JP4609757B2 - Substrate mounting method in film forming apparatus - Google Patents

Description

  The present invention relates to a substrate mounting method in a film forming apparatus.

  A vacuum vapor deposition apparatus (film forming apparatus) for manufacturing an organic EL (Electroluminescent) element is provided with a crucible for putting an organic material at the bottom, and a heater for heating and evaporating (sublimating) the organic material on the outer surface of the crucible It has been. Further, the vacuum deposition apparatus is provided with a chuck disposed so as to face the crucible and a substrate clamp that comes into contact with the edge of the glass substrate and mounts and holds the glass substrate on the bottom surface of the chuck. The chuck is a flat plate for keeping the glass substrate flat, and the substrate clamp is provided with a lifting mechanism. Further, in the vacuum deposition apparatus, a mask for forming a pattern of the organic EL element on the glass substrate is provided between the crucible and the crucible.

  FIG. 6 is an explanatory diagram when a glass substrate is mounted on the vacuum deposition apparatus. First, the glass substrate 2 is inserted between the chuck 1 and the mask 3 by the substrate transport mechanism and placed on the substrate clamp 4 (S1). The substrate clamp 4 rises when the glass substrate 2 is placed, and brings the glass substrate 2 into contact with the bottom surface of the chuck 1 (S2). Thereby, the glass substrate 2 is mounted and held by the chuck 1 and the substrate clamp 4. Thereafter, the mask 3 is raised and put on the glass substrate 2 (S3).

The vacuum vapor deposition method disclosed in Patent Document 1 describes a method in which a glass substrate is brought into contact with a holder member. That is, this method first places the glass substrate on the substrate support, holds the mask plate on the lower surface of the mask plate mounting means, aligns the glass substrate and the mask plate, and then the glass substrate and the mask. Join the board. Next, after separating the mask plate mounting means from the mask plate, the substrate support is inverted 180 ° so that the mask plate becomes the lower surface. And after raising a conveyance stand so that it may contact | abut to the lower surface of a mask board, a glass substrate is separated from a substrate support stand, and the upper surface of a glass substrate is made to contact | abut to a holder member after that.
JP 2004-259598 A

  The planar size of the glass substrate is, for example, about 370 mm × 470 mm, and the thickness thereof is about 0.5 to 0.7 mm. As described above, since the glass substrate is thin for a large plane size, if the glass substrate is mounted and held on the chuck with the edge of the glass substrate supported by the substrate clamp, the glass substrate's own weight or gravity Due to the influence, the central portion is bent. In S2 of FIG. 6, the interval indicated by the arrow A indicates the deflection.

  By the way, when manufacturing an organic EL element, red, green, and blue light emitting portions must be arranged for each pixel (pixel) having a width of several tens of μm on a glass substrate, and the positional accuracy of each pixel is ± 5. About ± 3 μm is required.

  Therefore, when film formation is performed in a state where the central portion of the glass substrate is bent, a pattern cannot be formed at a place where it is originally required, and position accuracy required for manufacturing an organic EL element can be obtained. I can't.

  An object of this invention is to provide the board | substrate mounting method in the film-forming apparatus which can form into a film, keeping a board | substrate flat.

In order to achieve the above object, the substrate mounting method in the film forming apparatus according to the present invention is also provided with an evaporation source in the film forming apparatus and a chuck opposed to the evaporation source, and the chuck mounts and holds the substrate. A substrate mounting method in a film forming apparatus, comprising: a mask disposed between the chuck and the evaporation source; and the substrate is inserted between the chuck, the substrate is brought close to the mask, and the substrate is An alignment mark provided on the glass substrate, placed on the mask, bringing the mask close to the chuck together with the substrate, bringing the substrate into contact with the chuck, holding the substrate, and then moving the mask downward. And alignment of the glass substrate and the mask is performed using alignment marks provided on the mask .

Further, the substrate deposition method in the film deposition apparatus is provided with an evaporation source and a chuck opposed to the evaporation source in the film deposition apparatus, and the substrate is mounted and held on the chuck, between the chuck and the evaporation source. The substrate is inserted between the arranged mask and the chuck, the mask is brought close to the substrate, the substrate is placed on the mask, the mask is brought close to the chuck together with the substrate, and the substrate is The position of the glass substrate and the mask is brought into contact with the chuck, holding the substrate, and then moving the mask downward, using the alignment mark provided on the glass substrate and the alignment mark provided on the mask. It is characterized by letting you match .

Further, the substrate deposition method in the film deposition apparatus is provided with an evaporation source and a chuck opposed to the evaporation source in the film deposition apparatus, and the substrate is mounted and held on the chuck, between the chuck and the evaporation source. The substrate is placed on the arranged mask, the mask is brought close to the chuck together with the substrate, the substrate is brought into contact with the chuck, the substrate is held, and then the mask is moved downward to be provided on the glass substrate. The alignment between the glass substrate and the mask is performed using the alignment mark provided and the alignment mark provided on the mask .

  When the substrate is placed on the mask, it becomes horizontal (planar) along the mask surface. When the mask on which the substrate is placed is brought close to the chuck and the substrate is brought into contact with the chuck, the substrate is brought into contact with the chuck while maintaining a horizontal state. If the substrate is mounted and held by the substrate clamp while maintaining the level of the substrate, the level of the substrate can be maintained and fixed to the chuck. Therefore, even if the mask is moved away from the substrate thereafter, the substrate can continue to be maintained in a horizontal state, and no bending occurs in the central portion of the substrate.

  Thereafter, when the organic material is evaporated from the evaporation source by aligning the substrate and the mask, a shape corresponding to the opening pattern provided in the mask can be formed on the substrate. Therefore, a pattern can be formed on the substrate with high accuracy.

  Hereinafter, the best embodiment of the substrate mounting method in the film forming apparatus according to the present invention will be described. In the present embodiment, a mode in which a vacuum vapor deposition apparatus is used as a film forming apparatus and an organic EL element is manufactured using the vacuum vapor deposition apparatus will be described. FIG. 1 is an explanatory diagram of a vacuum deposition apparatus. FIG. 2 is a schematic bottom view illustrating the arrangement of the chuck, the substrate clamp, and the mask clamp. The vacuum deposition apparatus 10 has a configuration in which an evaporation source 12 (sublimation source) of the organic material 20 is provided at the bottom, and a chuck 14, a substrate clamp 16 and a mask clamp 18 are provided at the top thereof.

  Specifically, the evaporation source 12 of the organic material 20 includes a crucible 22 in which the organic material 20 is placed, and a heater 24 that heats and evaporates (sublimates) the organic material 20 is provided on the outer surface of the crucible 22. . The chuck 14 provided on the upper portion of the vacuum vapor deposition apparatus 10 is a flat plate disposed in the horizontal direction so as to face the crucible 22. The chuck 14 can be horizontally rotated by a rotation mechanism (not shown) provided on the outer upper portion of the vacuum deposition apparatus 10.

  The substrate clamp 16 extends downward from the upper part of the vacuum deposition apparatus 10, and is a saddle type in which a tip end portion 16 a is bent toward the chuck 14 side (the center side of the deposition apparatus), and extends along the side edge of the chuck 14. A plurality of them are arranged. The substrate clamp 16 is set so that the tip portions 16a have the same height (in the same plane) in order to support the edge portion of the glass substrate 26 by the tip portion 16a (bending portion). Further, the substrate clamp 16 can be moved up and down by an elevating mechanism (not shown) provided on the outer upper portion of the vacuum vapor deposition apparatus 10 while maintaining the state in which the tip portions 16a are in the same plane. When the substrate clamp 16 is raised, the glass substrate 26 can be brought into contact with the chuck 14 and mounted and held in a flat shape.

  The mask clamp 18 extends downward from the upper part of the vacuum vapor deposition apparatus 10 and is a saddle type in which a tip end portion 18a is bent toward the chuck 14 side (the central side of the vapor deposition apparatus). A plurality are arranged along the side edges. The mask clamp 18 is set so that the tip portions 18a have the same height (in the same plane) in order to support the edge portion of the mask 28 with the tip portions 18a (folded portions). The mask clamp 18 can be moved up and down while maintaining the state in which the tip portions 18a are in the same plane by an elevating mechanism (not shown) provided on the upper outer portion of the vacuum deposition apparatus 10. The mask 28 includes a mask film 28a provided with a plurality of opening patterns corresponding to each pixel of the organic EL element, and a frame-shaped mask frame 28b that holds the peripheral portion of the mask film 28a.

  The substrate clamp 16 and the mask clamp 18 can be rotated together with the chuck 14 by a rotation mechanism (not shown) provided on the outer upper portion of the vacuum deposition apparatus 10.

  Next, a method for mounting the glass substrate 26 will be described. FIG. 3 is an explanatory diagram of a glass substrate mounting process. A mask 28 is disposed on the mask clamp 18 in advance. First, the glass substrate 26 is placed in the vacuum evaporation apparatus 10 by a substrate transport mechanism (not shown) and inserted between the chuck 14 and the mask 28. Then, the glass substrate 26 is moved downward together with the lowering operation of the substrate transport mechanism and placed on the substrate clamp 16 (S100).

  Thereafter, the mask clamp 18 is raised to move the mask 28 upward, and the glass substrate 26 is placed on the mask 28 (S110). The mask clamp 18 continues to be raised until the glass substrate 26 contacts the bottom surface (chuck surface) of the chuck 14 (S120). When the glass substrate 26 is placed on the mask 28, the glass substrate 26 becomes horizontal along the mask 28, and is brought into contact with the chuck 14 while maintaining this horizontal state. The glass substrate 26 may be placed on the mask 28 when inserted into the vacuum evaporation apparatus 10, or after being placed on the substrate clamp 16, the substrate clamp 16 is lowered and the substrate is placed on the mask 28. May be.

  Thereafter, the substrate clamp 16 is raised until it contacts the glass substrate 26 (S130). Thus, the glass substrate 26 is mounted and held on the chuck 14 while maintaining the horizontal state by the substrate clamp 16. Then, the mask clamp 18 is lowered and the mask 28 is moved downward (S140).

  Thereafter, the alignment between the glass substrate 26 and the mask 28 is performed using the alignment mark provided on the glass substrate 26 and the alignment mark provided on the mask 28. FIG. 4 is an explanatory diagram of alignment between the glass substrate and the mask. FIG. 4A illustrates the arrangement of the camera, the glass substrate, and the mask. FIG. 4B is an image captured by a camera and shows a case where a positional deviation has occurred. Further, FIG. 4C is an image captured by the camera and showing a case where the positions are correct.

  Specifically, the glass substrate 26 is provided with alignment marks 32 in at least two places. The alignment mark 32 provided on the glass substrate 26 is provided, for example, at a corner portion opposite to the glass substrate 26 and is formed of the same material as this electrode at the same time that the electrode film of the organic EL element is formed on the glass substrate 26. It only has to be done. The shape of the alignment mark 32 provided on the glass substrate 26 may be, for example, a circle, a dot, or a cross.

  The alignment mark 34 provided on the mask 28 may be provided at a position corresponding to the alignment mark 32 provided on the glass substrate 26, and the shape may be a dot, a circle, a cross, or the like. If the alignment mark 32 on the glass substrate 26 is round, the alignment mark 34 on the mask 28 may be used as a dot. If the alignment mark 32 on the glass substrate 26 is used as a dot, the alignment mark 34 on the mask 28 is enlarged. What is necessary is just to make it a different circle or a different shape.

  Furthermore, the vacuum deposition apparatus 10 may be provided with a camera 30 that images the alignment marks 32 provided on the glass substrate 26 and the alignment marks 34 provided on the mask 28 (see FIG. 4A).

  Then, while confirming the image captured by the camera 30, X (vertical) and Y (horizontal) of the mask 28 so that the dot-shaped alignment mark 34 (32) is placed in the circular alignment mark 32 (34). If the θ (rotation) direction is adjusted, the alignment between the glass substrate 26 and the mask 28 is completed (see FIGS. 4B and 4C).

  After the glass substrate 26 mounting process, the glass substrate 26 and the mask 28 are rotated, and the organic material 20 is heated and sublimated by the heater 24 to form a predetermined pattern on the glass substrate 26. Thereby, an organic EL element is manufactured.

  In such a method of mounting the glass substrate 26 in the vacuum deposition apparatus 10, the glass substrate 26 is once mounted on the mask 28 below the glass substrate 26 before being placed on the chuck 14 surface, and the mask surface together with the mask 28 as it is. Therefore, the bending at 16 o'clock of the substrate clamp can be eliminated. That is, even if a thin glass substrate 26 is used, the glass substrate 26 is maintained in a horizontal state and is held by the chuck 14, so that the central portion of the glass substrate 26 does not bend downward due to its own weight or gravity. . Therefore, each pixel can be formed on the glass substrate 26 with high accuracy.

  In this embodiment, the glass substrate 26 is mounted by inserting the glass substrate 26 between the chuck 28 and the mask 28 disposed between the chuck 14 and the evaporation source 12 and bringing the glass substrate 26 close to the mask 28. The glass substrate 26 is placed on the mask 28, the mask 28 is brought close to the chuck 14 together with the glass substrate 26, the glass substrate 26 is brought into contact with the chuck 14, and the glass substrate 26 is held. It will never be done. That is, first, the glass substrate 26 is inserted between the mask 28 disposed between the chuck 14 and the evaporation source 12 and the chuck 14. Next, the mask 28 is brought close to the glass substrate 26, and the glass substrate 26 is placed on the mask 28. Then, a mounting method may be used in which the mask 28 is brought close to the chuck 14 together with the glass substrate 26, the glass substrate 26 is brought into contact with the chuck 14, and the glass substrate 26 is held. The glass substrate 26 is mounted by placing the glass substrate 26 on a mask 28 arranged between the chuck 14 and the evaporation source 12, bringing the mask 28 close to the chuck 14 together with the glass substrate 26, and attaching the glass substrate 26 to the chuck 14. The glass substrate 26 may be held in contact with the substrate.

  In the present embodiment, as shown in FIG. 4, two cameras 30 for aligning the glass substrate 26 and the mask 28 are provided. However, the present invention is not limited to this. That is, three cameras 30 can be provided as shown in FIG. 5A, and four cameras 30 can be provided as shown in FIG.

  Moreover, although this embodiment demonstrated the form which manufactures an organic EL element with this vacuum vapor deposition apparatus 10 using the vacuum vapor deposition apparatus 10 as a film-forming apparatus, it is not limited to this form. That is, the substrate mounting method in the film forming apparatus can be applied when it is necessary to perform film formation while keeping the substrate horizontal (planar) in the film forming apparatus. Therefore, the film forming apparatus may be a film forming apparatus other than the vacuum vapor deposition apparatus, such as a sputtering apparatus. Further, the substrate is not limited to a glass substrate.

It is explanatory drawing of a vacuum evaporation system. It is a schematic bottom view explaining arrangement | positioning of a chuck | zipper, a board | substrate clamp, and a mask clamp. It is explanatory drawing of the mounting process of a glass substrate. It is explanatory drawing of position alignment with a glass substrate and a mask. It is a figure explaining the arrangement | positioning position of a camera. It is explanatory drawing when attaching a glass substrate to a vacuum evaporation system.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ......... Vacuum evaporation apparatus, 14 ......... Chuck, 16 ...... Substrate clamp, 18 ......... Mask clamp, 26 ......... Glass substrate, 28 ...... Mask, 30 ...... Camera.

Claims (3)

A substrate mounting method in a film forming apparatus in which an evaporation source and a chuck facing the evaporation source are provided in the film forming apparatus, and the substrate is mounted and held on the chuck,
A mask disposed between the chuck and the evaporation source, and the substrate inserted between the chuck and
Bringing the substrate close to the mask and placing the substrate on the mask;
The mask is brought close to the chuck together with the substrate, the substrate is brought into contact with the chuck,
Holding the substrate ,
Thereafter, the mask is moved downward, and the alignment between the glass substrate and the mask is performed using the alignment mark provided on the glass substrate and the alignment mark provided on the mask .
A substrate mounting method in a film forming apparatus. A substrate mounting method in a film forming apparatus in which an evaporation source and a chuck facing the evaporation source are provided in the film forming apparatus, and the substrate is mounted and held on the chuck,
A mask disposed between the chuck and the evaporation source, and the substrate inserted between the chuck and
Close the mask to the substrate and place the substrate on the mask;
The mask is brought close to the chuck together with the substrate, the substrate is brought into contact with the chuck,
Holding the substrate ,
Thereafter, the mask is moved downward, and the alignment between the glass substrate and the mask is performed using the alignment mark provided on the glass substrate and the alignment mark provided on the mask .
A substrate mounting method in a film forming apparatus. A substrate mounting method in a film forming apparatus in which an evaporation source and a chuck facing the evaporation source are provided in the film forming apparatus, and the substrate is mounted and held on the chuck,
Placing the substrate on a mask disposed between the chuck and the evaporation source;
The mask is brought close to the chuck together with the substrate, the substrate is brought into contact with the chuck,
Holding the substrate ,
Thereafter, the mask is moved downward, and the alignment between the glass substrate and the mask is performed using the alignment mark provided on the glass substrate and the alignment mark provided on the mask .
A substrate mounting method in a film forming apparatus.

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