JP4537974B2 - Component mounter - Google Patents

Description

  The present invention relates to a component mounter for mounting components such as semiconductor elements on a substrate by a flip chip mounting method.

  Conventionally, with the circuit surface of a component such as a semiconductor element facing down, bumps formed of solder, gold, etc. arranged on the electrode on the circuit surface are connected to the electrode of the substrate, and the electrical connection between the component and the substrate is made There are implementation methods to do.

  This mounting method is called a flip chip mounting method, and as a method of adopting the flip chip mounting method, for example, there is a method called C4 (Controlled Collapse Chip Connection).

  FIG. 18 is a process diagram showing a process of the C4 method. As shown in FIG. 18, in the C4 method, precoated solder is formed on the electrodes of the substrate, and solder bumps are formed on the components. Also, the component is mounted on the substrate by temporarily bonding the solder and the bump on the electrode of the substrate to which the flux is applied.

  Further, the component and the substrate are joined by heating and melting the solder by reflow, and thereafter, an adhesive that is a thermosetting resin is filled between the component and the substrate. That is, the space between the component and the substrate is sealed.

  In this state, heat is applied again, and the adhesive is cured, so that the component is fixed to the substrate, and the bonding reliability between the component and the substrate is improved. This adhesive is also referred to as underfill or underfill agent.

FIG. 19 is a diagram illustrating a state where the adhesive is filled between the component and the substrate.
The filling of the adhesive is performed by allowing the adhesive poured from the peripheral edge of the component to permeate between the component and the substrate by capillary action. Therefore, when a plurality of components are mixedly mounted on the substrate, as shown in FIG. 19A, components other than the components to be filled with the adhesive (in the drawing, represented by a rectangle with dots) There is a possibility that the adhesive will adhere to the surface.

  Therefore, in the C4 construction method, as shown in FIG. 19B, each part has a certain degree to secure an area for pouring the adhesive and to prevent adhesion of the adhesive to other parts. It will be arrange | positioned on a board | substrate at intervals of.

  In addition, a technique related to a construction method in which an adhesive is applied to a substrate instead of a component and the component is mounted on the substrate is also disclosed (for example, see Patent Document 1).

  FIG. 20 is a process diagram showing a process of a method of applying an adhesive to a substrate and mounting a component on the substrate.

  According to this construction method, (1) an adhesive is applied to a substrate, (2) a surface on which a bump of a component exists (hereinafter referred to as “bump surface”) is directed downward, and the component and the substrate are pressure-bonded. . Thereafter, the component is heated and fixed to the substrate.

  In this construction method, when unevenness exists on the surface of the adhesive applied to the substrate, bubbles may be generated between the adhesive and the component as shown in FIG. In addition, there are cases where the generated bubbles are heated in a state where many bubbles remain without being escaped to the outside.

  In such a case, heating is performed while applying a force from above the component in order to prevent the component from being lifted due to thermal expansion of bubbles.

  Also, in this construction method, when an amount of adhesive suitable for fixing the component to the substrate is applied to the substrate with a width (W1) equivalent to the width of the component, for example, as shown in FIG. The adhesive may not spread to the peripheral part of the later part.

  Therefore, by applying a slightly larger amount of adhesive to the substrate with a width (W2) wider than the width of the component, as shown in FIG. It is possible to spread the adhesive until the component is stably fixed to the substrate.

  In addition, a technique related to a method of applying an adhesive to a wafer on which bumps are formed and mounting a component cut out from the wafer on a substrate is also disclosed (for example, see Patent Document 2).

  FIG. 23 is a process diagram showing a process of a method of mounting a component cut out from a wafer coated with an adhesive on a substrate.

  In this construction method, there is a step of cutting a semiconductor element, which is a component to be mounted on a substrate, from the wafer and transferring it to a component mounting machine, so that the adhesive applied to the wafer is solid at room temperature.

  Therefore, in order to ensure the bonding between the component bump and the substrate when the component is bonded to the substrate, (1) when the adhesive is applied to the surface of the wafer having the bump, the tip of the bump is the adhesive. Adhesive is applied so that it will not be buried. Specifically, since the height of individual bumps on the wafer varies, the adhesive is applied almost uniformly at a height (h) lower than the lowest bump height (H).

  The component obtained by making the wafer smaller is (2) the bump surface is directed to the substrate, and (3) the component and the substrate are pressure-bonded. Thereafter, the component is fixed to the substrate by heating.

The component is mounted on the substrate also by a method having such steps.
Japanese Patent No. 2830852 JP 2000-223602 A

  In the C4 method, which is the first prior art described above, the substrate on which the components are mounted needs to be heated twice in order to dissolve the solder and cure the adhesive as described above. In this case, there is a high possibility that the parts are damaged by heat. That is, these two heatings cause the reliability of the parts to deteriorate.

  In recent years, high-density component mounting is desired in order to reduce the size and improve the functions of electronic devices. However, in the above-described C4 method, as described with reference to FIG. 19B, it is necessary to secure a certain interval between components, and it is difficult to realize high-density component mounting.

  Furthermore, since the adhesive is infiltrated using the capillary phenomenon in the gap between the component and the substrate, there is also a problem that it takes time to infiltrate, especially when the number of bumps is large.

  In addition, since the adhesive is poured from one side or two adjacent sides so that no bubbles remain in the adhesive, there is a problem that the adhesive may not evenly permeate between the component and the substrate. . For this reason, not only the fixing force of the component to the substrate by the adhesive decreases, but also, for example, the heat distribution of the component and the substrate is biased during heating for curing the adhesive, and the component or the substrate is deformed by thermal stress. There is also the possibility that the parts will be destroyed by

  Further, in the second conventional technique, which is a method of mounting a component on a substrate coated with an adhesive, as described above, in the heating process, heating is not performed but the component is applied from above. It is necessary to heat with pressure.

  Furthermore, when air bubbles remain between the adhesive and the component as shown in FIG. 21, a voltage is applied by using a substrate on which a component such as a semiconductor element is mounted in a product or an apparatus during heating in the manufacturing process. When a component such as a semiconductor element suddenly generates heat by application, bubbles may be thermally expanded, resulting in destruction of the component or connection failure due to lifting of the component.

  Furthermore, in order to increase the certainty of fixing the component to the substrate, it is necessary to make the width of application of the adhesive to the substrate somewhat wider than the width of the component. Therefore, similarly to the C4 method, there is a problem that it is difficult to realize high-density component mounting.

  Further, in the above-described third conventional technique, in which the adhesive is applied at the wafer stage, as described above, the thickness of the adhesive is substantially constant, and the surface of the adhesive and the substrate are The components are pressed onto the substrate in a substantially parallel state. Therefore, the air that existed between the adhesive and the substrate at the time of pressure bonding is difficult to escape, and the adhesive may be cured in a state in which many bubbles remain between the adhesive and the substrate.

  For this reason, when a component such as a semiconductor element is heated in a manufacturing process or when a voltage is applied using a substrate on which a component such as a semiconductor element is mounted in a product or apparatus, a large number of remaining components As a result of the thermal expansion of the bubbles, there is a case where the parts are broken or the connection is poor due to the parts being lifted.

  Further, when the wafer is cut into individual semiconductor elements, that is, when dicing, the dicing blade is water-cooled with water or the like, so that foreign matter may be mixed in the adhesive.

  In addition, since it takes a certain amount of time from the application of the adhesive to the wafer to the mounting of the semiconductor element cut out from the wafer to the substrate, there is a high possibility that foreign matter will adhere to the surface of the adhesive.

  In these cases, the adhesive is cured in a state where the foreign matter is mixed or adhered to the adhesive, and for example, a gap is formed around the foreign matter. As a result, when the adhesive is heated, thermal stress concentrates around the gap, and problems such as thermal breakdown of the parts may occur.

  Further, the possibility that the fixing force of the component to the substrate by the adhesive is reduced due to the mixing of the foreign substance into the adhesive is increased.

  Furthermore, in order to improve the thermal expansion coefficient and thermal conductivity of the adhesive, inorganic powders such as various metals and silica may be put into the adhesive. In this case, the fluidity of the adhesive is deteriorated, and the adhesive is hardened in a state where a gap is formed between the tip end of the bump of the component and the substrate, and connection failure may occur.

  In consideration of the above problems, the present invention is a component mounter that adopts a flip chip mounting method, and realizes high-density component mounting while ensuring sufficient fixing force of the component to the substrate through an efficient process. An object of the present invention is to provide a component mounting machine.

  In order to achieve the above object, a component mounter of the present invention is a component mounter that mounts a component having a bump as a terminal for connecting to a substrate on the substrate, and is a bump that is a surface having the bump of the component. With the surface facing upward, an application means for applying an adhesive to the bump surface for each component from above, an inversion means for inverting the component applied with the adhesive by the application means, and an inversion means Mounting means for mounting the inverted component on a substrate located under the component.

  As described above, the component mounter of the present invention applies the adhesive from the bump surface of the component, reverses it, and mounts it on the substrate. In other words, when the adhesive is applied to the bump surface and when the component is mounted on the substrate, the adhesive contacts the bump surface and the surface of the substrate in a convex downward shape, so that the vicinity of the center of the bump surface It spreads while extruding air in the outward direction. During this expansion, the gravity acting on the adhesive effectively acts as a force that pushes air outward. Therefore, the remaining of bubbles can be suppressed both between the adhesive and the component and between the adhesive and the substrate.

  Further, an adhesive can be applied to each component, and the component to which the adhesive has been applied can be immediately mounted on the substrate. Thereby, for example, the possibility of adhesion and mixing of foreign matters to the adhesive can be reduced.

  Furthermore, since the adhesive is applied to the bump surface and mounted on the substrate, it is possible to prevent the adhesive from spreading outside the component. Further, it is not necessary to secure an area between components for applying the adhesive on the substrate. Therefore, the component can be stably fixed to the substrate with a minimum amount necessary for fixing the component to the substrate, and high-density component mounting is possible.

  Further, the material of at least one of the bump and the electrode of the substrate bonded to the bump is solder, and the component mounter further includes the adhesive and the adhesive after the component is mounted on the substrate by the mounting means. It is good also as providing the heating means which joins the said components and the said board | substrate by hardening the said adhesive agent and melt | dissolving the said solder by heating a solder simultaneously.

  Thereby, it is not necessary to perform reflow of a solder and hardening of an adhesive agent by a separate heating process, and it can carry out by one heating process.

  Further, the mounting means is a nozzle for mounting the sucked component on the substrate, and the reversing means further makes the bump surface of the component upward by turning the nozzle sucking the component upward, After the adhesive is applied to the bump surface by the applying unit, the component may be turned upside down by turning the nozzle downward, and the component mounter includes two nozzles. The first nozzle and the second nozzle have a positional relationship in which one of the nozzles is directed upward by the reversing means and the other nozzle is directed downwards. The application means applies the adhesive to the bump surface of the first component adsorbed by the first nozzle, and then applies the second nozzle that is turned upward by the inversion means. The adhesive is applied to the bump surface of the second component that is attached, and the reversing means applies the adhesive to the bump surface of the second component, and the first nozzle causes the first nozzle to apply the adhesive. After the first component is mounted on the substrate, the second nozzle may be directed downward.

Thereby, a plurality of component mounting boards can be sequentially produced more efficiently.
In addition, the component mounter of the present invention further detects that the shape of the adhesive applied to the bump surface has become a predetermined shape after the application of the adhesive is started by the application means. When it is detected by the detection means and the detection means that the shape of the adhesive has a predetermined shape, the application means may include an application amount control means for stopping the application of the adhesive. Alternatively, the detection means detects that the height of the adhesive has reached a predetermined height, and the application amount control means causes the height of the adhesive to reach a predetermined height by the detection means. When this is detected, the application means may stop the application of the adhesive.

  As described above, the amount of the adhesive applied to the component can be controlled based on the state of application of the adhesive, not by the amount of application itself.

  Further, the adhesive applied to the bump surface may have a viscosity that prevents the adhesive from dropping from the bump surface and wettability to the bump surface when the bump surface faces downward, The viscosity may be a value included in the range of 0.001 Pa · s to 200 Pa · s.

  Thereby, various adhesives can be used, for example, it is not necessary to prepare a special adhesive and an expensive adhesive. That is, it is possible to economically mount the component on the board.

  In addition, the component mounting machine of the present invention further reduces the viscosity of the adhesive or cools the adhesive by heating the adhesive before the component is mounted on the substrate by the mounting means. Adjustment means for improving the viscosity may be provided.

  Thereby, for example, the viscosity of the adhesive can be adjusted in accordance with the temperature around the component mounting machine. That is, even when the environment such as the ambient temperature changes, the operation of the component mounting machine can be continued while absorbing the change in the environment such as the temperature without replacing the adhesive.

  In addition, the component mounting machine of the present invention further applies atmospheric pressure plasma to the bump surface before the adhesive is applied to the bump surface by the applying means, so that the bump surface is applied to the adhesive. Plasma processing means for improving the affinity may be provided.

  Thereby, the affinity with respect to the adhesive agent of a bump surface can be improved, and an adhesive agent can be made to spread easily on a bump surface. That is, the plasma processing unit can contribute to stable fixing of components.

  Furthermore, the present invention can be realized as a method in which the operations performed by the characteristic components in the component mounter of the present invention are steps, or can be realized as a program including those steps, or a CD- on which the program is stored. It can be realized as a storage medium such as a ROM or an integrated circuit. The program can also be distributed via a transmission medium such as a communication network.

  According to the present invention, a component can be stably fixed to a substrate with a minimum amount of adhesive. Further, it is not necessary to secure an area for applying the adhesive between the components, and the adhesive does not unnecessarily protrude from the components. Therefore, high-density component mounting is possible. Moreover, there are many types of adhesives that can be used, and solder reflow and adhesive curing can be performed in a single heating step. That is, it is possible to mount components efficiently in terms of cost and time.

  As described above, the present invention can provide a component mounting machine for realizing high-density component mounting while sufficiently securing the fixing force of the component to the substrate by an efficient process.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, the configuration of the component mounter 1 according to the embodiment will be described with reference to FIGS. 1 and 2.

FIG. 1 is a perspective view showing an overview of a component mounter 1 according to an embodiment.
A component mounter 1 shown in FIG. 1 is a component mounter that mounts components such as semiconductor elements on a substrate by a flip chip mounting method.

  The component mounter 1 includes a transfer unit 2, a beam 9, a component supply unit 22, a conveyor 30, and a thermocompression bonding head 40.

  The beam 9 is a component that moves in the X-axis direction and moves the transfer unit 2 in the Y-axis direction.

  The transfer unit 2 is a component that performs component adsorption and mounting on a substrate, and includes a head 4 to which two nozzles 3 are attached, a moving table 6, an application unit 5, and a tank 5a.

  The nozzle 3 is an example of a mounting unit in the component mounter of the present invention, and is a component that performs suction of the component 20 and mounting of the sucked component 20 on the substrate 23.

  The two nozzles 3 are attached to the head 4 in opposite directions and are in a positional relationship in which one nozzle 3 is directed upward and the other nozzle 3 is directed downward. Also, operations such as suction of the components 20 can be performed alternately. The nozzle 3 moves in parallel to the Z-axis direction with respect to the head 4, thereby sucking the component 20 from the component supply unit 22 and mounting the component 20 on the substrate 23.

  The moving table 6 is attached to the beam 9 so as to be movable in parallel to the beam 9 in the Y-axis direction. In addition, a head 4, an application unit 5, and a tank 5 a are attached to the movable table 6. The movable table 6 has a function of inverting the head 4 around the θ axis.

  The application unit 5 is a component that applies an adhesive to the component 20 that is sucked and inverted by the nozzle 3. The adhesive is replenished from the tank 5a.

  With this configuration, the head 4 can move on the XY plane and can be reversed about the θ axis. The nozzle 3 moves and reverses as the head 4 moves and reverses.

  The component supply unit 22 is a component that supplies the component 20 to the transfer unit 2. A plurality of components 20 are placed on the component supply unit 22 with their bump surfaces facing downward.

  The conveyor 30 is a component that transfers the substrate 23 on which components are to be mounted. When the component 20 is mounted by the transfer unit 2, the substrate 23 is transferred below the thermocompression bonding head 40 by the conveyor 30.

  The thermocompression bonding head 40 is a component that pressurizes and heats the component 20 mounted on the substrate 23. The heating is specifically applied to the adhesive and the solder constituting at least one of the bumps of the component 20 and the precoat portion 24 formed on the electrodes of the substrate 23.

  By this pressurization and heating, the solder is melted, and the electrode on the component 20 and the electrode on the substrate 23 corresponding to the electrode are joined through the solder.

  Further, along with this bonding, the adhesive applied to the component 20 is cured by the application unit 5 described later, and the component is fixed to the substrate.

  In the present embodiment, the adhesive applied to the component by the application unit 5 has a viscosity and wettability that does not drop from the component when applied to the component and reversed.

  Specifically, the viscosity of the adhesive used in the component mounting machine 1 of the present embodiment may be a value included in the range of 0.001 Pascal second (Pa · s) to 200 Pa · s.

  Furthermore, if the viscosity is in the range of 0.1 Pa · s to 3 Pa · s, it is more suitable as an adhesive used for the component mounting machine 1. Furthermore, if it exists in the range of 0.5 Pa.s-1 Pa.s, it is optimal as an adhesive agent used for the component mounting machine 1. FIG.

  As for the wettability of the adhesive, it suffices if the contact angle between the adhesive and the bump surface is 90 degrees or less when the adhesive is dropped on the bump surface.

  Examples of the thermosetting resin that is optimal as an adhesive used in the component mounting machine 1 include an epoxy resin.

  Thus, if it is a thermosetting resin having a viscosity within the range of at least 0.001 Pa · s to 200 Pa · s, it can be used in the component mounting machine 1 as an adhesive for fixing the component to the substrate. . In other words, the component mounter 1 can use various types of thermosetting resins as adhesives, thereby suppressing generation of wasteful costs.

  FIG. 2 is a functional block diagram illustrating an outline of a functional configuration of the component mounter 1. In FIG. 2, the components originally provided in the component mounter such as the component supply unit 22 are omitted, and the characteristic configurations of the present invention are illustrated and described. Since the two nozzles 3 are functionally the same, only the one nozzle 3 is shown and described.

  As shown in FIG. 2, the beam 9, the coating unit 5, the moving table 6, the conveyor 30, and the thermocompression bonding head 40 are controlled by the mounting control unit 10. Further, operations such as suction of the components of the nozzle 3 are also controlled by the mounting control unit 10 via the movable table 6.

  In addition, the movable table 6 includes a reversing unit 7 that reverses the head 4. The reversing unit 7 reverses the head 4 to a position where one of the two nozzles 3 is directed downward and the other is directed upward according to the control of the mounting control unit 10.

Next, the operation of the component mounting machine 1 will be described with reference to FIGS.
FIG. 3 is a flowchart showing a flow of processes related to component mounting in the component mounting machine 1. FIG. 4 is a process diagram illustrating an outline of the process shown in FIG.

  FIG. 3 is a flowchart showing the flow of an operation in which one nozzle 3 is focused and the nozzle 3 picks up a component and mounts it on the substrate. The operation in which the two nozzles 3 alternately suck components will be described later with reference to FIG.

  As shown in FIG. 3, first, the nozzle 3 sucks the component 20 placed in the component supply unit 22 (S1). In this state, the bump surface of the component 20 attracted by the nozzle 3 faces downward. After that, the reversing unit 7 reverses the head 4 so that the nozzle that sucks the component is turned upward, and the top and bottom of the component are reversed. That is, the bump surface faces upward (S2).

  The application unit 5 applies an adhesive from above the bump surface (S3). The amount of adhesive applied is approximately the same as the volume of the gap between the component 20 and the substrate 23 with the component 20 mounted on the substrate 23. Details of the coating amount will be described later with reference to FIG.

  The component 20 to which the adhesive is applied turns upside down when the reversing unit 7 reverses the head 4, and the bump surface to which the adhesive is applied faces downward (S4).

  The component 20 with the bump surface facing downward is mounted on the substrate 23 below by the pressure from the nozzle 3 (S5). Thereby, the component 20 and the board | substrate 23 will be in the state joined temporarily.

  The substrate 23 on which the component 20 is mounted is transferred by the conveyor 30 and placed below the thermocompression bonding head 40. Furthermore, the component 20 and the substrate 23 are joined by being solidified after the solder is melted by being pressurized and heated by the thermocompression bonding head 40. Also, the adhesive is cured. That is, reflow and curing are performed simultaneously (S6).

  In addition, although the temperature required for hardening of an adhesive agent changes with kinds of adhesive agent, it is about 100 degreeC-200 degreeC grade.

  Moreover, although the temperature required for solder reflow differs depending on the type of solder, it is about 180 ° C to 230 ° C. That is, the adhesive can be cured and the solder can be reflowed by applying a temperature necessary for the solder reflow.

  The above process will be briefly described with reference to FIG. 4. As shown in FIG. 4, (1) the adhesive is applied with the bump surface on which the bump 21 of the component 20 is present facing upward. This application is performed from above the center of the bump surface, and as shown in the figure, the adhesive is formed in a mountain shape having the apex around the center.

  (2) Invert the part. As a result, the bump surface to which the adhesive is applied faces downward and opposes the surface of the substrate 23 having the precoat portion 24 formed on the electrode. (3) The component 20 is mounted on the substrate 23 by the nozzle 3 that sucks the component 20. (4) By being heated, solder reflow and adhesive curing are performed simultaneously.

  Thus, the component mounter 1 according to the embodiment of the present invention applies the adhesive with the bump surface of the component facing upward. Thereby, generation | occurrence | production of the bubble between an adhesive agent and components can be suppressed.

FIG. 5 is a diagram illustrating the shape of the adhesive when the adhesive is discharged from the application unit 5.
As shown in FIG. 5, when the adhesive is discharged from the tip of the application part 5, it becomes spherical due to surface tension. Alternatively, at least the lower end of the adhesive has a downward convex curve.

  When the downwardly convex curved adhesive is hung on a horizontal plane, the adhesive first spreads to the plane while pushing air outward as shown in FIG. Become. Moreover, force is applied to the adhesive vertically downward by gravity (G). That is, the dead weight of the adhesive effectively acts on the adhesive as a force that pushes air between the flat surface and the adhesive outward. Therefore, it is possible to make it difficult for bubbles to remain between the component and the adhesive.

  In addition, the shape of the adhesive on the bump surface after the application is completed is a mountain shape having a vertex near the center as described above. Therefore, when the component is mounted on the substrate with the bump surface facing downward, the apex portion of the mountain-shaped adhesive first comes into contact with the substrate.

  Here, it is assumed that the adhesive on the bump surface after application is completed is in a state close to a flat surface due to reasons such as low viscosity of the adhesive or low surface tension. Even in such a case, when the component is reversed, the adhesive becomes a mountain shape having a downward apex near the center due to gravity.

  That is, as the component comes closer to the substrate, the adhesive between the component and the substrate spreads while pushing air outward from just below the center of the bump surface as shown in FIG. Naturally, gravity also affects the spread of the adhesive.

  That is, when the adhesive between the component 20 and the substrate 23 spreads on the substrate 23, not only the weight of the component and the force at the time of mounting received downward from the nozzle 3, but also the weight of the adhesive is applied to the substrate 23 and the adhesive. This effectively acts as a force for pushing the air between the substrate 23 and the outside, making it difficult for bubbles to remain between the substrate 23 and the adhesive.

  Further, as described above, the application amount is substantially the same as the volume of the gap between the component 20 and the substrate 23. Thereby, it can prevent that an adhesive agent protrudes from right under the component 20 unnecessarily.

  FIG. 7 is a diagram illustrating how the adhesive spreads on the substrate 23 when the component 20 is mounted on the substrate 23.

  As shown in FIG. 7, as the component 20 approaches the substrate 23, the adhesive spreads from near the center of the component 20 toward the outside. Further, when the mounting is completed, depending on the wettability of the adhesive to the substrate surface, the amount of application, and the like, the range of the adhesive on the substrate 23 is approximately the area immediately below the component 20 due to the surface tension of the adhesive. It becomes.

  In addition, as shown in FIG. 7, when the component 20 is mounted on the substrate 23 with the adhesive applied to the bump surface of the component 20 to the peripheral edge, the adhesive is adhered from the peripheral edge of the bump surface due to the viscosity of the adhesive. The component 20 is mounted on the substrate 23 in a state where the adhesive has spread to the peripheral edge without the agent dripping down.

  That is, as shown in FIG. 22A, unlike the case where the adhesive is applied to the board side to the width equivalent to the width of the component, as shown in FIG. it can. That is, the component 20 can be efficiently and stably fixed to the substrate 23 with a minimum amount of adhesive necessary for fixing the component 20 to the substrate 23.

  Further, as shown in FIG. 7, the range of the adhesive on the substrate 23 can be accommodated in a region almost directly below the component 20. Further, it is not a technique of pouring an adhesive after mounting a component on a substrate. Therefore, when a plurality of components are mounted on one substrate, it is not necessary to secure an area for pouring the adhesive between the components as shown in FIG.

  Therefore, when mounting a plurality of components on one board with the component mounter 1 of the present embodiment, or when mounting a component on a board on which other components have already been mounted, each component on the board is closer than before. Can be made. That is, high-density component mounting is possible.

  In order to enable such a state, the application amount of the adhesive is substantially the same as the volume of the gap between the component 20 and the substrate 23 when the component 20 is mounted on the substrate 23 as described above. There is a need. This amount can be obtained, for example, by taking an average of actually measured values. However, without actually mounting the component 20 on the substrate 23, it can be determined using, for example, the height of the bump and the area of the bump surface.

  FIG. 8A shows the height of the bumps and the distance between the component 20 and the substrate 23 after the component 20 is mounted on the substrate 23.

  As shown in FIG. 8A, the height of the bump 21 of the component 20 is h1, and the distance between the component 20 and the substrate 23 after the component 20 is mounted on the substrate 23 is h2. In this case, when h1 is substantially equal to h2, the amount of adhesive applied can be determined using the product of h1 and the area of the bump surface as a guide.

  FIG. 8B is a diagram showing an indication of the amount of adhesive applied to fix one component 20 in the present embodiment.

  Thus, if the component 20 is a rectangular parallelepiped shape, the area of the bump surface of the component 20 is equal to the area S of the upper surface. Accordingly, S × h1 is a measure of the amount of adhesive applied to fix one component 20 approximately.

  Further, when the number of bumps of the component 20 is small, the ratio of the volume of the bumps in the gap between the component 20 and the substrate 23 and the volume of the precoat portion formed on the electrode of the substrate 23 is small. May be applied as it is. Further, when the number of bumps of the component 20 is large, the total volume of the bumps of one component 20 and the precoat portion may be obtained, and the volume obtained by subtracting the total from S × h1 may be used as the coating amount.

  The coating amount determined in this way is set in the mounting control unit 10 shown in FIG. 2, and the coating unit 5 is an adhesive having the coating amount set in the mounting control unit 10 under the control of the mounting control unit 10. Is applied to the part 20.

  In addition, as a specific numerical value, if the part is a normal bare chip of about 2 mm × 2 mm to 20 mm × 20 mm, the amount of adhesive required is about 0.4 microliter (μl) to about 120 μl. is there.

  Further, if it is a large BGA (Ball Grid Array) having a size of about 60 mm × 60 mm, it is about 3600 μl.

  Here, the viscosity of the adhesive varies depending on the environment such as ambient temperature. Therefore, even when the adhesive is applied to a certain part by the amount determined as described above, the manner in which the adhesive spreads on the bump surface varies depending on the surrounding environment.

FIG. 9 is a diagram illustrating an example of the state of the adhesive applied to the bump surface.
9 (A) and 9 (B) are diagrams showing an example of a state where the adhesive is applied to the bump surface and spreads, and FIG. 9 (C) is a state where the adhesive is stopped at the peripheral portion of the bump surface. FIG.

  For example, when an adhesive is applied to a part in an amount necessary for fixing the part, the adhesive may spread over the entire bump surface as shown in FIG. As shown in B), the adhesive may not spread over the entire bump surface.

  However, as shown in FIG. 9C, the adhesive on the component 20 stops at the peripheral edge of the bump surface due to surface tension. Of course, if a large amount of adhesive is applied, the adhesive will spill from the bump surface, but as described above, the amount of adhesive applied is equivalent to the volume of the gap between the substrate and the component. The amount will not spill from the bump surface.

  Further, as shown in FIGS. 19A, 19B, and 20, when applying an adhesive on the substrate, it is assumed that the adhesive is applied on the substrate in an amount necessary for fixing the components. However, depending on the surrounding environment, it may spread on the substrate more than necessary.

  However, when the adhesive is applied to the component as in the component mounting machine 1 of the present embodiment, the adhesive is stopped at the peripheral portion of the component due to the surface tension of the adhesive. In this state, even when the component is reversed and mounted on the substrate, the amount of adhesive applied is the same as the volume of the gap between the substrate and the component, as described above. There is also the influence of the surface tension of the adhesive, and as shown in FIG.

  That is, the component mounter 1 of the present embodiment can mount one component on the board in a compact manner.

  Moreover, the component mounting machine 1 of this Embodiment can perform reflow and hardening simultaneously as mentioned above. In other words, it is only necessary to heat the substrate with the components mounted once.

  Therefore, for example, as compared with the C4 method shown in FIG. 18, the number of steps related to component mounting is reduced, and the possibility of damage to components and boards due to heat is reduced.

  Further, when the upper and lower parts of the component with the adhesive applied to the bump surface are turned upside down, the adhesive on the bump surface becomes a mountain shape with the center near the downward apex. Therefore, when the component is mounted on the board, if the component and the board come close to each other while keeping them parallel, the adhesive will first contact the immediate vicinity of the center of the component on the board, and gradually outside the contact point. To expand.

  When the adhesive spreads, the weight of the adhesive acts effectively as a force that pushes out bubbles between the adhesive and the substrate. Therefore, it is difficult for bubbles to remain between the adhesive and the substrate.

  In addition, the adhesive spreads in the gap between the component and the substrate so that the adhesive spreads almost evenly from directly under the center of the component toward the peripheral edge. Therefore, compared to the case where the adhesive is poured from one side or two sides of the component as shown in FIGS. 19A and 19B, the bias of the adhesive is less likely to occur.

  Further, the component mounting machine 1 applies an adhesive for each component, and the component to which the adhesive is applied is immediately mounted on the substrate. Therefore, unlike the conventional method including the process of cutting the individual semiconductor elements after applying the adhesive at the wafer stage shown in FIG. 23, the possibility of foreign matter adhering to and mixing into the adhesive is almost eliminated. Is possible.

  In addition, since it is not necessary to use an adhesive that becomes solid at room temperature, for example, in order to ensure that the component is mounted on the substrate, a process of heating the adhesive and dissolving it before mounting is required. do not do.

  As described above, the component mounter 1 according to the present embodiment can efficiently and stably fix the component to the substrate with the minimum necessary amount of adhesive applied. Furthermore, the amount of unnecessary protrusion of the adhesive from the components can be reduced, and high-density component mounting on the substrate becomes possible.

  Next, the case where the component mounting machine 1 uses two nozzles 3 and mounts components on the board more efficiently than when only one nozzle 3 is used will be described with reference to FIG.

  FIG. 10 is a process diagram illustrating a process in which the component mounter 1 according to the present embodiment mounts a component on a board using two nozzles 3.

  One of the two nozzles 3 is a nozzle A and the other is a nozzle B. Further, a component sucked by the nozzle A is a component a, and a component sucked by the nozzle B is a component b. A substrate on which the component a is mounted by the nozzle A is referred to as a substrate α, and a substrate on which the component b is mounted by the nozzle B is referred to as a substrate β. These are simply indicated as A, B, a, b, α, and β in the figure.

  The nozzle A is an example of a first nozzle in the component mounter of the present invention, and the nozzle B is an example of a second nozzle. In addition, the part a is an example of a first part, and the part b is an example of a second part.

  As shown in FIG. 10, (1) the nozzle A sucks the component a. (2) The head 4 is reversed and the nozzle B is directed downward to suck the component b. (3) In this state, the bump surface of the component a is facing upward, and an adhesive is applied to the bump surface of the component a by the application unit 5.

  (4) The head 4 is inverted, the bump surface of the component b is upward, and the upper and lower sides of the component a are inverted, and the bump surface comes to a position facing the substrate α. In this state, an adhesive is applied to the bump surface of the component b by the application unit 5. Further, the component a is mounted on the substrate α by the nozzle A.

  (5) The board α on which the component a is mounted is transferred to the lower side of the thermocompression bonding head 40 by the conveyor 30 and is pressurized and heated by the thermocompression bonding head 40. That is, reflow and curing processes are performed. Thereby, the mounting operation of the component a on the board α is completed. In addition, after the adhesive is applied to the bump surface of the component b and the component a is mounted on the substrate α by the nozzle A, the nozzle B is directed downward. Further, the component b is mounted on the substrate β by the nozzle B.

  (6) The substrate β on which the component b is mounted is transferred to the lower side of the thermocompression bonding head 40 by the conveyor 30, and reflow and curing processing is performed by the thermocompression bonding head 40. Thereby, the mounting operation of the component b on the board β is completed.

  It should be noted that when this step (6) is performed, no components are adsorbed to the nozzle A and the nozzle B. Therefore, the mounting control unit 10 moves the head 4 including the nozzle A and the nozzle B to the component supply unit 22 and causes the nozzle A and the nozzle B to suck the next component.

  The component mounter 1 can sequentially mount components on a plurality of substrates by repeating the steps (1) to (6) described above.

  As described above, when two nozzles 3 are used, components can be mounted on the board more efficiently than when only one nozzle 3 is used.

  Specifically, when only one nozzle 3 is used, for example, when only nozzle A is used, in order to mount the component a on the substrate α, the above description and (1) component a shown in FIG. It is necessary to perform four steps: adsorption, (3) application of an adhesive to the component a, (4) mounting of the component a on the substrate α, and (5) reflow and curing. That is, in order to mount each of the two components on the two substrates using only the nozzle A, it is necessary to perform eight steps.

  However, when two nozzles 3 are used, each of two components can be mounted on two substrates in six steps as described above. That is, the component can be mounted on the board more efficiently than when only one nozzle 3 is used.

  In the above description, the steps (2) and (3) may be performed simultaneously. That is, when the nozzle B adsorbs the component b, the adhesive may be applied to the component a that is inverted and has a bump surface facing upward.

  As shown in FIG. 1, in the component mounter 1 according to the present embodiment, both the head 4 and the coating unit 5 are attached to the moving table 6 and move as the moving table 6 moves.

  Therefore, when the nozzle B adsorbs the component b, the application unit 5 can apply the adhesive to the component a.

  Further, in this case, after the adhesive is applied to the component a, the head moves to a position above the substrate, but reversal may be performed so that the bump surface of the component a faces downward while moving. Alternatively, the adhesive may be applied to the component “a” while moving and reversed after the application is completed.

  Here, it is considered that movement of the part after application of the adhesive to the part or while applying the adhesive to the part affects the application state of the adhesive. However, if there is no substantial problem such as the adhesive spilling from the component due to the low viscosity of the adhesive, the process can be further compressed in this way, and the substrate of the component can be more efficiently Can be implemented.

  As described above, the component mounter 1 according to the present embodiment can more efficiently mount the component on the substrate by using two nozzles for sucking the component and mounting the component on the substrate. it can.

  Further, the component mounter 1 may use three or more nozzles 3. For example, the head 4 may have a shape in which three or more nozzles 3 are attached on the radiation around the θ axis shown in FIG. Further, the mounting control unit 10 may control each component to sequentially perform component adsorption, adhesive application, and the like for each component.

  In the present embodiment, the amount of adhesive applied to the component is set in advance in the mounting control unit 10, and the coating unit 5 is set in the mounting control unit 10 under the control of the mounting control unit 10. An application amount of adhesive was applied to the part 20.

  However, you may control the application quantity of the adhesive agent to components based on the application state of an adhesive agent.

  FIG. 11 is a schematic diagram showing an outline of a configuration for controlling the amount of adhesive applied to a component based on the height of the adhesive formed in a mountain shape on the component.

  FIG. 11A is a schematic diagram when the configuration is viewed from the X-axis direction, and FIG. 11B is a schematic diagram when the configuration is viewed from the Y-axis direction.

  As shown in FIG. 11A, the moving table 6 is provided with a detection unit 25 having a phototube 26. An irradiation unit 26 a that irradiates light toward the photoelectric tube 26 at a position in front of the photoelectric tube 26 is installed.

  The photoelectric tube 26 is a kind of optical sensor, and the detection unit 25 is an adhesive formed in a mountain shape on the component 20 by the light beam irradiated from the irradiation unit 26a being blocked near the top of the adhesive and being interrupted. It is possible to detect that the height of has reached a predetermined height.

  That is, the detection unit 25 does not actually measure the height of the peak of the mountain shape, but continuously treats the height near the vertex as the height of the adhesive, so that the detection unit 25 continuously detects the height of the adhesive. It is possible to detect that the height of the adhesive that is discharged and formed in a mountain shape has reached a predetermined height.

  The position of the phototube 26 in the X-axis direction is shifted from a straight line parallel to the Z-axis direction passing through the center of the tip of the coating unit 5 as shown in FIG. Further, the position of the photoelectric tube 26 in the Z-axis direction is set to a position equivalent to the height of the adhesive crest that provides a coating amount suitable for the component 20. Let Hp be the height of the peak of the adhesive that provides the optimum coating amount for the component 20.

  The Hp may be obtained by applying an adhesive having an application amount suitable for the component 20 described with reference to FIG. 8 to the component 20 and actually measuring the height of the peak of the adhesive. Moreover, you may obtain | require by calculation from the said application amount and the shape at the time of the application | coating to the components 20 of an adhesive agent.

  With this configuration, when the height of the adhesive crest applied to the component 20 reaches Hp, the light beam 26b irradiated from the irradiation unit 26a is blocked by the adhesive, and the photoelectric tube 26 receives the light beam 26b. become unable. Thereby, the detection unit 25 can detect that the height of the peak of the adhesive applied to the component 20 has reached Hp.

  Therefore, if the discharge of the adhesive from the application part 5 is stopped at the time of this detection, the height of the adhesive crest on the component 20 is substantially Hp. Accordingly, the amount of adhesive applied is suitable for the component 20.

  The component mounter 1 further includes a plurality of pairs of photoelectric tubes 26 and irradiation units 26a in the Z-axis direction, so that an amount of adhesive suitable for each component can be accommodated for a plurality of types of components having different sizes. Can be applied.

  Further, the amount of the adhesive applied to the part may be controlled based on the shape of the adhesive instead of the height of the mountain-shaped adhesive applied to the part.

  FIG. 12 is a schematic diagram showing an outline of a configuration for controlling the amount of adhesive applied to a component based on the shape of the adhesive on the component.

  FIG. 12A is a schematic diagram when the configuration is viewed from the X-axis direction, and FIG. 12B is a schematic diagram when the configuration is viewed from the Y-axis direction.

  As shown in FIG. 12A, the moving table 6 is provided with a detection unit 25 having a camera 27. Specifically, the camera 27 is installed at a position where the shape of the adhesive pile applied to the component 20 can be imaged.

  The detection unit 25 can detect that the shape has reached a predetermined shape by causing the camera 27 to capture an image of the mountain shape of the adhesive applied to the component 20.

  For example, the adhesive amount suitable for the component 20 described with reference to FIG. 8 is applied to the component 20, and the shape of the adhesive is determined by measuring the shape of the adhesive. be able to.

  It is assumed that the shape thus identified is, for example, a shape 27a indicated by a dotted line in FIG. In this case, the shape of the adhesive discharged from the application unit 5 gradually approaches the shape 27a.

  The detection unit 25 compares the contour line other than the bottom of the mountain shape of the adhesive imaged by the camera 27 with the dotted line portion of the shape 27a. By this comparison, for example, when the contour line is located outside the dotted line in 90% of the length of the dotted line part of the shape 27a, or the area of the mountain shape of the adhesive imaged by the camera 27 However, when the area of the portion surrounded by the bump surface of the component 20 and the dotted line portion of the shape 27a becomes 90%, the detection unit 25 detects that the shape of the adhesive being applied has reached the shape 27a. .

  Therefore, if the discharge of the adhesive from the application unit 5 is stopped at the time of this detection, the shape of the adhesive on the component 20 becomes substantially the same as the shape 27a. Accordingly, the amount of adhesive applied is suitable for the component 20.

  In addition, the shape corresponding to the application amount of the adhesive suitable for the component 20 varies depending on the viscosity of the adhesive changing according to the temperature at the time of applying the adhesive to the component. Therefore, even if the component mounter 1 stores a plurality of shapes according to the temperature and the detection unit 25 selects a shape corresponding to the amount of adhesive applied to the component 20 according to the temperature. Good.

  As described above, the component mounter 1 according to the present embodiment includes the detection unit 25 that detects the application state of the adhesive such as the height and shape of the pile of the adhesive applied to the component. The application amount of the adhesive can be controlled based on the application state.

  FIG. 13 is a block diagram illustrating an outline of a functional configuration of the component mounter 1 including the detection unit 25 that detects the application state of the adhesive.

  The component mounter 1 illustrated in FIG. 13 includes a detection unit 25 and a coating amount control unit 28 in addition to the components included in the component mounter 1 illustrated in FIG.

  As described above, the detection unit 25 includes the phototube 26 or the camera 27, and the height of the adhesive applied to the component has reached a predetermined height, or the shape of the adhesive is predetermined. It is possible to detect that the vicinity of the shape is reached. That is, it can be detected that the amount of the adhesive being applied to the component has become an amount suitable for the component.

  The application amount control unit 28 receives a signal from the detection unit 25 indicating that the application amount is suitable for the component, and performs control to stop the discharge of the adhesive to the application unit 5. Note that the start timing of application is controlled by the mounting control unit 10.

  With this configuration, the component mounter 1 can control the amount of adhesive applied to the component based on the application state.

  Further, in the present embodiment, the application of the adhesive to the component performed by the application unit 5 is performed from above the center of the bump surface.

  However, the application of the adhesive to the component performed by the application unit 5 may not be performed from above the center of the bump surface, but may be performed from above the center.

FIG. 14 is a diagram illustrating an example of the application position of the adhesive on the bump surface of the component.
In each of FIGS. 14A to 14C, a dotted circle represents an area near the center of the bump surface, and a hatched circle in the area represents an adhesive application position. Yes. In addition, eight white circles around the area represent bumps.

  As shown in FIG. 14A, when the adhesive is applied from above the center of the bump surface, the adhesive spreads evenly from the center of the bump surface. As shown in FIGS. 14B and 14C, when the adhesive is applied from above the position slightly deviated from the center of the bump surface, the adhesive is applied to the side closest to the application position. After reaching, the adhesive will reach the remaining sides.

  Thus, although there is a difference in the spreading method, in any case, as described with reference to FIG. 8, the amount of adhesive applied is the volume of the gap between the component and the substrate when the component is mounted on the substrate. And the influence of the surface tension of the adhesive does not spill from the bump surface.

  Further, as shown in FIGS. 14 (B) and 14 (C), even when the adhesive is applied from a position that is not precisely at the center of the bump surface, the adhesive formed on the bump surface The shape of the mountain is a mountain shape with a vertex near the center.

  In addition, when the bump surface is facing upward, even when the shape of the adhesive is close to a flat surface, that is, when the swell is not clearly understood, the component is reversed and bonded when the component is mounted on the board. The agent is affected by gravity, and has a mountain shape with a downward apex near the center.

  For this reason, as described above, when the component is mounted on the substrate, the adhesive spreads while pushing air existing in the gap between the substrate and the component from near the center of the component to the outside. Moreover, gravity acts effectively as a force that pushes air outward.

  Note that the shape of the region near the center of the bump surface and the ratio of the size to the bump surface shown in FIGS. 14A to 14C are examples, and these shapes and ratios are the shape of the bump surface of the component and the wetness. It depends on the properties and the viscosity of the adhesive. That is, the allowable range of the adhesive application position may be determined based on experimental values, theoretical values, and the like.

  In addition, as described with reference to FIGS. 3 and 4, the component mounter 1 according to the present embodiment has the functional and construction features of applying an adhesive to a component, inverting it, and mounting it on a substrate. Have. The characteristics of the component mounting machine 1 can be applied to various construction methods.

  For example, the above construction method features can be applied to the C4 construction method described with reference to FIG.

FIG. 15 is a process diagram showing an example in which the construction method features of the component mounting machine 1 are applied to the C4 construction method.
As shown in FIG. 15, (1) an adhesive is applied to the bump surface of the component 20. Further, a flux is applied to the precoat portion formed on the electrode of the substrate 23. Note that if the adhesive applied to the bump surface has the same function as the flux, it is not necessary to apply the flux. (2) The component 20 is inverted and mounted on the substrate 23. (3) Reflow and curing are performed by heating.

Also by such a process, the component 20 is fixed to the substrate 23 efficiently and stably.
Similarly, the above-mentioned characteristics of the construction method are applied to so-called gold-gold bonding, in which a gold bump formed on a semiconductor element and a gold portion formed on an electrode of a substrate are metal-bonded while being vibrated by ultrasonic waves. be able to.

  That is, the component mounting machine 1 can perform component mounting using ultrasonic waves by including an ultrasonic generator that generates ultrasonic waves.

  FIG. 16 is a process diagram illustrating a process in which the component mounting machine 1 includes the ultrasonic generator 35 and performs gold-gold bonding.

  As shown in FIG. 16, (1) gold bumps 21 a are formed on a component 20 that is a semiconductor element, and an adhesive is applied to the bump surface by the application unit 5. (2) The component 20 is inverted and comes to a position facing the substrate on which the gold part 24a is formed on the electrode. (3) The component 20 is pressed while being vibrated by the ultrasonic generator 35, and the gold bump 21a and the gold part 24a are joined. (4) The adhesive is cured by heating.

  As described above, the mounting method in which the gold-gold bonding is performed using the vibration caused by the ultrasonic wave is characterized by the mounting method performed by the component mounting machine 1 in which the adhesive is applied to the component, reversed, and mounted on the substrate. Can be applied.

  In addition, when implementing the mounting method which performs gold-gold joining using the vibration by an ultrasonic wave, you may form the electrode itself with gold instead of forming the gold | metal part 24a on the electrode of a board | substrate.

  Moreover, the component mounting machine 1 of this Embodiment may be provided with the plasma generator which irradiates atmospheric pressure plasma to the bump surface of components. By performing plasma treatment on the bump surface of the component, the affinity of the bump surface to the adhesive is improved, and the adhesive is easily spread.

  FIG. 17 is a process diagram showing a process in which the component mounter 1 includes a plasma generator and mounts a component on a substrate.

  As shown in FIG. 17, (1) the bump surface of the component 20 adsorbed by the nozzle 3 is subjected to plasma processing by the plasma generator 36. (2) The component 20 is reversed, and an adhesive is applied to the bump surface by the application unit 5. (3) The component 20 is inverted and mounted on the substrate 23. (4) Reflow and curing are performed by heating.

  The plasma generated by the plasma generator 36 is preferably a plasma generated by a gas containing at least oxygen gas.

  In this way, the C4 method, the mounting method using ultrasonic waves, and the mounting method using plasma are applied by the component mounting machine 1 in which the adhesive is applied to the component, reversed, and mounted on the substrate. The above features can be applied.

  In addition, for example, as described above, the material of the bump on the part electrode and the material of the pre-coating part or the electrode itself when not pre-coating are both gold, but the material of the bump is solder. And when there is no precoat part on the substrate and it is prefluxed directly on the electrode, when both the bump and the precoat part are solder, the bump is a gold wire bump or a gold plated bump, and the precoat formed on the electrode of the substrate The above process can be performed in various combinations, such as when the material of the part is lead (Pb) -free solder.

  In addition to the Pb-free solder, there are eutectic, high Pb, and the like. However, any type of solder does not hinder the implementation of the above process.

  In other words, whether or not to apply the process of applying the adhesive to the component, inverting it, and mounting it on the board, which is a feature on the construction method implemented by the component mounting machine 1, depends on the mounting construction method, the joining mode between the component and the board, Regardless of the type of adhesive and the content of additional processing, it can be applied to all methods including the step of fixing the component to the substrate by curing the adhesive between the component and the substrate.

  That is, in all these methods, the effect of fixing the component to the substrate efficiently and stably is exhibited. In addition, since it is possible to eliminate unnecessary protrusion of the adhesive from the component, it is possible to mount the component at a high density on the substrate in the component mounter having the above-described features.

  In addition, the adhesive used in the present embodiment is a thermosetting resin having a viscosity included in a range of at least 0.001 Pa · s to 200 Pa · s.

  However, regardless of whether or not the viscosity of the adhesive is included in the above range, the component mounting machine 1 may perform processing according to the viscosity of the adhesive and may include a component for the processing. good.

  For example, when reversing the part after applying the adhesive to the part, the viscosity of the adhesive is low, so if there is a possibility that the adhesive may spill from the part due to inertia or centrifugal force, the adhesive should be added to improve the viscosity. You may have the structure part to cool. Further, the reversing unit 7 may slow the reversing speed.

  The component that performs the cooling may be actively cooled by cold air or the like, or may be cooled by not inverting the component until the adhesive on the component is lowered to a predetermined temperature at room temperature.

  Further, for example, when the viscosity is high and the wet spread on the bump surface or the substrate of the component is poor, a component that heats the adhesive may be included to reduce the viscosity. The component that performs the heating may be positively heated by warm air or the like, or may be heated by not inverting the part until the adhesive on the part rises to a predetermined temperature at room temperature.

  Each of these components that cool or heat the adhesive is an example of the adjusting means in the component mounting machine of the present invention. In the case where the adhesive is cooled or heated, the cooling or heating may be performed until the part to which the adhesive is applied is reversed.

  Furthermore, in order to improve the wetting and spreading on the bump surface of the component or on the substrate, the drawing portion may be applied in accordance with the shape of the bump surface of the component by discharging the adhesive while the coating unit 5 moves. .

  Examples of drawing application are “×”, “*”, and the like. Also, other shapes may be used as long as there is no region surrounded by the adhesive when applied to the bump surface. That is, it is sufficient if the adhesive spreads the surface of the substrate so that air can be easily pushed outward from the vicinity of the center of the bump surface.

  In addition, the component mounting machine 1 includes a reversing unit 7 in the moving table 6 as a functional configuration, and the reversing unit 7 reverses the head 4 and reverses the top and bottom of the nozzle 3 sucking the component, thereby It was assumed that the top and bottom were reversed. However, the part may be reversed by other means.

  For example, the head 4 itself may have a function of reversing by providing a motor or the like for reversing the head 4. In other words, the component mounter 1 only needs to have a function of turning the component upside down when the component to which the adhesive is applied is mounted on the substrate.

  The component mounter 1 includes the thermocompression bonding head 40 and pressurizes and heats the component 20 mounted on the substrate 23. However, the thermocompression bonding head 40 may be eliminated, and a reflow device or a heating device used in the mounting process may be used. That is, you may perform only hardening by heating an adhesive agent.

  Furthermore, the thermocompression bonding head 40 may be eliminated by providing the nozzle 3 with a heating function to enable thermocompression bonding with the nozzle 3.

  That is, as described with reference to FIG. 6, the component mounter 1 can reduce bubbles remaining in the adhesive between the component at the stage before heating and the substrate. Therefore, it is not necessary to pressurize the parts for suppressing the thermal expansion of bubbles during heating.

  Further, the application unit 5 and the tank 5a are attached to the movable table 6 and are moved as the movable table 6 moves. With this configuration, for example, as described with reference to FIG. 10, when one nozzle 3 is sucking a component from the component supply unit 22, the application unit 5 is a component sucked by the other nozzle 3. An adhesive can be applied. However, it may not be attached to the movable table 6.

  The application unit 5 and the tank 5a may be attached to any position in the component mounting machine 1 as long as the adhesive can be applied to the bump surface in the upward state.

  In the component supply unit 22, the plurality of components 20 are placed with their bump surfaces facing downward. However, the plurality of components 20 may be placed with the bump surface facing up, respectively. In this case, a unit that reverses and holds the bump surface of the component 20 from the component supply unit 22 may be provided, and a surface that is not the electrode surface of the reversed component 22 may be sucked by the nozzle 3.

  Further, in the head 4 to which two nozzles 3 are attached, the nozzle 3 is configured to move in parallel with the head 4 in the Z-axis direction. However, the nozzle 3 may be configured not to move with respect to the head 4, and the entire head 4 may be configured to move in the Z-axis direction with respect to the moving table 6.

  The present invention can be applied to a component mounter for mounting components such as semiconductor elements on a substrate. In particular, it is useful as a component mounter that employs a method of fixing a component to a substrate by curing an adhesive between the component and the substrate.

It is a perspective view which shows the external appearance of the component mounting machine of embodiment. It is a functional block diagram which shows the outline | summary of the functional structure of the component mounting machine of embodiment. It is a flowchart which shows the flow of the process which concerns on the component mounting in the component mounting machine of embodiment. FIG. 4 is a process diagram illustrating an outline of a process illustrated in FIG. 3. It is a figure which shows the shape of the adhesive agent at the time of an adhesive agent being discharged from an application part. It is a schematic diagram which shows a mode that an adhesive spreads on a surface, extruding air. It is a figure which shows a mode that an adhesive agent spreads on a board | substrate in the case of mounting | wearing to the board | substrate of components. (A) is a figure which shows the height of bump, and the distance between a component and a board | substrate after mounting a component to a board | substrate, (B) is a figure of the adhesive agent required for fixation of one component. It is a figure which shows the standard of application amount. (A) is a figure which shows an example of the state which the adhesive spread on the bump surface, (B) is a figure which shows another example of the state where the adhesive spread on the bump surface, (C) It is a figure which shows the state which the adhesive agent has stopped in the peripheral part of the bump surface. It is process drawing which shows the process in which the component mounting machine of this Embodiment mounts components on a board | substrate using two nozzles. (A) is a schematic diagram when a configuration for controlling the amount of adhesive applied to a component based on the height of the adhesive formed in a mountain shape on the component is viewed from the X-axis direction; (B) is a schematic diagram when the configuration is viewed from the Y-axis direction. (A) is a schematic diagram when a configuration for controlling the amount of adhesive applied to a component based on the shape of the adhesive on the component is viewed from the X-axis direction, and (B) is the configuration It is a schematic diagram at the time of seeing from the Y-axis direction. It is a block diagram which shows the outline | summary of a functional structure of a component mounting machine provided with the detection part which detects the application | coating state of an adhesive agent. (A) is a figure which shows the 1st example of the application | coating position of the adhesive agent on the bump surface of components, (B) shows the 2nd example of the application | coating position of the adhesive agent on the bump surface of components. It is a figure and (C) is a figure which shows the 3rd example of the application position of the adhesive agent on the bump surface of components. It is process drawing which shows the example which applied the characteristic on the process of the component mounting machine of this Embodiment to C4 construction method. It is process drawing which shows the process in which the component mounting machine of this Embodiment is equipped with an ultrasonic generator and performs gold-gold joining. It is process drawing which shows the process in which the component mounting machine of this Embodiment is equipped with a plasma generator and mounts components on a board | substrate. It is process drawing which shows the process of C4 construction method. It is a figure which shows a mode that an adhesive agent is filled between components and a board | substrate. It is process drawing which shows the process of the construction method which apply | coats an adhesive agent to a board | substrate, and mounts components on a board | substrate. It is a figure which shows the state in which a bubble remains between an adhesive agent and components in the construction method shown in FIG. (A) is a figure which shows an example of the application | coating width | variety of the adhesive agent in the construction method shown in FIG. 20, (B) is a figure which shows another example of the application | coating width | variety of the adhesive agent in the construction method shown in FIG. It is process drawing which shows the process of the construction method which mounts the component cut out from the wafer with which the adhesive agent was apply | coated to a board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting machine 2 Transfer part 3 Nozzle 4 Head 5 Application | coating part 5a Tank 6 Moving stand 7 Inversion part 9 Beam 10 Mounting control part 20 Component 21 Bump 21a Gold bump 22 Component supply part 23 Substrate 24 Precoat part 24a Gold part 25 Detection Unit 26 photocell 26a irradiation unit 27 camera 28 coating amount control unit 30 conveyor 35 ultrasonic generator 36 plasma generator 40 thermocompression bonding head

Claims (4)

A component mounter for mounting a component having a bump as a terminal for connecting to a substrate on the substrate,
Application means for applying an adhesive from above to the bump surface for each component, with the bump surface being the surface having the bumps of the component facing upward,
Reversing means for reversing the top and bottom of the part to which the adhesive is applied by the application means;
Mounting means for mounting the component reversed by the reversing means on a substrate located under the component;
The mounting means is a nozzle for mounting the adsorbed component on the substrate;
The reversing means further turns the nozzle adsorbing the component upward so that the bump surface of the component faces upward, and after the adhesive is applied to the bump surface by the applying unit, the nozzle is Invert the top and bottom of the part by facing down
Component mounter. The component mounter includes two nozzles, a first nozzle and a second nozzle,
The first nozzle and the second nozzle are in a positional relationship in which one of the nozzles is directed upward by the reversing unit and the other nozzle is directed downward,
The applying means applies the adhesive to the bump surface of the first component adsorbed by the first nozzle, and then adsorbs the second nozzle that is directed upward by the reversing means. The adhesive is applied to the bump surface of the part 2
The inversion means applies the adhesive to the bump surface of the second component, and after the first component is mounted on the substrate by the first nozzle, the second nozzle faces downward. The component mounting machine according to claim 1 . A method of mounting a component having a bump, which is a terminal for connecting to a substrate, on the substrate,
A first application step of applying an adhesive from above to the bump surface for each component, with the bump surface being the surface having the bumps of the component facing upward;
A first reversing step of reversing the top and bottom of the component to which the adhesive has been applied in the first applying step;
A first mounting step of mounting the component inverted in the first reversing step on a substrate located under the component;
The component mounting method is executed in a component mounter including a nozzle for mounting a sucked component on a substrate,
In the first mounting step, the component is mounted on the substrate by the nozzle,
The component mounting method further includes a second reversing step in which a bump surface of the component is directed upward by making the nozzle adsorbing the component upward.
In the first inversion step, the upper and lower sides of the component are inverted by turning the nozzle downward after the adhesive is applied in the first application step on the bump surface that has been directed upward in the second inversion step. Make
Component mounting method. The component mounter includes a second nozzle different from the first nozzle that is the nozzle,
The first nozzle and the second nozzle are in a positional relationship facing in opposite directions,
The first nozzle adsorbs a first component, the second nozzle adsorbs a second component;
In the first reversing step, after the adhesive is applied to the bump surface of the first component, the first component is turned upside down and the second component is adsorbed. The bump surface of the second component is turned upward by making the nozzle of
The component mounting method further includes:
A second application step of applying the adhesive to the bump surface of the second component turned upward in the first inversion step;
After the adhesive is applied to the bump surface of the second component in the second application step and the first component is mounted on the substrate by the first nozzle, the second nozzle faces downward. A third inversion step to
Inverted the second part of the upper and lower in the third reversing step, according to claim 3, wherein said second nozzle and a second mounting step of mounting the substrate positioned under the second component Component mounting method.

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