JP4590771B2 - IC compression resin rotary compression molding machine - Google Patents

Description

【００２６】
表１に見られるように、実施例１〜４ではパウダー供給調整、融着発生もほとんどなく、生産性に非常に優れていることがわかる。
【００２７】
これに対して表１の比較例１〜６では、パウダー供給調整、あるいは融着発生において著しく劣っていることがわかる。
【００２８】
【発明の効果】
本発明は、以上のような構成により、ターンテーブルと流路制御用堰板部品との接触部分における摩擦熱の低下ならびに摩耗性の低減がなされており、ＩＣ封止樹脂パウダーの融着のみならず隙間への入り込みや漏れを防止し、金型への充填を円滑に行うことが可能になるという効果を有する。そのため、生産性にもすぐれ、安定した圧縮成形を可能にする。
【図面の簡単な説明】
【図１】本発明に係るＩＣ封止樹脂のロータリー式圧縮成形機の構成の一例を示す縦断面図である。
【図２】図１に示すＩＣ封止樹脂のロータリー式圧縮成形機の流路制御用堰板部品周辺の平面図である。
【符号の説明】
１：ターンテーブル
２：金型
３：上パンチ
４：下パンチ
５：流路制御用堰板部品
６：パウダーホッパー
７：堰板
８：擦り切り板
９：カーボンファイバー
１０：回転盤[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a rotary compression molding machine for IC sealing resin, and particularly to a rotary compression molding machine for compression molding an IC sealing resin powder having a low minimum melt viscosity (hereinafter simply abbreviated as powder).
[0002]
[Prior art]
Currently, one of the fields of application of compression-molded tablets is for sealing semiconductor chips, and rotary compression molding machines are widely used for compression molding of tablets. In recent years, semiconductor chips have been increasingly reduced in size and thickness, and one of the characteristics required for sealing semiconductor elements has been required to have good fluidity and easily melt.
[0003]
Generally, an epoxy resin-based IC sealing resin is kneaded using a biaxial kneader while being melted at 70 to 110 ° C. In the case of a biphenyl epoxy resin type IC sealing resin, since the viscosity is generally low, an undesirable epoxy curing reaction due to heat generation during melt kneading hardly proceeds. Therefore, the softening point of the obtained powder is low, and in compression molding of sealing resin, it is caused by frictional heat from the contact surface between the turntable and the weir plate part for controlling the powder flow path, or contact of powder that has entered these gaps. The powder is likely to be fused to the turntable and the flow path control weir plate component.
[0004]
When fusing occurs, the powder supply becomes unstable, causing drastic fluctuations, increasing the number of defective products, and increasing the gap between the turntable and the flow path control weir plate parts, causing powder leakage, etc. , Reduce production yield. In order to prevent this fusion, even if the mold, upper and lower punches are cooled, it is necessary to take measures such as reducing the rotation speed of the turntable, that is, sacrificing productivity. Yes. In addition, in order to prevent the powder from entering the gap or leaking, a measure such as attaching felt to the contact surface has been taken.
[0005]
Here, in the method of cooling the mold, the upper punch, and the lower punch, the upper punch and the lower punch rotate in synchronization with the turntable, and a plurality of molds, upper punches, and lower punches are installed on the turntable. In some cases, direct cooling of the mold, upper punch, and lower punch is difficult. In addition, since the mold is incorporated in the turntable, cooling the mold also cools the turntable, and as a result, the powder on the turntable is also cooled. In this case, the temperature difference between the powder and the molding chamber may lead to an influence on quality such as powder condensation.
[0006]
Moreover, reducing the rotation speed of the turntable is nothing but a method for reducing productivity as described above. Furthermore, a material such as felt at the contact portion is extremely wearable and unsuitable for speeding up.
[0007]
Until now, in order to perform stable production with regard to tablet shape and filling rate, we used a larger contact part between the turntable and the flow path control weir plate part. As mentioned above, IC sealing with a low melt viscosity is used. Since the frequency of occurrence of fusion is high in the resin, it has been dealt with by repeating the method of stopping the production after the occurrence and removing the fusion product and then performing the reproduction. Also, if the contact area between the turntable and the flow path control weir plate component is eliminated, fusion will not occur, but the amount of powder supplied will affect the tablet shape and filling rate, such as leakage and filling defects in the mold. It was necessary to adjust the powder supply frequently.
[0008]
[Problems to be solved by the invention]
The present invention has been made in view of such circumstances, and is capable of preventing fusion to a turntable or a flow path control dam plate component with respect to an IC sealing resin having good fluidity and easy to melt, and is stable. An object of the present invention is to provide a rotary compression molding machine that can perform the above molding.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the present invention adopts the following configuration. That is,
(1) In a rotary compression molding machine that continuously supplies IC sealing resin powder and performs compression molding, the IC sealing resin powder flow path control weir plate part (non-moving part) fixed to the device and the turntable The contact area is (3-20) × 10 ⁻³ m ² , the gap other than the contact part is 3 mm or less, and the weir in the flow path control weir plate component at the lowest point of the lower punch in the mold A rotary compression molding machine for IC sealing resin, wherein at least one plate is installed and the outer peripheral speed of the turntable is 0.2 to 2 m / sec.
[0010]
(2) The IC as described in (1) above, wherein the IC sealing resin powder is composed of a biphenyl epoxy resin composition having a minimum melt viscosity of 175 ° C. of 5 to 30 Pa · s measured with a Koka flow tester. Rotary compression molding machine for sealing resin.
[0011]
(3) The IC sealing resin rotary according to (1) or (2) above, wherein the material of the contact portion with the turntable of the IC sealing resin powder flow path control weir plate component is carbon fiber This is a compression compression molding machine.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a rotary compression molding machine for IC sealing resin according to the present invention will be described below.
[0013]
FIG. 1 is a longitudinal sectional view showing an example of the configuration of an IC sealing resin rotary compression molding machine according to the present invention, and FIG. 2 is a flow path control of the IC sealing resin rotary compression molding machine shown in FIG. It is a top view around a dam plate component.
[0014]
FIG. 1 shows a configuration of a rotary compression molding machine for IC sealing resin. A mold (mortar) 2 is incorporated in a turntable 1 and an upper punch 3 for compressing powder from above and below in the mold 2. And the lower punch 4 is installed so that it can move up and down with a fixed stroke by each main pressure roll cam mechanism (not shown). Here, the turntable 1, the mold 2 incorporated therein, and the upper punch 3 and the lower punch 4 are connected to the turntable 10 shown in FIG. 2, and in FIG. 1, from left to right, FIG. Then, it is moving in the counterclockwise direction around the rotating disk 10.
[0015]
Further, the flow path control dam plate component 5 and the powder hopper 6 are fixed to the molding machine body, and the dam plate 7 and the scraping plate 8 are fixed to the flow path control dam plate component 5 so that the powder is made of gold. The function is to fill the mold 2.
[0016]
Further, the powder continuously supplied from the powder hopper 6 into the flow path control dam plate component 5 on the turntable 1 is damped in the flow path control dam plate component 5 by the rotational movement of the turntable 1. The plate 7 and a scraping plate 8 attached to the rear portion of the plate 7 are dammed up and guided into the mold 2. Here, at least one dam plate 7 in the flow path control dam plate component 5 is installed at the lowest point where the lower punch descends in the mold 2. Improves fillability. Thereafter, compression molding is performed by raising the lower punch 4 and lowering the upper punch 3, and the tablet is pushed onto the turntable 1 by raising the lower punch 4.
[0017]
By the way, the feature of the present invention is that the flow rate control weir plate component 5 in contact with the turntable 1 and the contact portion of the weir plate 7 installed in the inside are reduced. For example, felt, ceramics, glass fiber, carbon fiber or the like is pasted, and carbon fiber is particularly preferred. By these methods, it is possible to reduce frictional heat and wear resistance, prevent not only powder fusion but also entry into the gap and leakage, and stable filling from the mold 2 It enables compression molding.
[0018]
Here, the contact area between the flow path control dam plate component 5 and the dam plate 7 and the turntable is in the range of (3 to 20) × 10 ⁻³ m ² , and practically (4 to 10) × 10. A range of ⁻³ m ² is preferred. If it exceeds 20 × 10 ⁻³ m ² , the fusion cannot be prevented, and if it is less than 3 × 10 ⁻³ m ² , the fusion can be suppressed. This will affect the filling rate. Further, the gap other than the contact portion is 3 mm or less, and if it is larger than this, the gap becomes too larger than the powder particle diameter, so that powder leakage occurs or the resistance force to improve the filling property to the mold 2 is reduced. . The contact area is the area of the contact portion between the turntable, the flow path control dam plate component and the dam plate, that is, the area of what is attached to the contact surface such as carbon fiber. The gap other than the contact portion is a space dimension in the non-contact portion of the turntable, the flow path control dam plate component, and the dam plate, and corresponds to the thickness of what is attached to the contact surface such as carbon fiber.
[0019]
Moreover, the outer peripheral speed of the turntable is in the range of 0.2 to 2 m / sec, preferably in the range of 0.4 to 1.2 m / sec. If the speed is less than 0.2 m / sec, the productivity is remarkably reduced. If the speed exceeds 2 m / sec, the powder supply and filling into the mold 2 may vary due to the high speed, and the frictional heat at the contact portion may decrease. Does not lead to reduced wear.
[0020]
The IC sealing resin composition used in the present invention means an epoxy resin, a phenol curing agent, a curing accelerator, a normal epoxy resin-based IC sealing resin mainly composed of silica, and the like. The epoxy resin of the present invention is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule. Specific examples of the epoxy resin include a cresol novolak type epoxy resin, a phenol novolak type epoxy resin, a phenol aralkyl type epoxy resin, a dicyclopentadiene skeleton-containing epoxy resin, a triphenylmethane type epoxy resin, a bisphenol A type epoxy resin, and a bisphenol F type. Epoxy resin, chain aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin and halogenated epoxy resin, 4,4'-bis (2,3-epoxypropoxy) biphenyl, 4 , 4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3', 5 5'-tetraethylbiphenyl, 4,4'-bis (2,3-epoxy propo Xy) -3,3 ′, 5,5′-tetramethyl-2-chlorobiphenyl and the like, 1,5-di (2,3-epoxypropoxy) naphthalene, 1,6-di (2, 3-epoxypropoxy) naphthalene, naphthol aralkyl type epoxy resin and the like.
[0021]
Among these, the epoxy resins that can remarkably exhibit the effects of the present invention are 4,4′-bis (2,3-epoxypropoxy) biphenyl and 4,4′-bis (2,3-epoxypropoxy) -3,3 ′. , 5,5'-tetramethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetraethylbiphenyl, 4,4'-bis (2,3-epoxy (Propoxy) -3,3 ', 5,5'-tetramethyl-2-chlorobiphenyl and other biphenyl type epoxy resins.
[0022]
The minimum melt viscosity of the IC sealing resin powder can be adjusted by the composition ratio of the blending components and the production conditions. The effect of the present invention can be exhibited particularly when the minimum melt viscosity at 175 ° C. measured with a Koka flow tester is 5 to 30 Pa · s. When the minimum melt viscosity is less than 5 Pa · s, the frequency of occurrence of fusion at the contact portion is high, and when it exceeds 30 Pa · s, the effect of the present invention is difficult to understand.
[0023]
【Example】
Hereinafter, the present invention will be described specifically by way of examples.
[0024]
Using biphenyl type epoxy resin with a minimum melt viscosity of 10 Pa · s and 25 Pa · s respectively for the IC sealing resin, the contact area between the turntable and the flow path control weir plate component is shown in Table 1 for experiments. The effect of the present invention was confirmed. In evaluating these, the following method was used.
Number of powder supply adjustments: During tablet production, the pressure fluctuation fluctuates severely due to powder leakage and deterioration of mold filling properties, etc., and the number of defective products increases. The number of times powder supply adjustment was performed (times / 8 hr) was shown.
Frequency of fusion occurrence: This represents the number of times (times / day) that fusion occurred so that the rotary compression molding machine had to be stopped during tablet production.
[0025]
[Table 1]

[0026]
As can be seen from Table 1, in Examples 1 to 4, there is almost no powder supply adjustment and no fusing, and it is understood that the productivity is very excellent.
[0027]
On the other hand, in Comparative Examples 1-6 of Table 1, it turns out that it is remarkably inferior in powder supply adjustment or fusion | melting generation | occurrence | production.
[0028]
【The invention's effect】
According to the present invention, with the above configuration, the frictional heat is reduced and the wear resistance is reduced at the contact portion between the turntable and the flow path control dam plate component. Therefore, it is possible to prevent entry into the gap and leakage, and to fill the mold smoothly. Therefore, it is excellent in productivity and enables stable compression molding.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing an example of the configuration of a rotary compression molding machine for IC sealing resin according to the present invention.
FIG. 2 is a plan view of the periphery of a flow path control weir plate component of the IC compression resin rotary compression molding machine shown in FIG. 1;
[Explanation of symbols]
1: Turntable 2: Mold 3: Upper punch 4: Lower punch 5: Flow path control weir plate part 6: Powder hopper 7: Weir plate 8: Fraying plate 9: Carbon fiber 10: Turntable

Claims (3)

In a rotary compression molding machine that continuously compresses and molds IC sealing resin powder, the contact area between the IC sealing resin powder flow path control weir plate component fixed to the device and the turntable is (3 to 20). ) × 10 ⁻³ m ² , the gap other than the contact part is 3 mm or less, and at least one dam plate in the flow path control dam plate component is installed at the lowest point of lowering the lower punch in the mold. A rotary compression molding machine for IC sealing resin, characterized in that the outer peripheral speed of the turntable is 0.2 to 2 m / sec. 2. The IC sealing resin according to claim 1, wherein the IC sealing resin powder is composed of a biphenyl epoxy resin composition having a minimum melt viscosity at 175 ° C. of 5 to 30 Pa · s measured with a Koka flow tester. Rotary compression molding machine. The rotary compression molding machine for IC sealing resin according to claim 1 or 2, wherein the material of the contact portion of the IC sealing resin powder flow path control weir plate part with the turntable is carbon fiber.

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