JP2002307429A - Rotary type compression molding machine for ic-sealing resin - Google Patents
Rotary type compression molding machine for ic-sealing resinInfo
- Publication number
- JP2002307429A JP2002307429A JP2001111567A JP2001111567A JP2002307429A JP 2002307429 A JP2002307429 A JP 2002307429A JP 2001111567 A JP2001111567 A JP 2001111567A JP 2001111567 A JP2001111567 A JP 2001111567A JP 2002307429 A JP2002307429 A JP 2002307429A
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- compression molding
- molding machine
- turntable
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B11/00—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
- B30B11/005—Control arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B11/00—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
- B30B11/02—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses using a ram exerting pressure on the material in a moulding space
- B30B11/08—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses using a ram exerting pressure on the material in a moulding space co-operating with moulds carried by a turntable
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ＩＣ封止樹脂の
ロータリー式圧縮成形機に関するもので、特に最低溶融
粘度の低いＩＣ封止樹脂パウダー（以下、単にパウダー
と略記）を圧縮成形するロータリー式圧縮成形機に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary compression molding machine for an IC sealing resin, and more particularly to a rotary compression molding machine for molding an IC sealing resin powder having a low minimum melt viscosity (hereinafter simply referred to as powder). It relates to a compression molding machine.
【０００２】[0002]
【従来の技術】現在、圧縮成形されたタブレットの利用
分野の一翼として半導体チップの封止用が挙げられ、こ
のタブレットの圧縮成形にロータリー式圧縮成形機が広
く用いられている。近年、半導体チップはますます小型
化、薄型化されてきており、半導体素子封止において求
められる特性の１つに流動性の良い、溶融しやすいもの
が要求されてきている。2. Description of the Related Art At present, one of the fields of application of compression-molded tablets is to seal semiconductor chips, and rotary compression molding machines are widely used for compression-molding tablets. In recent years, semiconductor chips have been increasingly reduced in size and thickness, and one of the characteristics required for encapsulating semiconductor elements has been demanded to have good fluidity and to be easily melted.
【０００３】一般的にエポキシ樹脂系ＩＣ封止樹脂は２
軸混練機を使用し、７０〜１１０℃で溶融状態にしなが
ら混練する。ビフェニルエポキシ樹脂型ＩＣ封止樹脂の
場合、一般的に粘度が低いため溶融混練時に発熱による
望ましからぬエポキシ硬化反応が進行しにくい。そのた
め、得られたパウダーの軟化点が低く、封止樹脂の圧縮
成形においては、ターンテーブルとパウダー流路制御用
堰板部品の接触面による摩擦熱や、これらの隙間に入り
込んだパウダーの接触により、パウダーのターンテーブ
ルや流路制御用堰板部品への融着が起こりやすい。In general, epoxy resin based IC sealing resin is 2
Using a shaft kneader, kneading is performed at 70 to 110 ° C. in a molten state. In the case of a biphenyl epoxy resin type IC sealing resin, an undesired epoxy curing reaction due to heat generation during melt-kneading hardly proceeds due to low viscosity generally. Therefore, the softening point of the obtained powder is low, and in the compression molding of the sealing resin, frictional heat due to the contact surface between the turntable and the powder flow path control dam plate part, and the contact of the powder entering these gaps, In addition, the powder is likely to be fused to the turntable or the channel control dam plate.
【０００４】融着が発生すると、パウダーの供給が不安
定となり、杵圧変動を激しくさせ、不良品を増加させた
り、ターンテーブルと流路制御用堰板部品との隙間を大
きくさせパウダー漏れを発生させるなど、生産歩留まり
を低下させる。この融着を防止するために、金型、上、
下パンチを冷却しても、ターンテーブルの回転速度を下
げる、すなわち生産性を犠牲にするなどの対応をせざる
を得ない状況となっている。また、パウダーの隙間への
入り込みや漏れを防止するために接触面にフェルトなど
を貼付するといった対応をとっていた。When the fusion occurs, the powder supply becomes unstable, and the punch pressure fluctuates sharply, increasing the number of defective products, and increasing the gap between the turntable and the flow path control dam plate part to reduce powder leakage. And reduce the production yield. To prevent this fusion, the mold,
Even if the lower punch is cooled, it is necessary to reduce the rotation speed of the turntable, that is, sacrifice productivity. In addition, in order to prevent the powder from entering the gap or leaking, a measure such as attaching a felt or the like to the contact surface has been taken.
【０００５】ここで金型、上パンチ、下パンチを冷却す
る方法では、上パンチおよび下パンチはターンテーブル
と同期して回転動作しており、かつ金型、上パンチ、下
パンチはターンテーブルに複数個設置されていることも
あり、金型、上パンチ、下パンチの直接冷却は難しい。
また、金型はターンテーブルに組み込まれており、金型
を冷却することがターンテーブルも冷却されることとな
り、その結果ターンテーブル上にあるパウダーも冷却さ
れることになる。この場合、パウダーと成形室内の温度
差から、パウダーが結露するなどの品質への影響にもつ
ながるおそれがある。In the method of cooling the mold, the upper punch, and the lower punch, the upper punch and the lower punch rotate in synchronization with the turntable, and the mold, the upper punch, and the lower punch are moved to the turntable. Since a plurality of dies, upper punches, and lower punches are difficult to cool directly, there are a plurality of them.
Also, the mold is incorporated in the turntable, and cooling the mold also cools the turntable, and as a result, the powder on the turntable is also cooled. In this case, the temperature difference between the powder and the molding chamber may lead to an influence on the quality such as dew condensation of the powder.
【０００６】また、ターンテーブルの回転速度を低下さ
せることは、上述したように生産性を低下させる方法に
ほかならない。さらに、接触部分においてフェルトなど
の材質では摩耗性が激しく高速化にも不向きである。[0006] Further, reducing the rotation speed of the turntable is nothing but a method of reducing productivity as described above. Further, a material such as felt at the contact portion has a severe abrasion and is not suitable for high speed operation.
【０００７】これまでタブレット形状や充填率について
安定した生産を行うため、ターンテーブルと流路制御用
堰板部品の接触部分を大きくしたものを使用していた
が、上述したように溶融粘度の低いＩＣ封止樹脂では融
着発生頻度が高いため、発生後は生産を停機し、融着物
を除去した後再生産を行う方法を繰り返すことで対応し
ていた。また、ターンテーブルと流路制御用堰板部品の
接触部分をなくした場合、融着は発生しなくなるが、パ
ウダーの供給量によって漏れや金型への充填不具合など
タブレット形状や充填率に影響を及ぼすこともあり、パ
ウダー供給調整を頻繁に行う必要があった。[0007] In the past, in order to perform stable production with respect to the tablet shape and the filling rate, a large contact portion between a turntable and a flow path controlling dam plate component has been used. However, as described above, the melt viscosity is low. Since the frequency of occurrence of fusion in the IC sealing resin is high, production has been stopped after the occurrence, and a method of removing the fusion material and then performing reproduction has been repeated. In addition, if the contact part between the turntable and the channel control dam plate is eliminated, fusion will not occur, but the amount of powder supplied will affect the tablet shape and filling rate, such as leakage and defective filling in the mold. Because of this, powder supply adjustment had to be performed frequently.
【０００８】[0008]
【発明が解決しようとする課題】本発明は、このような
事情に鑑みてなされたもので、流動性の良い、溶融しや
すいＩＣ封止樹脂に対し、ターンテーブルや流路制御用
堰板部品への融着を防止でき、安定した成形を可能とし
たロータリー式圧縮成形機を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has been developed for a turntable and a flow path controlling dam plate component for an IC sealing resin having good flowability and easy melting. An object of the present invention is to provide a rotary compression molding machine capable of preventing fusion to a material and enabling stable molding.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、以下の構成を採用する。すなわち、 （１）ＩＣ封止樹脂パウダーを連続的に供給して圧縮成
形するロータリー式圧縮成形機において、機器に固定し
たＩＣ封止樹脂パウダー流路制御用堰板部品（不動部
分）とターンテーブルとの接触面積が（３〜２０）×１
０-3ｍ2 、接触部分以外の隙間が３ｍｍ以下であり、か
つ金型内での下パンチ下降最下点において流路制御用堰
板部品内にある堰板が少なくとも１枚設置されており、
かつターンテーブルの外周速度が０．２〜２ｍ／秒であ
ることを特徴とするＩＣ封止樹脂のロータリー式圧縮成
形機。In order to achieve the above object, the present invention employs the following constitution. (1) In a rotary compression molding machine for continuously supplying and compressing an IC-sealing resin powder, an IC-sealing resin powder flow path control dam plate part (an immovable part) fixed to a device and a turntable Contact area with (3-20) × 1
0 -3 m 2 , the gap other than the contact portion is 3 mm or less, and at least one dam plate in the flow path control dam plate component is installed at the lowermost point of the lower punch lowering in the mold. ,
A rotary compression molding machine for an IC sealing resin, characterized in that an outer peripheral speed of the turntable is 0.2 to 2 m / sec.
【００１０】（２）ＩＣ封止樹脂パウダーが、高化式フ
ローテスターで測定した１７５℃の最低溶融粘度が５〜
３０Ｐａ・ｓのビフェニルエポキシ樹脂組成物からなる
ことを特徴とする前記（１）記載のＩＣ封止樹脂のロー
タリー式圧縮成形機。(2) The IC-encapsulating resin powder has a minimum melt viscosity at 175 ° C. of 5 to 5 as measured by a Koka type flow tester.
The rotary compression molding machine for an IC sealing resin according to the above (1), comprising a biphenyl epoxy resin composition of 30 Pa · s.
【００１１】（３）ＩＣ封止樹脂パウダー流路制御用堰
板部品のターンテーブルとの接触部分の材質がカーボン
ファイバーであることを特徴とする前記（１）または
（２）記載のＩＣ封止樹脂のロータリー式圧縮成形機で
ある。(3) The IC encapsulation according to the above (1) or (2), wherein the material of the contact portion of the damping plate component for controlling the resin encapsulation resin powder flow path with the turntable is carbon fiber. It is a rotary compression molding machine for resin.
【００１２】[0012]
【発明の実施の形態】以下、本発明に係るＩＣ封止樹脂
のロータリー式圧縮成形機の実施の形態について説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a rotary compression molding machine for IC sealing resin according to the present invention will be described below.
【００１３】図１は本発明に係るＩＣ封止樹脂のロータ
リー式圧縮成形機の構成の一例を示す縦断面図であり、
図２は図１に示すＩＣ封止樹脂のロータリー式圧縮成形
機の流路制御用堰板部品周辺の平面図である。FIG. 1 is a longitudinal sectional view showing an example of the configuration of a rotary compression molding machine for an IC sealing resin according to the present invention.
FIG. 2 is a plan view of the vicinity of a flow path control dam plate part of the rotary compression molding machine for the IC sealing resin shown in FIG.
【００１４】図１はＩＣ封止樹脂のロータリー式圧縮成
形機の構成を示すもので、ターンテーブル１に金型
（臼）２が組み込まれており、この金型２に上下からパ
ウダーを圧縮する上パンチ３および下パンチ４がそれぞ
れの本圧ロールカム機構（図示せず）によって一定のス
トロークで上下動が行えるように設置されている。ここ
で、ターンテーブル１、およびそれに組み込まれている
金型２、さらに上パンチ３、下パンチ４は、図２に示す
回転盤１０と接続されており、図１では左から右方向、
図２では回転盤１０を中心として反時計回転方向に動い
ている。FIG. 1 shows a configuration of a rotary compression molding machine for an IC sealing resin. A mold (die) 2 is incorporated in a turntable 1 and the powder is compressed into the mold 2 from above and below. The upper punch 3 and the lower punch 4 are installed so as to be able to move up and down with a constant stroke by respective main pressure roll cam mechanisms (not shown). Here, the turntable 1, the mold 2 incorporated therein, the upper punch 3, and the lower punch 4 are connected to the turntable 10 shown in FIG. 2, and from FIG.
In FIG. 2, it is moving in the counterclockwise direction around the turntable 10.
【００１５】また、流路制御用堰板部品５、パウダーホ
ッパー６は成形機本体に固定されているとともに、堰板
７および擦り切り板８は流路制御用堰板部品５に固定さ
れており、パウダーを金型２内に充填する機能となって
いる。The flow control dam member 5 and the powder hopper 6 are fixed to the molding machine main body, and the dam plate 7 and the scraping plate 8 are fixed to the flow control dam member 5. The function is to fill the powder into the mold 2.
【００１６】また、パウダーホッパー６からターンテー
ブル１上にある流路制御用堰板部品５内に連続的に供給
されるパウダーは、ターンテーブル１の回転運動によ
り、流路制御用堰板部品５内の堰板７およびその後部に
取り付けられた擦り切り板８によって堰き止められ、金
型２内に案内されるようになっている。ここで、金型２
内での下パンチ下降最下点において流路制御用堰板部品
５内にある堰板７が少なくとも１枚（あるいは１対）設
置されている構造となっており、これが充填性を高めて
いる。その後、下パンチ４の上昇および上パンチ３の下
降により圧縮成形され、下パンチ４の上昇によりターン
テーブル１上にタブレットが押し出される。The powder continuously supplied from the powder hopper 6 into the flow path control weir plate part 5 on the turntable 1 is rotated by the rotation of the turntable 1. It is dammed by an inner weir plate 7 and a scraping plate 8 attached to its rear part, and is guided into the mold 2. Here, mold 2
At least one (or one pair) of the weir plate 7 in the flow path control weir plate part 5 is installed at the lowermost point of the lower punch lowering in the inside, and this enhances the filling property. . Thereafter, compression molding is performed by raising the lower punch 4 and lowering the upper punch 3, and the tablet is extruded onto the turntable 1 by raising the lower punch 4.
【００１７】ところで、本発明の特徴は、ターンテーブ
ル１に接触している流路制御用堰板部品５ならびにその
内部に設置されている堰板７の接触部分を減少させてお
り、その接触面には具体例としてフェルトやセラミック
ス、ガラスファイバー、カーボンファイバーなどを貼り
付けるものであるが、特にカーボンファイバーの貼付が
好ましい。これらの方法により摩擦熱の低下ならびに摩
耗性の低減が可能となり、パウダーの融着のみならず隙
間への入り込みや漏れを防止し、金型２への充填を円滑
に行うことができることから安定した圧縮成形を可能に
したものである。The feature of the present invention is that the number of contact portions between the flow path controlling dam plate part 5 in contact with the turntable 1 and the dam plate 7 installed therein is reduced. Is applied with felt, ceramics, glass fiber, carbon fiber, or the like as a specific example. Particularly, carbon fiber is preferably attached. These methods make it possible to reduce frictional heat and abrasion, prevent not only powder fusion but also penetration and leakage into gaps, and smooth filling of the mold 2 can be achieved. It enables compression molding.
【００１８】ここで、流路制御用堰板部品５および堰板
７と、ターンテーブルとの接触面積は（３〜２０）×１
０-3ｍ2の範囲であり、実用上は（４〜１０）×１０-3
ｍ2の範囲が好ましい。２０×１０-3ｍ2を越えると融着
防止ができず、３×１０-3ｍ2未満では融着抑制は可能
であるが、原料パウダーの漏れや金型への充填不具合な
どタブレット形状や充填率に影響を及ぼしてしまう。ま
た、接触部分以外の隙間は３ｍｍ以下であり、これより
大きいと隙間がパウダー粒子径より大きくなりすぎるた
め、パウダー漏れが発生したり、金型２へ充填性を高め
る抵抗力が低下してしまう。なお、接触面積とはターン
テーブルと流路制御用堰板部品および堰板の接触部分の
面積、つまりカーボンファイバーなど接触面に貼付する
ものの面積となる。接触部分以外の隙間とはターンテー
ブルと流路制御用堰板部品および堰板の非接触部分にお
ける空間寸法であり、カーボンファイバーなど接触面に
貼付するものの厚み分に相当する。Here, the contact area between the flow path controlling weir plate part 5 and the weir plate 7 and the turntable is (3 to 20) × 1.
0 -3 m 2 , practically (4 to 10) × 10 -3.
A range of m 2 is preferred. If it exceeds 20 × 10 −3 m 2 , fusion cannot be prevented, and if it is less than 3 × 10 −3 m 2 , fusion can be suppressed. It affects the filling rate. In addition, the gap other than the contact portion is 3 mm or less. If the gap is larger than 3 mm, the gap becomes too large than the powder particle diameter, so that powder leakage occurs or the resistance to increase the filling property into the mold 2 decreases. . The contact area is the area of the contact portion between the turntable and the flow path control dam plate component and the dam plate, that is, the area of a material such as carbon fiber to be attached to the contact surface. The gap other than the contact portion is a space dimension in a non-contact portion between the turntable, the flow path control dam plate component, and the dam plate, and corresponds to a thickness of a material to be stuck to the contact surface such as carbon fiber.
【００１９】また、ターンテーブルの外周速度は０．２
〜２ｍ／秒の範囲であり、好ましくは０．４〜１．２ｍ
／秒の範囲である。０．２ｍ／秒未満では生産性が著し
く低下することとなり、２ｍ／秒を越えると高速のため
パウダー供給および金型２への充填にバラツキが発生す
ることや、接触部分の摩擦熱の低下や摩耗性の低減につ
ながらない。The outer peripheral speed of the turntable is 0.2
２2 m / sec, preferably 0.4 to 1.2 m
/ Second range. If the speed is less than 0.2 m / sec, the productivity is significantly reduced. If the speed exceeds 2 m / sec, the powder is supplied at high speed and the filling of the mold 2 is not uniform. Does not lead to reduced wear.
【００２０】本発明で用いるＩＣ封止樹脂組成物とは、
エポキシ樹脂、フェノール硬化剤、硬化促進剤、シリカ
を主成分とする通常のエポキシ樹脂系ＩＣ封止樹脂など
を意味する。本発明のエポキシ樹脂とは１分子中に２個
以上のエポキシ基を有する化合物であれば特に限定され
ない。エポキシ樹脂の具体例としては、クレゾールノボ
ラック型エポキシ樹脂、フェノールノボラック型エポキ
シ樹脂、フェノールアラルキル型エポキシ樹脂、ジシク
ロペンタジエン骨格含有エポキシ樹脂、トリフェニルメ
タン型エポキシ樹脂、ビスフェノールＡ型エポキシ樹
脂、ビスフェノールＦ型エポキシ樹脂、鎖状脂肪族エポ
キシ樹脂、脂環式エポキシ樹脂、複素環式エポキシ樹
脂、スピロ環含有エポキシ樹脂およびハロゲン化エポキ
シ樹脂、４，４´−ビス（２，３−エポキシプロポキ
シ）ビフェニル、４，４´−ビス（２，３−エポキシプ
ロポキシ）−３，３´，５，５´−テトラメチルビフェ
ニル、４，４´−ビス（２，３−エポキシプロポキシ）
−３，３´，５，５´−テトラエチルビフェニル、４，
４´−ビス（２，３−エポキシプロポキシ）−３，３
´，５，５´−テトラメチル−２−クロロビフェニルな
どのビフェニル型エポキシ樹脂、１，５−ジ（２，３−
エポキシプロポキシ）ナフタレン、１，６−ジ（２，３
−エポキシプロポキシ）ナフタレン、ナフトールアラル
キル型エポキシ樹脂などが挙げられる。The IC sealing resin composition used in the present invention is:
It means an epoxy resin, a phenol curing agent, a curing accelerator, a normal epoxy resin-based IC sealing resin containing silica as a main component, and the like. The epoxy resin of the present invention is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule. Specific examples of the epoxy resin include a cresol novolak type epoxy resin, a phenol novolak type epoxy resin, a phenol aralkyl type epoxy resin, an epoxy resin containing a dicyclopentadiene skeleton, a triphenylmethane type epoxy resin, a bisphenol A type epoxy resin, and a bisphenol F type. Epoxy resin, chain aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin and halogenated epoxy resin, 4,4'-bis (2,3-epoxypropoxy) biphenyl, , 4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy)
-3,3 ', 5,5'-tetraethylbiphenyl, 4,
4'-bis (2,3-epoxypropoxy) -3,3
Biphenyl-type epoxy resins such as', 5,5'-tetramethyl-2-chlorobiphenyl; 1,5-di (2,3-
Epoxypropoxy) naphthalene, 1,6-di (2,3
-Epoxypropoxy) naphthalene, naphthol aralkyl type epoxy resin and the like.
【００２１】この中で特に本発明の効果を著しく発現で
きるエポキシ樹脂は４，４´−ビス（２，３−エポキシ
プロポキシ）ビフェニル、４，４´−ビス（２，３−エ
ポキシプロポキシ）−３，３´，５，５´−テトラメチ
ルビフェニル、４，４´−ビス（２，３−エポキシプロ
ポキシ）−３，３´，５，５´−テトラエチルビフェニ
ル、４，４´−ビス（２，３−エポキシプロポキシ）−
３，３´，５，５´−テトラメチル−２−クロロビフェ
ニルなどのビフェニル型エポキシ樹脂である。Among them, epoxy resins which can remarkably exhibit the effects of the present invention are 4,4'-bis (2,3-epoxypropoxy) biphenyl and 4,4'-bis (2,3-epoxypropoxy) -3. , 3 ', 5,5'-tetramethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3', 5,5'-tetraethylbiphenyl, 4,4'-bis (2, 3-epoxypropoxy)-
It is a biphenyl type epoxy resin such as 3,3 ', 5,5'-tetramethyl-2-chlorobiphenyl.
【００２２】ＩＣ封止樹脂パウダーの最低溶融粘度は配
合成分の組成比率、および製造条件で調整できる。高化
式フローテスターで測定した１７５℃での最低溶融粘度
が５〜３０Ｐａ・ｓの場合に特に本発明の効果を発現で
きる。最低溶融粘度が５Ｐａ・ｓ未満では接触部の融着
発生頻度が多く、３０Ｐａ・ｓを越えたものでは本発明
の効果がわかりにくい。The minimum melt viscosity of the IC encapsulating resin powder can be adjusted by the composition ratio of the components and the production conditions. The effect of the present invention can be particularly exhibited when the minimum melt viscosity at 175 ° C. measured by a Koka type flow tester is 5 to 30 Pa · s. If the minimum melt viscosity is less than 5 Pa · s, the frequency of occurrence of fusion at the contact portion is high, and if it exceeds 30 Pa · s, the effect of the present invention is difficult to understand.
【００２３】[0023]
【実施例】以下、実施例により本発明を具体的に説明す
る。The present invention will be described below in detail with reference to examples.
【００２４】ＩＣ封止樹脂に最低溶融粘度が各々１０Ｐ
ａ・ｓ、２５Ｐａ・ｓのビフェニル型エポキシ樹脂を使
用し、ターンテーブルと流路制御用堰板部品との接触面
積を表1に示したもので実験を行い本発明の効果を確認
した。なお、これらを評価するにあたり以下の方法で行
った。 パウダー供給調整回数：タブレット生産を行っている際
に、パウダー漏れや金型への充填性悪化などにより杵圧
変動が激しくなり、不良品が増加することからやむなく
ロータリー式圧縮成形機を停機させ、パウダー供給調整
を行った回数（回／８ｈｒ）を表した。 融着発生頻度：タブレット生産中に、ロータリー式圧縮
成形機を停機せざるをえない程度の融着が発生した回数
（回／日）を表した。Each of the IC sealing resins has a minimum melt viscosity of 10P.
Using a biphenyl-type epoxy resin of a · s and 25 Pa · s, an experiment was conducted with the contact area between the turntable and the flow path controlling weir plate component shown in Table 1, and the effect of the present invention was confirmed. The evaluation was performed by the following method. Number of powder supply adjustments: During tablet production, fluctuations in punch pressure become severe due to powder leakage and deterioration in mold filling, and the number of defective products increases, so the rotary compression molding machine must be stopped. The number of times the powder supply adjustment was performed (times / 8 hr) is shown. Fusing frequency: The number of times (times / day) that the rotary compression molding machine had to be stopped during tablet production to the extent that it had to be stopped.
【００２５】[0025]
【表１】 [Table 1]
【００２６】表１に見られるように、実施例１〜４では
パウダー供給調整、融着発生もほとんどなく、生産性に
非常に優れていることがわかる。As can be seen from Table 1, in Examples 1 to 4, there was almost no powder supply adjustment and no fusion occurred, indicating that the productivity was extremely excellent.
【００２７】これに対して表１の比較例１〜６では、パ
ウダー供給調整、あるいは融着発生において著しく劣っ
ていることがわかる。On the other hand, in Comparative Examples 1 to 6 in Table 1, it can be seen that the powder supply adjustment and the occurrence of fusion are remarkably inferior.
【００２８】[0028]
【発明の効果】本発明は、以上のような構成により、タ
ーンテーブルと流路制御用堰板部品との接触部分におけ
る摩擦熱の低下ならびに摩耗性の低減がなされており、
ＩＣ封止樹脂パウダーの融着のみならず隙間への入り込
みや漏れを防止し、金型への充填を円滑に行うことが可
能になるという効果を有する。そのため、生産性にもす
ぐれ、安定した圧縮成形を可能にする。According to the present invention, frictional heat is reduced and abrasion is reduced at the contact portion between the turntable and the flow path control dam plate part by the above-described structure.
This has the effect of preventing not only the fusion of the IC sealing resin powder but also the entry and leakage into the gaps and the smooth filling of the mold. Therefore, it is excellent in productivity and enables stable compression molding.
【図１】本発明に係るＩＣ封止樹脂のロータリー式圧縮
成形機の構成の一例を示す縦断面図である。FIG. 1 is a longitudinal sectional view showing an example of the configuration of a rotary compression molding machine for an IC sealing resin according to the present invention.
【図２】図１に示すＩＣ封止樹脂のロータリー式圧縮成
形機の流路制御用堰板部品周辺の平面図である。FIG. 2 is a plan view of the periphery of a flow path control dam plate component of the rotary compression molding machine for the IC sealing resin shown in FIG.
１：ターンテーブル ２：金型 ３：上パンチ ４：下パンチ ５：流路制御用堰板部品 ６：パウダーホッパー ７：堰板 ８：擦り切り板 ９：カーボンファイバー １０：回転盤 1: Turntable 2: Mold 3: Upper punch 4: Lower punch 5: Flow control dam member 6: Powder hopper 7: Dam plate 8: Scratched plate 9: Carbon fiber 10: Turntable
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F201 AA39 AC04 AH37 AJ01 AJ14 AR08 AR12 BA02 BC02 BC12 BL01 BL23 BL42 BQ09 BQ14 BQ40 BQ48 BQ57 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F201 AA39 AC04 AH37 AJ01 AJ14 AR08 AR12 BA02 BC02 BC12 BL01 BL23 BL42 BQ09 BQ14 BQ40 BQ48 BQ57
Claims (3)
圧縮成形するロータリー式圧縮成形機において、機器に
固定したＩＣ封止樹脂パウダー流路制御用堰板部品とタ
ーンテーブルとの接触面積が（３〜２０）×１０
-3ｍ2 、接触部分以外の隙間が３ｍｍ以下であり、かつ
金型内での下パンチ下降最下点において流路制御用堰板
部品内にある堰板が少なくとも１枚設置されており、か
つターンテーブルの外周速度が０．２〜２ｍ／秒である
ことを特徴とするＩＣ封止樹脂のロータリー式圧縮成形
機。In a rotary compression molding machine for continuously supplying and compressing an IC-sealing resin powder, a contact area between a turntable and an IC-sealing resin powder flow path control dam plate fixed to a device. Is (3-20) × 10
-3 m 2 , a gap other than the contact portion is 3 mm or less, and at least one dam plate in the flow path control dam plate component is installed at the lowermost point of the lower punch lowering in the mold, A rotary compression molding machine for an IC sealing resin, wherein the outer peripheral speed of the turntable is 0.2 to 2 m / sec.
スターで測定した１７５℃の最低溶融粘度が５〜３０Ｐ
ａ・ｓのビフェニルエポキシ樹脂組成物からなることを
特徴とする請求項１に記載のＩＣ封止樹脂のロータリー
式圧縮成形機。2. The IC-sealing resin powder has a minimum melt viscosity at 175 ° C. of 5 to 30 P measured by a Koka type flow tester.
2. The rotary compression molding machine for an IC sealing resin according to claim 1, comprising a biphenyl epoxy resin composition of a · s.
のターンテーブルとの接触部分の材質がカーボンファイ
バーであることを特徴とする請求項１または２に記載の
ＩＣ封止樹脂のロータリー式圧縮成形機。3. The rotary member of an IC sealing resin according to claim 1, wherein a material of a contact portion of the damping plate component for controlling the flow path of the IC sealing resin powder with the turntable is carbon fiber. Type compression molding machine.
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|---|---|---|---|
| JP2001111567A JP4590771B2 (en) | 2001-04-10 | 2001-04-10 | IC compression resin rotary compression molding machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001111567A JP4590771B2 (en) | 2001-04-10 | 2001-04-10 | IC compression resin rotary compression molding machine |
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|---|---|
| JP2002307429A true JP2002307429A (en) | 2002-10-23 |
| JP4590771B2 JP4590771B2 (en) | 2010-12-01 |
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| JPH0498398U (en) * | 1991-01-25 | 1992-08-25 | ||
| JPH0623694U (en) * | 1991-08-28 | 1994-03-29 | 株式会社菊水製作所 | Rotary powder compression molding machine |
| JPH06297199A (en) * | 1993-04-14 | 1994-10-25 | Hata Tekkosho:Kk | Rotary type powder compacting machine |
| JPH0947900A (en) * | 1995-06-01 | 1997-02-18 | Hitachi Chem Co Ltd | Rotary type granule compacting machine |
| JPH09122990A (en) * | 1995-10-31 | 1997-05-13 | Mitsubishi Chem Corp | Tableting machine |
| JPH09290420A (en) * | 1996-04-26 | 1997-11-11 | Toshiba Chem Corp | Epoxy resin composition tablet and its manufacture |
| JP2000280096A (en) * | 1999-03-30 | 2000-10-10 | Sumitomo Heavy Ind Ltd | Powder supply device for rotary power compression molding machine |
-
2001
- 2001-04-10 JP JP2001111567A patent/JP4590771B2/en not_active Expired - Lifetime
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51123286U (en) * | 1975-04-01 | 1976-10-06 | ||
| JPS63130298A (en) * | 1986-11-18 | 1988-06-02 | Teikoku Hormone Mfg Co Ltd | Feed shoe for tablet making machine |
| JPH0498398U (en) * | 1991-01-25 | 1992-08-25 | ||
| JPH0623694U (en) * | 1991-08-28 | 1994-03-29 | 株式会社菊水製作所 | Rotary powder compression molding machine |
| JPH06297199A (en) * | 1993-04-14 | 1994-10-25 | Hata Tekkosho:Kk | Rotary type powder compacting machine |
| JPH0947900A (en) * | 1995-06-01 | 1997-02-18 | Hitachi Chem Co Ltd | Rotary type granule compacting machine |
| JPH09122990A (en) * | 1995-10-31 | 1997-05-13 | Mitsubishi Chem Corp | Tableting machine |
| JPH09290420A (en) * | 1996-04-26 | 1997-11-11 | Toshiba Chem Corp | Epoxy resin composition tablet and its manufacture |
| JP2000280096A (en) * | 1999-03-30 | 2000-10-10 | Sumitomo Heavy Ind Ltd | Powder supply device for rotary power compression molding machine |
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|---|---|
| JP4590771B2 (en) | 2010-12-01 |
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