JP4560016B2 - Electronic component adjustment inspection system - Google Patents

Description

  The present invention relates to an electronic component adjustment inspection apparatus having a function of detecting an inclination angle (vertical rotation angle), such as a G sensor and an inclination sensor.

The G sensor outputs a voltage corresponding to the acceleration including the stationary acceleration, but only a voltage proportional to the stationary acceleration is output in the stationary state. Since the static acceleration becomes a beltle component of the gravitational acceleration applied to the G sensor, the inclination angle of the G sensor can be converted from the output voltage of the G sensor.

  The principle of operation of such a G sensor is due to the action of the sensor element (for example, a piezo element) inside the G sensor. However, the sensor element itself has a variation in sensitivity and a variation in mounting state (angle deviation). In order to obtain an ideal voltage characteristic with respect to the tilt angle, the G sensor attitude is in the range of 0 ° to + 270 ° under low temperature, normal temperature, and high temperature environments. Measure the voltage while tilting at an angle of 2 to 3 or more, and adjust the IC element that controls the output voltage of the G sensor based on the measured value to correct the voltage characteristic error with respect to the tilt angle. There is a need to.

  In order to adjust and inspect electronic components for detecting an inclination angle in a room temperature or temperature controlled environment, a collective adjustment inspection method is generally adopted. An example of the G sensor batch adjustment inspection method is shown below.

  An example of the collective adjustment inspection method of the G sensor is shown in FIGS. First, G sensors 1 are loaded one by one into a plurality of sockets 3 arranged in an array on the jig substrate 2.

  Next, the jig substrate 2 is mounted in the slot 4 e of the prismatic slot jig 4 installed on the horizontal table 7, and the jig substrate 2 and the measuring instrument 5 are connected by the cable 6. At this time, the bottom surface 4a and the top surface 4c of the slot jig 4 are parallel to the slot 4e, and the side surfaces 4b and 4d are perpendicular to the slot 4e.

  Next, as shown in FIG. 2, the slot jig 4 is installed so that the bottom surface 4a of the slot jig 4 is on the lower side, and this state is set to 0 ° and loaded into the socket 3 of each jig substrate 2. The voltage of the G sensor 1 is measured by the measuring instrument 5.

  Next, as shown in FIG. 3, the slot jig 4 is set so that the side surface 4b of the slot jig 4 is on the lower side, and this state is set to a 90 ° posture and loaded into the socket 3 of each jig substrate 2. The voltage of the G sensor 1 is measured by the measuring instrument 5.

  Similarly, as shown in FIGS. 4 and 5, the slot jig 4 is installed so that the upper surface 4c and the side surface 4d of the slot jig 4 are on the lower side, and this state is set to 180 ° and 270 ° to each jig substrate. The voltage of the G sensor 1 loaded in the socket 3 of 2 is measured by the measuring instrument 5.

  With the above operation, voltage characteristics with respect to tilt angles in four postures of 0 °, 90 °, 180 °, and 270 ° are measured, correction values are calculated, and writing to the IC element is performed.

  After writing to the IC element, the slot jig 4 is again installed in the order of 0 °, 90 °, 180 °, and 270 °, and the voltage of the G sensor 1 loaded in the socket 3 of each jig substrate 2 is set. Measure to see if the corrected characteristic is within the inspection standard.

  The adjustment inspection described above is performed in a room temperature environment. However, when the adjustment inspection including the temperature characteristics of the G sensor is performed, the slot jig 4 is attached to the table 7 installed in the thermostat 8 as shown in FIG. Then, the measurement of paragraphs “0007” to “0009” in the environment of low temperature, normal temperature, and high temperature is performed, and an optimum correction value is calculated from the voltage characteristics with respect to the temperature and the inclination angle, and writing to the IC element is performed.

  The batch type adjustment inspection method is as follows: (1) Angular accuracy of outer surface (bottom surface, upper surface, both side surfaces) and slot of slot jig, looseness of slot and jig substrate, warpage of jig substrate, inclination of socket with respect to jig substrate There are many error factors such as posture, and the accuracy of the inclination angle of each electronic component is lacking. (2) Since the angle of inclination is determined by the angle of the slot jig outer wall (bottom surface, top face, both side faces) and the slot, the slot jig must be remade when measuring at another angle (eg 45 °). I must. (3) It is necessary to manually change the tilt angle of the jig substrate. (4) Even if the tilt angle of the jig substrate is automatically changed, it is difficult to install the rotation mechanism in a low and high temperature environment. (5) When manually changing the tilt angle of the jig substrate in a low or high temperature environment, it is necessary to open the temperature chamber door each time the tilt angle of the jig substrate is changed. Takes a lot of time. (6) To increase production capacity, a large number of thermostats, slot jigs, jig substrates, and measuring instruments are required. (7) It takes time and effort to put electronic parts into and out of the socket. As a result, the system has become a bottleneck in improving accuracy, saving space, and improving productivity.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object thereof is to provide a method and apparatus for adjusting and inspecting an electronic component that is improved in accuracy, space-saving, and productivity.

  The above object can be achieved by the following means.

(1) In an electronic component adjustment inspection apparatus that adjusts and inspects the characteristics of an electronic component while tilting the electronic component whose inclination angle or rotation is detected at a predetermined angle, the posture of the electronic component is rotated in the vertical direction. A temperature adjustment unit that is inclined by an angle control unit and rotates together with the angle control unit is disposed in the angle control unit, and the surface of the temperature adjustment unit conveys the electronic component directly or with the electronic component. It is indirect contact through a carrier and has a structure for maintaining the temperature of the electronic component at a predetermined temperature, and the temperature control unit is a cooling / heating plate method using a Peltier element as a cooling source or a heating source, has a structure in which indirect contact via a carrier in which the electronic parts are transported directly or electronic components on the surface of the cold heating plate, the angle The control unit is provided with a contact unit that rotates together with the angle control unit, and ensures electrical connection between the electronic component and the measuring instrument via a conductive contact included in the contact unit. It has a structure for measuring electrical characteristics corresponding to the posture of the part, and the angle control unit in which the temperature adjustment unit and the contact unit are arranged is arranged by the number of temperature conditions corresponding to a plurality of temperature conditions, The plurality of angle control units perform angle control independently of each other, and the electronic component is adjusted and inspected by sequentially moving between the temperature conditions by the transport unit. Inspection device.

  (2) The angle control unit includes a vertical rotation shaft that rotates the posture of the electronic component in a vertical direction, and a rotary joint that rotates concentrically with the vertical rotation shaft is connected to the vertical rotation shaft. The electronic component adjustment inspection according to (1), wherein a cooling liquid for radiating heat generated by the temperature control unit is supplied and recovered from the outside through the rotary joint. apparatus.

  (3) The angle control unit including the temperature adjusting unit is disposed in a sealed container, and the sealed container can be filled with a dry gas. (1) or (2) ) Electronic component adjustment inspection device.

  (4) A preliminary temperature adjustment unit is provided in a pre-process of the angle control unit provided with the temperature adjustment unit, and the surface of the preliminary temperature adjustment unit conveys the electronic component directly or with the electronic component. The electronic component according to any one of the above (1) to (3), wherein the electronic component is configured to contact indirectly through a carrier so that the temperature of the electronic component approaches the temperature of the temperature control unit. Adjustment inspection equipment.

  (5) The electronic component adjustment inspection apparatus according to any one of (1) to (4), wherein the electronic component is transported by a carrier.

  (6) The carrier is configured such that a plurality of the electronic components are collectively transported to perform adjustment inspection for each unit carrier. The electronic component adjustment inspection apparatus according to any one of the above.

  (7) The angle control unit includes a vertical rotation shaft that rotates the posture of the electronic component in the vertical direction, and is placed on the angle control unit by rotating the vertical rotation shaft to an arbitrary angle. The electronic component adjustment inspection apparatus according to any one of (1) to (6), wherein the posture of the electronic component is inclined to an arbitrary angle.

(8) The electronic component adjustment / inspection apparatus according to any one of (1) to (7), wherein the conductive contact is configured to include a conductor having a spring property.

  According to the above (1) and the like, since the posture of the electronic component can be inclined to an arbitrary angle by the rotation of the angle control unit, manual work such as rolling the slot jig in the prior art becomes unnecessary. The restriction that the angle cannot be set to an arbitrary angle can be solved. In addition, since there are almost no inclusions such as slot jigs, jig substrates, and sockets between the angle control unit and the electronic component, if the assembly accuracy of the angle control unit and the rotation accuracy of the vertical rotation shaft are secured, The accuracy of the tilt angle can be increased with respect to the prior art.

  Furthermore, according to the above (1), the electrical characteristics with respect to the tilt angle can be measured by changing the posture of the electronic component while maintaining the temperature of the electronic component at low temperature, normal temperature or high temperature. Since there is no need to open the temperature chamber door or set the temperature again each time the position of the part is changed, a much more efficient work is possible.

  According to the above (2), there is no need to rotate the two hoses for supplying and recovering the cooling liquid for enhancing the heat dissipation effect of the Peltier element by pulling with the temperature control unit rotating with the vertical rotating shaft. The trouble that comes off or is damaged can be avoided. In other words, the rotary joint is designed to deliver coolant between the rotating side (inner circumference side) and the fixed side (outer circumference side), and the two hoses connected to the temperature control unit are connected to the rotary side of the rotary joint. The two hoses that rotate together with the rotating side and are connected to the coolant supply / recovery device side are connected to the fixed side of the rotary joint so that they cannot move. Do not twist.

  In addition, as described in (1) above, the temperature adjustment unit is preferably a cooling / heating plate type using a Peltier element as a cooling source and a heating source. However, if only the high temperature side is used, a ceramic heater or a cartridge heater is used as the heating source. The heated plate type is also preferable. Here, when the Peltier element is used as a cooling source and a heating source, it is preferable to perform auxiliary cooling with a cooling liquid in order to enhance the heat dissipation effect of the Peltier element.

  According to the above (3), the temperature control unit when the temperature control unit is cooled to low temperature by placing the angle control unit with the temperature control unit in the sealed container and filling the inside with the dry gas. Condensation around the area can be prevented.

  According to the above (1), instead of sequentially repeating the temperature setting and the angle setting with one angle control unit with a temperature adjustment unit, a plurality of angle control units with a temperature adjustment unit with different set temperatures (for example, Productivity can be improved by arranging the low temperature, normal temperature, and high temperature) and measuring the electrical characteristics with respect to the tilt angle in each step.

  According to the above (4), since the temperature of the electronic component can be brought close to the measurement temperature by the preliminary temperature adjustment unit, the temperature of the electronic component is reduced when the electronic component is placed on the temperature adjustment unit that performs the adjustment inspection. Time to reach the measurement temperature can be shortened.

According to the above (5), since the electronic component is transported on the carrier, troubles such as clogging that easily occur when the electronic component is transported alone can be reduced. In addition, since the adjustment inspection with the posture changed requires a considerable amount of time, a plurality of electronic components are placed on the carrier and conveyed, and the adjustment inspection is performed in units of one carrier as in (6) above. By doing so, it is possible to shorten the time required for each piece.

  The carrier is preferably a metal such as aluminum or stainless steel in the case of an adjustment inspection device in a normal temperature environment, and in the case of an adjustment inspection device in a low temperature, normal temperature, and high temperature environment, the thermal conductivity is 100 kcal / m · h. A material having a temperature of ° C or higher is preferable, and aluminum or aluminum nitride is preferable. Since aluminum has problems such as surface wear during transportation, it is preferable to perform surface treatment such as electroless nickel plating, hard alumite, and tafram.

According to the above (7), it is possible to measure the electrical characteristics of the electronic component with the posture of the electronic component tilted. Further, in the above (1) , the angle control unit is provided with a contact unit that rotates together with the angle control unit, and the conductive contact included in the contact unit places the electronic component on the electronic component mounted on the angle control unit. It is preferable to have a structure that regulates an inclination angle of the electronic component with respect to the electronic component placement surface by pressing against the placement surface. In this way, it is possible to reduce the angle error due to the floating of the electronic component when the electronic component is placed on the angle control unit, and to prevent the electronic component from dropping when tilting.

In addition, the conductive contact in the above (1) is preferably a spring-like conductor such as a contact probe, and needle-shaped or leaf-spring-shaped beryllium copper pieces, ACF (anisotropic conductive rubber), and the like are also preferable. Moreover, a socket can be arranged on the electronic component mounting surface of the angle control unit, and contact with the electronic component can be achieved by a contact of the socket.

  The angle control unit is provided with a centering unit that rotates together with the angle control unit, and the side surfaces of the electronic component that are opposed to each other are sandwiched between the contact surfaces of the centering claws of the centering unit. It is desirable to have a structure that regulates the angle of the direction. In this way, by restricting the horizontal angle of the electronic component, it is possible to reduce errors in electrical characteristics due to the inclination of the electronic component with respect to the vertical axis when the electronic component is rotated in the vertical direction.

  Still further, in the above means, the angle control unit is provided with an angle sensor that rotates together with the angle control unit, and an error between the set angle of the angle control unit and the actual angle is calculated from the measured value of the angle sensor. It is preferable that the angle control unit has a structure for feedback control of the set angle. By doing this, feedback control of the measured values of the angle sensor is performed for errors in the tilt angle of the electronic component placement surface due to the assembly accuracy and rigidity of the angle control unit, positioning errors of the motor that rotates the vertical rotation axis, etc. Can be reduced. The angle sensor is preferably a G sensor or a tilt sensor, and preferably has a higher absolute accuracy than the electronic component that is the object. If such a sensor is expensive, an angle sensor that measures the voltage characteristics with respect to temperature and angle is installed in advance, and the measurement result of the angle sensor is corrected based on the data to improve the absolute accuracy. The method is fine.

  Furthermore, in the above-mentioned means, it is preferable that a vibration-proof material is disposed in the installation portion of the angle control unit, and that vibrations from mechanisms disposed around the angle control unit are not transmitted. . A sensor that detects acceleration, such as a G sensor, detects dynamic acceleration in addition to static acceleration, so that slight vibration transmitted to the electronic component is output as a noise component. Accordingly, in this way, it is possible to perform adjustment inspection with higher accuracy by reducing vibration that affects the output of the electronic component.

  According to the invention of claim 1, since the attitude of the electronic component can be inclined to an arbitrary angle by the rotation of the angle control unit, the manual operation of rolling the slot jig in the prior art becomes unnecessary. The restriction that the angle cannot be set to an arbitrary angle can be solved. In addition, since there are almost no inclusions such as slot jigs, jig substrates, and sockets between the angle control unit and the electronic component, if the assembly accuracy of the angle control unit and the rotation accuracy of the vertical rotation shaft are secured, The accuracy of the tilt angle can be increased with respect to the prior art.

  Furthermore, according to the first aspect of the present invention, the electrical characteristics with respect to the tilt angle can be measured by changing the posture of the electronic component while maintaining the temperature of the electronic component at a low temperature, a normal temperature, or a high temperature. Since there is no need to open the temperature chamber door or set the temperature again every time the posture of the electronic component is changed, a much more efficient work is possible.

  Further, according to the invention of claim 2, there is no need to rotate the two hoses for supplying and recovering the cooling liquid for enhancing the heat dissipation effect of the Peltier element by pulling with the temperature adjusting unit rotating with the vertical rotating shaft. , Troubles where the hose is disconnected or damaged can be avoided. In other words, the rotary joint is designed to deliver coolant between the rotating side (inner circumference side) and the fixed side (outer circumference side), and the two hoses connected to the temperature control unit are connected to the rotary side of the rotary joint. The two hoses that rotate together with the rotating side and are connected to the coolant supply / recovery device side are connected to the fixed side of the rotary joint so that they cannot move. Do not twist.

  According to the invention of claim 3, the temperature control unit when the temperature control unit is cooled to low temperature by placing the angle control unit having the temperature control unit in the sealed container and filling the inside with the dry gas. Condensation around the area can be prevented.

  According to the first aspect of the present invention, instead of sequentially repeating the temperature setting and the angle setting with one angle control unit with a temperature adjustment unit, a plurality of angle control units with a temperature adjustment unit with different set temperatures (for example, Productivity can be improved by measuring the electrical characteristics with respect to the tilt angle in each step.

  According to the invention of claim 4, since the temperature of the electronic component can be brought close to the measurement temperature by the preliminary temperature adjustment unit, the temperature of the electronic component when the electronic component is placed on the temperature adjustment unit for performing the adjustment inspection. The time until the temperature reaches the measurement temperature can be shortened.

  According to the invention of claim 5, since the electronic component is carried on the carrier, troubles such as clogging that easily occur when the electronic component is carried alone can be reduced. In addition, since adjustment inspections with different postures require a considerable amount of time, a plurality of electronic components are placed on a carrier and transported, and a plurality of adjustments are performed in units of one carrier, and the required time per piece Can be shortened.

According to the invention of claim 1 , it is possible to measure the electrical characteristics of the electronic component in a state where the posture of the electronic component is inclined.

  Next, exemplary embodiments of the present invention will be described in detail with reference to the drawings.

  As Example 1 of the present invention, a G-sensor temperature angle characteristic adjustment inspection device is shown in FIGS. 7 to 9, a temperature adjustment plate 14 that is inclined at an arbitrary angle by the vertical rotation shaft 13 is attached to the outer periphery of the vertical rotation shaft 13 that is rotated by the stepping motor 9. The rotational output of the stepping motor 9 is decelerated to 1/50 by the harmonic gear 10 and is connected to the vertical rotating shaft 13 via the coupling 11. The vertical rotation shaft 13 is structured to rotate with bearings 12 provided at both ends as guides.

  The upper surface of the Peltier element 15 is attached to the lower surface of the temperature adjustment plate 14, and the lower surface of the Peltier element 15 is attached to the upper surface of the cooling unit 16 provided below the temperature adjustment plate 14. Also, a probe upper / lower cylinder 17 is disposed on the upper side of the temperature control plate 14 so that the probe plate 18 embedded with the contact probe 19 is moved up and down. Although not shown in the figure, the contact probe 19 has a DC power source supplied to the G sensor A, a DC voltmeter for measuring the output voltage of the G sensor A, and data in an IC element in the G sensor A. A write IF for writing and adjusting is connected.

  Two rotating hoses 20 are connected to the lower surface of the cooling unit 16, and the opposite side of the two rotating hoses 20 is connected to the inner peripheral side 23 of the rotary joint through the inner cavity of the vertical rotating shaft 13. Has been. Further, two fixed-side hoses 21 are connected to the rotary joint outer peripheral side 22. The rotary joint inner peripheral side 23 is connected to the vertical rotary shaft 13 and is configured to rotate with a bearing 24 provided in the middle of the rotary joint outer peripheral side 22 as a guide. The Peltier element 15 is configured to dissipate heat stored therein by the coolant supplied / recovered to the cooling unit 16 to improve the cooling efficiency.

  Two fixed-side hoses 21 connected to the rotary joint outer peripheral side 22 are connected to an auxiliary cooling device (chiller device) installed outside, and the coolant supplied and recovered from the auxiliary cooling device is fixed-side hose. 21 → Rotary joint outer peripheral side 22 → Coolant passage 25 → Rotary joint inner peripheral side 23 → Rotary hose 20 → Cooling unit 16

  The above rotation measuring unit is installed on the upper unit base 26, and the unit base 26 is installed on the lower unit base 27 via a vibration isolating rubber 28.

  Next, the operation of the first embodiment will be described. First, the current control of the Peltier element 15 is performed so that the surface temperature of the temperature adjustment plate 14 becomes a low temperature (for example, −30 ° C.).

  Next, the vertical rotation shaft 13 is rotated by the rotation of the stepping motor 9 so that the upper surface of the temperature adjustment plate 14 has an inclination angle of 0 ° (horizontal upward). Here, the G sensor A is placed on the temperature adjustment plate 14 so that the terminal surface faces upward, the probe plate 18 is lowered by the probe upper and lower cylinders 17, and the contact probe 19 is connected to the terminal of the G sensor A. At this time, the G sensor A is pressed against and fixed to the upper surface of the temperature adjustment plate 14 by the spring pressure of the contact probe 19. When the above preparation is completed, a DC power source is applied to the G sensor via the contact probe 19 and the adjustment inspection is started.

  First, the output voltage of the G sensor A at 0 ° (horizontal and upward state) is measured with a DC voltmeter. Next, the vertical rotation shaft 13 is rotated, and the output voltage of the G sensor A is measured with a DC voltmeter so that the upper surface of the temperature adjustment plate 14 has an inclination angle of 90 ° (vertical state). Next, the vertical rotation shaft 13 is rotated, and the output voltage of the G sensor A is measured with a DC voltmeter so that the upper surface of the temperature adjustment plate 14 has an inclination angle of 180 ° (horizontal and downward). Further, the output voltage of the G sensor A is measured with a DC voltmeter by rotating the vertical rotation shaft 13 so that the upper surface of the temperature adjustment plate 14 has an inclination angle of 270 ° (vertical and opposite to 90 °). To do. When the above measurement is completed, the upper surface of the temperature control plate 14 is returned to 0 °.

  Next, the current control of the Peltier element 15 is performed so that the surface temperature of the temperature adjustment plate 14 becomes normal temperature (around 25 ° C.). When the temperature is stabilized, the output voltage of the G sensor A at 0 °, 90 °, 180 °, and 270 ° is measured by the procedure of paragraph “0058”.

  Next, the current control of the Peltier element 15 is performed so that the surface temperature of the temperature adjustment plate 14 becomes high (for example, + 85 ° C.). When the temperature is stabilized, the output voltage of the G sensor A at 0 °, 90 °, 180 °, and 270 ° is measured by the procedure of paragraph “0058”.

  When the above operations are completed, an optimal correction value is calculated from the voltage characteristics with respect to temperature and angle, and writing to the IC element inside the G sensor A is performed.

  During the series of operations described above, the G sensor A is pressed against the temperature control plate by the contact probe 19 and fixed, and is placed in a constantly temperature-controlled environment and tilts. It is not necessary to intervene the operator's hand to re-change.

  Next, as Example 2, FIGS. 10 to 14 show a continuous temperature angle characteristic adjustment inspection apparatus for the G sensor. In FIG. 10, a low temperature adjustment inspection unit 29, a normal temperature adjustment inspection unit 30, and a high temperature adjustment inspection unit 31 are arranged inside the sealed container 37. A preliminary temperature adjustment unit 35 is disposed on the right side of the rotation measuring unit 32 of each of the adjustment inspection units 29 to 31, and an inlet conveyor is disposed further on the right side of the preliminary temperature adjustment unit 35 disposed on the right side of the low temperature adjustment inspection unit 29. 33 is disposed, and an outlet conveyor 34 is disposed on the left side of the rotation measurement unit 32 of the high temperature adjustment inspection unit 31. Between the entrance conveyor 33 and the exit conveyor 34, a right-to-left flow in-line conveyance is used, and the G sensor A is supplied and collected by the carrier B. A transport unit 36 is disposed on the front side of the transport line.

  A conveyance window through which the carrier B passes is provided at the entrance / exit of the sealed container 37, and the internal airtightness is maintained by closing the shutter 39. A dry gas inlet 38 for filling with dry gas is provided inside the sealed container 37.

  Each adjustment inspection part 29-31 has the same structure as FIGS. 7-9, and the carrier B carrying G sensor A is placed on the upper surface of the temperature adjustment plate 14 as shown in FIG. ing. Further, a centering claw 41 that is opened and closed by a cylinder is arranged on the upper side of the temperature control plate 14 so that the side surface of the G sensor A on the carrier is sandwiched from the front and rear. Note that the centering claw 41 is processed on both sides of the carrier B so that the centering claw 41 sandwiches the side surface of the G sensor A.

  Next, the operation of the second embodiment will be described. First, with the shutter 39 at the doorway closed, a dry gas for preventing condensation is filled into the sealed container 37 from the dry gas inlet 38. When the dry gas is filled, the current control of the Peltier element 15 is performed so that the surface temperature of the temperature adjustment plate 14 of the low-temperature adjustment inspection unit 29 is low (for example, −30 ° C.). Similarly, the normal temperature adjustment inspection unit 30 is set to normal temperature (around 25 ° C.), and the high temperature adjustment inspection unit 31 is set to high temperature (for example, + 85 ° C.). In addition, the preliminary temperature adjustment unit 35 disposed on the right side of each of the adjustment inspection units 29 to 31 is set to the same temperature as the adjustment inspection unit on the left side (the rear side in the transport direction).

  Next, it waits so that the upper surface of the temperature control plate 14 of each adjustment test | inspection part 29-30 may become an inclination angle of 0 degree (horizontal upward state).

  When the above preparation is completed, the carrier B on which five G sensors A are mounted on the entrance conveyor 33 so that the terminal surface faces upward is loaded, the shutter 39 is opened and closed, and the carrier B is loaded into the sealed container 37. .

  Next, the carrier unit 36 is slid forward and backward to sequentially feed the carrier B from right to left.

  Three carriers B are placed on the preliminary temperature adjustment plate 35, and the temperature of the carrier B and the G sensor A is adjusted during the adjustment inspection time for three carriers in the adjustment inspection unit. At or near the temperature of.

  When the carrier B is sent to the rotation measurement unit 32 of each of the adjustment inspection units 29 to 31, the centering claw 41 is closed and the side surface of the G sensor A on the carrier B is sandwiched as shown in FIG. To be Next, the probe plate 18 is lowered by the probe upper / lower cylinder 17 to connect the contact probe 19 to the terminal of the G sensor A. At this time, the G sensor A is pressed and fixed to the carrier B by the spring pressure of the contact probe 19, and the carrier B is pressed and fixed to the upper surface of the temperature adjustment plate 14 by the contact probe 19 and the positioning pin 42. When the above preparation is completed, a DC power source is applied to the five G sensors via the contact probe 19 to start adjustment inspection.

  First, the output voltages of the five G sensors A at 0 ° (horizontal and upward state) are measured with a DC voltmeter. Next, the output voltages of the five G sensors A are measured with a DC voltmeter so that the upper surface of the temperature control plate 14 has an inclination angle of 90 ° (vertical state). Next, the output voltages of the five G sensors A are measured with a DC voltmeter so that the upper surface of the temperature control plate 14 has an inclination angle of 180 ° (horizontal and downward state). Further, the output voltages of the five G sensors A are measured with a DC voltmeter so that the upper surface of the temperature control plate 14 has an inclination angle of 270 ° (vertical and opposite to 90 °). When the above measurement is completed, the upper surface of the temperature control plate 14 is returned to 0 °.

  The operations of the above paragraphs “0070” to “0072” are repeated to perform measurement at low temperature, normal temperature, and high temperature. Finally, the high temperature adjustment inspection unit 31 calculates an optimum correction value from the voltage characteristics with respect to temperature and angle, and G Write to the IC element inside the sensor A.

  When the operation of the high temperature adjustment inspection unit 31 is completed, the shutter 39 on the outlet side is opened and closed, and the carrier B is carried out by the outlet conveyor 34.

  As described above, the G sensor A supply, temperature setting, angle characteristic measurement, and recovery operations are performed in parallel. Therefore, the adjustment inspection time for each G sensor (the time interval / time at which the carrier B is unloaded) 5) can be processed in a short time regardless of the number of measurement temperatures (low temperature, normal temperature, and high temperature in the embodiment). Further, since the inefficient manual work as in the conventional example is unnecessary, the productivity is high, and the number of installations for increasing the same production number can be reduced.

  In the second embodiment, five G sensors A are mounted on the carrier B. In addition to increasing this number, voltage measurement and writing to the IC element are performed in parallel, so that an adjustment inspection per G sensor is performed. It is possible to further shorten the time (time interval at which the carrier B is carried out / 5).

  Further, in the second embodiment, as in the first embodiment, each adjustment inspection unit 29 to 31 is subjected to vibration countermeasures using vibration-proof rubber, and thus occurs when a rotation operation is performed by another adjustment inspection unit during measurement. It is possible to reduce voltage noise due to slight vibrations and improve measurement accuracy.

  Next, as a third embodiment, a normal temperature angle characteristic inspection apparatus for a G sensor is shown in FIG. In FIG. 15, the G sensor A is placed on the upper surface of the room temperature plate 44 instead of the temperature control plate, and measurement is performed. Such a simple configuration can be used in the final inspection at normal temperature after adjusting the temperature angle characteristics. In the third embodiment, the angle sensor 43 embedded in the room temperature plate 44 measures the inclination angle of the room temperature plate and feeds back an error from the set angle to the rotation angle of the stepping motor to correct the angle. Such an angle sensor 43 can be applied to the temperature angle adjustment inspection apparatus as in the first and second embodiments, and is effective as a means for improving the accuracy of the inclination angle.

  Next, as Example 4, a room temperature angle characteristic inspection apparatus for a G sensor is shown in FIG. In FIG. 16, the G sensor A is loaded into the socket 45 disposed on the room temperature plate 44 and measurement is performed. Since the G sensor A is held by the socket even while it is tilted, it can be measured without falling. Although there is an error factor for the tilt angle such as the socket tilt, there is an advantage that the mechanism is simpler than the probe type.

  According to the present invention, it is possible to change the attitude of the electronic component while maintaining the temperature of the electronic component at a low temperature, normal temperature or high temperature, and measure the electrical characteristics with respect to the inclination angle. Since there is no need to open the temperature chamber door or set the temperature again each time it is changed, a much more efficient work is possible.

A perspective view of a collective adjustment inspection apparatus for explaining the configuration of the prior art Operation explanatory diagram of the collective adjustment inspection device explaining the configuration of the prior art Operation explanatory diagram of the collective adjustment inspection device explaining the configuration of the prior art Operation explanatory diagram of the collective adjustment inspection device explaining the configuration of the prior art Operation explanatory diagram of the collective adjustment inspection device explaining the configuration of the prior art Perspective view of a batch type temperature characteristic adjustment inspection device explaining the configuration of the prior art Top surface sectional view for explaining the configuration of Example 1 Side surface sectional drawing explaining the structure of Example 1 Front sectional view of a measuring part for explaining the configuration of Example 1 Top surface sectional view for explaining the configuration of Example 2 The top view of the carrier B explaining the structure of Example 2 Sectional drawing of the carrier B explaining the structure of Example 2 Side surface sectional drawing of the measurement part explaining the structure of Example 2 Operation explanatory diagram of the centering unit for explaining the configuration of the second embodiment Side surface sectional drawing explaining the structure of Example 3 Cross-sectional top view illustrating the configuration of Example 4

A ... G sensor B ... Carrier 1 ... G sensor 2 ... Jig substrate 3 ... Socket 4 ... Slot jig 4a ... Slot jig bottom surface 4b ... Slot jig Side surface 4c: Slot jig bottom top surface 4d: Slot jig side surface 4e ... Slot 5 ... Measuring instrument 6 ... Cable 7 ... Table 8 ... Constant temperature bath 9 ... Stepping motor 10 ... Harmonic gear 11 ... Coupling 12 ... Bearing 13 ... Vertical rotating shaft 14 ... Temperature control plate 15 ... Peltier element 16 ... Cooling unit 17 ... Probe Upper cylinder 18 ... Probe plate 19 ... Contact probe 20 ... Rotating side hose 21 ... Fixed side hose 22 ... Outer side of rotary joint 23 ... Low Inner circumferential side of Lie joint 24 ... Bearing 25 ... Coolant passage 26 ... Upper unit base 27 ... Lower unit base 28 ... Anti-vibration rubber 29 ... Low temperature adjustment inspection part 30 ... Normal temperature adjustment inspection unit 31 ... High temperature adjustment inspection unit 32 ... Rotation measurement unit 33 ... Inlet conveyor 34 ... Outlet conveyor 35 ... Preliminary temperature adjustment unit 36 ... Transport unit 37 ... Sealed Container 38 ... Dry gas inlet 39 ... Shutter 40 ... Centering claw relief groove 41 ... Centering claw 42 ... Positioning pin 43 ... Angle sensor 44 ... Room temperature plate 45 ... socket

Claims (8)

In an electronic component adjustment inspection apparatus for adjusting and inspecting the characteristics of an electronic component in a state in which the posture of the electronic component for detecting an inclination angle or rotation is inclined at a predetermined angle, an angle control unit that rotates the posture of the electronic component in a vertical direction Inclined at
The angle control unit is provided with a temperature adjustment unit that rotates together with the angle control unit, and the surface of the temperature adjustment unit is in direct contact with the electronic component or indirectly through a carrier that carries the electronic component. And the temperature of the electronic component is maintained at a predetermined temperature,
The temperature control unit is a cooling / heating plate type using a Peltier element as a cooling source or a heating source, and the electronic component is directly on the surface of the cooling / heating plate or indirectly via a carrier for transporting the electronic component. It has a structure to contact,
A contact unit that rotates together with the angle control unit is disposed in the angle control unit, and an electrical connection between the electronic component and the measuring instrument is ensured through a conductive contact included in the contact unit, It has a structure that measures electrical characteristics corresponding to the posture of the electronic component,
The angle control unit including the temperature adjusting unit and the contact unit is arranged in the number corresponding to a plurality of temperature conditions, and the plurality of angle control units perform angle control independently of each other. The electronic component adjustment inspection apparatus is characterized in that the electronic component is moved and inspected in order between the temperature conditions by the transport unit .   The angle control unit includes a vertical rotation shaft that rotates the posture of the electronic component in a vertical direction, and a rotary joint that rotates concentrically with the vertical rotation shaft is connected to the vertical rotation shaft, 2. The electronic component adjustment and inspection device according to claim 1, wherein a cooling liquid for radiating heat generated by the temperature control unit is supplied and recovered from the outside through a rotary joint.   3. The electronic component according to claim 1, wherein the angle control unit including the temperature control unit is disposed in a sealed container, and the sealed container can be filled with a dry gas. Adjustment inspection equipment.   A preliminary temperature control unit is disposed in a previous process of the angle control unit in which the temperature control unit is disposed, and the surface of the preliminary temperature control unit is directly connected to the electronic component or via a carrier that transports the electronic component. 4. The electronic component adjustment inspection apparatus according to claim 1, wherein the electronic component adjustment inspection device is configured to indirectly contact the electronic component and bring the temperature of the electronic component close to the temperature of the temperature adjustment unit. 5.   5. The electronic component adjustment inspection apparatus according to claim 1, wherein the electronic component is transported by a carrier.   6. The structure according to claim 1, wherein a plurality of the electronic components are collectively conveyed to perform adjustment inspection for each unit carrier. 7. Electronic component adjustment inspection equipment.   The angle control unit includes a vertical rotation shaft that rotates the posture of the electronic component in the vertical direction, and the vertical control shaft is rotated at an arbitrary angle, thereby placing the electronic component on the angle control unit. The electronic component adjustment inspection apparatus according to claim 1, wherein the electronic component has a structure in which the posture of the electronic component is inclined at an arbitrary angle. The conductive contacts are adjustment test apparatus for electronic components according to any one of claims 1 to 7, characterized in that it is configured with a conductor having a spring property.

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