JP4608966B2 - 発光装置の製造方法 - Google Patents

発光装置の製造方法 Download PDF

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Publication number
JP4608966B2
JP4608966B2 JP2004191295A JP2004191295A JP4608966B2 JP 4608966 B2 JP4608966 B2 JP 4608966B2 JP 2004191295 A JP2004191295 A JP 2004191295A JP 2004191295 A JP2004191295 A JP 2004191295A JP 4608966 B2 JP4608966 B2 JP 4608966B2
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JP
Japan
Prior art keywords
light
light emitting
emitting element
emitting device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004191295A
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English (en)
Japanese (ja)
Other versions
JP2006013311A (ja
JP2006013311A5 (OSRAM
Inventor
慎介 祖父江
邦治 宮西
俊之 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2004191295A priority Critical patent/JP4608966B2/ja
Publication of JP2006013311A publication Critical patent/JP2006013311A/ja
Publication of JP2006013311A5 publication Critical patent/JP2006013311A5/ja
Application granted granted Critical
Publication of JP4608966B2 publication Critical patent/JP4608966B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

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  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2004191295A 2004-06-29 2004-06-29 発光装置の製造方法 Expired - Fee Related JP4608966B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004191295A JP4608966B2 (ja) 2004-06-29 2004-06-29 発光装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191295A JP4608966B2 (ja) 2004-06-29 2004-06-29 発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006013311A JP2006013311A (ja) 2006-01-12
JP2006013311A5 JP2006013311A5 (OSRAM) 2007-08-02
JP4608966B2 true JP4608966B2 (ja) 2011-01-12

Family

ID=35780159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004191295A Expired - Fee Related JP4608966B2 (ja) 2004-06-29 2004-06-29 発光装置の製造方法

Country Status (1)

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JP (1) JP4608966B2 (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227791A (ja) * 2006-02-24 2007-09-06 Nichia Chem Ind Ltd 発光装置の製造方法および発光装置
EP2059954B1 (en) * 2006-08-29 2016-10-19 Panasonic Intellectual Property Management Co., Ltd. Semiconductor electroluminescent and phosphor-converted light source, method for manufacturing the same
KR101202169B1 (ko) 2006-09-29 2012-11-15 서울반도체 주식회사 다중 몰딩부재를 갖는 발광 다이오드 패키지 제조방법
US20090230409A1 (en) * 2008-03-17 2009-09-17 Philips Lumileds Lighting Company, Llc Underfill process for flip-chip leds
US8889439B2 (en) * 2012-08-24 2014-11-18 Tsmc Solid State Lighting Ltd. Method and apparatus for packaging phosphor-coated LEDs
JP6940775B2 (ja) 2018-10-30 2021-09-29 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3900144B2 (ja) * 1998-02-17 2007-04-04 日亜化学工業株式会社 発光ダイオードの形成方法
JP2000208822A (ja) * 1999-01-11 2000-07-28 Matsushita Electronics Industry Corp 半導体発光装置
JP2002134792A (ja) * 2000-10-25 2002-05-10 Matsushita Electric Ind Co Ltd 白色半導体発光装置の製造方法
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2006013311A (ja) 2006-01-12

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