JP4587431B2 - Method for manufacturing fluorescent plate and method for manufacturing radiation detection apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a fluorescent plate and a method for manufacturing a radiation detection apparatus .
[0002]
[Prior art]
FIG. 1 is a sectional view of an indirect X-ray area sensor as a conventional example. On the optical sensor 111 including the photoelectric conversion elements 112 arranged in a grid pattern on the glass substrate 110, the wiring portion 113 connecting them, and the optical sensor protective layer 114 protecting them, the phosphor 103 and the reflection Layer 102 is formed to create an X-ray area sensor.
[0003]
X-rays incident on the phosphor 103 from the phosphor substrate 101 side are wavelength-converted from the X-rays to light such as visible light by the phosphor 103, and then the visible light is photoelectrically converted by the photoelectric conversion element 112 of the optical sensor 111. It is converted into an electrical signal. An X-ray digital image can be obtained by amplifying the signal and applying image processing.
[0004]
Currently, as means for forming the phosphor 103 on the optical sensor 111, a method of directly depositing and coating the phosphor 103 on the optical sensor 111, and reflecting on the base 101 separate from the optical sensor 111 as shown in FIG. There is a method in which the layer 102 and the phosphor 103 are formed, covered with a protective layer 130, and then attached to the optical sensor 111 via an adhesive using a roller 107.
[0005]
Comparing the two, the latter is generally used at present because the phosphor 103 can be formed on the photosensor 111 more efficiently with a higher yield. Further, CsI (cesium iodide) is mainly used as the phosphor for the X-ray area sensor from the viewpoint of light emission amount and resolution, and the method of forming on the phosphor substrate is often by vacuum deposition. .
[0006]
A method for forming a phosphor on an optical sensor by bonding will be described. A method for manufacturing the fluorescent plate will be described. FIG. 2 is a sectional view showing the manufacturing process. As the material of the phosphor substrate 101 on which the phosphor is formed, an amorphous carbon (a-C) with little X-ray absorption, an inexpensive glass substrate, or an aluminum plate or the like is used as a material that also serves as the reflective layer 102 at the same time. The
[0007]
First, as shown in FIG. 2A, the reflective layer 102 is formed on the phosphor substrate 101. The reflective layer 102 is formed in order to reflect the phosphor light emitted in the opposite direction to the photosensor so that the photosensor can detect it efficiently. As the material of the reflective layer 102, a metal or a metal compound material such as Al or Ag having high reflectivity is used, and the formation method is performed by a method such as sputtering.
[0008]
Next, as shown in FIG. 2B, the phosphor 103 is formed on the reflective layer 102 formed on the phosphor substrate 101. CsI or the like is used as the material of the phosphor 103. The case of forming by vacuum deposition using CsI will be described below.
[0009]
The phosphor substrate 103 on which the reflective layer 102 is formed is set in a vacuum chamber, and CsI (Na ⁺ ) or CsI (Tl ⁺ ), which is an evaporation material, is placed in the port. The pressure in the vacuum chamber is pulled to 0.1 to 1.0 [Pa], the phosphor substrate 101 on which the reflective layer 102 is formed is heated to a high temperature (about 100 to 180 ° C.), and a current is supplied to the port for heating. Then, CsI is vaporized and CsI columnar crystals are formed on the phosphor substrate 101 on which the reflective layer 102 is formed.
[0010]
At that time, before CsI is completely vaporized (in a solidified state), the CsI may jump into the vacuum chamber, and the solid matter may adhere to the vapor deposition surface of the phosphor substrate 103 on which the reflective layer 102 is formed. This is called splash.
[0011]
As shown in FIG. 2B, the splashed CsI has a size (diameter) 404 of about several tens to several hundreds of μm and a height 405 of about ten to several hundreds of μm, as shown in FIG. It appears as a convex part. Further, as shown in FIG. 2B, a concave portion having a gap width 406 of several to several tens of μm and a depth of several tens to several hundreds of μm is also generated around the convex portion at the same time. The unevenness is also caused by foreign matter adhering to the phosphor substrate 101 formed on the reflective layer 102 before vapor deposition, or by foreign matter adhering to the vapor deposition surface during or immediately after vapor deposition.
[0012]
An effective method for eliminating the unevenness of the CsI surface due to these causes has not been considered at present. Further, if the thickness of the phosphor 103 is increased, the vapor deposition time is increased accordingly, so that the phosphor 103 is likely to be generated, and the generation rate is increased even if the vapor deposition area is increased.
[0013]
Next, as shown in FIG. 2C or FIG. 2D, a protective layer 130 is formed on the phosphor 103 or on the entire circumference of these layers to protect it from mechanical stress and moisture. Since the protective layer 130 enters between the phosphor and the optical sensor when bonded, the protective layer 130 must be formed of a material having a high light transmittance and thin.
[0014]
When the transmittance is low, the light emitted from the phosphor 103 is absorbed by the protective layer 130 and the sensitivity of the photosensor is lowered. Further, when the protective layer 130 is thick, the distance between the phosphor and the photosensor is increased, and the light from the phosphor 103 is scattered, so that the resolution of the photosensor is lowered. Furthermore, when CsI is used for the phosphor 103, since CsI has deliquescence, a material with low moisture permeability must be used so that it can be protected from moisture. The polyparaxylylene resin is a material that satisfies these conditions.
[0015]
As shown in FIG. 2C, when the phosphor 103 made of CsI is formed by vacuum deposition, irregularities due to splash or foreign matter appear, and the convex portions have a height of several tens to several tens of μm. Since the protective layer is as thin as several μm to several tens of μm, it appears in the same size as the unevenness before the formation of the protective layer 130.
[0016]
In addition, as shown in FIG. 2D, in the recesses around the protrusions, there are gaps of several μm to several tens of μm, so that the protective layer 130 is not formed, or the protective layer 130 It may be thinner than the part. The gap is not filled unless a protective layer having a gap distance is formed. However, if the protective layer has a thickness of several tens of μm, the resolution is deteriorated, which is not possible.
[0017]
An X-ray sensor is obtained by bonding the fluorescent plate, in which the reflection layer 102, the phosphor 103, and the protective layer 130 are formed as described above on the phosphor substrate 101, to an optical sensor through an adhesive.
[0018]
When the fluorescent plate is bonded to the optical sensor 111 via the adhesive 115, the adhesive 115 is formed between the phosphor 103 and the optical sensor 111, similarly to the protective layer 130. Therefore, the light transmittance and film thickness are important.
[0019]
As a general bonding of the fluorescent plate 109, an adhesive 115 is applied on the optical sensor 111, the fluorescent plate 109 is overlaid thereon, and the bonding is performed while pressing with a roller. At that time, the thickness of the adhesive 115 is controlled by the load / moving speed of the roller and the viscosity of the adhesive 115.
[0020]
[Problems to be solved by the invention]
As described above, when phosphor (especially CsI) is formed on a phosphor substrate by vapor deposition, irregularities of several tens to several hundreds of μm are generated due to splash or foreign matter. Due to these irregularities, as shown in FIGS. 3A and 3B, the following problems occur when the fluorescent plate and the optical sensor are bonded together.
[0021]
(1) Destruction of the optical sensor As shown in FIG. 3A, the optical sensor 111 is covered and protected by the optical sensor protective layer 114, but the optical sensor 111 is projected by the protrusion on the bonding surface of the fluorescent plate 109. Will be damaged and destroyed. The optical sensor 111 is a collection of photoelectric conversion elements 112 arranged in a lattice pattern, but the number of photoelectric conversion elements 112 that are destroyed increases depending on the size or number of protrusions. In addition, when the wiring portion 113 connecting the photoelectric conversion elements 112 is destroyed, it leads to destruction of all the columns of the photoelectric conversion elements 112.
[0022]
(2) Destruction of protective layer As shown in FIG. 3 (b), if the surface of the fluorescent plate is uneven, the load of the roller is concentrated on the convex portion at the time of bonding, and the phosphor 103 and the protective layer 130 in the convex portion are crushed. It is. Therefore, cracks (cracks) occur in the protective layer 130.
[0023]
Further, in the concave portion, there is a portion where the protective layer 130 is not covered when the protective layer is formed, and the phosphor 103 is exposed, and when the temperature and humidity durability test is performed, the crack and the concave portion not covered with the protective layer 130 In some cases, moisture (moisture) enters the phosphor 103 and the phosphor 103 may be destroyed. In particular, when the phosphor 103 is CsI, it is deliquescent.
[0024]
(3) Decrease in resolution In the pasting of the fluorescent plate 109 and the optical sensor 111, the film thickness of the adhesive 115 after formation is important, and 20 μm or less is desirable for obtaining high resolution. However, the concavo-convex portions on the surface of the fluorescent plate 109 are often several tens to hundreds of tens of μm, and in this state, when bonding is performed so that the optical sensor 111 and the protective layer 130 are not broken, The thickness must be increased to a thickness of 20 μm or more (a thickness of a few tens of μm). As a result, the distance between the phosphor 103 and the optical sensor 111 becomes large and the resolution decreases.
[0025]
(4) Contamination of bubbles The unevenness of the fluorescent plate 109 may not only destroy the protective layer 130 and the optical sensor 111 but also embed bubbles during bonding. If there are innumerable convex portions on the surface of the fluorescent plate 109, the load of the roller is concentrated on the convex portions, the roller load is not applied to the adhesive 115, and the adhesive 115 is difficult to spread.
[0026]
Moreover, even when there are few convex parts, the location where a load is not applied will generate | occur | produce around a convex part, and it will become impossible to push away a bubble. For this reason, bubbles remain between the fluorescent plate 109 and the optical sensor 111, so that the light emitted from the phosphor 103 is diffusely reflected to lower the resolution.
[0027]
Since the unevenness of the phosphor causes the problems (1) to (4) described above, flattening thereof is an important issue.
[0028]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides a method of manufacturing a fluorescent plate, the phosphor on a substrate, a deposition step of forming by vapor deposition a phosphor layer having a columnar crystal, by splash formed in the deposition step A step of forming a first protective layer on the surface of the phosphor layer having the surface on which the convex portions are formed; a planarizing step of flattening the convex portions from above the first protective layer; and the planarization. after the step, characterized in that it comprises a step of forming a second protective layer on the covering of the convex portion is flattened region first protective layer.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
First, the basic concept of the present invention will be described. The above problem is solved by flattening the unevenness on the surface of the fluorescent plate before bonding. In the above-described conventional example, in order to flatten the surface before forming the protective layer, when the phosphor is CsI, it has to be deliquescent and must be performed in a vacuum or in an N ² atmosphere. For this purpose, it is necessary to manufacture a dedicated device, which is costly. Therefore, after forming the phosphor, temporary protection is performed by covering the entire surface including the phosphor surface or the phosphor substrate with the first protective layer, and then flattening the phosphor and the protective layer formed thereon Process. Then, a second protective layer is formed.
[0030]
Hereinafter, a method for performing planarization will be described.
[0031]
(1) Crushing FIG. 4A is a cross-sectional view showing an example of flattening by crushing the unevenness of the phosphor surface. The equipment used for crushing includes a flat plate and a roller. In this example, a flat plate 412 is used. At that time, if the pressing pressure is too strong, it will affect the surroundings of the convex part and the surrounding phosphor may be destroyed.Therefore, a stopper is attached so that the pressure can be controlled, or a load like a push-pull gauge is applied. It is better to have a mechanism that can measure Moreover, the convex part of the whole surface can be planarized all at once by putting a fluorescent plate on a flat plate (surface plate or the like) with a protective layer facing down and pressing and rolling with a roller from above.
[0032]
(2) Sharpening FIG. 4B is a cross-sectional view showing an example of flattening by sharpening. A disk-shaped file 413 is rotated to cut and flatten the convex portion. Although it may be applied to a phosphor that cannot withstand crushing, there is a problem that shavings occur.
[0033]
(3) Cutting off FIG. 4C is a cross-sectional view showing an example of flattening by cutting off. It cut | disconnects with the blade 415 which faced like a nail clipper, and planarizes. This is effective when cutting out protrusions with a high height.
[0034]
(4) Laser processing burned off by a laser is suitable for fine processing, can be processed on the order of microns, and is currently used in semiconductor manufacturing processes. Processing accuracy varies depending on parameters such as laser irradiation time and pulse width, and the type of laser, and there are a long wavelength YAG laser, a short wavelength excimer laser, and the like. Effective processing can be performed by using properly depending on the shape and mode (splash, foreign matter) of the convex part. Further, by interlocking with the substrate inspection apparatus, the projections can be flattened fully automatically.
[0035]
FIG. 5 is a cross-sectional view showing a state after the flattening process shown in the above (1) to (4). When flattened by crushing, the result is as shown in FIG. As shown in FIG. 5A, there may be an infinite number of cracks 421 having a width of about several tens of micrometers on the surface. It is seen when the convex part is about several hundred μm.
[0036]
FIG. 5B is an example in which the protective layer does not enter the concave portion in the peripheral portion of the convex portion when forming the protective layer shown in FIG. . When the convex portion is pushed, the gap 406 that was open in FIG. 2D spreads in the lateral direction, and the gap 406 becomes narrow like the gap 422 in FIG. 5B. As an example, a gap of about 20 μm before crushing was reduced to about 4 μm by crushing. In this case, the size of the projection is about 250 μm and the height is about 40 μm. FIG.5 (c) is an example when the convex part is shaved or cut off. As shown in FIG. 5C, the portion where the phosphor 103 is cut out is exposed as shown at 423.
[0037]
The second protective layer formed on the fluorescent plate with the convex portions flattened as described above will be described below.
[0038]
<Second protective layer material>
Since the second protective layer is formed between the phosphor and the photosensor, the same conditions as the material conditions of the first protective layer (the protective layer formed immediately after the phosphor is formed) are required.
[0039]
(1) Light transmittance A material having a transmittance of about 80% or more at a wavelength λ≈400 to 700 [nm] is desirable so as not to absorb light emitted by the phosphor.
[0040]
(2) Thickness The total thickness including the first protective layer is preferably 20 μm or less, and if it is thicker than this, the resolution is significantly reduced.
[0041]
(3) Although moisture resistance is strong or weak due to the moisture-permeable phosphor, the moisture resistance is particularly weak in the case of CsI and has a deliquescent property. When CsI is used for the phosphor, the material is preferably 2.0 g / 24 h (ASTM E96-63T) or less, thereby improving the reliability.
[0042]
(4) Since the second protective layer is an interface to be bonded to the optical sensor through an adhesive, a material having good wettability is preferable. In some cases, it is also effective to improve the wettability by performing plasma treatment or corona discharge treatment.
[0043]
(5) Compatibility with the phosphor The second protective layer is a surface of the phosphor on which the first protective layer is not formed, and is in contact with the phosphor. Therefore, a material that does not affect the phosphor (dissolution, etc.) is used. Good.
[0044]
Examples of materials that satisfy the conditions described in (1) to (5) above include polyparaxylylene resins (manufactured by Three Bond, trade name Parylene), particularly polyparachloroxylylene (manufactured by the company, Trade name Parylene C), polyimide resin, acrylic resin, epoxy resin, and the like. As a film curing condition, a thermosetting type, an ultraviolet curing method, or the like can be used.
[0045]
<Second protective layer forming method>
As a method for forming the second protective layer, there is a method in which the protective layer is applied by thermal CVD, plasma CVD, spin coating or dip coating (immersion pulling method), potting (drip method), spray method (dispersing method), brushing, or the like. is there.
[0046]
The second protective layer may be formed on the entire surface of the first protective layer, but may be formed only at a location where the first protective layer is peeled off or cracked during planarization. If the number of concavo-convex portions on the phosphor surface is large and several tens or more, it is better to coat the entire surface, but if it is about several, the second protective layer may be applied with a brush or dropped with a dispenser. . In that case, care must be taken so that the height (thickness) of the second protective layer is several μm to tens of μm or less.
[0047]
It is necessary to cover the cracks generated by the planarization process and the gaps generated during the phosphor formation with the second protective layer. By performing the flattening process for both cracks and gaps, the thickness is several μm to several tens of μm. The second protective layer having a thickness of several μm to several tens of μm is formed by the above-described forming method so as to fill these. By performing such flattening treatment and formation of the second protective layer, gaps and cracks with a width of several tens of μm are filled, and moisture resistance (in the case of CsI) at the uneven portions is improved.
[0048]
An embodiment performed in view of the above points will be described below.
[0049]
(Embodiment 1)
FIG. 6 is a sectional view showing Embodiment 1 of the present invention. As shown in FIG. 6A, an amorphous carbon plate (a-C) is used as the phosphor substrate 101, aluminum (Al) is deposited as the reflective layer 102, and cesium iodide (CsI) is deposited as the phosphor 103. Parylene was formed as the first protective layer 104. Splashes on the phosphor 103 and irregularities due to foreign matters are indicated by convex portions 105.
[0050]
The thickness of the phosphor 103 was about 500 μm, and the thickness of the first protective layer 104 was about 5 μm. In this case, approximately 200 convex portions 105 having a size of about 200 to 500 μm and a height of about 30 to 70 μm were present over the entire surface. The convex portion was measured using a substrate inspection apparatus used for liquid crystal and a three-dimensional shape measuring machine using a laser. Three-dimensional shape measurement was performed. As a result, only those having a high convex portion 105 of 100 μm or more were cut with a nail clip-like double blade.
[0051]
Next, as shown in FIG. 6B, the phosphor plate 109 was placed on the surface plate 106 with the phosphor 103 surface side down, and was flattened by rolling with a roller 107 from above. By performing the flattening process as described above, the convex portion 105 in the phosphor 103 has a height of about 5 to 20 μm. Further, the gap between the concave portions around the convex portions was also about several μm. In addition, as shown in FIG. 1B, all the convex portions were simultaneously crushed by the roller 107 and the surface plate 106, so that flattening could be performed without increasing the number of steps.
[0052]
Thereafter, as shown in FIG. 6C, as the second protective layer 108, parylene, which is the same material as the first protective layer 104, is formed on the entire surface by about 10 μm by the thermal CVD method, and a gap of several μm is formed. And covered cracks from above.
[0053]
The fluorescent plate 109 that has been flattened in this manner and formed parylene as the second protective layer 108 shows discoloration even in the temperature and humidity durability test (condition 55 ° C. 90% / 750 h), even in the uneven portion. There wasn't. For comparison, a substrate not subjected to planarization was also tested at the same time, but discoloration was observed at 750 h, and deliquescence was confirmed.
[0054]
Next, as illustrated in FIG. 6D, the fluorescent plate 109 formed as described above is bonded to the optical sensor 111 using an adhesive 115. By setting the roller load and speed so that the film thickness of the adhesive 115 at the time of bonding is about 20 μm, the optical sensor 111 is not destroyed and bubbles are not mixed, and the fluorescent screen 109 is placed on the optical sensor 111. I was able to form.
[0055]
(Embodiment 2)
FIG. 7 is a sectional view showing Embodiment 2 of the present invention. The configuration of the fluorescent screen 109 is the same as that of the first embodiment. Since the number of the convex portions 105 is as small as about 20 compared to the first embodiment, as shown in FIG. 7A, only a rotating mechanism that does not use a roller and cannot be uniformly flattened by a push-pull gauge 120 is used. The surface was shaved with a file with a diameter of 0.5.
[0056]
Thereafter, as shown in FIG. 7B, a UV curable acrylic UV curable resin was dropped as a second protective layer 108 with a dispenser 122 and cured by applying a UV lamp. At that time, the time until curing was determined in consideration of the viscosity, surface tension, curing shrinkage rate, and the like of the UV curable acrylic resin so that the height of the dripped portion did not increase.
[0057]
(Embodiment 3)
There is no drawing showing this embodiment, and the configuration of the fluorescent screen 109 is the same as that of the first or second embodiment. In the third embodiment, a laser is used as means for flattening the convex portion on the phosphor surface. By adjusting the laser irradiation time, the irradiation energy, the number of times of irradiation, etc., the depth at which the convex portion is burned out can be determined, and the respective parameters are set according to the size and height of each convex portion. A convex portion is detected by the substrate inspection device, and the position coordinate data is sent to the laser repair device, and the flattening process is performed fully automatically from the size and height under the conditions suitable for each. After the flattening process, the protrusion shape is confirmed again by the substrate inspection apparatus and the three-dimensional measuring device, and it is confirmed whether or not the convex portion is flattened.
[0058]
Thus, in the case of flattening with a laser, it is possible to flatten with higher accuracy than in the first or second embodiment, and the height of the convex portion can be made to be 5 μm or less. In the third embodiment, an adhesive used for bonding to the optical sensor is also used for the second protective layer. For the second protective layer, a thermosetting acrylic resin having high light transmittance and low moisture permeability is used. For this reason, the distance between the phosphor and the optical sensor can be reduced to about 10 μm, so that a high-resolution optical sensor can be realized. (Parylene ≒ 5μm, thermosetting acrylic resin ≒ 5μm)
[0059]
(Embodiment 4)
FIG. 8 shows an application example of the above embodiment to the radiation detection system. The present embodiment is an X-ray imaging system that captures an X-ray image, and the first embodiment and the like are used as an X-ray imaging apparatus 6040. X-rays 6060 generated by an X-ray tube 6050 serving as an X-ray generation source pass through an observation portion 6062 such as a chest of a patient or a subject 6061 and enter an X-ray imaging apparatus 6040. This incident X-ray includes information inside the subject 6061. The X-ray imaging apparatus 6040 obtains electrical information by the incidence of X-rays. This information is converted into digital data, and is image-processed by an image processor 6070 as an image processing means, and can be observed on a display 6080 as a display means in a control room (control room).
[0060]
In addition, this information can be transferred to a remote place by a transmission means such as a telephone line or wireless 6090, etc., and can be diagnosed by a remote doctor by displaying it on a display 6081 in a doctor room in another place or by outputting a film or the like. It is. The obtained information can be recorded and stored in a recording medium 6110 such as an optical disk, a magneto-optical disk, a magnetic disk, or a recording medium 6110 such as a film or paper by a recording means 6100 such as a film processor.
[0061]
【The invention's effect】
As described above, according to the present invention, after forming the first protective layer, the convex portions formed on the surface of the phosphor layer are flattened by crushing or removing the second protective layer. Since the layer was formed, the optical sensor was not destroyed during bonding. By flattening the bonding surface of the phosphor, the protective layer was not broken during the bonding, and the moisture resistance and storage stability were improved.
[0062]
By flattening the bonding surface of the phosphor, the gap between the concave portions near the convex portion is narrowed, and the gap can be completely coated with the second protective layer from above, and the moisture resistance and storage stability are improved. Improved. By flattening the bonding surface of the phosphor, the thickness distribution of the adhesive after the bonding is lost, and the resolution is not deteriorated. By flattening the bonding surface of the phosphor, the flow of the adhesive at the time of bonding is improved, and bubbles generated near the convex portions are eliminated.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view for explaining a process of bonding a fluorescent plate to an optical sensor.
FIG. 2 is a cross-sectional view showing a manufacturing process of a conventional fluorescent plate.
FIG. 3 is a cross-sectional view for explaining a problem caused by a convex portion of a phosphor.
FIG. 4 is a cross-sectional view for explaining a method of flattening a convex portion of a phosphor.
FIG. 5 is a cross-sectional view showing a state after a convex portion of a phosphor is flattened.
FIG. 6 is a cross-sectional view for explaining Embodiment 1 of the present invention.
FIG. 7 is a cross-sectional view for explaining a second embodiment of the present invention.
FIG. 8 is a configuration diagram of Embodiment 4 of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 101 Phosphor substrate 102 Reflective layer 103 Phosphor layer 104 First protective layer 105 Convex part 106 Surface plate 107 Roller 108 Second protective layer 109 Fluorescent plate 110 Photosensor substrate 111 Photosensor 112 Photoelectric conversion element 113 Wiring 114 Photosensor protection Layer 115 adhesive 130 protective layer

Claims (6)

A vapor deposition step of forming a phosphor layer having a columnar crystal on the phosphor substrate by vapor deposition ;
Forming a first protective layer on the phosphor layer having the convex portion by Oite formed splash deposition process is formed plane,
A flattening step of flattening the protrusion from above the first protective layer;
After the planarization step, a step of the convex portion forms a second protective layer over the first protective layer to cover the flattened area,
A method for producing a fluorescent plate, comprising: Fluorescent plate method according to claim 1, height at after the planarization process of the convex portions is equal to or is 20μm or less. The planarization step, crushing of the convex portions, cutting, cut off, and the fluorescent plate manufacturing method according to claim 1, characterized in that according to one or more processing selected from laser irradiation. 2. The flattening step according to claim 1, further comprising a measuring step of measuring the height of the convex portion before the flattening step, and performing the flattening step based on a result obtained by the measuring step. Manufacturing method of fluorescent plate.   The method for manufacturing a fluorescent plate according to claim 1, wherein the phosphor layer contains cesium iodide as a main component. A method for manufacturing a radiation detection apparatus, comprising the step of adhering a surface side of a flattened phosphor layer of a fluorescent plate manufactured by the method for manufacturing a fluorescent plate according to claim 1 to an optical sensor substrate with an adhesive.

Images