JP4532845B2 - 管理システム及び方法並びにデバイス製造方法 - Google Patents

管理システム及び方法並びにデバイス製造方法 Download PDF

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Publication number
JP4532845B2
JP4532845B2 JP2003125440A JP2003125440A JP4532845B2 JP 4532845 B2 JP4532845 B2 JP 4532845B2 JP 2003125440 A JP2003125440 A JP 2003125440A JP 2003125440 A JP2003125440 A JP 2003125440A JP 4532845 B2 JP4532845 B2 JP 4532845B2
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Japan
Prior art keywords
alignment
wafer
accuracy
parameter value
data
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Expired - Fee Related
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JP2003125440A
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Japanese (ja)
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JP2004031929A5 (enExample
JP2004031929A (ja
Inventor
武彦 鈴木
秀樹 稲
哲 大石
隆宏 松本
孝一 千徳
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Canon Inc
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Canon Inc
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2003125440A 2002-04-30 2003-04-30 管理システム及び方法並びにデバイス製造方法 Expired - Fee Related JP4532845B2 (ja)

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JP2003125440A JP4532845B2 (ja) 2002-04-30 2003-04-30 管理システム及び方法並びにデバイス製造方法

Applications Claiming Priority (2)

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JP2002129326 2002-04-30
JP2003125440A JP4532845B2 (ja) 2002-04-30 2003-04-30 管理システム及び方法並びにデバイス製造方法

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JP2004031929A JP2004031929A (ja) 2004-01-29
JP2004031929A5 JP2004031929A5 (enExample) 2006-06-22
JP4532845B2 true JP4532845B2 (ja) 2010-08-25

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101087515B1 (ko) * 2004-03-31 2011-11-28 가부시키가이샤 니콘 얼라인먼트 조건 결정 방법 및 장치, 그리고 노광 방법 및장치
US7259828B2 (en) * 2004-05-14 2007-08-21 Asml Netherlands B.V. Alignment system and method and device manufactured thereby
JP2006140204A (ja) * 2004-11-10 2006-06-01 Nikon Corp 計測条件の最適化方法、該最適化方法を使用した位置計測方法、該位置計測方法を使用した位置合わせ方法、該位置合わせ方法を使用したデバイス製造方法、計測条件の最適化システム、該最適化システムを使用した位置計測装置及び該位置計測装置を使用した露光装置
JP2007027573A (ja) 2005-07-20 2007-02-01 Canon Inc 露光装置および露光方法ならびにこれらの露光装置または露光方法を用いたデバイス製造方法
JP4984038B2 (ja) * 2006-07-27 2012-07-25 株式会社ニコン 管理方法
US8175831B2 (en) 2007-04-23 2012-05-08 Kla-Tencor Corp. Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
JP5634864B2 (ja) 2007-05-30 2014-12-03 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ リソグラフィック・プロセスに於ける、プロセス制御方法およびプロセス制御装置
JP2009283600A (ja) * 2008-05-21 2009-12-03 Nec Electronics Corp 露光アライメント調整方法、露光アライメント調整プログラム、及び露光装置
TWI735323B (zh) * 2020-08-31 2021-08-01 南亞塑膠工業股份有限公司 改性熱塑性聚酯彈性體及透溼防水膜
CN118610132B (zh) * 2024-08-09 2024-10-29 青岛天仁微纳科技有限责任公司 一种基于晶圆检测数据的生成设备参数调节方法及系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62242866A (ja) * 1986-04-15 1987-10-23 Matsushita Electric Ind Co Ltd 部品検査方法
JP2626637B2 (ja) * 1995-08-28 1997-07-02 株式会社ニコン 位置合わせ方法
JPH0992591A (ja) * 1995-09-21 1997-04-04 Nikon Corp 位置合わせ方法
JPH10284403A (ja) * 1997-04-04 1998-10-23 Ricoh Co Ltd ウエハのリソグラフィー装置
JP3003646B2 (ja) * 1997-09-16 2000-01-31 株式会社ニコン 投影露光装置
JPH11297739A (ja) * 1998-04-07 1999-10-29 Mitsubishi Electric Corp 半導体組立装置及び半導体装置
JP2000235949A (ja) * 1998-12-17 2000-08-29 Tokyo Electron Ltd 塗布現像処理装置及び塗布現像処理方法
JP2001134798A (ja) * 1999-11-08 2001-05-18 Nippon Chem Ind Co Ltd 製品品質管理情報システム

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