JP4572608B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP4572608B2 JP4572608B2 JP2004204293A JP2004204293A JP4572608B2 JP 4572608 B2 JP4572608 B2 JP 4572608B2 JP 2004204293 A JP2004204293 A JP 2004204293A JP 2004204293 A JP2004204293 A JP 2004204293A JP 4572608 B2 JP4572608 B2 JP 4572608B2
- Authority
- JP
- Japan
- Prior art keywords
- motor
- workpiece
- workpiece support
- work
- tension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
(2) 回転砥石
(3) ワーク支持台
(4) ワーク支持台送り手段
(11) モータ
(12) ベルト
(13) 張力検出手段
(W) ワーク
Claims (1)
- 所定位置に保持された回転砥石によって研削されるワークを支持するワーク支持台と、ワーク支持台を移動させるワーク支持台送り手段とを備えている研削装置において、ワーク支持台は、複数のワークを支持して回転可能な円盤状とされ、ワーク支持台送り手段は、モータと、モータの駆動軸とワーク支持台とを連結してモータの駆動力をワーク支持台に伝達するベルトと、ベルトの張力を検知する張力検出手段と、張力検出手段から得られた張力値に基づいてモータの駆動力を制御するモータ制御手段とを備え、ワーク支持台をワークの被加工面に垂直な軸を中心に回転させるものであることを特徴とする研削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004204293A JP4572608B2 (ja) | 2004-07-12 | 2004-07-12 | 研削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004204293A JP4572608B2 (ja) | 2004-07-12 | 2004-07-12 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006026751A JP2006026751A (ja) | 2006-02-02 |
JP4572608B2 true JP4572608B2 (ja) | 2010-11-04 |
Family
ID=35893695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004204293A Expired - Fee Related JP4572608B2 (ja) | 2004-07-12 | 2004-07-12 | 研削装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4572608B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6202906B2 (ja) * | 2013-06-28 | 2017-09-27 | 中村留精密工業株式会社 | 研削加工装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS606335A (ja) * | 1983-06-08 | 1985-01-14 | Koyo Seiko Co Ltd | 立軸両頭研削盤の研削方法とその装置 |
JPS6094263A (ja) * | 1983-10-28 | 1985-05-27 | Hitachi Metals Ltd | 研削方法 |
JPS6391356U (ja) * | 1986-11-29 | 1988-06-13 | ||
JPH0419064A (ja) * | 1990-05-11 | 1992-01-23 | Fujitsu Ltd | ラップ加工方法 |
JP2000033557A (ja) * | 1998-07-21 | 2000-02-02 | Systemseiko Co Ltd | 研磨盤の制御方法および装置 |
JP2002036099A (ja) * | 2000-07-21 | 2002-02-05 | Fujikoshi Mach Corp | 両面研磨装置 |
JP2003071687A (ja) * | 2001-08-28 | 2003-03-12 | Daisho Seiki Kk | 平面研削方法及び平面研削盤 |
-
2004
- 2004-07-12 JP JP2004204293A patent/JP4572608B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS606335A (ja) * | 1983-06-08 | 1985-01-14 | Koyo Seiko Co Ltd | 立軸両頭研削盤の研削方法とその装置 |
JPS6094263A (ja) * | 1983-10-28 | 1985-05-27 | Hitachi Metals Ltd | 研削方法 |
JPS6391356U (ja) * | 1986-11-29 | 1988-06-13 | ||
JPH0419064A (ja) * | 1990-05-11 | 1992-01-23 | Fujitsu Ltd | ラップ加工方法 |
JP2000033557A (ja) * | 1998-07-21 | 2000-02-02 | Systemseiko Co Ltd | 研磨盤の制御方法および装置 |
JP2002036099A (ja) * | 2000-07-21 | 2002-02-05 | Fujikoshi Mach Corp | 両面研磨装置 |
JP2003071687A (ja) * | 2001-08-28 | 2003-03-12 | Daisho Seiki Kk | 平面研削方法及び平面研削盤 |
Also Published As
Publication number | Publication date |
---|---|
JP2006026751A (ja) | 2006-02-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100421223C (zh) | 半导体晶片,生产半导体晶片的装置及方法 | |
US20100006082A1 (en) | Wire slicing system | |
EP2529886B1 (en) | Lens spherical surface grinding method using dish-shaped grindstone | |
JP4921430B2 (ja) | 半導体ウェハを研削する方法 | |
JP5815150B2 (ja) | 仕上研削装置および仕上研削方法 | |
TW201417947A (zh) | 雙面磨削裝置及工件的雙面磨削方法 | |
KR20100115819A (ko) | 연마 장치, 연마 보조 장치 및 연마 방법 | |
CN105609414B (zh) | 被加工物的磨削方法 | |
US6537139B2 (en) | Apparatus and method for ELID grinding a large-diameter workpiece to produce a mirror surface finish | |
JP6457275B2 (ja) | 研削装置 | |
WO2015050218A1 (ja) | 研磨物の製造方法 | |
JP4572608B2 (ja) | 研削装置 | |
JP4797204B2 (ja) | 研削装置 | |
JP2009078326A (ja) | ウェーハ面取り装置、及びウェーハ面取り方法 | |
JP4733805B2 (ja) | 矩形部材を棒状部材に形成する加工方法および加工装置 | |
JP2000158306A (ja) | 両面研削装置 | |
JP2005262431A (ja) | 研削装置 | |
CN102101257B (zh) | 基板的端面研磨装置 | |
JP2008062364A (ja) | 研削装置 | |
JP2613081B2 (ja) | ウエハ外周部の鏡面研磨方法 | |
JP4779160B2 (ja) | 研削方法 | |
JP2005230966A (ja) | 研削装置 | |
JP2005230965A (ja) | 研削装置 | |
KR20230024207A (ko) | 드레싱 링 및 피가공물의 연삭 방법 | |
JP5777383B2 (ja) | 研磨パッド及び該研磨パッドを使用した板状物の研磨方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070629 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090220 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100420 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100528 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100706 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100802 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130827 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |