JP4534717B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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JP4534717B2
JP4534717B2 JP2004316003A JP2004316003A JP4534717B2 JP 4534717 B2 JP4534717 B2 JP 4534717B2 JP 2004316003 A JP2004316003 A JP 2004316003A JP 2004316003 A JP2004316003 A JP 2004316003A JP 4534717 B2 JP4534717 B2 JP 4534717B2
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light
phosphor
led
emits
emitting element
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JP2006128456A (en
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光博 苗代
聡 稲垣
修 山中
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Toyoda Gosei Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Description

本発明は、ＬＥＤ素子から放射される光によって励起される蛍光体を使用することにより白色系が発光可能な発光装置に関し、特に、蛍光体の量や発光状態のばらつきがあっても所望の白色度を得ることのできる発光装置に関する。   The present invention relates to a light emitting device capable of emitting white light by using a phosphor excited by light emitted from an LED element, and in particular, a desired white color even if there are variations in the amount of phosphor and the light emission state. The present invention relates to a light emitting device capable of obtaining a degree.

従来、ＬＥＤ（Light Emitting Diode）素子を光源に用いた発光装置が提案されている。このような発光装置において、青色系のＬＥＤ素子から放射される青色光と、その発光を吸収して黄色光を放射する蛍光体とを有し、青色光と黄色光の混合によって白色光を生じるものがある（例えば、特許文献１参照。）。   Conventionally, a light emitting device using an LED (Light Emitting Diode) element as a light source has been proposed. Such a light emitting device has blue light emitted from a blue LED element and a phosphor that absorbs the emitted light and emits yellow light, and generates white light by mixing blue light and yellow light. There are some (for example, refer to Patent Document 1).

特許文献１に記載される発光装置は、マウントリードのカップ内に窒化ガリウム系半導体ＬＥＤチップを配置し、セリウムで付活されたイットリウム・アルミニウム・ガーネット系のフォトルミネセンス蛍光体を含む透光性樹脂をカップに充填することによって封止しており、更にその外側をエポキシ樹脂等の樹脂材料からなるモールド部材で覆って形成されている。   The light-emitting device described in Patent Document 1 includes a gallium nitride-based semiconductor LED chip disposed in a cup of a mount lead, and includes a light-transmitting material including a yttrium-aluminum-garnet-based photoluminescent phosphor activated with cerium. The resin is sealed by filling the cup with resin, and the outside is further covered with a mold member made of a resin material such as epoxy resin.

特許文献１に記載される発光装置によれば、ボディーカラーが黄色であるフォトルミネセンス蛍光体から発光する光が補色関係にある場合、ＬＥＤチップからの発光と、フォトルミネセンス蛍光体からの発光とを混色表示させると、白色系の発光色表示を行うことができる。   According to the light-emitting device described in Patent Document 1, when light emitted from a photoluminescent phosphor whose body color is yellow has a complementary color relationship, light emission from the LED chip and light emission from the photoluminescence phosphor Are displayed in a mixed color display, a white emission color display can be performed.

しかしながら、ＬＥＤチップの種類によっては発光ピークが蛍光体の励起ピークと効率良く重ならないことがある。上記したフォトルミネセンス蛍光体の励起ピークが４００ｎｍで、ＩｎＧａＮ系青色ＬＥＤチップで発光ピークが４６５〜５２０ｎｍである場合、フォトルミネセンス蛍光体の励起効率が充分でなく、高輝度な白色光を得ることができない。   However, depending on the type of LED chip, the emission peak may not efficiently overlap with the excitation peak of the phosphor. When the excitation peak of the photoluminescence phosphor described above is 400 nm and the emission peak is 465 to 520 nm with an InGaN blue LED chip, the excitation efficiency of the photoluminescence phosphor is not sufficient and high luminance white light is obtained. I can't.

上記した励起効率を改善するものとして、例えば、オキシ窒化物ガラスを母体材料として用い、可視・紫外光領域の広い波長範囲（≦５５０ｎｍ）に励起スペクトルを有する蛍光体が提案されている（例えば、特許文献２参照。）。   For improving the above-described excitation efficiency, for example, a phosphor having an excitation spectrum in a wide wavelength range (≦ 550 nm) in the visible / ultraviolet region using oxynitride glass as a base material has been proposed (for example, (See Patent Document 2).

特許文献２に記載される蛍光体は、母体材料のＣａ2+ イオンの一部を発光中心となるＥｕ2＋、Ｅｕ3+、Ｃｅ3+、Ｔｂ3+などの希土類イオンまたはＣｒ3+、Ｍｎ2+などの遷移金属イオンで置換して合成したものであり、モル％表示で、ＣａＣＯ3をＣａＯに換算して：２０〜５０モル％、Ａｌ2Ｏ3：０〜３０モル％、ＳｉＯ：２５〜６０モル％、ＡｌＮ：５〜５０モル％、希土類酸化物または遷移金属酸化物：０．１〜２０モル％で、５成分の合計が１００モル％となるオキシ窒化物ガラスを母体材料としている。 The phosphor described in Patent Document 2 is composed of rare earth ions such as Eu 2 +, Eu 3+ , Ce 3+ , Tb 3+ or Cr 3+ , in which a part of the Ca 2+ ions of the base material is the emission center. It is synthesized by substituting with transition metal ions such as Mn 2+ , and in terms of mol%, CaCO 3 is converted to CaO: 20 to 50 mol%, Al 2 O 3 : 0 to 30 mol%, SiO : 25 to 60 mol%, AlN: 5 to 50 mol%, rare earth oxide or transition metal oxide: 0.1 to 20 mol%, and oxynitride glass in which the total of the five components is 100 mol% is the base material It is said.

また、青色ＬＥＤから放射される青色光に対し、黄色から黄オレンジ色までのルミネセンス光を発生するユウロピウムで活性化されたアルカリ土類金属オルト珪酸塩蛍光体が知られている（例えば、特許文献３参照。）。
特開平１０−２４２５１３号公報（［００１８］〜［００２０］、図１） 特開２００１−２１４１６２号公報（［０００８］〜［０００９］） 特表２００４−５１６６８８号公報（［００１３］） Further, an alkaline earth metal orthosilicate phosphor activated with europium that emits luminescence light from yellow to yellow orange with respect to blue light emitted from a blue LED is known (for example, patents). Reference 3).
Japanese Patent Laid-Open No. 10-242513 ([0018] to [0020], FIG. 1) JP 2001-214162 A ([0008] to [0009]) Japanese translation of PCT publication No. 2004-516688 ([0013])

しかし、特許文献１および２に記載された発光装置によると、白色光を生じさせる青色光と黄色光は、いずれもＬＥＤチップの発光に伴って生じるため、例えば、発光装置によって蛍光体量にばらつきがある場合、励起光量の差が生じて白色の度合いに個体差が生じる。また、蛍光体の劣化によって励起効率が低下した場合についても白色の度合いが変化する。このような場合に青色光および黄色光の混合状態を変化させることができないという問題がある。   However, according to the light emitting devices described in Patent Documents 1 and 2, since both blue light and yellow light that generate white light are generated along with the light emission of the LED chip, for example, the amount of phosphor varies depending on the light emitting device. If there is, there is a difference in the amount of excitation light, resulting in individual differences in the degree of whiteness. Further, the degree of whiteness also changes when the excitation efficiency is reduced due to the deterioration of the phosphor. In such a case, there is a problem that the mixed state of blue light and yellow light cannot be changed.

従って、本発明の目的は、蛍光体量のばらつきや励起効率の低下に依存せず、所望の白色度を得ることのできる発光装置を提供することにある。   Accordingly, an object of the present invention is to provide a light emitting device capable of obtaining a desired whiteness without depending on variations in the amount of phosphor and a decrease in excitation efficiency.

本発明は、上記した目的を達成するため、第１の発光波長領域の光を放射する第１の発光素子と、前記第１の発光波長領域の光によって励起されて励起光を放射する蛍光体と、前記蛍光体を第２の発光波長領域の光で励起して前記励起光を放射させる第２の発光素子とを有し、前記第１の発光素子は青色光を放射する青色発光素子であり、前記第２の発光素子は紫外光を放射する紫外光発光素子であり、前記蛍光体は、前記第１および前記第２の発光波長領域の光で励起されることによって黄色の前記励起光を放射することを特徴とする発光装置を提供する。 In order to achieve the above object, the present invention provides a first light emitting element that emits light in a first emission wavelength region, and a phosphor that emits excitation light when excited by light in the first emission wavelength region. When the phosphor is excited by light of the second light-emitting wavelength region have a second light-emitting element for emitting the excitation light, the first light emitting element is a blue light emitting element that emits blue light The second light-emitting element is an ultraviolet light-emitting element that emits ultraviolet light, and the phosphor is excited by light in the first and second emission wavelength regions, thereby generating yellow excitation light. the provides a light emitting device which is characterized in that radiation.

本発明によれば、蛍光体が第１の発光波長領域の光および第２の発光波長領域の光によって励起光を生じるので、青色光および黄色光の光の混合状態を任意に変化させることができ、蛍光体の量や発光状態のばらつきがあっても所望の白色度を得ることができる。   According to the present invention, since the phosphor generates excitation light by the light in the first emission wavelength region and the light in the second emission wavelength region, the mixed state of blue light and yellow light can be arbitrarily changed. In addition, a desired whiteness can be obtained even if there are variations in the amount of phosphor and the light emission state.

（第１の実施の形態）
（ＬＥＤ１の構成）
図１（ａ）および（ｂ）は、第１の実施の形態に係る発光装置としてのＬＥＤを示し、（ａ）は平面図、（ｂ）は（ａ）のＡ−Ａ部における縦断面図である。このＬＥＤ１は、青色光を放射するフェイスアップ型のＬＥＤ素子２Ａと、紫外光を放射するフェイスアップ型のＬＥＤ素子２Ｂと、表面にＬＥＤ素子２Ａ、２Ｂとの電気接続用の配線パターンである配線部３Ａ、３Ｂ、および３Ｃを有する基板３と、基板３と一体化されてＬＥＤ１の外装を形成する本体部４と、本体部４の開口部４０に充填されるとともに本体部４内に収容されるＬＥＤ素子２Ａ，２Ｂ，およびワイヤ７を封止する光透過性の樹脂封止部５と、樹脂封止部５に含有される蛍光体６とを有する。 (First embodiment)
(Configuration of LED1)
1A and 1B show an LED as a light emitting device according to a first embodiment, FIG. 1A is a plan view, and FIG. 1B is a longitudinal sectional view taken along the line AA in FIG. It is. This LED 1 is a wiring pattern that is a wiring pattern for electrical connection between a face-up type LED element 2A that emits blue light, a face-up type LED element 2B that emits ultraviolet light, and LED elements 2A and 2B on the surface. The substrate 3 having the portions 3A, 3B, and 3C, the main body portion 4 that is integrated with the substrate 3 to form the exterior of the LED 1, and the opening 40 of the main body portion 4 is filled and accommodated in the main body portion 4. Light-transmitting resin sealing portion 5 for sealing the LED elements 2A and 2B and the wire 7 and the phosphor 6 contained in the resin sealing portion 5.

ＬＥＤ素子２Ａは、窒化物系化合物半導体材料によって形成されて、発光スペクトルの主ピークが４５０〜４８０ｎｍの発光波長を有する青色光を放射する。   The LED element 2A is formed of a nitride-based compound semiconductor material, and emits blue light having a main emission spectrum wavelength of 450 to 480 nm.

ＬＥＤ素子２Ｂは、窒化物系化合物半導体材料によって形成されて、発光スペクトルの主ピークが３７０〜４００ｎｍの発光波長を有する紫外光を放射する。   The LED element 2B is formed of a nitride-based compound semiconductor material and emits ultraviolet light having a main peak of an emission spectrum having an emission wavelength of 370 to 400 nm.

基板３は、セラミックによって形成されており、基板上にＬＥＤ素子２Ａ，２Ｂ，および外部回路との電気的接続を行うタングステン薄膜からなる配線部３Ａ，３Ｂ，および３Ｃが形成されている。なお、配線部３Ａ，３Ｂ，および３Ｃは、銅箔等の導電性薄膜で形成することも可能である。配線部３Ａは共通電極であり、配線部３Ｂおよび３ＣとともにＬＥＤ素子２Ａ，２Ｂの電極部とワイヤ７を介して電気的に接続される。また、配線部３Ａ，３Ｂ，および３Ｃは、基板３の底面において図示しない外部回路と半田リフロー等によって電気的に接続される。なお、基板３は、セラミック以外の他の材料としてガラスエポキシ等によって形成することも可能である。   The substrate 3 is made of ceramic, and wiring portions 3A, 3B, and 3C made of a tungsten thin film that is electrically connected to the LED elements 2A, 2B and an external circuit are formed on the substrate. Note that the wiring portions 3A, 3B, and 3C can be formed of a conductive thin film such as a copper foil. The wiring part 3A is a common electrode and is electrically connected to the electrode parts of the LED elements 2A and 2B through the wire 7 together with the wiring parts 3B and 3C. The wiring portions 3A, 3B, and 3C are electrically connected to an external circuit (not shown) on the bottom surface of the substrate 3 by solder reflow or the like. The substrate 3 can also be formed of glass epoxy or the like as a material other than ceramic.

本体部４は、ナイロンによって形成されており、ＬＥＤ素子２Ａ，２Ｂの収容空間を形成するように光放射方向に開口された円形状の開口部４０を有し、開口部４０の内側には傾斜面４Ａが設けられている。また、本体部４の底には配線部３Ａ，３Ｂ，および３Ｃが露出しており、ＬＥＤ素子２Ａ，２Ｂは接着剤によって配線部３Ａ上に接着固定されている。なお、ナイロン以外の他の樹脂材料によって形成することも可能である。   The main body 4 is made of nylon, and has a circular opening 40 opened in the light emission direction so as to form a housing space for the LED elements 2A and 2B. A surface 4A is provided. Further, the wiring portions 3A, 3B, and 3C are exposed at the bottom of the main body portion 4, and the LED elements 2A and 2B are bonded and fixed on the wiring portion 3A with an adhesive. It is also possible to form with a resin material other than nylon.

樹脂封止部５は、シリコン樹脂によって形成されており、蛍光体６を含有している。蛍光体６は、ＬＥＤ素子２Ａから放射される４５０〜４８０ｎｍの青色光、ＬＥＤ素子２Ｂから放射される３７０〜４００ｎｍの紫外光によって励起されることにより５５０〜５７０ｎｍの発光波長の光を放射する、Ｅｕで賦活された希土類珪酸塩蛍光体によって形成されている。   The resin sealing part 5 is made of silicon resin and contains a phosphor 6. The phosphor 6 emits light having an emission wavelength of 550 to 570 nm by being excited by 450 to 480 nm of blue light emitted from the LED element 2A and 370 to 400 nm of ultraviolet light emitted from the LED element 2B. It is formed by a rare earth silicate phosphor activated with Eu.

（ＬＥＤ１の動作）
以下に、第１の実施の形態に係るＬＥＤ１の動作について説明する。 (Operation of LED1)
Below, operation | movement of LED1 which concerns on 1st Embodiment is demonstrated.

配線部３Ａ，３Ｂ，および３Ｃを図示しない電源部に接続して電圧を印加することにより、ＬＥＤ素子２Ａ，２Ｂが発光する。樹脂封止部５に含有される蛍光体６は、ＬＥＤ素子２Ａ，２Ｂから放射される青色光および紫外光によって励起されて黄色の励起光を放射する。この青色光と黄色の励起光とが混合されることによって白色を生じ、本体部４の外部に放射される。   By connecting the wiring portions 3A, 3B, and 3C to a power source portion (not shown) and applying a voltage, the LED elements 2A and 2B emit light. The phosphor 6 contained in the resin sealing portion 5 is excited by blue light and ultraviolet light emitted from the LED elements 2A and 2B to emit yellow excitation light. The blue light and the yellow excitation light are mixed to produce a white color, which is emitted to the outside of the main body 4.

（第１の実施の形態の効果）
上記した第１の実施の形態によると、以下の効果が得られる。
（１）樹脂封止部５に含有される蛍光体６は、ＬＥＤ素子２Ａから放射される青色光だけでなくＬＥＤ素子２Ｂから放射される紫外光によっても励起されるようにしたので、青色光の放射を変化させることなく励起光の放射を可変させることができ、所望の白色度を得ることができる。このため、ＬＥＤ素子２Ａ，２Ｂに対する駆動制御に基づいて青色光の光量と励起光の光量を調整することにより、青色寄りの白色から黄色寄りの任意の白色を容易に得ることができ、色度範囲のバリエーションを付与することができる。 (Effects of the first embodiment)
According to the first embodiment described above, the following effects are obtained.
(1) The phosphor 6 contained in the resin sealing portion 5 is excited not only by the blue light emitted from the LED element 2A but also by the ultraviolet light emitted from the LED element 2B. The radiation of the excitation light can be varied without changing the radiation of the light, and a desired whiteness can be obtained. For this reason, by adjusting the light quantity of the blue light and the light quantity of the excitation light based on the drive control for the LED elements 2A and 2B, it is possible to easily obtain any white color from the blue color to the yellow color. Range variations can be imparted.

（２）ＬＥＤ１におけるＬＥＤ素子２Ａの発光特性、蛍光体量のばらつきがあっても青色光と黄色光の混合状態を可変させることによって所望の白色度が得られる。 (2) The desired whiteness can be obtained by varying the mixed state of blue light and yellow light even if there is a variation in the light emission characteristics of the LED element 2A and the amount of phosphor in the LED 1.

なお、第１の実施の形態では、樹脂封止部５に１種の蛍光体６が含有された構成を説明したが、複数の蛍光体を樹脂封止部５に含有させても良い。例えば、赤色やオレンジ色の励起光を放射する蛍光体を含有させることで演色性を付与することができる。   In the first embodiment, the configuration in which one type of phosphor 6 is contained in the resin sealing portion 5 has been described, but a plurality of phosphors may be contained in the resin sealing portion 5. For example, color rendering can be imparted by including a phosphor that emits red or orange excitation light.

また、ＬＥＤ素子２Ａ，２Ｂについてもフェイスアップ型のＬＥＤ素子に限定されることなく、配線部３Ａ，３Ｂ，および３Ｃに対してフリップ実装するＬＥＤ素子であっても良い。   Further, the LED elements 2A and 2B are not limited to face-up type LED elements, and may be LED elements that are flip-mounted with respect to the wiring portions 3A, 3B, and 3C.

（第２の実施の形態）
（ＬＥＤ１の構成）
図２は、第２の実施の形態に係る発光装置としてのＬＥＤの縦断面図である。以下の説明において、第１の実施の形態と同一の構成および機能を有する部分については共通の符号を付している。 (Second Embodiment)
(Configuration of LED1)
FIG. 2 is a longitudinal sectional view of an LED serving as a light emitting device according to the second embodiment. In the following description, portions having the same configuration and function as those of the first embodiment are denoted by common reference numerals.

このＬＥＤ１は、シリコン樹脂からなる樹脂封止部５と、樹脂封止部５の表層に蛍光体６を含有させたシリコン樹脂からなる蛍光体層６０とを積層状に設けた構成において第１の実施の形態と相違している。   This LED 1 has a first structure in which a resin sealing portion 5 made of a silicon resin and a phosphor layer 60 made of a silicon resin containing the phosphor 6 in the surface layer of the resin sealing portion 5 are provided in a laminated form. This is different from the embodiment.

（第２の実施の形態の効果）
上記した第２の実施の形態によると、樹脂封止部５の表層に蛍光体層６０を設けているので、第１の実施の形態の好ましい効果に加えて蛍光体６の使用量を低減することができ、ＬＥＤ１のコストダウンを実現できる。また、蛍光体層６０に対してＬＥＤ素子２Ａ，２Ｂから放射される青色光，紫外光が充分に照射されるので、蛍光体６の励起効率に優れる。 (Effect of the second embodiment)
According to the second embodiment described above, since the phosphor layer 60 is provided on the surface layer of the resin sealing portion 5, the usage amount of the phosphor 6 is reduced in addition to the preferable effects of the first embodiment. Therefore, the cost of the LED 1 can be reduced. Further, since the phosphor layer 60 is sufficiently irradiated with the blue light and the ultraviolet light emitted from the LED elements 2A and 2B, the excitation efficiency of the phosphor 6 is excellent.

（第３の実施の形態）
（ＬＥＤ１の構成）
図３は、第３の実施の形態に係る発光装置としてのＬＥＤの縦断面図である。このＬＥＤ１は、軟金属のリードからなる配線部３Ａ，３Ｂ，および３Ｃに対してＬＥＤ素子２Ａ，２Ｂを実装したリード搭載型ＬＥＤであり、ＬＥＤ素子２Ａ，２Ｂは、配線部３Ｃの上部に設けられる素子搭載部３１に接着剤によって接着固定されている。また、ＬＥＤ素子２Ａ，２Ｂおよび配線部３Ａ，３Ｂ，３Ｃは、蛍光体６を含有した樹脂封止部８によって封止されており、樹脂封止部８の光放射側は半球状に形成されている。 (Third embodiment)
(Configuration of LED1)
FIG. 3 is a longitudinal sectional view of an LED serving as a light emitting device according to the third embodiment. This LED 1 is a lead-mounted LED in which LED elements 2A and 2B are mounted on wiring parts 3A, 3B, and 3C made of soft metal leads, and LED elements 2A and 2B are provided above wiring part 3C. The element mounting portion 31 is bonded and fixed with an adhesive. Further, the LED elements 2A, 2B and the wiring portions 3A, 3B, 3C are sealed by a resin sealing portion 8 containing the phosphor 6, and the light emission side of the resin sealing portion 8 is formed in a hemispherical shape. ing.

配線部３Ａ，３Ｂ，および３Ｃは、銅又は銅合金をプレス加工することによって形成されており、表面にＮｉめっきが施されている。   The wiring portions 3A, 3B, and 3C are formed by pressing copper or a copper alloy, and the surface is plated with Ni.

樹脂封止部８は、エポキシ樹脂に珪酸塩蛍光体からなる蛍光体６を含有して形成されており、蛍光体６は、ＬＥＤ素子２Ａ，２Ｂから放射される青色光および紫外光によって励起されて黄色の励起光を放射する。なお、樹脂封止部８を形成する樹脂材料はエポキシ樹脂に限定されず、例えば、シリコン樹脂を用いても良い。   The resin sealing portion 8 is formed by containing a phosphor 6 made of a silicate phosphor in an epoxy resin, and the phosphor 6 is excited by blue light and ultraviolet light emitted from the LED elements 2A and 2B. Emits yellow excitation light. In addition, the resin material which forms the resin sealing part 8 is not limited to an epoxy resin, For example, you may use a silicon resin.

（ＬＥＤ１の動作）
以下に、第３の実施の形態に係るＬＥＤ１の動作について説明する。 (Operation of LED1)
Below, operation | movement of LED1 which concerns on 3rd Embodiment is demonstrated.

配線部３Ａ，３Ｂ，および３Ｃを図示しない電源部に接続して電圧を印加することにより、ＬＥＤ素子２Ａ，２Ｂが発光する。樹脂封止部８に含有される蛍光体６は、ＬＥＤ素子２Ａ，２Ｂから放射される青色光および紫外光によって励起されて黄色の励起光を放射する。この青色光と黄色の励起光とが混合されることによって生じた白色の光は、樹脂封止部８の半球形状に応じた方向に集光されて放射される。   By connecting the wiring portions 3A, 3B, and 3C to a power source portion (not shown) and applying a voltage, the LED elements 2A and 2B emit light. The phosphor 6 contained in the resin sealing portion 8 is excited by blue light and ultraviolet light emitted from the LED elements 2A and 2B to emit yellow excitation light. White light generated by mixing the blue light and yellow excitation light is condensed and emitted in a direction corresponding to the hemispherical shape of the resin sealing portion 8.

（第３の実施の形態の効果）
上記した第３の実施の形態によると、リードに実装されたＬＥＤ素子２Ａ，２Ｂを蛍光体６を含有する樹脂封止部８で封止したものについても第１の実施の形態と同様に所望の白色度を得ることができ、ＬＥＤ素子２Ａ，２Ｂに対する駆動制御に基づいて青色光の光量と励起光の光量を調整することにより、青色寄りの白色から黄色寄りの任意の白色を容易に得ることができ、色度範囲のバリエーションを付与することができる。なお、樹脂封止部８に設けた半球形状に変えて外部放射する光の集光、拡散に応じた光学形状を設けることも可能である。 (Effect of the third embodiment)
According to the third embodiment described above, the LED elements 2A and 2B mounted on the leads are sealed with the resin sealing portion 8 containing the phosphor 6 as well as the first embodiment. Can be obtained, and by adjusting the light quantity of the blue light and the light quantity of the excitation light based on the drive control for the LED elements 2A and 2B, it is possible to easily obtain any white color from the blue color to the yellow color. And variations in the chromaticity range can be imparted. In addition, it is also possible to provide an optical shape corresponding to the collection and diffusion of light radiated to the outside instead of the hemispherical shape provided in the resin sealing portion 8.

（第４の実施の形態）
（ＬＥＤ１の構成）
図４は、第４の実施の形態に係る発光装置としてのＬＥＤの縦断面図である。このＬＥＤ１は、第３の実施の形態で説明したリード搭載型ＬＥＤの樹脂封止部８を透明なエポキシ樹脂で形成し、その外表面に蛍光体６を含有した蛍光体層６０を薄膜状に設けた構成において第３の実施の形態と相違している。 (Fourth embodiment)
(Configuration of LED1)
FIG. 4 is a longitudinal sectional view of an LED as a light emitting device according to the fourth embodiment. In this LED 1, the resin-sealed portion 8 of the lead-mounted LED described in the third embodiment is formed of a transparent epoxy resin, and the phosphor layer 60 containing the phosphor 6 on the outer surface thereof is formed into a thin film. The provided configuration is different from the third embodiment.

蛍光体層６０は、例えば、バインダーに蛍光体を溶解した蛍光体溶液を作成し、この蛍光体溶液に対して樹脂封止部８をディッピングすることにより設ける方法、又は蛍光体溶液を樹脂封止部８表面に塗布する方法等により設ける。   For example, the phosphor layer 60 is prepared by preparing a phosphor solution in which a phosphor is dissolved in a binder and dipping the resin sealing portion 8 into the phosphor solution, or by encapsulating the phosphor solution with a resin. It is provided by a method of applying to the surface of the part 8.

（第４の実施の形態の効果）
上記した第４の実施の形態によると、半球球状に形成される樹脂封止部８の表面に均一な厚さで蛍光体層６０を容易に設けることができる。また、ＬＥＤ素子２Ａ，２Ｂから放射される青色光および紫外光が充分に蛍光体層６０に照射されることにより、波長変換効率を向上させることができる。なお、蛍光体層６０は、湿気等による劣化を防ぐものとして透光性を有するコーティングを施すことにより表面を保護するようにしても良い。 (Effect of the fourth embodiment)
According to the above-described fourth embodiment, the phosphor layer 60 can be easily provided with a uniform thickness on the surface of the resin sealing portion 8 formed in a hemispherical shape. Moreover, the wavelength conversion efficiency can be improved by sufficiently irradiating the phosphor layer 60 with blue light and ultraviolet light emitted from the LED elements 2A and 2B. In addition, you may make it protect the surface of the fluorescent substance layer 60 by providing the coating which has translucency as what prevents deterioration by humidity etc.

また、蛍光体層６０は、ＬＥＤ１の製造工程とは別工程で形成されたキャップ状の蛍光体層を組み合わせる構成としても良い。   Further, the phosphor layer 60 may be configured to combine a cap-like phosphor layer formed in a process different from the manufacturing process of the LED 1.

（第５の実施の形態）
（ＬＥＤ１の構成）
図５は、第５の実施の形態に係る発光装置としてのＬＥＤの縦断面図である。このＬＥＤ１は、第３の実施の形態で説明したリード搭載型ＬＥＤの配線部３Ｃの上部にカップ部３０を設け、このカップ部３０内にＬＥＤ素子２Ａ，２Ｂを収容するとともに蛍光体６を含有したコーティングで封止してコーティング部６１を設けた構成において第３の実施の形態と相違している。 (Fifth embodiment)
(Configuration of LED1)
FIG. 5 is a longitudinal sectional view of an LED as a light emitting device according to the fifth embodiment. This LED 1 is provided with a cup portion 30 above the wiring portion 3C of the lead-mounted LED described in the third embodiment, and contains the LED elements 2A and 2B in the cup portion 30 and contains the phosphor 6. The configuration in which the coating portion 61 is provided by sealing with the above-described coating is different from the third embodiment.

カップ部３０は、配線部３Ｃのプレス加工時に圧痕形成され、素子搭載部３１に搭載されるＬＥＤ素子２Ａ，２Ｂから放射される光を反射して外部放射を促すように傾斜した側面を有して形成されている。   The cup part 30 is formed with an indentation when the wiring part 3C is pressed, and has an inclined side surface so as to reflect light emitted from the LED elements 2A and 2B mounted on the element mounting part 31 and promote external radiation. Is formed.

コーティング部６１は、シリコン樹脂に珪酸塩蛍光体からなる蛍光体６を混合したコーティングを充填することによって形成されている。   The coating part 61 is formed by filling a coating in which a phosphor 6 made of a silicate phosphor is mixed with a silicon resin.

（第５の実施の形態の効果）
上記した第５の実施の形態によると、配線部３Ｃの上部に設けたカップ部３０内にＬＥＤ素子２Ａ，２Ｂを収容し、蛍光体６を含有したコーティングでカップ部３０を封止するようにしたので、蛍光体６の使用量を低減でき、コストダウンを図れる。また、ＬＥＤ素子２Ａ，２Ｂが収容されたカップ部３０をコーティングで封止しているので、外部放射性に優れる波長変換型のＬＥＤ１が得られる。 (Effect of 5th Embodiment)
According to the fifth embodiment described above, the LED elements 2A and 2B are accommodated in the cup part 30 provided on the upper part of the wiring part 3C, and the cup part 30 is sealed with the coating containing the phosphor 6. As a result, the amount of phosphor 6 used can be reduced, and the cost can be reduced. Moreover, since the cup part 30 in which the LED elements 2A and 2B are accommodated is sealed with a coating, the wavelength conversion type LED 1 having excellent external radiation can be obtained.

なお、上記した第１から第５の実施の形態では、珪酸塩蛍光体を用いたＬＥＤを説明したが、珪酸塩蛍光体以外の他の蛍光体を用いても良く、例えば、オキシ窒化物ガラス蛍光体、ニトリドシリケート系蛍光体等の、紫外光および青色光によって励起可能なものであれば良い。   In the first to fifth embodiments described above, LEDs using silicate phosphors have been described. However, phosphors other than silicate phosphors may be used. For example, oxynitride glass Any phosphor that can be excited by ultraviolet light and blue light, such as a phosphor and a nitride silicate phosphor, may be used.

（ａ）および（ｂ）は、第１の実施の形態に係る発光装置としてのＬＥＤを示し、（ａ）は平面図、（ｂ）は（ａ）のＡ−Ａ部における縦断面図である。(A) And (b) shows LED as a light-emitting device which concerns on 1st Embodiment, (a) is a top view, (b) is a longitudinal cross-sectional view in the AA part of (a). . 第２の実施の形態に係る発光装置としてのＬＥＤの縦断面図である。It is a longitudinal cross-sectional view of LED as a light-emitting device based on 2nd Embodiment. 第３の実施の形態に係る発光装置としてのＬＥＤの縦断面図である。It is a longitudinal cross-sectional view of LED as a light-emitting device which concerns on 3rd Embodiment. 第４の実施の形態に係る発光装置としてのＬＥＤの縦断面図である。It is a longitudinal cross-sectional view of LED as a light-emitting device based on 4th Embodiment. 第５の実施の形態に係る発光装置としてのＬＥＤの縦断面図である。It is a longitudinal cross-sectional view of LED as a light-emitting device which concerns on 5th Embodiment.

符号の説明Explanation of symbols

１…ＬＥＤ、２Ａ，２Ｂ，…ＬＥＤ素子、３…基板、３Ａ，３Ｂ，３Ｃ…配線部、４…本体部、４Ａ…傾斜面、５…樹脂封止部、６…蛍光体、７…ワイヤ、８…樹脂封止部、３０…カップ部、３１…素子搭載部、４０…開口部、６０…蛍光体層、６１…コーティング部 DESCRIPTION OF SYMBOLS 1 ... LED, 2A, 2B, ... LED element, 3 ... Board | substrate, 3A, 3B, 3C ... Wiring part, 4 ... Main-body part, 4A ... Inclined surface, 5 ... Resin sealing part, 6 ... Phosphor, 7 ... Wire , 8 ... Resin sealing part, 30 ... Cup part, 31 ... Element mounting part, 40 ... Opening part, 60 ... Phosphor layer, 61 ... Coating part

Claims (5)

第１の発光波長領域の光を放射する第１の発光素子と、
前記第１の発光波長領域の光によって励起されて励起光を放射する蛍光体と、
前記蛍光体を第２の発光波長領域の光で励起して前記励起光を放射させる第２の発光素子とを有し、
前記第１の発光素子は青色光を放射する青色発光素子であり、前記第２の発光素子は紫外光を放射する紫外光発光素子であり、
前記蛍光体は、前記第１および前記第２の発光波長領域の光で励起されることによって黄色の前記励起光を放射することを特徴とする発光装置。 A first light emitting element that emits light in a first emission wavelength region;
A phosphor that is excited by light in the first emission wavelength region and emits excitation light;
The phosphor is excited by light of the second light-emitting wavelength region have a second light-emitting element for emitting the excitation light,
The first light emitting element is a blue light emitting element that emits blue light, and the second light emitting element is an ultraviolet light emitting element that emits ultraviolet light,
The phosphor emits yellow excitation light by being excited by light in the first and second emission wavelength regions . 前記蛍光体は、珪酸塩蛍光体であることを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the phosphor is a silicate phosphor. 前記第１の発光素子は、４５０〜４８０ｎｍの青色光を放射し、The first light emitting element emits blue light of 450 to 480 nm,
前記第２の発光素子は、３７０〜４００ｎｍの紫外光を放射し、The second light emitting element emits ultraviolet light of 370 to 400 nm,
前記蛍光体は、５５０〜５７０ｎｍの黄色光を放射する請求項２に記載の発光装置。The light emitting device according to claim 2, wherein the phosphor emits yellow light of 550 to 570 nm. 前記第１の発光素子及び前記第２の発光素子を封止し、前記蛍光体を含有する光透過性の樹脂封止部を有することを特徴とする請求項１から３のいずれか１項に記載の発光装置。The first light-emitting element and the second light-emitting element are sealed, and a light-transmitting resin sealing portion containing the phosphor is provided. The light-emitting device of description. 黄色の前記励起光を放射する前記蛍光体の他に、赤色又はオレンジ色の励起光を放射する蛍光体をさらに有することを特徴とする請求項１から４のいずれか１項に記載の発光装置。5. The light emitting device according to claim 1, further comprising a phosphor that emits red or orange excitation light in addition to the phosphor that emits yellow excitation light. 6. .
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