JP4605948B2 - Warpage measuring apparatus and firing apparatus using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a warpage measuring device for a plate-like object, and more particularly to a warpage measuring device for measuring a warpage state of a plate-like material being conveyed on a roller conveyor and a baking apparatus using the warpage measuring device.
[0002]
[Prior art]
A glass substrate as an electronic component such as a plasma display substrate has a number of components such as electrodes and ribs formed on it, and the warpage state of the glass substrate must be managed through the component formation process. is important. In particular, in the firing step of baking and solidifying the components formed on the glass substrate, as described later, the warpage of the setter on which the glass substrate is placed affects the warpage of the glass substrate. It becomes important.
[0003]
Conventionally, the type shown in FIG. 1 is generally used as a baking furnace for baking and solidifying components formed on this type of glass substrate. Normally, the firing temperature of the constituent electrodes and ribs is 500 to 600 ° C. However, if the firing treatment is carried out at this temperature while the glass substrate is being transported on a roller conveyor, the glass substrate is warped or distorted due to the transport effect. Will occur. For this reason, as shown in FIG. 1, baking is performed with a glass substrate G placed on a heat-resistant setter S that does not soften even during baking. This prevents thermal deformation of the glass substrate and prevents damage due to contact with the transport system. For firing the plasma display substrate, a crystallized glass plate (for example, “Neoceram NO” manufactured by Nippon Electric Glass) is used as the setter for the firing treatment. In addition, it is also preferable to use a large plate of ceramics or the like.
[0004]
In the baking apparatus shown in FIG. 1, first, a glass substrate G is placed on the setter S at the upper position of the lifter conveyor 2 outside the baking furnace body 1. Then, the glass substrate G is introduced into the upper passage in the baking furnace body 1 by the entrance conveyor 3 together with the setter S, and is transported by the roller conveyor with the setter S as it is at a normal temperature to about 500 to 600 ° C. in the heating unit. And then cooled to about 400 ° C. in the slow cooling part. Next, when the glass substrate G is conveyed to the end of the upper passage, the glass substrate G is lowered to the lower passage by the lifter conveyor 4 together with the setter S, and is returned to room temperature in the cooling section while being conveyed in the reverse direction in the lower passage by the roller conveyor. When the setter S on which the glass substrate G is placed reaches the outlet, the setter S is transferred to the lifter conveyor 2 by the outlet conveyor 5, where the glass substrate G that has been baked is removed. And the setter S which became empty moves to the upper stage position with the lifter conveyor 2, and the next glass substrate G is mounted here and a baking process is repeated. In this type of baking apparatus, heaters are continuously installed on the ceiling and floor of the upper passage, and the baking temperature is controlled as described above by these heaters. In this type of baking equipment, the continuous transfer method of transferring at a constant speed was the mainstream, but recently, in order to maintain the quality of the glass substrate and prevent cracking during baking, the glass substrate is predetermined in each processing zone. The number of machines that employ a so-called tact transport system that stops for a period of time is increasing.
[0005]
[Problems to be solved by the invention]
As described above, the glass substrate is fired in a state of being placed on a heat-resistant setter. Therefore, the warpage state of the setter directly affects the warpage of the glass substrate. For this reason, the setter needs to check the warpage state and replace it if it is determined that the warpage has increased. However, since the setter is circulated by being conveyed by a roller conveyor in the main body of the firing furnace, it is taken out at the exit of the main body of the firing furnace, and the warpage is measured by applying a straight ruler by hand. In addition, since it is labor intensive and inefficient, a simple warp measuring means is desired.
[0006]
The present invention has been made in view of the circumstances as described above, and the object of the present invention is to provide a warp measuring device that can easily measure the warp state of a plate-like object being conveyed on a roller conveyor. And a baking apparatus using the same.
[0007]
[Means for Solving the Problems]
To achieve the above object, warpage measuring apparatus of the present invention is an apparatus for measuring the warpage state of the individual plate-like object being conveyed on the roller conveyor separately, the plate-like material of the roller conveyor predetermined comprising holding means for holding a predetermined time and stopped at the position, and height measuring means for measuring a height position of a plurality of points in a plate-like workpiece, and a display means for displaying the measured values directly or calculated by, The height measuring means is attached to the frame so that it is located below the roller conveyor transport line and parallel to the transport line and can be moved up and down, and each of them is sequentially positioned between the rollers of the roller conveyor. The dial rises and the probe on the spindle tip of the dial gauge is plate-shaped while the plate-like object is held for a certain period of time by the holding means. It is characterized in that it is configured to measure the height position of the plurality of points in a plate-like workpiece by abutting the rear surface of the.
[0009]
The firing apparatus of the present invention is a firing apparatus for firing a glass substrate while transporting the inside of the firing furnace main body with the glass substrate placed on a heat-resistant setter, and includes an outlet and an inlet of the firing furnace main body. A circulation path composed of roller conveyors connecting the two is provided, and in order to measure the warpage state of the setter, the warpage measuring device having the above configuration is installed in the middle of the circulation path of the setter.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0011]
FIG. 2 is a schematic configuration diagram showing the warpage measuring apparatus of the present invention, and shows a state where the plate-like object B conveyed by the roller conveyor 10 is stopped at the warpage measuring apparatus as shown.
[0012]
In FIG. 2, reference numeral 11 denotes a horizontal frame that is parallel to the transport line of the roller conveyor 10 and can be moved up and down, and dial gauges 12 are respectively attached to the both ends and the center. Although the frame 11 with the dial gauge 12 is not visible in the figure, three frames 11 are arranged in a direction perpendicular to the paper surface. The plate-like object B stops on the roller conveyor 10 at the position shown in FIG. 2 and is held for a certain period of time. During the holding, the plate-like object B is warped by the height measuring means comprising the frame 11 and the dial gauge 12. Is measured. Specifically, when the frame 11 is raised and the probe at the tip of the spindle of the dial gauge 12 contacts the back surface of the plate-like object B, nine points P on the plate-like object B are obtained as shown in FIG. Measure the height position.
[0013]
The values measured by the three dial gauges 12 are sent to the calculation device 13, where calculation is performed according to a predetermined procedure, and the calculation result is displayed on the display device 14. Moreover, it can also be output by the printer 15 as needed. In some cases, the result measured with the dial gauge 12 can be displayed or printed out as it is.
[0015]
FIG. 4 is a schematic view showing an example of a baking apparatus using the warp measuring apparatus shown in FIG. This firing apparatus is provided with a mounting device for placing the glass substrate before firing on the setter at the entrance 21 of the firing furnace body 20, and a removal device for removing the glass substrate after firing from the setter at the exit 22 of the firing furnace body 20, Further, a circulation path 23 composed of a roller conveyor connecting the outlet 22 and the inlet 21 is provided, and a warp measuring device 24 as shown in FIG.
[0016]
In the firing apparatus shown in FIG. 4, a glass substrate is placed on the setter at the entrance 21 of the firing furnace body 20, and then the glass substrate is put into the firing furnace body 20 together with the setter. After being baked while being conveyed at, it is taken out from the setter at the outlet 22. Next, the setter that has been emptied is transported through the circulation path 23 constituted by the roller conveyor and returns to the inlet 21. The warpage measuring device 24 in the middle of the circulation path 23 measures the warpage state of the setter. It is like that. If the measured setter warpage is large, it is replaced with a new one.
[0017]
FIG. 5 is a schematic view showing another example of a baking apparatus using the warp measuring apparatus shown in FIG. In this baking apparatus, a mounting device for placing a glass substrate before baking on a setter is provided at the inlet 21 of the baking furnace body 20, and a circulation path 23 including a roller conveyor connecting the outlet 22 and the inlet 21 of the baking furnace body 20 is provided. A removal device for removing the fired glass substrate from the setter is provided immediately before the circulation path 23 reaches the inlet 21 of the baking furnace body 20, and a warp measuring device as shown in FIG. 24 is installed.
[0018]
In the firing apparatus shown in FIG. 5, a glass substrate is placed on the setter at the entrance 21 of the firing furnace body 20, and then the glass substrate is put into the firing furnace body 20 together with the setter. After being baked while being conveyed at, it is discharged from the outlet 22. Next, the setter with the glass substrate placed thereon is conveyed through a circulation path 23 constituted by a roller conveyor and reaches a removal device in front of the inlet 21 of the baking furnace body 20. The warpage measuring device 24 measures the setter warpage. The glass substrate after baking is taken out from the setter by the removing device. Next, the emptied setter is conveyed to the entrance 21 of the baking furnace body 20, where the glass substrate before baking is again placed on the setter. At this time, if the measured setter warpage is large, it is replaced with a new one.
[0019]
As described above, the embodiment of the present invention has been described in detail. However, the warpage measuring apparatus and the firing apparatus using the same according to the present invention are not limited to the above-described embodiment, and the gist of the present invention is not limited. Naturally, various changes can be made without departing from the scope.
[0020]
【The invention's effect】
As described above, warpage measuring apparatus of the present invention is an apparatus for measuring the warpage state of the individual plate-like object being conveyed on the roller conveyor separately, the plate-like material at a predetermined position of the roller conveyor Holding means for stopping and holding for a certain period of time; height measuring means for measuring the height positions of a plurality of points on the plate-like object; and display means for displaying the measured values as they are or after calculating , The height measuring means is attached to the frame so as to be positioned between the rollers of the roller conveyor, and a lateral frame which is below the roller conveyor transport line and parallel to the transport line and which can be moved up and down. While the plate is held by the holding means for a certain period of time, the frame rises and the probe at the tip of the dial gauge spindle Because characterized in that it is configured to measure the height position of the plurality of points in a plate-like workpiece by contact, the plate-like material is stopped at a predetermined position during the transport, the height measuring means By measuring the height positions of a plurality of points, the warpage state of the plate-like object can be easily measured.
[0021]
And, by using this warpage measuring device for the firing device, it is possible to measure the warpage of the substrate and setter in-line, which greatly reduces the burden on the operator compared to the work of measuring the amount of warpage that has been done by hand until now. Can be reduced.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing an example of a baking apparatus.
FIG. 2 is a schematic configuration diagram showing a warpage measuring apparatus of the present invention.
FIG. 3 is an explanatory diagram showing measurement points of a plate-like object.
4 is a schematic view showing an example of a baking apparatus using the warp measuring apparatus shown in FIG.
FIG. 5 is a schematic view showing another example of a baking apparatus using the warp measuring apparatus shown in FIG. 2;
[Explanation of symbols]
G glass substrate S setter B plate 1 firing furnace body 2 lifter conveyor 3 entrance conveyor 4 lifter conveyor 5 exit conveyor 10 roller conveyor 11 frame 12 dial gauge 13 computing device 14 display device 15 printer 20 firing furnace body 21 entrance 22 exit 23 Circulation path 24 Warpage measurement device

Claims (2)

A device for measuring the warping state of individual plate-like objects conveyed separately on a roller conveyor, the holding means for stopping the plate-like object at a predetermined position on the roller conveyor and holding it for a certain period of time, and the plate-like object A height measuring means for measuring the height positions of a plurality of points, and a display means for displaying the measured values as they are or after being calculated. The height measuring means is located below the conveying line of the roller conveyor. A horizontal frame that is parallel to the conveying line and that can be raised and lowered, and a plurality of dial gauges attached to the frame so as to be sequentially positioned between the rollers of the roller conveyor. While the frame is held for a certain period of time, the frame rises and the probe at the tip of the dial gauge spindle abuts against the back of the plate-like object. Warpage measuring apparatus characterized by being configured to measure the height position of the. A firing apparatus for firing a glass substrate while transporting the inside of the firing furnace body in a state where the glass substrate is placed on a heat-resistant setter, and a circulation path including a roller conveyor connecting the exit and the entrance of the firing furnace body A calcining apparatus which is provided and has the warpage measuring device according to claim 1 installed in the middle of a circulation path of the setter in order to measure a warpage state of the setter.

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