CN103205682B - The method of the indirect para-position of mask assembly - Google Patents
The method of the indirect para-position of mask assembly Download PDFInfo
- Publication number
- CN103205682B CN103205682B CN201210010695.2A CN201210010695A CN103205682B CN 103205682 B CN103205682 B CN 103205682B CN 201210010695 A CN201210010695 A CN 201210010695A CN 103205682 B CN103205682 B CN 103205682B
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- Prior art keywords
- mask
- registration holes
- para
- plate
- mask frame
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Abstract
The invention discloses a kind of method of the indirect para-position of mask assembly, comprises the following steps：Mask frame is placed on para-position base station, makes mask frame align with para-position pin；Alignment auxiliary plate is placed on mask frame and which is relatively fixed with para-position base station, and make the registration holes of Alignment auxiliary plate corresponding with mask frame registration holes；The location drawing picture that registration holes in Alignment auxiliary plate and mask frame are caught by CCD, and measure position deviation L of their corresponding two registration holes；The position of adjustment para-position pin causes L≤15 μm with the position of trim mask framework；Alignment auxiliary plate is removed, mask plate is placed on mask frame and which is fixed on para-position base station；And mask plate registration holes and the location drawing picture of corresponding mask frame registration holes are caught by CCD, detect whether the former is blocked by the edge of the latter, repeat above step if being blocked until mask plate registration holes are entirely through hole.
Description
Technical field
A kind of a kind of the present invention relates to alignment method of mask assembly, more particularly to the method for the indirect para-position of mask assembly.
Background technology
Organic electroluminescent device（OLED）Because its visual angle is wide, low cost, manufacturing process are simple, high resolution and from preparation
The features such as light, receive much concern, and be considered to make the emerging application technology of follow-on flat-panel screens.
In terms of the vacuum deposition apparatus of manufacture organic electroluminescent device, the earthenware for holding organic material is set in bottom
Crucible, is set using organic material heating, the heater of evaporation outside crucible.In evaporation coating device, arrange relative with crucible
The chuck of configuration and sandwich the insulating element of glass substrate and make the substrate that the substrate fixture of the bottom surface for being maintained at chuck to be installed.
It is plane flat board for maintaining glass substrate that chuck is, arranges elevating mechanism, and set on elevating mechanism in substrate folder
There is fixture, by fixture permanent mask framework so as to which the position deviation relative to substrate is controlled within the specific limits, with limitation
Property.Lift dog, makes mask assembly near substrate.
And when organic illuminating element is manufactured, on substrate, the pixel per 10um width must sending out red, green, blue
Side by side, the positional precision of each pixel is necessary for the degree of ± 5um in light portion；And during due to evaporation, temperature is constantly raised, by plate
The impact of material expanded by heating, mask assembly can produce position deviation relative to substrate, therefore the position to vacuum deposition apparatus mask
Put required precision very high.
It is that para-position is carried out by the loci on mask plate and substrate during evaporated device on mask assembly, due to mask frame
Position debugging scope there is limitation, mask plate is welded on mask frame again so that only by mask plate loci and
Substrate carries out para-position and cannot meet position accuracy demand, it is therefore necessary to ensure that mask plate and the position deviation of mask frame will also be controlled
System is within the specific limits.
When mask plate and mask frame carry out para-position, typically using being made on mask plate 03 and mask frame 02 respectively
Mark（Loci）The method of A, B, is caught to the location drawing picture of A, B by CCD, as shown in figure 1, making A, B both center
Overlap, complete the para-position of the two.
Due to being to carry out para-position by loci A on mask plate 03 and substrate during evaporated device on mask assembly, in order to
Avoid the points of the Mark on mask frame 02 B from producing the Mark points on mask plate 03 to block, it is desirable to the Mark on mask plate 03
The diameter of point A is less than the diameter of the point B of the Mark on mask frame 02, when so just can guarantee that evaporation para-position on mask plate 03
Mark point A are entirely through hole, and contrast is obvious, so that mask plate 03 is high with the aligning accuracy of substrate.
However, when mask plate carries out para-position with mask frame, carrying out location graphic seizure by CCD to A, B, CCD is regarded
Angle captures the location drawing picture of A from top to bottom, first, if the diameter with diameter greater than A of B, the more difficult positions for capturing B of CCD
Image, the thus para-position to mask plate 03 with mask frame 02 bring difficulty, so that affecting mask plate with mask frame
Aligning accuracy.
Content of the invention
Present invention seek to address that making mask plate when the diameter of mask plate registration holes is less than the diameter of mask frame registration holes
Technical problem with mask frame accurate contraposition.
For solving above-mentioned technical problem, the invention discloses a kind of method for the indirect para-position of mask assembly, including with
Lower step：S1, mask frame is lain in a horizontal plane on para-position base station, make the para-position pin pair on mask frame and para-position base station
Together；S2, Alignment auxiliary plate is lain in a horizontal plane on mask frame and is relatively fixed with para-position base station, and make the right of Alignment auxiliary plate
Position hole A1Registration holes B corresponding with mask frame are corresponding；S3, Alignment auxiliary plate and mask frame are caught from top to bottom by CCD
The location drawing picture of registration holes on frame, and measure registration holes A1Relative position deviation L with registration holes B；If S4 is L>15 μm, then adjust
The position of whole para-position pin is with the position of trim mask framework until L≤15 μm, directly carry out subsequent step if L≤15 μm；
S5, Alignment auxiliary plate is removed from para-position base station, and mask plate is lain in a horizontal plane on mask frame and is fixed on para-position base
On platform；And S6, registration holes A of mask plate and the location drawing of corresponding mask frame registration holes B are caught from top to bottom by CCD
Whether picture, detection registration holes A are blocked by the edge of registration holes B, and repeat step S2～S6 if being blocked is until registration holes A are complete
For through hole.Wherein, diameter of the diameter of registration holes A of mask plate less than registration holes B of mask frame, and Alignment auxiliary plate is right
Hole A is identical with the diameter of registration holes B for position.
The indirect alignment method that the present invention is provided is able to ensure that the diameter in mask plate registration holes is less than mask frame para-position
Mask plate and mask frame accurate contraposition in the case of the diameter in hole, so as to the mask plate when mask assembly is with evaporation substrate para-position
Registration holes are through hole.
Description of the drawings
The schematic diagram of registration holes when Fig. 1 illustrates the direct para-position of mask plate and mask frame, wherein on A- mask plates
Registration holes, the registration holes of B- mask frames；
Fig. 2 illustrates a schematic diagram para-position base station of mask assembly direct para-position on base station, wherein
01- mask frames
02- mask plates
04A- mask plate registration holes
04B- mask frame registration holes
05A- mask plate registration holes
05B- mask frame registration holes
06～08- finely tunes pin；
Fig. 3 illustrates another schematic diagram of mask assembly direct para-position on base station, wherein 01- para-positions base station
02- mask frames
03- mask plates
04A- mask plate registration holes
05A- mask plate registration holes
06～08- finely tunes pin；
Fig. 4 illustrates the schematic diagram of the registration holes of the indirect para-position of mask assembly according to an embodiment of the invention, wherein A1-
Aligning plate registration holes
B- mask frame registration holes
L- aligning plates registration holes and the position deviation of mask frame registration holes；And
Fig. 5 illustrates signal of the aligning plate according to an embodiment of the invention with the indirect para-position of mask frame on base station
Figure, wherein 01- para-positions base station
02- mask frames
04A1- aligning plate registration holes
05A1- aligning plate registration holes
06～08- finely tunes pin
11- aligning plates.
Specific embodiment
Each preferred embodiment of the present invention described below.It is to be understood by those skilled in the art that herein detailed
Illustrate to be not intended as limiting the scope of the invention, the present invention can also be by the modification of following embodiment or other equivalents
Mode is achieved.
The present invention relates to a kind of method of the indirect para-position of mask assembly, this method is carried out by Alignment auxiliary plate indirectly
Para-position so that mask plate is controlled at ± 15 μm with the position deviation of mask frame.In an example of the present invention, mask assembly
May include mask plate and mask frame.
According to one embodiment, the method for the indirect para-position of mask assembly, it may include following steps：
S1, as shown in Figure 5 mask frame is lain in a horizontal plane on para-position base station 01, and mask frame is close to alignment pin
Nail 06～08 is placed, i.e., align with these para-position pins；
S2, aligning plate 11 is lain in a horizontal plane on mask frame 02 and is close to both, make aligning plate 11 and para-position base station
01 is relatively fixed, and makes aligning plate Mark points corresponding with mask frame corresponding；
S3, the location drawing picture for catching Mark points on aligning plate 11 and mask frame 02 by CCD from top to bottom, and by figure
Shape measures aligning plate Mark point A1Relative position deviation L with mask frame Mark point B；
The position of the para-position pin 06～08 on S4, adjustment para-position base station, with the mask frame to being adjacent to para-position pin
It is finely adjusted so that aligning plate Mark point A1Relative position deviation L≤15 μm with mask frame Mark point B；
S5, after mask frame 02 is with relative position deviation L≤15 μm of the Mark points of aligning plate 11, by aligning plate from right
Remove on the base station of position, then mask plate 03 is lain in a horizontal plane on mask frame 02 and is allowed to be fixed on para-position base station 01；And
S6, by CCD catch from top to bottom mask plate Mark point A and mask frame Mark point B location drawing picture, detect
The edge of the Mark point B of the whether masked frameworks of Mark point A is blocked, repeat step S2～S6 if being blocked, until Mark
Point A is entirely through hole.
Wherein, if before being finely adjusted to mask frame L≤15 μm, be not required to carry out step S4, but directly enter
Row subsequent step；If fine setting once cannot accomplish L≤15 μm, repeat step S4 is needed until reaching L≤15 μm.
The plate face of mask plate has the opening figure region for meeting that evaporation is required.In one example, para-position Mark points A is extremely
It is two less.In addition, the Mark point A of mask plate can be at diagonal position and outside opening figure region.Mask plate Mark
Diameter of the diameter of point A less than mask frame Mark point B.Preferably, the diameter≤0.5mm of Mark points A.Mask plate and mask frame
Frame is close to, and the external boundary of mask plate extends beyond the external boundary of mask frame, and can be fixed on para-position base station.
On the frame of mask frame, the position corresponding with mask plate Mark point A has Mark point B.In one example, B
Diameter be preferably 2-3mm.
Aligning plate, in addition to not having and meeting the opening figure that evaporation is required, other features are identical with mask plate.For example,
Aligning plate is equivalently-sized with mask plate, and aligning plate Mark point A is identical with the relative position of the Mark of mask plate point A, etc..But
It is that the diameter of aligning plate Mark point A is identical with the diameter of the Mark of mask frame point B, is beneficial to mask frame with aligning plate
Position para-position.
After trim mask framework 02, the position deviation for controlling mask frame 02 with aligning plate 11 is at ± 15 μm.Because right
Position plate and mask plate are fixed on para-position base station in the same fashion, so aligning plate is consistent with the position of mask plate.
After removing aligning plate and putting mask plate 03, due to the position of mask plate 03 and the position of aligning plate identical, therefore mask plate with
The position deviation of mask frame is also controlled at ± 15 μm, so as to realize the exactitude position of mask plate and mask frame.
Claims (6)
1. a kind of method for the indirect para-position of mask assembly, comprises the following steps：
S1, mask frame is lain in a horizontal plane on para-position base station, make mask frame align with the para-position pin on para-position base station；
S2, Alignment auxiliary plate is lain in a horizontal plane on mask frame and is relatively fixed with para-position base station, and make Alignment auxiliary plate
Registration holes A1Registration holes B corresponding with mask frame are corresponding；
S3, the location drawing picture for catching registration holes on Alignment auxiliary plate and mask frame by CCD from top to bottom, and measure registration holes
A1Relative position deviation L with registration holes B；
If S4 is L>15 μm, then the position of adjustment para-position pin with the position of trim mask framework until L≤15 μm, if L≤15 μm
Subsequent step is then directly carried out；
S5, Alignment auxiliary plate is removed from para-position base station, and by mask plate lie in a horizontal plane on mask frame and be fixed on right
On the base station of position；And
S6, catch registration holes A of mask plate and the location drawing picture of corresponding mask frame registration holes B by CCD from top to bottom, examine
Survey whether registration holes A are blocked by the edge of registration holes B, repeat step S2～S6 if being blocked is until registration holes A are entirely logical
Hole,
Wherein, diameter of the diameter of registration holes A of mask plate less than registration holes B of mask frame, and the para-position of Alignment auxiliary plate
Hole A is identical with the diameter of registration holes B of mask frame.
2. the method for claim 1, it is characterised in that registration holes A of mask plate at least two.
3. method as claimed in claim 2, it is characterised in that registration holes A of mask plate are in diagonal position, and are in mask
Outside opening figure region on plate.
4. the method as any one of claim 1-3, it is characterised in that registration holes A of Alignment auxiliary plate1With mask plate
Registration holes A relative position identical.
5. the method as any one of claim 1-3, it is characterised in that the diameter of registration holes A of mask plate is not more than
0.5mm.
6. method as claimed in claim 5, it is characterised in that a diameter of 2-3mm of registration holes B of mask frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010695.2A CN103205682B (en) | 2012-01-16 | 2012-01-16 | The method of the indirect para-position of mask assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010695.2A CN103205682B (en) | 2012-01-16 | 2012-01-16 | The method of the indirect para-position of mask assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103205682A CN103205682A (en) | 2013-07-17 |
| CN103205682B true CN103205682B (en) | 2017-03-15 |
Family
ID=48753084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010695.2A Expired - Fee Related CN103205682B (en) | 2012-01-16 | 2012-01-16 | The method of the indirect para-position of mask assembly |
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| CN (1) | CN103205682B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107682477B (en) * | 2017-09-25 | 2021-02-26 | 捷开通讯(深圳)有限公司 | Camera assembly and terminal |
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|---|---|---|---|---|
| CN1755528A (en) * | 2004-09-27 | 2006-04-05 | 精工爱普生株式会社 | Alignment method of exposure mask and manufacturing method of thin film element substrate |
| JP2006249544A (en) * | 2005-03-14 | 2006-09-21 | Dainippon Printing Co Ltd | Reference position indicator, and metal mask position alignment device |
| CN1856743A (en) * | 2003-08-04 | 2006-11-01 | 麦克罗尼克激光系统公司 | Psm alignment method and device |
| CN101090997A (en) * | 2005-02-23 | 2007-12-19 | 三井造船株式会社 | Mask aligning mechanism for film forming apparatus, and film forming apparatus |
| JP2008007857A (en) * | 2006-06-02 | 2008-01-17 | Sony Corp | Alignment device, alignment method, and manufacturing method of display device |
| CN101533225A (en) * | 2008-03-11 | 2009-09-16 | 株式会社阿迪泰克工程 | Glass mask and position alignment apparatus of mask retainer |
| JP4341385B2 (en) * | 2003-11-26 | 2009-10-07 | 凸版印刷株式会社 | Manufacturing method of vapor deposition mask |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4534011B2 (en) * | 2004-06-25 | 2010-09-01 | 京セラ株式会社 | Display manufacturing method using mask alignment method |
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2012
- 2012-01-16 CN CN201210010695.2A patent/CN103205682B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1856743A (en) * | 2003-08-04 | 2006-11-01 | 麦克罗尼克激光系统公司 | Psm alignment method and device |
| JP4341385B2 (en) * | 2003-11-26 | 2009-10-07 | 凸版印刷株式会社 | Manufacturing method of vapor deposition mask |
| CN1755528A (en) * | 2004-09-27 | 2006-04-05 | 精工爱普生株式会社 | Alignment method of exposure mask and manufacturing method of thin film element substrate |
| CN101090997A (en) * | 2005-02-23 | 2007-12-19 | 三井造船株式会社 | Mask aligning mechanism for film forming apparatus, and film forming apparatus |
| JP2006249544A (en) * | 2005-03-14 | 2006-09-21 | Dainippon Printing Co Ltd | Reference position indicator, and metal mask position alignment device |
| JP2008007857A (en) * | 2006-06-02 | 2008-01-17 | Sony Corp | Alignment device, alignment method, and manufacturing method of display device |
| CN101533225A (en) * | 2008-03-11 | 2009-09-16 | 株式会社阿迪泰克工程 | Glass mask and position alignment apparatus of mask retainer |
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| Publication number | Publication date |
|---|---|
| CN103205682A (en) | 2013-07-17 |
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