JP2878649B2 - Resin tablet for semiconductor encapsulation, manufacturing method thereof and semiconductor encapsulation method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin tablet used for sealing a semiconductor chip and a method for manufacturing the same.

[0002]

2. Description of the Related Art Resin sealing of semiconductor chips (package)
In general, a transfer molding method is used.
In this transfer molding method, a semiconductor chip is set in a mold cavity of a transfer molding machine, and generally, a thermosetting resin tablet preheated by high-frequency dielectric heating is put into a pot of the transfer molding machine, and the tablet is placed in the pot. The plasticized resin is heated and pressurized by a plunger, and the plasticized resin is introduced into a mold cavity via a spool, a runner, a gate, and the like, thereby completing shaping and curing. Further, recently, a method of encapsulating with a small tablet, which is called a multi-plunger method and belongs to the category of the transfer molding method, has been proposed.

[0003]

Conventionally, in this kind of tablet, a cold compression molding method (plasticizing and kneading a raw material with a roll or an extruder, cooling the kneaded material, pulverizing with a pulverizer, A predetermined amount of this powder is supplied to a mold, and the powder in the mold is compression-molded into a tablet at room temperature with an upper plunger and a lower plunger. In such tablets, the wear metal components are mixed in the kneaded material which is a metal impurity during the pulverization, so that it is difficult to increase the purity of the tablet and the generation of voids is remarkable.

[0004] The moldability of the resin tablet for semiconductor encapsulation obtained in this way originally depends on the physical properties of the resin, but in practice it is greatly affected by impurities in the tablet, especially metallic impurities. The amount of heat generated during tablet preheating by high-frequency dielectric heating is expressed as ωv ² εtanδ (ω: frequency, V: applied voltage, ε: dielectric constant of the tablet),
Since the ε of the resin is 4 to 5 and the ε of the metal material is substantially ∞, the portion in which the metal material is mixed is abnormally heated, and there is a high possibility that the curing reaction proceeds excessively only in that portion. is there. Further, in some cases, a spark is generated, and an overcurrent flows in the high-frequency dielectric heating device, which is likely to cause a failure.

Further, prior to transfer molding (including a multi-plunger method, the same applies hereinafter), even if the tablet is not subjected to high-frequency dielectric heating, if a metal impurity is contained in the tablet, a resin-sealed semiconductor is formed. A decline in the reliability of the chip is unavoidable, and it is undeniable that it is unsuitable as a semiconductor sealing tablet.

Further, in the above-mentioned conventional tablet, there are many voids inside, and since ε of the air is smaller than ε of the resin, unevenness of heating may occur due to the voids. However, since the viscosity of the resin changes logarithmically with the temperature of the resin, the heating unevenness appears as uneven flowability of the encapsulating resin during transfer molding, and may cause poor molding.

Conventionally, tablets are manufactured by an extrusion method (a method in which a resin material for semiconductor encapsulation is kneaded and plasticized by an extruder, rolled into a sheet, and the sheet resin is formed into a tablet by cutting or cutting). It is also proposed that, even in this method, metal mixing by punching is unavoidable, and there is a void at the time of kneading,
Since a compression ratio of only about 90% can be expected, the above disadvantage cannot be solved.

Further, since it is difficult to manufacture a thick sheet, L / D (L: length of the tablet, D: diameter of the tablet), which will be described later, is restricted. There are also disadvantages such as poor weight accuracy.

On the other hand, it has been proposed that a molten resin composition is poured into a mold to form a tablet. However, in general, a highly viscous resin composition is cast, and large bubbles easily remain in the tablet. , L / D, the effect is great.

It has also been attempted to fill the molten resin composition into a molding die with an injection machine to form a tablet. However, since the injection pressure is high, tablets having a compression ratio of 98% or more are required. It is very difficult to obtain.

In recent years, the performance of semiconductors has been dramatically improved, and the quality of tablets used for encapsulation of semiconductors has been required to be dramatically improved. I can't get it. Under such circumstances, in the present inventors, a resin supply passage member is connected to a tip of a screw accommodating cylinder in a kneading extruder, and a kneading molten resin containing a curing agent in the cylinder is passed through the resin supply passage member. A method of injecting into a tablet molding die at an extrusion pressure and molding while applying pressure (hereinafter, referred to as a plasticizing pressure method) has already been proposed (Japanese Patent Application No. 81696/1991 and Japanese Patent Application No. 349648/1991). ).

In the tablet obtained by this plasticizing and pressurizing method, the content of metallic impurities can be less than 50 ppm. Therefore, when the tablet is preheated using a high-frequency dielectric heating apparatus prior to the use of the tablet, it is difficult to obtain a super-spark. Troubles can be reduced, and the compression ratio can be reduced to 9
8% or more, ε of the whole tablet is stable,
The amount of heat ωv ² εtanδ generated during high-frequency dielectric heating is also uniform, so that transfer molding is stable.

Further, since the metal impurity content can be reduced to less than 50 ppm, corrosion of the semiconductor chip due to ionization of the impurity metal can be reliably eliminated, and the water content is reduced to less than 0.1% by weight, preferably less than 0.02% by weight. So you can
The reliability of the package can be drastically improved by preventing ionization of the impure metal and reducing the generation of voids due to moisture contained in the transfer molding.

In addition, 250 mesh or less (mesh 25
Of fine powder adhering to powder having a particle size of 0
Less wt% preferably case of less than 0.002 wt%
Can well cope with the recent tendency to clean semiconductor encapsulation factories.

Further, according to the plasticizing and pressurizing method, the cooling of the molten resin composition in the tablet molding die proceeds from the outer surface toward the inside, so that the longer the inside, the longer the time of exposure to a high temperature. In general, the gelation time is slightly shortened, so that the transfer molding cycle can be shortened.

Further, since the supply of the molten resin composition to the tablet molding die is performed by the pushing force of the kneading extruder, the productivity of the semiconductor sealing tablet can be improved by increasing the extrusion speed.

In recent years, in addition to the above-mentioned high performance of semiconductor chips, compactness has also been remarkably progressed, and with this compactness, the thickness of semiconductor devices has been reduced, and the thickness of gates of transfer molding machines has also been considerably increased. It is thin.

Therefore, in the above-mentioned plasticizing and pressurizing method,
A resin supply passage member is attached to the end of the cylinder of the extruder, and when the outlet of the resin supply passage member coincides with the resin injection port of the tablet molding die, the resin is injected into the mold. It is necessary to temporarily stop the resin flow in the resin supply passage member until the resin injection, so that the resin flow in the resin supply passage member becomes intermittent and melts while the resin flow is stopped. The gelation of the resin composition (containing a curing agent) is promoted, and the growth of gelled particles is promoted. If the gel particles are larger than the thickness of the gate, gate clogging is caused. become.

An object of the present invention is to suppress the generation of gelling particles of the tablet produced by the above-mentioned plasticizing and pressurizing method, and to smoothly seal the semiconductor chip by the transfer molding method without clogging the gate. It is to make.

[0020]

The resin tablet for semiconductor encapsulation of the present invention is a tablet obtained by cooling and solidifying a resin composition melt containing a curing agent, and the tablet has a gelling particle content of 60 mesh. ON is 0, 100 mesh ON is 10 ppm or less, the compression ratio is 98% or more, and the metallic impurity content is 50 ppm.
Less than 20 ppm, particularly preferably less than 10 ppm
be less than pm, containing Arimizu amount is configured, characterized in that less than 0.1 wt%.

The above-mentioned compression ratio C is a ratio between the apparent specific gravity of the tablet and the specific gravity when the voids in the tablet are set to 0 (true specific gravity). Is V and the weight of the tablet is W, C = [(W / ρ) / V] × 100%. The cured resin tablet is 200
It can be obtained by completely curing (for example, at 175 ° C. for 10 minutes) with a transfer molding machine under a pressure of kg / cm ² . For the measurement of the gelled particles, the tablet is dissolved in a solvent, for example, acetone, and the solution is strained through a two-stage screen of 60 mesh and 100 mesh, and the solution is filtered.
The gelled particles of Messhu are 60 mesh on, 60-1
For the gelled particles of 00 mesh, a method of measuring the amount of 100 mesh on can be used. The above two-stage screen is
For example, it can be based on ASTM E11-58T.

The metallic impurities are substantially almost the metals themselves. Metal compounds such as metal oxides are listed above.
This metallic impurity is not included in "metallic impurities." This metallic impurity is a magnetic analyzer (for example, TMA-0 manufactured by Tatsumori Corporation).
It can be measured by 1).

The amount of the attached fine powder can be measured by scattering the fine powder on the surface of the tablet with an air gun having an air pressure of 2 to 5 kg / cm ² .

In the resin tablet for semiconductor encapsulation of the present invention, as described later, the gelation time at the center of the tablet is generally slightly shorter than the gelation time at a portion outside the central portion.

Regarding the shape and dimensions of the tablet, the outer diameter (D) is 20 mm or less, the ratio L / D of the outer diameter (D) to the length (L) is 1 or more, and the outer diameter (D) is When the ratio L / D of the outer diameter (D) to the length (L) is 20 mm or more, and the outer diameter (D) is 20 mm or more, the outer diameter (D) and the length (L) A plurality of tablet moldings having a ratio L / D of 1 or less are laminated or bonded together,
Alternatively, it is preferable that a solid body is bonded or fused to a hollow body having an outer diameter of 20 mm or more and an inner diameter of 20 mm or less.

According to the method of manufacturing a semiconductor-encapsulated tablet of the present invention, a resin supply passage member with a built-in stirrer is connected to the tip of a screw accommodating cylinder in a kneading extruder. It is characterized in that the molten resin is injected into the tablet molding die at an extrusion pressure while being agitated with a stirrer through a resin supply passage member, and is molded while being pressurized. In this case, the resin pressure of the molten resin composition is buffered. It is possible to make it constant by a vessel.

At this time, generally, the supply temperature of the resin composition to the molding die is about 80 ° C. to 120 ° C., and the temperature of the molding die is about room temperature to 50 ° C. In the mold, a cooling medium (usually hot water) is usually circulated, and the tablet is cooled from the surface toward the inside. It is generally short and slightly shorter from inside to inside. The surface temperature of the tablet when taken out of the mold is usually 50 ° C. or lower. Also, the degree of pressurization during tablet production is generally 50 kg / cm ² -30.
0 kg / cm ^2, preferably 80 to 120 kg / cm ² .

[0028]

The tablet obtained in this manner can prevent gelled particles in the tablet from being mixed well. Even if gelation occurs, the gelled particles are extremely fine, so the gate is shallow and also, gate clogging without, moreover, gold
Since the content of attribute impurities can be reduced to 50 ppm,
Prior to use of the kit, the high frequency dielectric heating device was used to
If you preheat the tablet,
The compression ratio can be increased to 98% or more.
, The ε of the whole tablet is stable,
Ωv ² εtanδ also becomes uniform,
Transfer molding is possible.

In the production of the tablet, when the outlet of the resin supply passage member coincides with the resin injection port of the tablet molding die, the resin is supplied to the die, and the resin supply is temporarily stopped until the next resin supply. Even when the resin supply is stopped, the resin in the resin supply passage member is agitated, so that the progress of gelation can be well suppressed and the generation of gelled particles can be well suppressed.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The resin composition for encapsulating a semiconductor used in the present invention may be a known one.
It is possible to use a composition comprising a main component such as a resin, a polyimide resin, and a curing agent, a curing accelerator, a filler, a release agent, a pigment, a flame retardant, a flame retardant auxiliary, a surface treatment agent, and the like. The ratio is, for example, 100 parts by weight of an epoxy resin main agent, 10 to 30 parts by weight of a flame retardant auxiliary, 40 to 80 parts by weight of a curing agent, 200 to 1900 parts by weight of a filler, 10 to 20 parts by weight of a flame retardant. , Release agent: 1 to 3 parts by weight, pigment: 1 to 3 parts by weight, curing accelerator: 1 to 3 parts by weight, surface treatment agent: 1 to 3 parts by weight.

During the production of the resin tablet for semiconductor encapsulation of the present invention, a step of dry-blending the above resin composition with a mixer, for example, a Henschel mixer, and melt-kneading the mixture with a kneading extruder during the production, The step of filling the tablet forming die, the step of pressurizing and cooling the filling while cooling the die by passing water through it, and the step of taking out the tablet from the forming die after the completion of cooling are performed. Fifteen
The temperature of the molten resin at the time of filling is about 80 to 120 ° C, and the temperature of the mold is about 5 to 50 ° C.

For the pressure molding of the molten resin in the molding die, the upper and lower plungers are provided on the tablet molding die so that the die can be closed with the upper and lower plungers. A suitable method is to form the supplied molten resin composition while pressing it at about 50 to 300 kg / cm ^{2 by} operating a plunger.

According to this method, the tablet can be easily pressurized and thereby can the high compression ratio less than 98% compression rate in achieving <br/>, even including chromatic water content, less than 0.1 wt% You can easily get a tablet.

The above pressure is applied while cooling the mold. In this case, despite the surface pressure between the inner surface of the mold and the resin being molded due to the pressure, the resin having a smaller adhesive force and a larger expansion coefficient due to cooling than the mold due to cooling. It is considered that the shrinkage by cooling is large.
Therefore, the tablet can be smoothly removed from the mold by pushing up the plunger. Therefore, it is not necessary to attach a taper (about 1/80) to the inner surface of the mold.

On the other hand, in the conventional cold forming method, when a tablet is compression-molded by a tablet forming die and then the tablet is pushed up and pushed out by a lower plunger, friction between the tablet surface and the inner surface of the forming die is large. For this purpose, a taper is attached to the inner surface of the molding die to facilitate removal.

However, in the production of the tablet of the present invention, the taper can be made substantially zero (1/200 or less),
As a result, it is considered that the pot of the transfer molding machine can be designed with high precision, the clearance between the tablet and the inner surface of the pot can be extremely reduced, and the entrapment void can be effectively prevented. The property can be improved well.

In the resin tablet for semiconductor encapsulation of the present invention, since the cooling proceeds from the outer surface toward the inside in the mold, the inside is exposed to a high temperature for a longer time and the gelation time is slightly shorter. In general,

On the other hand, during transfer molding of a semiconductor chip using a tablet, the outer surface side of the tablet flows faster than the central portion and flows into the cavity earlier, and the central portion is more time-consuming. Tend to flow into the cavity late. Therefore, when the gelation time at the center of the tablet is rather short, the reaction of the cull portion after the transfer mold molding progresses well, which is advantageous in preventing the so-called "cull residue" from forming problems.

FIG. 1 shows an example of an apparatus used for manufacturing the resin tablet for semiconductor encapsulation of the present invention. In FIG. 1, reference numeral 1 denotes a kneading extruder, and 11 denotes a cylinder of the kneading extruder 1 in which a screw is housed. Reference numeral 3 denotes a mold holder which moves left and right by the orbit rail 9.
A cooling jacket 8 is provided. Reference numeral 4 denotes a tablet molding die, which is closed by an upper plunger 5 and a lower plunger 6. 2 is the cylinder-11 of the kneading extruder 1
Is a resin supply passage member attached to the tip of the mold, and has a built-in stirrer, and the discharge port 21 is slidably contacted with the upper surface of the mold. Reference numeral 10 denotes a tablet sending machine.

The resin supply passage member having a built-in stirrer includes:
For example, as shown in FIGS. 2A and 2B [cross-sectional view of FIG. 2B], the resin supply pipe 2 is attached to the tip of the cylinder 11 and the stirrer 22 is screwed. 1
2 can be used. The clearance between the inner wall of the resin supply pipe 2 and the stirrer 22 is generally 1 mm or less, preferably 0.5 mm ± 0.1 mm. When a twin-screw type is used as the kneading extruder 1, as shown in FIG. 2C, one screw 121 and the resin supply pipe 2 are concentric, and the one screw tip is used. To which a stirrer 22 is attached can be used.

In order to produce the resin tablet for semiconductor encapsulation of the present invention by the production method of the present invention using the apparatus shown in FIG. 1, the semiconductor encapsulation is carried out in a popper (not shown) of the kneading extruder 1. The resin composition for stopping is fed, and the resin composition in the popper is fed into the heating cylinder 11 of the kneading extruder 1 by rotating the screw of the kneading extruder 1, and usually kneading while heating and melting at about 60 to 150 ° C. Then, the molten resin composition is filled into the tablet molding die 4 through the resin supply passage member 2 with the pushing force of the screw. By providing a pressure detecting device such as a load cell in the lower plunger 6, the injection pressure of the molten resin is detected, and a signal indicating completion of resin filling is generated.

Upon receiving the filling completion signal, the mold holder
3 moves to the right (or left), and when the left (or right) tablet molding die 4 reaches the position of the discharge port 21 of the resin supply passage member 2, the die holder 3 stops. The resin filled in the tablet molding die moved to the right (or left) is fed to the upper plunger 5 and the lower plunger 6 for 50 to 30.
It is molded while being pressed at about 0 kg / cm ² . At this time, cooling water whose temperature has been adjusted to 5 ° C. to 50 ° C. is circulated through the cooling jacket 8 of the mold holder-3.

The cooled resin (room temperature to about 60 ° C.) is projected upward by the lower plunger 6, and the projected resin body, that is, the tablet 7, is discharged forward by the tablet delivery machine 10.

Thereafter, when the filling of the resin into the left (or right) molding die is completed, the die holder moves to the right (left), and the above operation is repeated. In the above,
The discharge port of the resin supply passage member 2 until the filling of the resin into the left (or right) tablet molding die is completed and the next filling of the resin into the right (or left) tablet molding die is started. 21 is slidably contacted with the mold holder 3 to temporarily stop the discharge of the resin (usually 1 second or less). In addition, the resin in the resin supply passage member 2 can be stirred and fluidized well, and the generation and generation of gelled particles can be prevented well.
It is thought that it can be done. This is clear from the first embodiment described below.

[0045]

【Example】

[Example 1] The resin composition contained 60 parts by weight of an epoxy resin base, 10 parts by weight of a flame retardant aid, 30 parts by weight of a curing agent, and filler 2
20 parts by weight, flame retardant 5 parts by weight, release agent 1 part by weight, pigment 1
1 part by weight of a curing accelerator and 1 part by weight of a surface treating agent were used. The manufacturing apparatus shown in FIG. 1 was used, and the dimensions of the tablet forming die were 13 mm in inner diameter and 20 mm in height.

After mixing the above composition with a Henschel mixer for 30 minutes, this mixed composition was supplied to a kneading extruder,
The resin melted by the kneading extruder is injected into the tablet molding die with a pressing force, and the injection composition is molded at a molding pressure of 100 kg / c.
m ^2, the tool holder - circulating cooling water temperature 20 ⁰ C under at pressure molding cooling, followed, molded product (tablet) lower plunger - was removed from the mold by pushing up by.

Twenty-five tablets thus obtained were dissolved in acetone by stirring for 10 minutes, and the solution was strained with a two-stage screen having a mesh of 60 meshes on the upper side and 100 meshes on the lower side. Of the tablets, and the value was 100 ppm or less. The compression ratio are all 98% to 100%, all metallic impurities content of less than 9 ppm, including Arimizu amount was less than all 0.02%.

FIG. 3 shows another example of an apparatus used for producing the semiconductor encapsulating tablet of the present invention. In FIG. 3, 1 is a kneading extruder, 2 is a resin supply passage member having a built-in stirrer, and has the same structure as that shown in FIG. Reference numeral 3 denotes a turntable in which a plurality of tablet molding dies 4,... Are arranged on the same circumference at regular intervals. 8 is a cooling jacket, 5 is an upper plunger, 6 is a lower plunger, and 10 is a scraper for sending out a tablet.

In order to manufacture the tablet for semiconductor encapsulation of the present invention using the apparatus shown in FIG. 3, the molten resin composition (80 to 120 ° C.) is supplied from the kneading extruder 1 through the resin supply passage member 2. The resin is supplied to one tablet forming die 4 (about 40 ° C.) by the screw pressing force of the kneading extruder 1 and while stirring the resin in the resin supply passage member 2 with a stirrer. When the filling of the molten resin composition into the resin is completed, the completion of resin filling is generated by a pressure detecting device such as a load cell as described above, and the turntable 3 is rotated in the direction of the arrow to form the next tablet molding metal. When the mold 4 reaches the discharge port 21 of the resin supply passage member 2, the turntable 3 is turned on.
Is stopped, and the supply of the molten resin composition to the tablet molding die 4 is started. In addition, when the resin is slid off by the rotation of the turntable 3, the resin is slid off while receiving a back pressure (extrusion pressure), thereby further improving the weight accuracy of the tablet.

On the other hand, for the tablet molding die 4 which has been filled with the molten resin composition, the upper plunger 5 is moved immediately after the die leaves the discharge port 21 of the resin supply passage member 2. The upper and lower plungers 5, 6 are moved in synchronism with the turntable 3, and the upper and lower plungers 5, 6 allow the resin composition in the tablet molding die 4 to be 50 to 300 kg / cm. Cool while pressurizing at about ² (5 ° C to 50 ° C in the cooling jacket 8 of the turntable 3).
Circulating cooling water whose temperature has been adjusted to ℃), scraper
The semiconductor encapsulating tablet cooled and solidified before 10 is released by pushing up the lower plunger 6, and is transferred to the outside of the turntable 3 by the scraper 10.

The number of pairs of the upper and lower plungers 5, 6 is plural, and each of the upper and lower plungers 5, 6 is used for each tablet molding die 3 which is successively filled with the molten resin composition. By operating as described above, tablets for semiconductor encapsulation are continuously produced by a turntable method.

When manufacturing the tablet for semiconductor encapsulation of the present invention using the apparatus shown in FIG. 1 or FIG. 3, furthermore, in order to speed up the production, it is necessary to use a mold holder or a turner.
Increase the moving speed of the table 3 or turn the table 3
It is effective to increase the number of the above-mentioned tablet forming dies 4 and increase the supply speed of the resin composition to the tablet forming dies 4.

Example 2 The apparatus shown in FIG. 3 was used.
The composition of the resin composition, the dimensions of the tablet molding die 4, the premixing by the Henschel mixer, the temperature of the cooling circulating water, the molding pressure, and the like were the same as in Example 1. The number of the tablet forming dies 4 on the turntable 3 is set to eight, and the temperature of the resin supply passage member 2 is adjusted to 80 ° C. and the kneading extruder 1
Was supplied to the tablet molding die 4 through the resin supply passage member 2 by the pushing force of the kneading extruder 1.

The gelled particles of 25 tablets obtained in this example were measured in the same manner as in Example 1. As in Example 1, those having a size smaller than 60 mesh and larger than 100 mesh were less than 10 ppm. there were. The compression rate, all 98% to 100%, the amount of metallic impurities all 9ppm less than, including Arimizu quantity also was <br/> a fully end all 0.02%.

When the semiconductor encapsulating tablet of the present invention is manufactured by the apparatus shown in FIG. 1 or FIG. 3, the mold holder or turntable 3 is stopped and the molten resin composition is added to the tablet forming mold 4. The resin pressure during the filling period (resin filling period) is a steady pressure, but during the period following the filling period (the mold replacement period), the discharge of the resin is temporarily stopped. The resin pressure rises.

In order to stabilize the quality of the tablet for semiconductor encapsulation, it is desirable to keep the resin pressure constant throughout the whole period. It is preferable to keep the supply pressure of the product constant.

For this shock absorber, for example, an air cylinder is used, and if the steady pressure of the resin is P, the air cylinder diameter is R ₁ , and the piston diameter is R ₂ , the air pressure is P ×
(R ₂ / R ₁ ) ² or slightly higher.

The location of the buffer may be between the outlet of the kneading extruder 1 and the tablet molding die 4, but
It is particularly desirable to be near the exit side. Installation position and installation direction of buffer (vertical direction, horizontal direction, tilt direction)
Does not interfere with other components of the device, for example,
It is selected so as not to hinder the movement of the upper plunger.

[0059]

As described above, in the resin tablet for encapsulating a semiconductor according to the present invention, the particle diameter of the contained gelled particles is 0 for 60 mesh-on and 10 ppm or less for 100 mesh-on. The semiconductor chip can be sealed smoothly by molding even under extremely thin gates. Can be used well under

Further, since the content of metallic impurities is less than 50 ppm, troubles in the high-frequency dielectric heating device due to generation of spark can be reduced, and since the compressibility is 98% or more, the dielectric constant of the whole tablet is reduced. Is stable, and the amount of heat generated during high-frequency dielectric heating, ωv ² εtanδ, is also uniform, so that transfer molding can be stabilized.

Further, since the amount of metallic impurities is less than 50 ppm, corrosion of the semiconductor chip due to ionization of impurity metals can be effectively eliminated, and the water content is preferably less than 0.01% by weight. The reliability of the package can be significantly improved by preventing ionization of the impurity metal and reducing the generation of voids due to moisture contained during transfer molding.

[0062]

[0063]

Furthermore, it is possible to shorten the gelation time of the central portion of the tablet which is usually slowly flowed into the cavity during the transfer molding of the semiconductor chip, thereby shortening the cycle of the transfer molding of the tablet. .

According to the method for producing a resin tablet for encapsulating a semiconductor of the present invention, it is possible to produce such an excellent resin tablet for encapsulating a semiconductor. In particular, the molten resin composition is subjected to a pressing force of a kneading extruder. Because of the supply, high-speed production becomes possible. Furthermore, when the resin pressure is made constant by the buffer, the quality of the tablet for semiconductor encapsulation can be easily stabilized, and the overload of the kneading extruder can be prevented.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an example of a manufacturing apparatus used for manufacturing a resin tablet for semiconductor encapsulation of the present invention.

FIG. 2A is an explanatory cross-sectional view showing a stirrer in the apparatus of FIG. 1, and FIG. 2B is a cross-sectional view of FIG. FIG. 2C is an explanatory sectional view showing another example of the stirrer.

FIG. 3 is an explanatory view showing another example of the manufacturing apparatus used for manufacturing the resin tablet for semiconductor encapsulation of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Kneading extruder 2 Resin supply passage member 22 Stirrer 3 Mold holder or turntable 4 Tablet molding die 5 Upper plunger 6 Lower plunger 7 Semiconductor sealing resin tablet 8 Cooling jacket 9 Track rail Le 10 Tablet delivery machine or scraper

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shinichi Kanai 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nippon Denko Corporation (72) Inventor Shoichi Kimura 1-1-1, Shimohozumi, Ibaraki-shi, Osaka No. 2 within Nitto Denko Corporation (56) References JP-A-61-270121 (JP, A) JP-A-63-54468 (JP, A) JP-A-59-7709 (JP, A) JP-A No. 1 JP-A-129424 (JP, A) JP-A-61-115330 (JP, A) JP-A-63-160256 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/56 H01L 23/28-23/30 B29B 9/08 B29C 45/02 C08J 3/12

Claims (9)

(57) [Claims] 1. A tablet comprising a resin composition melt of the curing agent formulation is cooled and solidified, 100 mesh on gelation particle content of 60 mesh on 0 in the tablet Ri der less 10 ppm, Compression ratio (appearance of tablet
Specific gravity and specific gravity when the void inside the tablet is zero (true ratio
Is 98% or more, and the content of metallic impurities is 98% or more.
Is less than 50 ppm . Wherein wherein the water content is less than 0.1 wt%
Item 4. The resin tablet for semiconductor encapsulation according to Item 1 . 3. A resin composition melt containing a curing agent is cooled and solidified.
Tablet comprising the gelled particles in the tablet
Child content is 60 mesh on and 100 mesh on
Is less than 10 ppm and the water content is less than 0.1% by weight.
Fully encapsulating resin tablet for semiconductors. 4. A gel time of the tablet center is, the center portion other than the portion 1 to less claim than the gel time of the 請
The resin tablet for semiconductor encapsulation according to claim 3 . 5. A resin composition melt containing a curing agent is cooled and solidified.
Tablet comprising the gelled particles in the tablet
Child content is 60 mesh on and 100 mesh on
Is less than 10 ppm, and gelation at the center of the tablet
The interval is a half shorter than the gel time of the part other than the center part.
Resin tablets for conductor sealing. 6. A resin supply passage member with a built-in stirrer is connected to the tip of a screw accommodating cylinder in a kneading extruder. in stirring injected at an extrusion pressure in the tablet molding mold while pressurized with claims 1 to 5 or serial mounting semiconductor sealing resin tablet production method of the characterized by molding. 7. The method according to claim 6 , wherein the resin pressure of the molten resin composition is made constant by a buffer. 8. The method for producing a resin tablet for encapsulating a semiconductor according to claim 6 , wherein the resin tablet is molded under pressure while cooling. 9. A semiconductor encapsulating method for encapsulating a semiconductor chip using the resin encapsulating resin tablet according to claim 1 .