Z position) and the tilt angle of the substrate P, thereby controlling the substrate P. The surface (exposed surface) is adjusted to an optimum state with respect to the image plane formed via the projection optical system PL and the liquid LQ by the autofocus method and the autoleveling method.

  As shown in FIG. 2, the exposure apparatus EX includes a pressure adjustment mechanism 90 that adjusts the pressure of the liquid LQ supplied from the liquid supply mechanism 10. The pressure adjustment mechanism 90 includes a pressure adjustment liquid supply unit 91 that can further add the liquid LQ to the liquid LQ supplied from the liquid supply mechanism 10, and a pressure adjustment liquid recovery unit 92 that can recover a part of the liquid LQ. It has.

  One end of a supply pipe 93 (93A, 93B) is connected to the pressure adjusting liquid supply section 91, and the other end of the supply pipe 93 (93A, 93B) is formed inside the flow path forming member 70. Connected to the supply flow path 94 (94A, 94B). The pressure adjusting liquid supply unit 91 includes a tank for storing the liquid LQ, a pressure pump, and the like.

  The other end of the supply pipe 93 </ b> A is disposed in the recess 75 of the flow path forming member 70. One end of the supply channel 94A is formed on the side surface of the recess 75 of the channel forming member 70, and the other end of the supply pipe 93A is connected to one end of the supply channel 94A. The other end of the supply pipe 93 </ b> B is disposed in the recess 76 of the flow path forming member 70. One end of the supply flow path 94B is formed on the side surface of the recess 76 of the flow path forming member 70, and the other end of the supply pipe 93B is connected to one end of the supply flow path 94B.

  One end of a recovery pipe 95 (95A, 95B) is connected to the pressure adjusting liquid recovery part 92, and the other end of the recovery pipe 95 (95A, 95B) is formed inside the flow path forming member 70. Are connected to one end of the recovery channel 96 (96A, 96B). The pressure adjustment liquid recovery unit 92 includes, for example, a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, a tank that stores the recovered liquid LQ, and the like. Yes. As a vacuum system, a vacuum system in a factory where the exposure apparatus EX is disposed may be used without providing the exposure apparatus EX with a vacuum pump.

  The other end of the recovery pipe 95 </ b> A is disposed in the recess 75 of the flow path forming member 70. One end of the recovery channel 96A is formed on the side surface of the recess 75 of the channel forming member 70, and the other end of the recovery tube 95A is connected to one end of the recovery channel 96A. The other end of the recovery pipe 95B is disposed in the recess 76 of the flow path forming member 70. One end of the recovery channel 96B is formed on the side surface of the recess 76 of the channel forming member 70, and the other end of the recovery tube 95B is connected to one end of the recovery channel 96B.

  FIG. 3 is a perspective view of the flow path forming member 70 as viewed from the lower surface 70A side. In FIG. 3, the projection area AR1 of the projection optical system PL is set to a rectangular shape with the Y-axis direction (non-scanning direction) as the longitudinal direction. The immersion area AR2 filled with the liquid LQ is substantially within a region surrounded by the two liquid recovery ports 23A and 23B so as to include the projection area AR1 and locally on a part of the substrate P. It is formed. The liquid immersion area AR2 only needs to cover at least the projection area AR1, and the entire area surrounded by the two liquid recovery ports 23A and 23B may not necessarily become the liquid immersion area.

  The liquid supply ports 13A and 13B are provided on both sides of the projection area AR1 of the projection optical system PL with respect to the X-axis direction (scanning direction) on the lower surface 70A of the flow path forming member 70 facing the substrate P. Yes. Specifically, the liquid supply port 13A is provided on one side (−X side) in the scanning direction with respect to the projection area AR1 on the lower surface 70A of the flow path forming member 70, and the liquid supply port 13B is on the other side (+ X). Side). That is, the liquid supply ports 13A and 13B are provided near the projection area AR1, and are provided on both sides of the projection area AR1 with respect to the scanning direction (X-axis direction). Each of the liquid supply ports 13 </ b> A and 13 </ b> B is formed in a slit shape having a substantially U-shape (arc shape) in plan view extending in the Y-axis direction. First and second optical members 83 and 84 are disposed on both sides in the Y-axis direction of the lower surface 70A of the flow path forming member 70, and the liquid supply ports 13A and 13B are disposed on the lower surface 70A of the flow path forming member 70. The first and second optical members 83 and 84 are formed over a region other than where the first and second optical members 83 and 84 are disposed. The lengths of the liquid supply ports 13A and 13B in the Y-axis direction are at least longer than the length of the projection area AR1 in the Y-axis direction. The liquid supply ports 13A and 13B are provided so as to surround at least the projection area AR1. The liquid supply mechanism 10 can simultaneously supply the liquid LQ on both sides of the projection area AR1 via the liquid supply ports 13A and 13B.

  The liquid recovery ports 23A and 23B are provided outside the projection area AR1 of the projection optical system PL from the liquid supply ports 13A and 13B of the liquid supply mechanism 10 on the lower surface 70A of the flow path forming member 70 facing the substrate P. With respect to the X-axis direction (scanning direction), the projection optical system PL is provided on both sides of the projection area AR1. Specifically, the liquid recovery port 23A is provided on one side (−X side) in the scanning direction with respect to the projection area AR1 on the lower surface 70A of the flow path forming member 70, and the liquid recovery port 23B is on the other side (+ X). Side). Each of the liquid recovery ports 23A and 23B is formed in a slit shape having a substantially U-shape (arc shape) in plan view extending in the Y-axis direction. The liquid recovery ports 23A and 23B are formed over a region of the lower surface 70A of the flow path forming member 70 other than where the first and second optical members 83 and 84 are disposed. The liquid recovery ports 23A and 23B are provided so as to surround the projection area AR1 of the projection optical system PL and the liquid supply ports 13A and 13B.

  In addition, although the liquid supply port 13 is the structure provided one each on both sides of the projection area | region AR1, it may be divided | segmented into plurality and the number is arbitrary. Similarly, the liquid recovery port 23 may also be divided into a plurality.

  In addition, although the liquid supply ports 13 provided on both sides of the projection area AR1 are formed with substantially the same size (length), they may have different sizes. Similarly, the liquid recovery ports 23 provided on both sides of the projection area AR1 may have different sizes.

  In addition, the slit width of the supply port 13 and the slit width of the recovery port 23 may be the same, or the slit width of the recovery port 23 may be larger than the slit width of the supply port 13, or conversely. The slit width of the port 23 may be smaller than the slit width of the supply port 13.

  Further, a recess 78 having a longitudinal direction in the Y-axis direction is formed on the lower surface 70A of the flow path forming member 70. In the lower surface 70A of the flow path forming member 70, the optical element 2 at the tip of the projection optical system PL is exposed at substantially the center in the longitudinal direction of the recess 78.

  On the lower surface 70A of the flow path forming member 70, a pressure adjusting liquid recovery port (pressure) that is a second liquid recovery port is provided on both sides in the non-scanning direction (Y-axis direction) with respect to the projection area AR1 of the projection optical system PL. Adjustment recovery ports) 98A and 98B are provided. The pressure adjustment recovery ports 98A and 98B are connected to the other ends of the recovery flow paths 96A and 96B formed inside the flow path forming member 70, respectively. Each of the pressure adjustment recovery ports 98A and 98B is connected to the pressure adjustment liquid recovery part 92 via recovery flow paths 96A and 96B and recovery pipes 95A and 95B. By driving the pressure adjustment liquid recovery section 92, the liquid LQ can be recovered through the pressure adjustment recovery ports 98A and 98B.

  The pressure adjustment recovery port 98A is provided on one side (−Y side) in the non-scanning direction with respect to the projection area AR1 in the recess 78 formed on the lower surface 70A of the flow path forming member 70, and the pressure adjustment recovery port 98B is provided on the other side (+ Y side). The pressure adjustment recovery ports 98A and 98B are disposed closer to the projection area AR1 of the projection optical system PL than the liquid supply ports 13A and 13B of the liquid supply mechanism 10.

  Further, the pressure adjustment liquid recovery unit 92 has a vacuum system, and is projected via pressure adjustment recovery ports 98A and 98B disposed in the vicinity of the optical element 2 on the image plane side of the projection optical system PL. The gas on the image plane side of the optical system PL can be discharged (depressurized).

  On the lower surface 70A of the flow path forming member 70, a pressure adjusting liquid supply port (pressure) that is a second liquid supply port is provided on each side of the projection area AR1 of the projection optical system PL on both sides in the non-scanning direction (Y-axis direction). Adjustment supply ports) 97A and 97B are provided. The pressure adjustment supply ports 97A and 97B are connected to the other ends of the supply flow paths 94A and 94B formed inside the flow path forming member 70, respectively. Each of the pressure adjustment supply ports 97A and 97B is connected to the pressure adjustment liquid supply unit 91 via the supply flow paths 94A and 94B and the supply pipes 93A and 93B. The liquid LQ can be supplied through the pressure adjustment supply ports 97A and 97B by driving the pressure adjustment liquid supply unit 91.

  The pressure adjustment supply port 97A is provided on one side (−Y side) in the non-scanning direction with respect to the projection area AR1 in the recess 78 formed on the lower surface 70A of the flow path forming member 70, and the pressure adjustment supply port 97B is provided on the other side (+ Y side). The pressure adjustment supply ports 97A and 97B are disposed closer to the projection area AR1 of the projection optical system PL than the liquid supply ports 13A and 13B of the liquid supply mechanism 10.

  The liquid supply ports 13A and 13B are provided so as to surround the projection area AR1, the pressure adjustment supply ports 97 (97A and 97B), and the pressure adjustment recovery ports 98 (98A and 98B).

  In the present embodiment, the pressure adjustment supply ports 97A and 97B are provided outside the pressure adjustment collection ports 98A and 98B with respect to the projection area AR1 of the projection optical system PL, but are provided inside. Alternatively, the pressure adjustment supply ports 97A and 97B and the pressure adjustment recovery ports 98A and 98B may be provided close to each other. Alternatively, for example, pressure adjustment supply ports 97A and 97B are provided on both sides of the projection area AR1 with respect to the X-axis direction (or Y-axis direction), and pressure adjustment recovery ports 98A and 98B are provided in the Y-axis direction (or X-axis direction). May be provided on both sides of the projection area AR1. In this case, the distance between the pressure adjustment supply ports 97A and 97B with respect to the projection area AR1 and the distance between the pressure adjustment recovery ports 98A and 98B with respect to the projection area AR1 may be different or substantially equal.

  4 is a sectional view taken along the line AA in FIG. 2, and FIG. 5 is a sectional view taken along the line BB in FIG. As shown in FIG. 4, each of the supply flow paths 14A and 14B has one end connected to the supply pipes 12A and 12B and the other end connected to the liquid supply ports 13A and 13B. Each of the supply flow paths 14A and 14B has a horizontal flow path portion 14h and a vertical flow path portion 14s. The liquid LQ supplied from the liquid supply part 11 via the supply pipes 12A and 12B flows into the supply flow paths 14A and 14B, flows through the horizontal flow path part 14h in a substantially horizontal direction (XY plane direction), and then substantially It is bent at a right angle and flows in the vertical flow path portion 14s in the vertical direction (−Z direction), and is supplied onto the substrate P from above the substrate P through the liquid supply ports 13A and 13B.

  Each of the recovery channels 24A and 24B has one end connected to the recovery pipes 22A and 22B, and the other end connected to the liquid recovery ports 23A and 23B. Each of the recovery channels 24A and 24B has a horizontal channel 24h and a vertical channel 24s. By driving the liquid recovery unit 21 having a vacuum system, the liquid LQ on the substrate P is directed vertically upward (+ Z) to the recovery flow paths 24A and 24b via the liquid recovery ports 23A and 23B provided above the substrate P. Direction) and flows through the vertical flow path portion 24s. At this time, the surrounding gas (air) is also introduced (recovered) from the liquid recovery ports 23A and 23B together with the liquid LQ on the substrate P. The liquid LQ that has flowed into the recovery flow paths 24A and 24B in the + Z direction flows in the horizontal flow path 24h in a substantially horizontal direction after the flow direction is changed in a substantially horizontal direction. Thereafter, the liquid is recovered by suction into the liquid recovery unit 21 via the recovery tubes 22A and 22B.

  A gap G is provided between the side surface 2T of the optical element 2 of the projection optical system PL and the flow path forming member 70. The gap G is provided for vibrationally separating the optical element 2 of the projection optical system PL and the flow path forming member 70. Further, the liquid supply mechanism 10 and the liquid recovery mechanism 20 including the flow path forming member 70 and the projection optical system PL are supported by separate support mechanisms, and are separated vibrationally. This prevents vibrations generated in the liquid supply mechanism 10 and the liquid recovery mechanism 20 including the flow path forming member 70 from being transmitted to the projection optical system PL side.

  Each of the inner side surface 70T of the flow path forming member 70 that forms the gap G and the side surface 2T of the optical element 2 is liquid repellent. Specifically, each of the inner side surface 70T and the side surface 2T has liquid repellency by being subjected to liquid repellency treatment. As the liquid repellent treatment, a liquid repellent material such as a fluorine resin material, an acrylic resin material, or a silicon resin material is applied, or a thin film made of the liquid repellent material is attached. Further, the film for surface treatment may be a single layer film or a film composed of a plurality of layers. On the other hand, as described above, the liquid contact surface 2A of the optical element 2 of the projection optical system PL and the lower surface (liquid contact surface) 70A of the flow path forming member 70 including the lower surfaces of the first and second optical members 83 and 84 are It has lyophilicity (hydrophilicity).

  Of the lower surface 70A of the flow path forming member 70, a groove 130 is formed outside the liquid supply ports 13A and 13B with respect to the projection area AR1. The liquid recovery ports 23 </ b> A and 23 </ b> B are formed inside the groove 130 in the lower surface 70 </ b> A of the flow path forming member 70. The groove 130 is formed along the liquid recovery port 23 on the lower surface 70A of the flow path forming member 70, and is also formed continuously on the lower surfaces of the first and second optical members 83 and 84. It is formed in an annular shape so as to surround the area AR1. An annular wall 131 is formed outside the groove 130 with respect to the projection area AR1. The wall part 131 is a convex part protruding to the substrate P side. The wall part 131 can hold the liquid LQ in at least a part of the region inside the wall part 131 including the groove part 130.

  A pressure sensor 120 for detecting the pressure in the gap G between the inner side surface 70T of the flow path forming member 70 and the side surface 2T of the optical element 2 is provided on the inner side surface 70T of the flow path forming member 70. The pressure sensors 120 are provided on both sides of the gap G with respect to the X-axis direction (scanning direction) across the projection area AR1 of the projection optical system PL. The detection result of the pressure sensor 120 is output to the control device CONT.

  In some cases, the liquid LQ in the liquid immersion area AR2 formed between the projection optical system PL and the substrate P enters the gap G between the side surface 2T of the optical element 2 and the flow path forming member 70. In that case, the height position of the liquid level of the liquid LQ that has entered the gap G changes according to the pressure of the liquid LQ in the liquid immersion area AR2. Further, the height position of the liquid level of the liquid LQ that has entered the gap G and the pressure in the gap G have a corresponding relationship. For example, when the pressure of the liquid LQ in the liquid immersion area AR2 increases, the height position of the liquid level of the liquid LQ that has entered the gap G also increases, and the pressure in the gap G also increases. On the other hand, when the pressure of the liquid LQ in the liquid immersion area AR2 decreases, the height position of the liquid surface of the liquid LQ that has entered the gap G decreases, and the pressure in the gap G also decreases. The relationship between the pressure of the gap G and the height position of the liquid level of the liquid LQ that has entered the gap G is stored in advance in the control device CONT. This relationship can be obtained in advance by experiments or simulations. Therefore, by detecting the pressure in the gap G with the pressure sensor 120, the control device CONT determines the height position of the liquid level of the liquid LQ that has entered the gap G based on the detection result of the pressure sensor 120 and the relationship. Can be sought. Further, since the pressure in the gap G also changes in accordance with the pressure of the liquid LQ in the liquid immersion area AR2 on the substrate P, the control device CONT determines the liquid immersion area AR2 based on the pressure detection result of the gap G by the pressure sensor 120. The pressure of the liquid LQ can be obtained.

  The installation position of the pressure sensor 120 may be a position where the pressure of the gap G can be detected, and is not limited to the inner side surface 70T of the flow path forming member 70, and may be the side surface 2T of the optical element 2, for example. Further, instead of the pressure sensor 120, a liquid detection sensor (water detection sensor) or a liquid level sensor (water level sensor) for detecting the height of the liquid may be used.

  The horizontal flow path portion 14h is formed so as to gradually expand in the horizontal direction from the connection portion to the supply pipes 12A and 12B toward the vertical flow path portion 14s. By forming the horizontal flow path part 14h in a tapered shape, the liquid LQ supplied from the liquid supply part 11 via the supply pipes 12A and 12B is sufficiently spread in the Y-axis direction in the horizontal flow path part 14h and then vertically Since the liquid is supplied onto the substrate P via the flow path portion 14s, the liquid LQ can be simultaneously supplied to a wide area on the substrate P.

  The horizontal flow path part 24h is formed so as to gradually narrow in the horizontal direction from the vertical flow path part 24s toward the connection part to the recovery pipes 22A and 22B. By forming the horizontal flow path portion 24h in a tapered shape, the liquid recovery force distribution at the liquid recovery ports 23A and 23B whose longitudinal direction is the Y-axis direction is made uniform, and the liquid LQ in a wide area on the substrate P is liquidized. It can collect | recover simultaneously via the collection ports 23A and 23B.

  As shown in FIG. 5, a recess 78 is formed on the lower surface 70A of the flow path forming member 70, and the lower surface 70A of the recess 78 includes the liquid contact surface 2A of the optical element 2 of the projection optical system PL, the first, It is higher than the lower surfaces of the second optical members 83 and 84 (far from the substrate P). That is, a step portion is formed between the lower surface of the concave portion 78 of the flow path forming member 70 and the first and second optical members 83 and 84, and the lower surface of the concave portion 78 of the flow path forming member 70 and the optical element 2. A step portion is also formed between the liquid contact surface 2A. In the case where the concave portion 78 is not provided on the lower surface 70A of the flow path forming member 70, that is, the lower surface 70A of the flow path forming member 70, the lower surface (liquid contact surface) 2A of the optical element 2, and the first and second optical members 83 and 84. When the detection light La of the focus / leveling detection system 80 is irradiated onto the desired region (in this case, the projection region AR1) of the substrate P at a predetermined incident angle θ, the light of the detection light La For example, the flow path forming member 70 is disposed on the path to prevent the detection light La from being irradiated, or to secure the optical path of the detection light La, the incident angle θ or the lower surface of the optical element 2 of the projection optical system PL (liquid contact) Surface) The distance (working distance) between 2A and the surface of the substrate P must be changed. However, by providing the concave portion 78 so as to be continuous with the first and second optical members 83 and 84 constituting the focus / leveling detection system 80 in the lower surface 70A of the flow path forming member 70, the projection optical system PL is provided. While maintaining the distance between the lower surface (liquid contact surface) 2A of the optical element 2 and the surface of the substrate P to a desired value, the optical path of the detection light La of the focus / leveling detection system 80 is secured and detected in a desired region on the substrate P. Light La can be irradiated.

Next, a method for exposing the pattern image of the mask M onto the substrate P using the exposure apparatus EX having the above-described configuration will be described with reference to a schematic diagram shown in FIG.
When the mask M is loaded on the mask stage MST and the substrate P is loaded on the substrate stage PST and then the substrate P is scanned and exposed, the controller CONT drives the liquid supply mechanism 10 to The liquid supply operation is started. The liquid LQ supplied from the liquid supply unit 11 of the liquid supply mechanism 10 to form the liquid immersion area AR2 flows through the supply pipes 12A and 12B, and then the liquid supply ports 13A and 14A via the supply channels 14A and 14B. It is supplied onto the substrate P from 13B.

  When starting the supply of the liquid LQ onto the substrate P using the liquid supply mechanism 10, the control device CONT drives the pressure adjustment liquid recovery unit 92 having a vacuum system in the pressure adjustment mechanism 90. When the pressure adjustment liquid recovery unit 92 having a vacuum system is driven, the projection optical system passes through the pressure adjustment recovery ports 98A and 98B provided in the vicinity of the optical element 2 on the image plane side of the projection optical system PL. The gas in the space near the image plane side of the system PL is exhausted, and the space is made negative. In this way, the control device CONT drives the pressure adjustment liquid recovery unit 92 of the pressure adjustment mechanism 90 and is arranged closer to the projection area AR1 by the projection optical system PL than the liquid supply ports 13A and 13B of the liquid supply mechanism 10. Liquid supply by the liquid supply mechanism 10 for forming the immersion area AR2 is started while discharging the gas on the image plane side of the projection optical system PL through the pressure adjustment recovery ports 98A and 98B.

  Supply of the liquid LQ by the liquid supply mechanism 10 while discharging the gas on the image plane side of the projection optical system PL through the pressure adjustment recovery ports 98A and 98B arranged near the projection area AR1 of the projection optical system PL. By performing the above, the pressure adjusting recovery ports 98A, 98B and the vicinity thereof become negative pressure, so the supplied liquid LQ is smoothly arranged in the negative pressure negative pressure region (space). Since the pressure adjustment recovery ports 98A, 98B are provided closer to the projection area AR1 than the liquid supply ports 13A, 13B, the projection area AR1 can be satisfactorily covered with the liquid LQ.

  In particular, in this embodiment, since the concave portion 78 of the flow path forming member 70 is formed on the image plane side of the projection optical system PL, the supply is performed when the liquid LQ is supplied to form the liquid immersion area AR2. Thus, the liquid LQ does not enter the recess 78, and there is a high possibility that gas portions such as bubbles are generated in the liquid LQ in the liquid immersion area AR2. When the gas portion is generated, the exposure light EL for forming the pattern image on the substrate P does not reach the substrate P due to the gas portion, or the exposure light EL for forming the pattern image on the substrate P. Does not reach a desired position on the substrate P, for example, the detection light La of the focus / leveling detection system 80 does not reach the substrate P or the light receiving unit 82, or the detection light La reaches a desired position on the substrate P. Such a phenomenon occurs that the exposure accuracy and the measurement accuracy are deteriorated. However, the liquid LQ can be smoothly arranged in the recess 78 by starting the liquid supply by the liquid supply mechanism 10 while discharging the gas on the image plane side of the projection optical system PL. Accordingly, it is possible to prevent a problem that a gas portion is generated in the liquid immersion area AR2 formed on the image plane side of the projection optical system PL, and high exposure accuracy and measurement accuracy can be obtained. In particular, in the present embodiment, since the pressure adjusting recovery ports 98A and 98B that constitute the exhaust port of the exhaust means are provided inside the recess 78, the liquid LQ can be more smoothly arranged in the recess 78.

  The liquid immersion area AR2 is formed between the projection optical system PL and the substrate P by the liquid LQ supplied onto the substrate P. Here, the liquid LQ flowing through the supply pipes 12A and 12B expands in the width direction of the supply channels 14A and 14B and the liquid supply ports 13A and 13B formed in a slit shape, and is supplied to a wide range on the substrate P. The liquid LQ supplied onto the substrate P from the liquid supply ports 13A and 13B is supplied so as to spread between the lower end surface of the front end portion (optical element 2) of the projection optical system PL and the substrate P, and the projection area AR1. A liquid immersion area AR2 smaller than the substrate P and larger than the projection area AR1 is locally formed on a part of the substrate P including At this time, the control device CONT moves from both sides of the projection area AR1 onto the substrate P from each of the liquid supply ports 13A and 13B arranged on both sides of the projection area AR1 in the X-axis direction (scanning direction) of the liquid supply mechanism 10. The liquid LQ is simultaneously supplied.

  Further, in parallel with the driving of the liquid supply mechanism 10, the control device CONT drives the liquid recovery unit 21 of the liquid recovery mechanism 20 to recover the liquid LQ on the substrate P. Then, the control device CONT controls the driving of the liquid supply mechanism 10 and the liquid recovery mechanism 20 to form the liquid immersion area AR2.

  After the liquid immersion area AR2 is formed, the control device CONT stops the gas discharge operation on the image plane side of the projection optical system PL by the pressure adjustment liquid recovery unit 92 of the pressure adjustment mechanism 90.

  In parallel with the supply of the liquid LQ onto the substrate P by the liquid supply mechanism 10, the control device CONT performs the recovery of the liquid LQ on the substrate P by the liquid recovery mechanism 20, and the substrate stage PST that supports the substrate P X While moving in the axial direction (scanning direction), the pattern image of the mask M is projected and exposed onto the substrate P via the liquid LQ between the projection optical system PL and the substrate P and the projection optical system PL. At this time, since the liquid supply mechanism 10 simultaneously supplies the liquid LQ from both sides of the projection area AR1 with respect to the scanning direction via the liquid supply ports 13A and 13B, the liquid immersion area AR2 is formed uniformly and satisfactorily. .

  In the present embodiment, when supplying the liquid LQ to the substrate P from both sides in the scanning direction of the projection area AR1, the control device CONT uses the flow rate controllers 16A and 16B of the liquid supply mechanism 10 to supply the liquid per unit time. The amount of liquid supplied from one side of the projection area AR1 with respect to the scanning direction (liquid supply amount per unit time) during the scanning exposure of one shot area on the substrate P is adjusted, and the liquid supplied from the other side Different from the amount. Specifically, the control device CONT sets the liquid supply amount per unit time supplied from the front of the projection area AR1 in the scanning direction to be larger than the liquid supply amount supplied on the opposite side.

  For example, when the exposure processing is performed while moving the substrate P in the + X direction, the control device CONT sets the amount of liquid from the −X side (that is, the liquid supply port 13A) to the projection area AR1, and the + X side (that is, the liquid supply port). 13B), when the exposure processing is performed while moving the substrate P in the -X direction, the liquid amount from the + X side is larger than the liquid amount from the -X side with respect to the projection area AR1. To do. As described above, the control device CONT changes the liquid supply amount per unit time from the liquid supply ports 13A and 13B according to the moving direction of the substrate P.

  During immersion exposure of the substrate P, the pressure of the gap G, and thus the pressure of the liquid LQ in the immersion area AR2 is constantly monitored by the pressure sensor 120. The detection result of the pressure sensor 120 is output to the control device CONT. The controller CONT adjusts the pressure of the liquid LQ in the immersion area AR2 formed on the substrate P using the pressure adjustment mechanism 90 based on the detection result of the pressure sensor 120 during the immersion exposure of the substrate P. .

  The control device CONT adds the liquid LQ on the substrate P or partially recovers the liquid LQ on the substrate P via the pressure adjusting liquid supply unit 91 and the pressure adjusting liquid recovery unit 92 of the pressure adjusting mechanism 90. As a result, the pressure of the liquid LQ in the liquid immersion area AR2 is adjusted so that the liquid LQ that has entered the gap G between the side surface 2T of the optical element 2 and the flow path forming member 70 does not enter more than a predetermined height. To do.

  As described above, since the pressure of the gap G changes according to the height position of the liquid level of the liquid LQ that has entered the gap G, the pressure of the gap G is preset based on the detection result of the pressure sensor 120, for example. The controller CONT determines that the height position of the liquid level of the liquid LQ that has entered the gap G is equal to or greater than a predetermined value (upper limit) set in advance. to decide. The control device CONT then sets the liquid in the liquid immersion area AR2 so that the height of the liquid LQ that has entered the gap G is equal to or lower than the upper limit, that is, the pressure in the gap G is equal to or lower than the upper limit. Adjust LQ pressure. Specifically, as shown in FIG. 6A, the control device CONT drives the pressure adjustment liquid recovery unit 92 and supplies the liquid LQ in the immersion area AR2 via the pressure adjustment recovery ports 98A and 98B. Collect a portion. By collecting a part of the liquid LQ, the pressure of the liquid LQ in the liquid immersion area AR2 is lowered, and thereby the height position of the liquid surface of the liquid LQ in the gap G can be lowered. As described above, since the height position of the liquid surface of the liquid LQ that has entered the gap G changes according to the pressure of the liquid LQ in the liquid immersion area AR2, the pressure of the liquid LQ in the liquid immersion area AR2 is adjusted. The height position of the liquid level of the liquid LQ that has entered the gap G can be adjusted.

  When the liquid LQ enters the gap G, the liquid LQ that has entered the gap G applies a force to the side surface 2T of the optical element 2, and the optical element 2 may be deformed (distorted). However, by setting the height of the liquid level of the liquid LQ that has entered the gap G to be equal to or lower than a preset upper limit value, the force that the side surface 2T of the optical element 2 receives from the liquid LQ can be reduced, and the above disadvantages are caused. Occurrence can be prevented.

  When the pressure of the liquid LQ in the liquid immersion area AR2 is high (when positive), the liquid LQ in the liquid immersion area AR2 that has been positively pressurized is pushed by the substrate P, the substrate stage PST, or the optical element 2. However, the liquid LQ is reduced to the substrate P or the substrate stage PST by setting the liquid level height of the liquid LQ below the upper limit value and the pressure of the liquid LQ in the liquid immersion area AR2 below the upper limit value. Alternatively, the force exerted on the optical element 2 can be reduced. Therefore, it is possible to prevent inconveniences such as deformation of the substrate P and the substrate stage PST.

  On the other hand, when it is determined that the pressure of the liquid LQ in the liquid immersion area AR2 is equal to or lower than a predetermined value (lower limit) set based on the detection result of the pressure sensor 120, the control device CONT enters the gap G. It is determined that the height position of the liquid level of the liquid LQ is equal to or less than a predetermined value (lower limit value) set in advance. The control device CONT then sets the liquid in the liquid immersion area AR2 so that the height of the liquid level of the liquid LQ that has entered the gap G is equal to or higher than the lower limit value, that is, the pressure in the gap G is equal to or higher than the lower limit value. Adjust LQ pressure. Specifically, as shown in FIG. 6B, the control device CONT drives the pressure adjustment liquid supply unit 91 and supplies the liquid LQ in the immersion area AR2 via the pressure adjustment supply ports 97A and 97B. Further, liquid LQ is added. By adding the liquid LQ, the pressure of the liquid LQ in the liquid immersion area AR2 increases, and thereby the height position of the liquid surface of the liquid LQ in the gap G can be increased.

  In addition, when the pressure of the liquid LQ in the liquid immersion area AR2 is low (when the pressure is negative), the liquid LQ in the liquid immersion area AR2 that has been reduced in pressure is pulled to the substrate P, the substrate stage PST, or the optical element 2. However, by setting the liquid level height of the liquid LQ to be equal to or higher than the lower limit value and the pressure of the liquid LQ in the liquid immersion area AR2 to be equal to or higher than the lower limit value, the liquid LQ becomes the substrate P or the substrate stage PST. Alternatively, the force exerted on the optical element 2 can be reduced. Therefore, it is possible to prevent inconveniences such as deformation of the substrate P and the substrate stage PST.

  The upper limit value and the lower limit value are values that allow the substrate P to be exposed with desired exposure accuracy, and can be obtained in advance by, for example, experiments or simulations.

  Further, the pressure fluctuation of the liquid LQ is adjusted by adjusting the pressure of the liquid LQ in the liquid immersion area AR2 so that the height position of the liquid LQ that has entered the gap G is between the upper limit value and the lower limit value. Can be reduced. Therefore, it is possible to prevent inconvenience that the vibration due to the pressure fluctuation occurs in each member that contacts the liquid LQ such as the optical element 2, the substrate P, or the substrate stage PST. In particular, by setting the height position of the liquid LQ that has entered the gap G between the upper limit value and the lower limit value, large fluctuations in the height position of the liquid LQ that has entered the gap G are suppressed. Therefore, the pressure fluctuation of the liquid LQ in contact with the side surface 2T of the optical element 2 can be suppressed, and the disadvantage that the optical element 2 vibrates can be effectively prevented.

  When the pressure of the liquid LQ in the liquid immersion area AR2 is adjusted using the pressure adjustment mechanism 90, the liquid supply amount per unit time supplied from each of the plurality (two) of pressure adjustment supply ports 97A and 97B. May be different amounts or the same amount. Similarly, the liquid recovery amounts per unit time recovered from each of the plurality (two) of pressure adjustment recovery ports 98A and 98B may be different from each other or the same amount.

  As described above, by adjusting the pressure of the liquid LQ in the liquid immersion area AR2 formed on the substrate P, for example, the optical element 2 in contact with the liquid LQ in the substrate P, the substrate stage PST, or the projection optical system PL. It is possible to prevent the occurrence of deformation (distortion). Further, by adjusting the pressure of the liquid LQ in the liquid immersion area AR2 to suppress the pressure fluctuation, it is possible to prevent the substrate P, the substrate stage PST, or the optical element 2 from vibrating. In particular, by adjusting the pressure of the liquid LQ in the liquid immersion area AR2 so that the liquid LQ that has entered the gap G between the side surface 2T of the optical element 2 and the flow path forming member 7 does not enter more than a predetermined height. The force received from the liquid LQ from the side surface 2T of the optical element 2 can be reduced, and the distortion and vibration of the optical element 2 can be prevented from occurring. Therefore, high exposure accuracy and measurement accuracy can be obtained.

  In particular, in the present embodiment, a recess 78 is provided in the flow path forming member 70 in contact with the liquid LQ in the immersion area AR2 on the image plane side of the projection optical system PL, and the pressure fluctuation of the liquid LQ is provided in the recess 78. Is likely to occur. Further, since the liquid LQ is moved by scanning the substrate P, the pressure fluctuation becomes significant. Therefore, pressure adjusting supply ports 97A and 97B for adding the liquid LQ to adjust the pressure of the liquid LQ in the liquid immersion area AR2 are provided inside the recess 78, and pressure adjustment for recovering a part of the liquid LQ is provided. Since the recovery ports 98A and 98B are provided, the pressure fluctuation generated in the recess 78 can be effectively reduced, and the pressure can be adjusted satisfactorily.

  In the present embodiment, the pressure of the liquid in the liquid immersion area AR2 is adjusted by the pressure adjustment mechanism 90 so that the liquid LQ that has once entered the gap G does not enter more than a predetermined height. Specifically, the pressure adjusting mechanism 90 reduces the height of the liquid LQ existing in the gap G when the liquid LQ that has entered the gap G exceeds a predetermined height, or the liquid LQ is present in the gap G. The liquid pressure in the liquid immersion area AR2 is adjusted so as not to enter. During this adjustment, the liquid LQ may remain (attach) on the side surface 2T of the optical element 2. This remaining liquid LQ may gradually vaporize. As the liquid LQ vaporizes, the remaining liquid LQ removes heat from the optical element 2, so that the temperature distribution of the optical element 2 is changed, and the optical performance of the U element 2, and consequently the imaging performance of the projection optical system PL. May change. Therefore, in this embodiment, a sealing member such as an O-ring is provided above the gap G between the inner side surface 70T of the flow path forming member 70 and the side surface 2T of the optical element 2 to improve the airtightness of the gap G. That's fine. By providing the seal member in this way, the humidity of the gap G can be kept always close to the humidity of the liquid immersion area AR2, and the vaporization of the liquid LQ remaining on the side surface 2T of the optical element 2 can be suppressed. it can. Therefore, the influence on the optical performance of the optical element 2 or the imaging performance of the projection optical system PL can be reduced.

  In the above-described embodiment, the optical element 2 is exposed from the lens barrel PK, and the side surface 2T of the optical element 2 faces the inner side surface 70T of the flow path forming member 70. The second side surface 2T may be held by a part (tip portion) of the lens barrel PK or by a holding member (lens cell) different from the lens barrel PK. In this case, the side surface of the lens barrel PK or the side surface of the lens cell faces the inner side surface 70T of the flow path forming member 70. The control device CONT prevents the liquid level of the liquid LQ that has entered the gap between the side surface of the lens cell (or lens barrel) holding the optical element 2 and the flow path forming member 70 from entering more than a predetermined height. Then, the pressure of the liquid LQ in the liquid immersion area AR2 is adjusted.

  In the embodiment described above, the liquid supply ports 13A and 13B for supplying the liquid LQ and the liquid recovery ports 23A and 23B for recovering the liquid LQ are formed on the lower surface 70A of one flow path forming member 70. However, the flow path forming member (supply member) having the liquid supply ports 13A and 13B and the flow path forming member (collecting member) having the liquid recovery ports 23A and 23B may be provided separately.

  In the above-described embodiment, the liquid LQ immersion area AR2 is formed on the substrate P. However, as described above, the liquid LQ is formed on the upper surface of the reference member provided on the substrate stage PST. The liquid immersion area AR2 may be formed. Various measurement processes may be performed via the liquid LQ in the liquid immersion area AR2 on the upper surface. In this case, the pressure adjustment mechanism 90 can adjust the pressure of the liquid LQ so that the liquid LQ in the liquid immersion area AR2 formed on the reference member does not enter the gap G beyond a predetermined height. At this time, the pressure adjustment mechanism 90 can adjust the pressure of the liquid LQ in consideration of the affinity between the upper surface of the reference member and the liquid LQ. Similarly, when the liquid LQ immersion area AR2 is formed on the upper surface of the upper plate of the illuminance unevenness sensor, the upper surface of the upper plate of the aerial image measurement sensor, or the like, the pressure adjustment mechanism 90 causes the liquid LQ to enter the gap G. The pressure of the liquid LQ can be adjusted so as not to enter beyond a predetermined height. Furthermore, a configuration in which the liquid immersion area AR2 is formed on the upper surface of the Z tilt stage 52 (substrate stage PST) is also conceivable. In this case, the pressure adjustment mechanism 90 prevents the liquid LQ from entering the gap G beyond a predetermined height. The pressure can be adjusted.

  In the above-described embodiment, the pressure adjustment mechanism 90 performs the pressure adjustment operation of the liquid LQ in the liquid immersion area AR2 formed on the substrate P during the liquid immersion exposure of the substrate P. It may be performed before or after immersion exposure.

  In the above-described embodiment, the pressure adjustment supply port 97 and the pressure adjustment recovery port 98 are independent ports, but the liquid supply unit 91 and the liquid recovery unit 92 also serve as one port. Liquid supply and recovery may be performed through one port.

  In the above-described embodiment, the liquid supply amount per unit time from each of the plurality (two) of pressure adjustment supply ports 97A and 97B provided is different from each other depending on, for example, the moving direction of the substrate P and the scanning speed. It may be. Similarly, the liquid recovery amounts per unit time through each of the plurality of pressure adjustment recovery ports 98A and 98B may be different from each other.

  In the embodiment described above, two pressure adjustment supply ports 97 and two pressure adjustment supply ports 98 are provided side by side in the non-scanning direction (Y-axis direction), but in the scanning direction (X-axis direction). A plurality may be provided side by side. When a plurality of X-axis directions are provided side by side, they can be provided on both sides of the projection area AR1. Also in this case, when performing the liquid LQ pressure adjustment, the liquid supply amount from each of the plurality of pressure adjustment supply ports 97 arranged in the X-axis direction is reduced so that the force exerted by the liquid LQ on the substrate P is reduced. For example, different values may be used depending on the scanning direction and scanning speed of the substrate P. Similarly, the liquid recovery amounts from the plurality of pressure adjustment recovery ports 98 arranged in the X-axis direction may be different from each other.

  In the above-described embodiment, two pressure adjustment supply ports 97 and two pressure adjustment recovery ports 98 are provided. However, one may be provided, or two or more arbitrary plural locations may be provided. May be. The shape of the pressure adjustment supply port 97 and the pressure adjustment recovery port 98 is not limited to a circular shape, and may be, for example, a rectangular shape, a polygonal shape, an arc shape, or a slit shape having a predetermined direction as a longitudinal direction.

  In the above-described embodiment, a porous body made of a sponge-like member, porous ceramics, or the like is provided in the liquid supply port 13 and the liquid recovery port 23, the supply channel 14 and the recovery channel 24 connected thereto, and the like. You may arrange.

  In the above-described embodiment, the exposure apparatus EX adjusts the pressure of the liquid LQ in the immersion area AR2 by the pressure adjustment mechanism 90 having the pressure adjustment supply port 97 and the pressure adjustment recovery port 98. As shown in FIG. 7, even if the pressure adjustment mechanism 90 is omitted, the pressure of the liquid LQ in the liquid immersion area AR2 can be adjusted. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In FIG. 7, the substrate P is exposed to exposure light EL while moving in the X-axis direction. Then, the pressure adjustment of the liquid LQ in the liquid immersion area AR2 is performed by adjusting the liquid supply amount per unit time from the liquid supply ports 13A and 13B for forming the liquid immersion area AR2 or the unit time from the liquid recovery ports 23A and 23B. This is done by adjusting the amount of liquid recovered per hit. In this way, by adjusting the amount of liquid supplied from the liquid supply ports 13A and 13B or the amount of liquid recovered by the liquid recovery ports 23A and 23B, the pressure of the liquid LQ in the liquid immersion area AR2 is adjusted to enter the gap G. It is also possible to adjust the height of the liquid level of the liquid LQ.

  In addition, there is a possibility that the liquid level of the liquid LQ in the gap G between the side surface 2T of the optical element 2 and the flow path forming member 70 is distributed. For example, when the substrate P moves in the X-axis direction, the gap X1 on the −X side and the gap G2 on the + X side with respect to the projection area AR1 are larger in the gap G1 on the −X side, for example, as shown in FIG. Liquid LQ may enter and the level of the liquid LQ may be higher than that on the + X side. In that case, the control device CONT is a liquid provided so as to surround the projection area AR1 of the projection optical system PL in order to make the height of the liquid surface of the liquid LQ entering the gap X1 on the −X side lower than the upper limit value. Of the supply ports 13A, 13B and the liquid recovery ports 23A, 23B, for example, the liquid supply amount from the liquid supply port 13A provided at a position close to the gap X1 on the −X side is the liquid supply amount from the liquid supply port 13B. The liquid recovery amount is adjusted to be smaller than the liquid recovery amount or the liquid recovery amount from the liquid recovery port 23A is increased compared to the liquid recovery amount from the liquid recovery port 23B. Thus, according to the distribution of the height position of the liquid level of the liquid LQ in the gap G, the liquid supply amount from each of the plurality of liquid supply ports 13A and 13B or the liquid recovery from the plurality of liquid recovery ports 23A and 23B. By adjusting the amount, the height of the liquid surface of the liquid LQ that has entered the gap G can be made substantially uniform.

  Also in this case, since the pressure sensor 120 is provided in each of the −X side gap G1 and the + X side gap G2, a plurality of liquid supplies are supplied based on the outputs of the plurality of pressure sensors 120, respectively. The amount of liquid supplied from each of the ports 13A and 13B or the amount of liquid recovered from each of the plurality of liquid recovery ports 23A and 23B can be adjusted.

  As described above, the liquid LQ in the present embodiment is composed of pure water. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. . When the purity of pure water supplied from a factory or the like is low, the exposure apparatus may have an ultrapure water production device.

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be approximately 1.44. When ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL, On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution can be obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

  As described above, when the liquid immersion method is used, the numerical aperture NA of the projection optical system may be 0.9 to 1.3. When the numerical aperture NA of the projection optical system becomes large in this way, the imaging performance may deteriorate due to the polarization effect with random polarized light conventionally used as exposure light. desirable. In that case, linearly polarized illumination is performed in accordance with the longitudinal direction of the line pattern of the mask (reticle) line-and-space pattern. From the mask (reticle) pattern, the S-polarized light component (TE-polarized light component), that is, the line pattern It is preferable that a large amount of diffracted light having a polarization direction component is emitted along the longitudinal direction. When the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with a liquid, the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with air (gas). Compared with the case where the transmittance of the diffracted light of the S-polarized component (TE-polarized component) contributing to the improvement of the contrast is high on the resist surface, the numerical aperture NA of the projection optical system exceeds 1.0. Even in this case, high imaging performance can be obtained. Further, it is more effective to appropriately combine a phase shift mask or an oblique incidence illumination method (particularly a die ball illumination method) or the like according to the longitudinal direction of the line pattern as disclosed in JP-A-6-188169.

  Further, for example, an ArF excimer laser is used as the exposure light, and a fine line and space pattern (for example, a line and space of about 25 to 50 nm) is formed on the substrate by using the projection optical system PL with a reduction magnification of about 1/4. When exposing on P, depending on the structure of the mask M (for example, the fineness of the pattern and the thickness of chrome), the mask M acts as a polarizing plate due to the Wave guide effect, and the P-polarized component (TM polarized light) that lowers the contrast. Since the diffracted light of the S-polarized component (TE-polarized component) is emitted from the mask M more than the diffracted light of the component), it is desirable to use the above-mentioned linearly polarized illumination, but the mask M is illuminated with random polarized light Even when the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3, high resolution performance can be obtained. When an extremely fine line-and-space pattern on the mask M is exposed on the substrate P, the P-polarized component (TM-polarized component) is larger than the S-polarized component (TE-polarized component) due to the Wire Grid effect. For example, an ArF excimer laser is used as exposure light, and a line and space pattern larger than 25 nm is exposed on the substrate P using the projection optical system PL with a reduction magnification of about 1/4. In this case, since the diffracted light of the S polarization component (TE polarization component) is emitted from the mask M more than the diffracted light of the P polarization component (TM polarization component), the numerical aperture NA of the projection optical system PL is 0.9. High resolution performance can be obtained even when the value is as large as -1.3.

  Furthermore, not only linearly polarized illumination (S-polarized illumination) matched to the longitudinal direction of the line pattern of the mask (reticle) but also a circle centered on the optical axis as disclosed in JP-A-6-53120. A combination of the polarization illumination method that linearly polarizes in the tangential (circumferential) direction and the oblique incidence illumination method is also effective. In particular, when a mask (reticle) pattern includes not only a line pattern extending in a predetermined direction but also a plurality of line patterns extending in different directions, the same is disclosed in Japanese Patent Laid-Open No. 6-53120. In addition, by using the polarization illumination method that linearly polarizes in the tangential direction of the circle centered on the optical axis and the annular illumination method, high imaging performance can be obtained even when the numerical aperture NA of the projection optical system is large. it can.

  In the present embodiment, the optical element 2 is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, for example, aberration (spherical aberration, coma aberration, etc.) can be adjusted by this lens. The optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a plane parallel plate that can transmit the exposure light EL.

  When the pressure between the optical element at the tip of the projection optical system PL generated by the flow of the liquid LQ and the substrate P is large, the optical element is not exchangeable but the optical element is moved by the pressure. It may be fixed firmly so that there is no.

  In the present embodiment, the space between the projection optical system PL and the surface of the substrate P is filled with the liquid LQ. However, for example, the liquid with the cover glass made of a plane-parallel plate attached to the surface of the substrate P is used. The structure which satisfy | fills LQ may be sufficient.

The liquid LQ of the present embodiment is water, but may be a liquid other than water. For example, when the light source of the exposure light EL is an F ₂ laser, the F ₂ laser light does not pass through water. The liquid LQ may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F ₂ laser light. In this case, the lyophilic treatment is performed by forming a thin film with a substance having a molecular structure having a small polarity including fluorine, for example, at a portion in contact with the liquid LQ. In addition, as the liquid LQ, the liquid LQ is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used. Also in this case, the surface treatment is performed according to the polarity of the liquid LQ to be used.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise. In this case, for example, a projection exposure apparatus (immersion type) having a refracting projection optical system with a magnification of 1/8 is used, and at least two patterns are transferred onto the substrate P in a partially overlapping manner. The present invention can also be applied to a type of exposure apparatus.

  The present invention can also be applied to a twin stage type exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 10-163099, Japanese Patent Application Laid-Open No. 10-214783, and Japanese Translation of PCT International Publication No. 2000-505958.

  In the above-described embodiment, an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed. However, the present invention is disclosed in Japanese Patent Laid-Open No. 6-124873. It is also applicable to an immersion exposure apparatus that moves a stage holding a substrate to be exposed in a liquid tank.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  When using a linear motor (see USP5,623,853 or USP5,528,118) for the substrate stage PST and mask stage MST, use either an air levitation type using air bearings or a magnetic levitation type using Lorentz force or reactance force. Also good. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  As a driving mechanism for each stage PST, MST, a planar motor that drives each stage PST, MST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, either one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages PST and MST.

As described in JP-A-8-166475 (USP 5,528,118), the reaction force generated by the movement of the substrate stage PST is not transmitted to the projection optical system PL, but mechanically using a frame member. You may escape to the floor (ground).
As described in JP-A-8-330224 (US S / N 08 / 416,558), a frame member is used so that the reaction force generated by the movement of the mask stage MST is not transmitted to the projection optical system PL. May be mechanically released to the floor (ground).

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 8, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows one Embodiment of the exposure apparatus of this invention. It is a perspective view which shows a flow-path formation member. It is the perspective view which looked at the flow-path formation member from the lower surface side. FIG. 3 is a cross-sectional view taken along the line AA in FIG. 2. It is a BB cross-sectional arrow view of FIG. It is a schematic diagram which shows an example of operation | movement of the exposure apparatus of this invention. It is sectional drawing which shows another embodiment of the exposure apparatus of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

2 ... optical element (optical member), 2T ... side surface, 10 ... liquid supply mechanism,
13 (13A, 13B) ... liquid supply port, 20 ... liquid recovery mechanism,
23 (23A, 23B) ... liquid recovery port, 70 ... flow path forming member (annular member),
90 ... Pressure adjustment mechanism, 97A, 97B ... Pressure adjustment supply port (second liquid supply port),
98A, 98B ... Pressure adjusting recovery port (second liquid recovery port),
120 ... Pressure sensor (pressure detector), AR1 ... Projection area, AR2 ... Immersion area,
EL ... exposure light, EX ... exposure device, P ... substrate, PK ... barrel (holding member),
PL ... Projection optical system, LQ ... Liquid

Claims (9)

In an exposure apparatus that forms a liquid immersion region between the projection optical system and the substrate, and exposes the substrate by irradiating the substrate with exposure light via the projection optical system and the liquid.
Among the plurality of optical members constituting the projection optical system, provided so as to surround the side surface of the optical member in contact with the liquid or the side surface of the holding member that holds the optical member, and at least one of the liquid supply port and the liquid recovery port Comprising an annular member having one of these,
Adjusting the pressure of the liquid in the liquid immersion region so that the liquid that has entered the gap between the side surface of the optical member or the holding member and the annular member does not enter more than a predetermined height. Exposure equipment to do. A pressure detector for detecting the pressure in the gap;
2. The exposure apparatus according to claim 1, wherein the pressure of the liquid is adjusted based on a detection result of the pressure detector.   By adjusting at least one of a liquid supply amount per unit time from the liquid supply port for forming the liquid immersion region and a liquid recovery amount per unit time from the liquid recovery port, 3. The exposure apparatus according to claim 1, wherein the liquid pressure is adjusted. Each of the liquid supply port and the liquid recovery port is provided in a plurality so as to surround the projection region of the projection optical system,
Depending on the distribution of the height of the liquid in the gap between the side surface of the optical member or the holding member and the annular member, the amount of liquid supplied from each of the plurality of liquid supply ports, and the plurality of liquid recovery ports 4. The exposure apparatus according to claim 3, wherein at least one of the liquid recovery amounts is adjusted. The substrate is exposed while moving in a predetermined direction,
The exposure apparatus according to claim 4, wherein the liquid supply port and the liquid recovery port are provided on both sides of the projection optical system with respect to the predetermined direction.   6. The exposure apparatus according to claim 4, wherein the liquid recovery port is provided outside the liquid supply port with respect to a projection region of the projection optical system.   A second liquid supply port and a second liquid recovery port, which are different from the liquid supply port and the liquid recovery port, are provided, and an additional liquid or a liquid is supplied via the second liquid supply port and the second liquid recovery port. The exposure apparatus according to claim 1, wherein the pressure of the liquid is adjusted by performing partial recovery.   The exposure apparatus according to claim 7, wherein the second liquid supply port and the second liquid recovery port are disposed closer to a projection region of the projection optical system than the liquid supply port.   A device manufacturing method using the exposure apparatus according to claim 1.

Images