JP2003028632A - Warpage measuring instrument and baking apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a warpage measuring instrument capable of simply measuring the warpage state of the plate-shaped article fed on a roller conveyor. SOLUTION: The warpage measuring instrument is equipped with a holding means for holding the plate-shaped article B stopped at a predetermined position of the roller conveyor 10 for a constant time, height measuring means 11 and 12 for measuring the height positions of the plate-shaped article at a plurality of points, and a display means for displaying the measured values as they are or by operation. The plate-shaped article B is stopped at a predetermined position during feed, and the height positions of the plate-shaped article B at a plurality of points are measured by the height measuring means 11 and 12 to simply measure the warpage state of the plate-shaped article B. By using this warpage measuring instrument in a baking apparatus, the warpage of a substrate or setter can be measured in-line and the load of a worker can be sharply reduced as compared with warpage quantity measuring work performed manually up to now.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a warp measuring device for a plate-like object, and more particularly to a warp measuring device for measuring the warp state of a plate-like object conveyed on a roller conveyor and a baking apparatus using the warp measuring device. It is about.

[0002]

2. Description of the Related Art A glass substrate as an electronic component such as a substrate for a plasma display has a large number of constituent elements such as electrodes and ribs formed thereon. Managing state is important. In particular, in the firing step of baking and hardening the components formed on the glass substrate, as will be described later, since the warp of the setter on which the glass substrate is placed affects the warp of the glass substrate, it is possible to manage the warp of the setter. It becomes important.

Conventionally, a firing furnace of the type shown in FIG. 1 is generally used as a firing furnace for firing and hardening the constituent elements formed on a glass substrate of this type. Usually, the firing temperature of the electrodes and ribs that are the constituent elements is 500 to 600 ° C. However, if the firing process is performed at this temperature while the glass substrate is being transported on the roller conveyor, the glass substrate is warped or distorted due to the influence of the transportation. Will occur. Therefore, as shown in FIG.
Firing is performed with a glass substrate G placed on a heat-resistant setter S that does not soften even during firing. This prevents thermal deformation of the glass substrate,
Scratches due to contact with the transport system are also prevented. A crystallized glass plate (for example, "Neoceram N-O" manufactured by Nippon Electric Glass Co., Ltd.) is used as a setter for the baking treatment in baking the substrate for plasma display. In addition, it is also preferable to use a large-sized plate-like ceramic or the like.

In the firing apparatus shown in FIG. 1, first, a glass substrate G is placed on the setter S at the upper position of the lifter conveyor 2 outside the firing furnace body 1. Then, the glass substrate G is introduced into the upper passage of the firing furnace main body 1 by the inlet conveyor 3 together with the setter S, and is conveyed by the roller conveyor together with the setter S as it is from the room temperature to a peak temperature of about 500 to 600 ° C. in the heating section. After being heated up to, it is cooled down to about 400 ° C. in the slow cooling part. Next, when the glass substrate G is conveyed to the end of the upper passage, the glass substrate G is lowered to the lower passage by the lifter conveyor 4 together with the setter S, and is returned to room temperature in the cooling section while being conveyed in the reverse direction by the roller conveyor in the lower passage. When the setter S on which the glass substrate G is placed reaches the exit,
It is transferred to the lifter conveyor 2 by the exit conveyor 5, and the glass substrate G that has been fired is removed there. Then, the empty setter S moves to the upper position on the lifter conveyor 2, where the next glass substrate G is placed and the firing process is repeated. In this type of firing device,
Heaters are continuously installed on the ceiling and floor of the upper passage, and the firing temperature is controlled by these heaters as described above. In this type of baking apparatus, a continuous transfer method of transferring at a constant speed was the mainstream, but recently, in order to maintain the quality of the glass substrate and prevent cracks during baking, the glass substrate is recently specified in each processing zone. There is an increasing number of devices that employ a so-called tact transfer method of stopping for a time.

[0005]

As described above, the glass substrate is fired while being placed on the heat-resistant setter. Therefore, the warp state of the setter directly affects the warp of the glass substrate. For this reason, the setter needs to check the warp state and replace it if it is determined that the warp is large. However, since the setter is circulated in the firing furnace body by being conveyed by a roller conveyor, it is the current situation that the setter is taken out at the exit of the firing furnace body and the warp is measured by manually applying a straightedge. However, since it requires labor and is inefficient, a simple warp measuring means is desired.

The present invention has been made in view of the above circumstances, and an object of the present invention is to easily measure the warped state of a plate-like object conveyed on a roller conveyor. An object of the present invention is to provide a warpage measuring device and a firing device using the same.

[0007]

In order to achieve the above object, a warpage measuring apparatus of the present invention is an apparatus for measuring a warp state of a plate-like object conveyed on a roller conveyor,
Holding means for stopping the plate-like object at a predetermined position of the roller conveyor and holding it for a certain period of time, height measuring means for measuring height positions of a plurality of points on the plate-like object, and the measured value as it is or by calculating. And a display means for displaying.

In the warp measuring device having the above construction, a dial gauge or a laser displacement meter can be used as the height measuring means.

Further, the firing apparatus of the present invention is a firing apparatus for firing a glass substrate while transporting it inside the firing furnace main body in a state where the glass substrate is placed on a heat-resistant setter. For the measurement, the warpage measuring device having the above-mentioned configuration is installed in the circulation path of the setter.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 2 is a schematic block diagram showing the warp measuring device of the present invention, which is a plate-like object B conveyed by the roller conveyor 10.
Shows the state where it stopped at the warp measuring device as shown in the figure.

In FIG. 2, 11 is a roller conveyor 10.
It is a horizontal frame that is parallel to the transport line and can move up and down, and dial gauges 12 are attached to the both ends and the center, respectively. Although not visible in the figure, three frames 11 with the dial gauges 12 are arranged in a direction perpendicular to the paper surface. The plate-like object B is stopped at the position shown in FIG. 2 on the roller conveyor 10 and is held for a certain period of time. While the plate-like object B is held, the warp state of the plate-like object B is measured by the height measuring means including the frame 11 and the dial gauge 12. Is measured. Specifically, the frame 11 rises, and the probe at the spindle tip of the dial gauge 12 is moved to the plate-like object B.
By contacting the back surface of the plate B, as shown in FIG.
Measure the height position of the nine points P at.

The values measured by the three dial gauges 12 are sent to the arithmetic unit 13, where the arithmetic operation is performed according to a predetermined procedure, and the arithmetic result is displayed.
4 is displayed. In addition, the printer 15 can output the data as needed. In some cases, the result measured by the dial gauge 12 may be displayed or printed out as it is.

In the example shown in FIG. 2, a contact type dial gauge is used as the height measuring means, but a non-contact type measuring means such as a laser displacement meter may be used.

FIG. 4 is a schematic view showing an example of a firing apparatus using the warpage measuring apparatus shown in FIG. This baking device is provided with a mounting device for mounting a glass substrate before baking on a setter at an inlet 21 of the baking furnace body 20, and a removing device for removing a glass substrate after baking from the setter at an outlet 22 of the baking furnace body 20, Further, a circulation path 23 composed of a roller conveyor connecting the outlet 22 and the inlet 21 is provided, and a warp measuring device 24 as shown in FIG. 2 is installed in the middle of the circulation path 23.

In the firing apparatus shown in FIG. 4, a glass substrate is placed on the setter at the inlet 21 of the firing furnace body 20, and then the glass substrate is set together with the setter in the firing furnace body 20.
And is fired while being conveyed in the firing furnace main body 20 by the roller conveyor, and then taken out from the setter at the outlet 22. Next, the emptied setter is conveyed through the circulation path 23 formed of a roller conveyor and returns to the entrance 21, but the warp measuring device 24 in the middle of the circulation path 23 measures the warp state of the setter. It is like this. If the measured warp of the setter is large, replace it with a new one.

FIG. 5 is a schematic view showing another example of a firing apparatus using the warpage measuring apparatus shown in FIG. In this firing apparatus, a mounting device for placing a glass substrate before firing on a setter is provided at the inlet 21 of the firing furnace body 20.
A circulation path 23 including a roller conveyor connecting the exit 22 and the entrance 21 of the baking machine is provided. Just before the circulation path 23 reaches the entrance 21 of the baking furnace main body 20, a removing device for removing the baked glass substrate from the setter is provided. Is provided,
A warp measuring device 24 as shown in FIG. 2 is provided in the middle of the circulation path 23.
Is installed.

In the firing apparatus shown in FIG. 5, the glass substrate is placed on the setter at the inlet 21 of the firing furnace body 20, and then the glass substrate is set together with the setter in the firing furnace body 20.
And is fired while being conveyed in the firing furnace main body 20 by the roller conveyor, and then discharged from the outlet 22. Next, the setter with the glass substrate placed thereon is conveyed through the circulation path 23 constituted by the roller conveyor and reaches the removal device in front of the inlet 21 of the firing furnace main body 20, but on the way of the circulation path 23. The warp measuring device 20 in FIG. 2 measures the warp state of the setter. The glass substrate after firing is taken out from the setter by the removing device. Next, the emptied setter is carried to the inlet 21 of the firing furnace main body 20, where the glass substrate before firing is placed on the setter again. At this time, if the measured warp of the setter is large, replace it with a new one.

Although the embodiments of the present invention have been described in detail above, the warpage measuring apparatus and the firing apparatus using the same according to the present invention are not limited to the above-described embodiments, and the present invention is not limited thereto. It goes without saying that various modifications can be made without departing from the spirit of the above.

[0020]

As described above, the warp measuring device of the present invention is a device for measuring the warp state of a plate-like object being conveyed on a roller conveyor, and the plate-like object is placed at a predetermined position of the roller conveyor. Holding means to stop at and hold for a certain time,
Since the height measuring means for measuring the height positions of a plurality of points on the plate-like object and the display means for displaying the measured value as it is or as an arithmetic operation are provided, a predetermined position during conveyance is provided. The warp state of the plate-shaped object can be easily measured by stopping the plate-shaped object with and measuring the height positions of a plurality of points by the height measuring means.

By using this warpage measuring apparatus in a firing apparatus, it is possible to measure the warpage of a substrate or a setter in-line, which is a burden on the operator as compared with the manual operation of measuring the warpage amount. Can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an example of a firing apparatus.

FIG. 2 is a schematic configuration diagram showing a warp measuring device of the present invention.

FIG. 3 is an explanatory diagram showing measurement points of a plate-like object.

FIG. 4 is a schematic view showing an example of a firing apparatus using the warpage measuring apparatus shown in FIG.

5 is a schematic view showing another example of a firing apparatus using the warpage measuring apparatus shown in FIG.

[Explanation of symbols]

G glass substrate S setter B Plate 1 firing furnace body 2 lifter conveyor 3 entrance conveyor 4 lifter conveyor 5 Exit conveyor 10 roller conveyor 11 frames 12 dial gauge 13 Arithmetic device 14 Display 15 Printer 20 Main body of firing furnace 21 entrance 22 exit 23 Circulation path 24 Warpage measuring device

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2F062 AA41 AA55 BB14 BC00 BC25                       CC27 EE64 FF12 GG18 LL00                       LL12                 2F065 AA25 AA47 BB01 CC00 CC25                       DD06 GG04 MM02                 2F069 AA42 AA58 BB36 BB40 DD16                       GG01 GG04 GG07 GG58 HH09                       HH30 PP07 QQ05 QQ13                 4K050 AA04 BA07 EA02

Claims (4)

[Claims] 1. A device for measuring a warp state of a plate-like object being conveyed on a roller conveyor, comprising a holding means for stopping the plate-like object at a predetermined position of the roller conveyor and holding the plate-like object for a certain period of time. A warp measuring device comprising: height measuring means for measuring height positions of a plurality of points on an object; and display means for displaying the measured values as they are or by calculating them. 2. The warpage measuring device according to claim 1, wherein a dial gauge is used as the height measuring means. 3. The warpage measuring device according to claim 1, wherein a laser displacement meter is used as the height measuring means. 4. A firing apparatus for firing a glass substrate while transporting it in a firing furnace main body in a state where the glass substrate is placed on a heat-resistant setter, wherein the setter of the setter is used for measuring the warp state of the setter. A warpage measuring apparatus having the warpage measuring apparatus according to any one of claims 1 to 3 installed in a circulation path.