JP4518383B2 - TAB lead tape made of polyphenylene ether resin - Google Patents

Description

  The present invention relates to a TAB lead tape made of polyphenylene ether resin, which is excellent in water absorption resistance, heat resistance, heat shrinkability, and hole punching.

  The present invention relates to a TAB tape that is carried by a spacer tape having excellent heat resistance for protecting a printing tape on which a large number of semiconductor devices are automatically mounted, that is, a tape automated bonding tape (hereinafter referred to as TAB tape). The present invention relates to a lead tape that is wound around a reel and connected to the beginning and end of winding of a TAB tape used for mounting on a semiconductor driver. The TAB lead tape does not deform even when heated in the oven in the process of curing the encapsulant of the semiconductor device attached to the TAB, and exhibits a thermal contraction rate substantially equivalent to that of the TAB tape or TAB spacer tape. Is required.

  Conventionally, super engineering plastics such as polyimide, polyetherimide, and polyethylene naphthalate have been used for these TAB lead tapes. However, all of these tapes have a large specific gravity and high water absorption, and there is a limit to the number of times they can be reused. Furthermore, as lead tape, guide holes for meshing with the roll are punched out on both sides of the raw tape, but at this time, as a flash, there is a problem that a long whisker-like object protrudes from the tape or powder is generated. Yes, and costly and uneconomical. Accordingly, a TAB lead tape that is inexpensive, has a small specific gravity, and is excellent in water absorption resistance in addition to the aforementioned heat resistance and thermal shrinkage ratio is desired. In particular, a long whisker-like shape generated as a flash may damage a semiconductor device, and there is a high need for a resin lead tape having excellent punchability.

Conventionally, as a TAB spacer tape, it has been proposed to use a sheet made of a thermoplastic resin having a glass transition temperature of 180 ° C. or more. However, it is a substantial polyetherimide and has sufficient specific gravity, water absorption resistance, and punchability. (For example, see Patent Document 1).
On the other hand, although a resin composition and a sheet in which liquid crystalline polyester is blended with polyphenylene ether have been proposed, there is no description about a TAB lead tape (for example, see Patent Documents 2 and 3).
No. 7-35391 JP 2002-241515 A JP 2002-241601 A

  An object of the present invention is to provide a polyphenylene ether resin TAB lead tape having excellent water absorption resistance, heat resistance, heat shrinkability, and hole punching properties.

  As a result of intensive studies on the technology to achieve the above-mentioned problems, the present inventors have found that a TAB lead tape obtained by molding a composition containing a polyphenylene ether resin has excellent water absorption resistance, heat resistance, and heat shrinkage. The present invention has been completed by finding that, with regard to the hole punchability, in particular, the beard-like protrusions and the flashes of powder are not at a very high level.

That is, the present invention
[1] A TAB lead tape obtained by molding the polyphenylene ether resin (A),
[2] The TAB lead tape according to [1], which is obtained by molding a resin composition containing the liquid crystalline polyester (B) in the polyphenylene ether resin (A),
[3] The TAB lead according to [2], obtained by molding a resin composition containing 50 to 99.5 parts by mass of the polyphenylene ether resin (A) and 0.5 to 50 parts by mass of the liquid crystal polyester (B). tape,
[4] [2] or [ 2] obtained by molding a resin composition containing 0.1 to 5 parts by mass of the silane compound (D) with respect to 100 parts by mass of the total of the components (A) and (B) . 3] TAB lead tape,
[5] The TAB lead tape according to [4] , wherein the component (D) is a silane compound having an amino group,
[6] Any one of [2] to [5] obtained by molding a resin composition containing (A) component 70 to 99.5 parts by mass and (B) component 0.5 to 30 parts by mass. TAB lead tape as described in
It is.

  According to the present invention, it has become possible to provide a TAB lead tape made of polyphenylene ether resin that is excellent in water absorption resistance, heat resistance, heat shrinkability, and hole punching.

Hereinafter, the present invention will be specifically described.
The (A) polyphenylene ether resin used in the present invention has a repeating unit structure of the following (formula 1), and has a reduced viscosity (0.5 g / dl, chloroform solution, measured at 30 ° C.) of 0.15 to 1. Homopolymers and / or copolymers in the range of 0 dl / g. A more preferred reduced viscosity is in the range of 0.20 to 0.70 dl / g, most preferably in the range of 0.40 to 0.60.

(R ₁ and R ₄ each independently represents hydrogen, primary or secondary lower alkyl, phenyl, aminoalkyl or hydrocarbon oxy. R ₂ and R ₃ each independently represent hydrogen Represents primary or secondary lower alkyl or phenyl.)
Specific examples of the polyphenylene ether resin include poly (2,6-dimethyl-1,4-phenylene ether), poly (2-methyl-6-ethyl-1,4-phenylene ether), and poly (2- Methyl-6-phenyl-1,4-phenylene ether), poly (2,6-dichloro-1,4-phenylene ether) and the like, and 2,6-dimethylphenol and other phenols (for example, And a polyphenylene ether copolymer such as a copolymer with 2,3,6-trimethylphenol or 2-methyl-6-butylphenol). Of these, poly (2,6-dimethyl-1,4-phenylene ether) and a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol are preferable, and poly (2,6-dimethyl-1 , 4-phenylene ether).

As an example of the method for producing (A) polyphenylene ether used in the present invention, there is a method of oxidative polymerization of 2,6-xylenol using a complex of cuprous salt and amine described in US Pat. No. 3,306,874 as a catalyst. is there.
The methods described in U.S. Pat. Nos. 3,306,875, 3,257,357 and 3,257,358, JP-B-52-17880, JP-A-50-51197, and JP-A-63-152628 are also included. (A) It is preferable as a method for producing polyphenylene ether.
The (A) polyphenylene ether resin of the present invention may be used as a powder after polymerization, or under an atmosphere of nitrogen gas or non-nitrogen gas, devolatilization or non-devolatilization using an extruder or the like. It may be used after being pelletized by melting and kneading in the above.

  The (A) polyphenylene ether resin of the present invention includes polyphenylene ethers functionalized with various dienophile compounds. Examples of various dienophile compounds include maleic anhydride, maleic acid, fumaric acid, phenylmaleimide, itaconic acid, acrylic acid, methacrylic acid, methyl allylate, methyl methacrylate, glycidyl acrylate, glycidyl methacrylate, stearyl acrylate, styrene, and the like. Can be mentioned. Furthermore, as a method of functionalizing with these dienophile compounds, an extruder or the like may be used in the presence or absence of a radical generator, and functionalization may be performed in a molten state under devolatilization or non-devolatilization. Alternatively, the functionalization may be performed in a non-molten state, that is, in a temperature range from room temperature to the melting point in the presence or absence of a radical generator. In this case, the melting point of polyphenylene ether is defined by the peak top temperature of the peak observed in the temperature-heat flow graph obtained when the temperature is raised at 20 ° C./min in the differential thermal scanning calorimeter (DSC) measurement. If there are a plurality of peak top temperatures, the peak top temperature is defined as the highest temperature.

  The polyphenylene ether resin (A) of the present invention is a polyphenylene ether resin alone or a mixture of a polyphenylene ether resin and an aromatic vinyl polymer, and further includes a mixture of other resins. Examples of the aromatic vinyl polymer include atactic polystyrene, high impact polystyrene, syndiotactic polystyrene, acrylonitrile-styrene copolymer, and the like. When a mixture of a polyphenylene ether resin and an aromatic vinyl polymer is used, the polyphenylene ether resin is 70 wt% or more, preferably 80 wt% or more with respect to the total amount of the polyphenylene ether resin and the aromatic vinyl polymer. is there.

In the present invention, a TAB lead tape can be obtained by molding with a polyphenylene ether-based resin alone, but it is preferable to contain (B) liquid crystal polyester described below.
The (B) liquid crystal polyester of the present invention is a polyester called a thermotropic liquid crystal polymer, and known ones can be used. For example, a thermotropic liquid crystal polyester mainly composed of p-hydroxybenzoic acid and polyethylene terephthalate, a thermotropic liquid crystal polyester mainly composed of p-hydroxybenzoic acid and 2-hydroxy-6-naphthoic acid, p-hydroxybenzoic acid Examples thereof include thermotropic liquid crystal polyesters mainly composed of acid, 4,4'-dihydroxybiphenyl and terephthalic acid, and are not particularly limited. As the (B) liquid crystal polyester used in the present invention, those composed of the following structural units (a) and / or (b) and, if necessary, the following structural units (c) and / or (d) are preferable.

  Here, the structural units (A) and (B) are respectively a structural unit of a polyester generated from p-hydroxybenzoic acid and a structural unit generated from 2-hydroxy-6-naphthoic acid. By using the structural units (a) and (b), it is possible to obtain the thermoplastic resin composition of the present invention having an excellent balance of mechanical properties such as excellent heat resistance, fluidity and rigidity. X in the structural units (c) and (d) can be independently selected from the following (Formula 2), or one or more of them can be selected.

In the structural formula (c), preferred are structural units formed from ethylene glycol, hydroquinone, 4,4′-dihydroxybiphenyl, 2,6-dihydroxynaphthalene and bisphenol A, and more preferred are ethylene glycol, Structural units formed from 4,4'-dihydroxybiphenyl and hydroquinone, and particularly preferred are structural units formed from ethylene glycol and 4,4'-dihydroxybiphenyl.
In the structural formula (d), preferred are structural units formed from each of terephthalic acid, isophthalic acid and 2,6-dicarboxynaphthalene, and more preferred are structural units formed from each of terephthalic acid and isophthalic acid. It is.

In the structural formula (c) and the structural formula (d), at least one or two or more of the structural units listed above can be used in combination. Specifically, when two or more kinds are used in combination, in the structural formula (c), 1) a structural unit generated from ethylene glycol / a structural unit generated from hydroquinone, 2) a structural unit generated from ethylene glycol / 4,4 Examples include structural units formed from '-dihydroxybiphenyl, 3) structural units formed from hydroquinone / 4, structural units formed from 4,4'-dihydroxybiphenyl, and the like.
In the structural formula (d), 1) a structural unit generated from terephthalic acid / a structural unit generated from isophthalic acid, 2) a structural unit generated from terephthalic acid / 2, a structural unit generated from 2,6-dicarboxynaphthalene , Etc. Here, the amount of terephthalic acid is preferably 40 wt% or more, more preferably 60 wt% or more, and particularly preferably 80 wt% or more in the two components. By setting the amount of terephthalic acid to 40 wt% or more of the two components, a resin composition having relatively good fluidity and heat resistance can be obtained. The proportion of the structural units (A), (B), (C) and (D) in the liquid crystal polyester (B) component is not particularly limited. However, the structural units (c) and (d) are basically in equimolar amounts.

  Further, the following structural unit (e) composed of the structural units (c) and (d) can also be used as the structural unit in the component (B). Specifically, 1) a structural unit produced from ethylene glycol and terephthalic acid, 2) a structural unit produced from hydroquinone and terephthalic acid, 3) a structural unit produced from 4,4'-dihydroxybiphenyl and terephthalic acid, 4) And structural units formed from 4,4'-dihydroxybiphenyl and isophthalic acid, and 5) structural units formed from bisphenol A and terephthalic acid.

The liquid crystal polyester component (B) of the present invention is formed from other aromatic dicarboxylic acids, aromatic diols, and aromatic hydroxycarboxylic acids within a small range that does not impair the features and effects of the present invention as necessary. Structural units can be introduced.
The temperature at which the liquid crystal state at the time of melting of the component (B) of the present invention (hereinafter referred to as the liquid crystal start temperature) is preferably 150 to 350 ° C, more preferably 180 to 320 ° C. Setting the liquid crystal start temperature within this range is preferable because less black foreign matter is present in the resulting resin sheet.

  In the present invention, it is preferable to contain a compound containing an I, II, III or IV metal element of the component (C), and the compound is an inorganic compound or an organic compound containing a metal. . The component (C) of the present invention is a compound essentially comprising a metal element as a main constituent component. Specific examples of metal elements that can take I, II, III, or IV in the component (C) include Li, Na, K, Zn, Cd, Sn, Cu, Ni, Pd, Co, Fe, Ru, Mn, Pb, Mg, Ca, Sr, Ba, Al, Ti, Ge, Sb are mentioned. Among these, Zn, Mg, Ti, Pb, Cd, Sn, Sb, Ni, Al, and Ge elements are preferable, and Zn, Mg, and Ti elements are more preferable. From the viewpoint of greatly improving the toughness of the sheet without delamination, the metal element of I, II, III, or IV is more preferably Zn and / or Mg, more preferably Zn. Particularly preferred.

(C) As a compound containing an I-valent, II-valent, III-valent or IV-valent metal element, an oxide, hydroxide, alkoxide salt, aliphatic carboxylate or acetate of the above metal element is preferable. Examples of preferable oxides include ZnO, MgO, TiO ₄ , TiO ₂ , PbO, CdO, SnO, SbO, Sb ₂ O ₃ , NiO, Al ₂ O ₃ , GeO, and the like. Examples of preferred hydroxides include Zn (OH) ₂ , Mg (OH) ₂ , Ti (OH) ₄ , Ti (OH) ₂ , Pb (OH) ₂ , Cd (OH) ₂ , Sn (OH) ₂ , Sb (OH) ₂ , Sb (OH) ₃ , Ni (OH) ₂ , Al (OH) ₃ , Ge (OH) _{2 and the} like. Examples of preferable alkoxide salts include Ti (O-iso-Pr) ₄ and Ti (On-Bu) ₄ . Examples of preferred aliphatic carboxylates include zinc stearate, magnesium stearate, titanium stearate, lead stearate, cadmium stearate, tin stearate, antimony stearate, nickel stearate, aluminum stearate, germanium stearate. Etc. Examples of preferred acetates include zinc acetate, magnesium acetate, titanium acetate, lead acetate, cadmium acetate, tin acetate, antimony acetate, nickel acetate, aluminum acetate, germanium acetate, titanium acetate and the like.

Among these, ZnO, Mg (OH) ₂ , Ti (O-iso-Pr) ₄ , Ti (On-Bu) ₄ , zinc acetate, zinc stearate, and aluminum stearate are more preferable examples. Can be mentioned. Furthermore, ZnO and / or Mg (OH) ₂ are preferable from the viewpoint of no delamination, and ZnO is particularly preferable. Moreover, these (C) components may contain the impurity in the range which does not impair the effect of this invention.
The (D) silane compound of the present invention is a functional group-containing silane compound, which contains at least one functional group selected from the group consisting of an amino group, a ureido group, an epoxy group, an isocyanate group, and a mercapto group. A compound. The functional group-containing silane compound usually only needs to contain any one of these functional groups in the molecule, but in some cases, two or more of these functional groups are contained in the molecule. It may be what you do.

  Moreover, the silane compound used in the present invention is usually an alkoxysilane containing a functional group as described above in the molecule. Specific examples of the functional group-containing silane compound include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, N- (β-aminoethyl) -γ-aminopropyltrimethoxy. Silane compounds containing amino groups such as silane, N- (β-aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltrimethoxysilane, γ Examples include ureido group-containing silane compounds such as ureidopropylmethyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-ureidopropylmethyltriethoxysilane, and γ- (2-ureidoethyl) aminopropyltrimethoxysilane. .

Further, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyldimethylmethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4- Silane compounds containing an epoxy group such as epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane; γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ- Isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane, γ-isocyanatopropylethyldiethoxysilane, γ-isocyanatepropyl Silane compounds containing isocyanate groups, such as Rikuroroshiran the like.
Further, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylethyldiethoxysilane, γ-mercaptopropylmethyldiethoxysilane, β-mercaptoethyltrimethoxysilane, β-mercaptoethyltriethoxy Silane compounds containing mercapto groups such as silane and β-mercaptoethyldimethoxysilane;

The blending amount of the (A) polyphenylene ether resin in the present invention is 50 from the viewpoint of preventing unevenness of the thickness of the tape and the layer with respect to 100 parts by mass of the total of (A) polyphenylene ether resin and (B) liquid crystal polyester. It is 99.5 parts by mass or less from the viewpoint of fluidity, extruder torque (extruder load) and heat shrinkage, preferably 70-99.5 parts by mass, more preferably 75- 98 parts by mass.
In the present invention, the blending amount of the liquid crystal polyester of the component (B) is 0.5 mass from the viewpoint of fluidity and prevention of occurrence of black foreign matters in the sheet with respect to 100 parts by mass of the total of the components (A) and (B). It is 50 parts by mass or less, preferably 0.5 to 30 parts by mass, and more preferably 2 to 25 parts by mass from the viewpoint of preventing unevenness in the thickness of the sheet due to the anisotropy of the liquid crystal polymer.
The blending amount of the component (C) in the present invention is 0.1 parts by mass or more from the viewpoint of preventing peeling of the sheet layer with respect to a total of 100 parts by mass of (A) and (B), and the specific gravity of the composition And from the viewpoint of heat resistance, it is 10 parts by mass or less, more preferably 0.2 to 5 parts by mass, and particularly preferably 0.4 to 3 parts by mass.

The blending amount of component (D) in the present invention is 0.1 parts by mass or more from the viewpoint of preventing delamination of the sheet with respect to 100 parts by mass in total of (A) and (B), and the stability of the composition or From the viewpoint of moisture resistance, it is 5 parts by mass or less, more preferably 0.2 to 3 parts by mass, and particularly preferably 0.3 to 1 part by mass.
In the present invention, the component (C) and the component (D) can be used in combination.
The inorganic filler (E) used in the present invention is a strength imparting agent such as glass fiber, metal fiber, potassium titanate, carbon fiber, silicon carbide, ceramic, silicon nitride, mica, nepheline sinite, talc, wollast. Examples thereof include inorganic compounds such as knight, slag fiber, ferrite, glass beads, glass powder, glass balloon, quartz, quartz glass, fused silica, titanium oxide, and calcium carbonate. Among these, calcium carbonate, talc, wollastonite, and fused silica are preferable from the viewpoint of sheet formability and heat shrinkage.

The shape of these inorganic fillers is not limited, and can be arbitrarily selected from a fiber shape, a plate shape, a spherical shape, and the like, but a plate shape and a spherical shape are more preferable from the viewpoints of sheet formability and heat shrinkage.
These inorganic fillers can be used in combination of two or more. Further, if necessary, it can be used after pretreatment with a coupling agent such as silane or titanium.
Moreover, the compounding quantity of (E) inorganic filler is 0.00 with respect to a total of 100 parts by mass of component (A) and component (B) (or 100 parts by mass of component (A) when component (B) is not included). 1 to 150 parts by mass. In particular, from the viewpoint of sheet formability and heat shrinkage, it is preferably 1 to 100 parts by mass, and more preferably 2 to 20 parts by mass.

  In the present invention, in addition to the above-mentioned components, other additional components, such as antioxidants, flame retardants (organic phosphate ester compounds, phosphazene compounds), as necessary, within the range not impairing the characteristics and effects of the present invention. Compound), elastomer (ethylene / propylene copolymer, ethylene / 1-butene copolymer, ethylene / propylene / non-conjugated diene copolymer, ethylene / ethyl acrylate copolymer, ethylene / glycidyl methacrylate copolymer, Ethylene / vinyl acetate / glycidyl methacrylate copolymer and ethylene / propylene-g-maleic anhydride copolymer, olefin copolymer such as ABS, polyester polyether elastomer, polyester polyester elastomer, vinyl aromatic compound-conjugated diene Compound block copolymer, vinyl aromatic compound Hydrogenated product of conjugated diene compound block copolymer), plasticizer (oil, low molecular weight polyethylene, epoxidized soybean oil, polyethylene glycol, fatty acid ester, etc.), flame retardant aid, weather resistance (light) improver, polyolefin A nucleating agent and various colorants may be added.

In the present invention, when kneading the components (A), (B), (C), (D) and (E), the kneading order is not particularly limited, but batch kneading simplifies the process. From the viewpoint of improving properties and physical properties. However, when the components (C) and (D) are used in combination, the components (C) and (D) may be kneaded simultaneously with the components (A) and (B). From the viewpoint of suppression, it is desirable to knead (C) and then knead (D), or knead (D) and then knead (C). In the case of the component (E), if it is not desired to be crushed by kneading, it can be kneaded later.
The resin composition of the present invention can be produced by various methods. For example, a heat melt kneading method using a single screw extruder, a twin screw extruder, a roll, a kneader, a Brabender plastograph, a Banbury mixer or the like can be mentioned. Among them, a melt kneading method using a twin screw extruder is most preferable. Although the melt kneading temperature in this case is not particularly limited, it can usually be arbitrarily selected from 150 to 350 ° C.

The TAB lead tape of the present invention can be once slit into a tape shape, or can be continuously slit into a tape shape obtained from a sheet molding machine. Here, the thickness of the TAB lead tape is 0.001 to 2.0 mm, preferably 0.005 to 0.50 mm, and more preferably 0.05 to 0.20 mm. Sometimes called a film. In many cases, a thickness of 0.075 mm or 0.125 mm is suitable.
The TAB lead tape width is 10 to 100 mm, preferably 20 to 90 mm, and more preferably 30 to 80 mm. In many cases, widths of 35 mm, 48 mm, 70 mm and the like are suitable.

The TAB lead tape of the present invention has a tape shape having the above-mentioned width and thickness, and is obtained by punching guide holes of about 0.5 to 2 mm square on both sides using a punching machine.
The TAB lead tape of the present invention can be obtained by extrusion sheet molding using the resin composition obtained above as a raw material, or the components of the present invention are directly fed into an extrusion sheet molding machine, and blending and sheet molding are simultaneously performed. It can also be obtained by implementation.
The TAB lead tape of the present invention can be produced by an extrusion tubular method, and in some cases also called an inflation method. In order to prevent the parison coming out of the cylinder from being cooled immediately, the temperature of the parison is appropriately selected from the temperature range of 50 to 290 ° C., and the temperature of the parison can be made uniform so that the sheet does not peel off. Is extremely important in creating.

On the other hand, the TAB lead tape of the present invention can be manufactured by T-die extrusion. In this case, it may be used without stretching, may be uniaxially stretched, or may be obtained by biaxially stretching. When it is desired to increase the strength of the sheet, it can be achieved by stretching.
The TAB lead tape of the present invention thus obtained is excellent in water absorption resistance and excellent in heat resistance, heat shrinkability, and hole punching.

The present invention will be described below based on examples. However, the present invention is not limited to the following examples as long as the gist thereof is not exceeded.
[Production Example 1]
<Production example of polyphenylene ether (PPE-1)>
Powdered poly (2,6-dimethyl-1,4-phenylene ether) having a reduced viscosity (0.5 g / dl, chloroform solution, measured at 30 ° C.) of 0.42 obtained by oxidative polymerization of 2,6-dimethylphenol ).

[Production Example 2]
<Production Example of Liquid Crystalline Polyester (LCP-1)>
Under a nitrogen atmosphere, p-hydroxybenzoic acid, 2-hydroxy-6-naphthoic acid, and acetic anhydride were charged, heated, melted, and polycondensed to obtain a liquid crystal polyester (LCP-1) having the following theoretical structural formula. Obtained. In addition, the component ratio of a composition represents molar ratio.

Tape formation and tape physical property evaluation of each resin composition were performed according to the following methods.
(1) Tape molding The obtained pellets were subjected to extrusion sheet molding by a tubular method using an extruder with a screw diameter of 50 mm set at a cylinder temperature of 290 ° C and a cylindrical die temperature of 290 ° C. The pressure of the blown air was set so that the thickness was 125 μm. This was cut into a width of 35 mm using a slitter.
(2) Water absorption resistance Using the TAB lead tape obtained in (1) above, a sample was cut into a length of 1 m, and a constant temperature and humidity chamber (PL-3FP, manufactured by Tabai Espec Co., Ltd.) was used. After exposure to a warm and humid environment of 95% relative humidity for 48 hours, the weight increase rate (Δw) was determined according to the following formula. An average value of two of each was taken.
Weight increase rate (Δw) (%) = (w1−w0) / w0 × 100
(W1: after 48 hours of heating and humidification, removed from the thermostatic chamber, wiped off dew on the surface of the tape, and left for 30 minutes in a room controlled at 23 ° C. and 50% relative humidity (g) , W0: tape weight (g) dried in a hot air dryer at 100 ° C. for 2 hours and then cooled to room temperature in a desiccator before heating and humidification
The water absorption resistance of the tape was evaluated based on the following criteria.
○: Δw is less than 0.1%.
Δ: Δw is 0.1% or more and less than 0.4%.
X: Δw is 0.4% or more.

(3) Heat resistance Using the tape obtained in (1) above, a sample was cut out to a length of 20 cm and placed in a hot air drying oven (perfect oven PHH-201 manufactured by ESPEC Corporation) set at 170 ° C. for 1 hour. After putting in, it was taken out and the presence or absence of deformation was visually observed.
○: No deformation was observed.
X: Deformed.
(4) Thermal shrinkage Using the TAB lead tape obtained in (1) above, a sample was cut out to a length of 1 m and placed in a hot air drying oven (perfect oven PHH-201 manufactured by ESPEC Corporation) set at 170 ° C. After putting the time, the sample was taken out and sufficiently cooled to room temperature, then the length was measured, and the dimensional change rate (ΔL) was determined according to the following formula. An average value of two of each was taken.
Dimensional change rate (ΔL) (%) = (L1−L0) / L0 × 100
(L1: length after heating, L0: length before heating)
The tape thermal shrinkage was evaluated based on the following criteria.
A: The dimensional change rate is less than 0.05%.
○: The dimensional change rate is 0.05% or more and less than 0.1%.
Δ: Dimensional change rate is 0.1% or more and less than 0.2%.
X: The dimensional change rate is 0.2% or more.

(5) Hole punching ability Each of the film lengths of 300 m was punched at 1 mm square holes at intervals of 5 mm with a continuous film punching machine, and the hole punching ability was judged based on the following criteria.
○: The film was observed from the side with an optical microscope (50 times), and no flash of beard was observed above and below the hole, and no generation of powder was observed.
X: The film was observed from the side with an optical microscope (50 times), and a beam extending like a whisker was observed above and below the hole, or generation of powder was observed.

[Example 1]
Polyphenylene ether (PPE-1), liquid crystal polyester (LCP-1) and zinc oxide (ZnO, special grade, manufactured by Wako Pure Chemical Industries, Ltd.) were blended in the proportions (mass parts) shown in Table 1, and the feed side ZONE1 is set to 250 ° C, ZONE2 to 7 and the die head is set to 310 ° C. = 42) was melt-kneaded so that (rotation speed) = 300 rpm and (discharge amount) = 12 kg / hr to obtain pellets.
Using this pellet, a tape having a thickness of 125 μm and a width of 35 mm was obtained by the method described above. Tape evaluation was performed according to the method shown above. The results are shown in Table 1.

[Example 2]
As the component (D), a silane compound containing an amino group (Silane 1, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, KBM-603, manufactured by Shin-Etsu Chemical Co., Ltd.) is used. Except having been blended at the ratio (parts by mass) shown in Table 1, the same procedure as in Example 1 was carried out to obtain pellets, which were then subjected to sheet molding processing, and then a tape was obtained. Tape evaluation was performed according to the method shown above. The results are shown in Table 1.

[Example 3]
(A) In addition to polyphenylene ether (PPE-1), high impact polystyrene (HIPS, H9405, manufactured by PS Japan Co., Ltd.) is used as the component, and vinyl aromatic compound-conjugated diene compound block co-polymer is used as the other component. Example 1 except that the combined hydrogenated product (SEBS, Tuftec H1051 (registered trademark), manufactured by Asahi Kasei Chemicals Corporation) was blended in the proportions (parts by mass) shown in Table 1. After carrying out and obtaining a pellet and carrying out sheet forming processing, a tape was obtained. Tape evaluation was performed according to the method shown above. The results are shown in Table 1.

[Example 4]
A tape was obtained after sheet forming in the same manner as in Example 1 except that modified PPE resin (Zylon X9102 (registered trademark), manufactured by Asahi Kasei Chemicals Corporation) was used as the pellet. Tape evaluation was performed according to the method shown above. The results are shown in Table 1.

[Comparative Example 1]
Example 1 except that polyphenylene etherimide (PEI, Ultem 1000 (registered trademark), manufactured by GE Plastics Co., Ltd.) was used as the pellet, and the cylinder temperature at the time of sheet molding was 350 ° C. Similarly, a tape was obtained after sheet forming. Tape evaluation was performed according to the method shown above. The results are shown in Table 1.

[Comparative Example 2]
A tape was obtained after the sheet was formed in the same manner as in Example 1 except that polyphenylene sulfide (PPS, Torelina A900 (registered trademark), manufactured by Toray Industries, Inc.) was used as the pellet. Tape evaluation was performed according to the method shown above. The results are shown in Table 1.

[Comparative Example 3]
The sheet was processed in the same manner as in Example 1 except that 0.62 dl / g of polyethylene naphthalate (measured at 35 ° C. in a phenol / tetrachloroethine mixed solvent) was used as the pellet. Obtained. Tape evaluation was performed according to the method shown above. The results are shown in Table 1.
From Table 1, it can be seen that the polyphenylene ether-based resin tape obtained according to the present invention is excellent in water absorption resistance, heat resistance, heat shrinkability, and hole punching properties, which is unprecedented, inexpensive and excellent. It can be seen that this is a TAB lead tape.

  The polyphenylene ether-based TAB lead tape of the present invention is excellent in water absorption resistance, heat resistance, heat shrinkability, and hole punchability. The TAB lead tape does not deform even when heated in the oven in the process of curing the encapsulant of the semiconductor device attached to the TAB, and exhibits a thermal contraction rate substantially equivalent to that of the TAB tape or TAB spacer tape. In addition to low water resistance, low specific gravity, excellent water absorption resistance, stretched whiskers, especially as flashes, can damage semiconductor devices and require excellent punchability. It has been. Therefore, the TAB lead tape made of the polyphenylene ether resin of the present invention is very suitable for the TAB lead tape characteristics and has an extremely great industrial value.

Claims (6)

  A TAB lead tape obtained by molding a polyphenylene ether resin (A).   The TAB lead tape according to claim 1, obtained by molding a resin composition containing the liquid crystalline polyester (B) in the polyphenylene ether resin (A).   The TAB lead tape according to claim 2, obtained by molding a resin composition containing 50 to 99.5 parts by mass of a polyphenylene ether resin (A) and 0.5 to 50 parts by mass of a liquid crystal polyester (B). The component according to claim 2 or 3, obtained by molding a resin composition containing 0.1 to 5 parts by mass of the silane compound (D) with respect to 100 parts by mass of the total of the component (A) and the component (B). TAB lead tape. The TAB lead tape according to claim 4 , wherein the component (D) is a silane compound having an amino group. The TAB lead according to any one of claims 2 to 5 , which is obtained by molding a resin composition containing (A) component 70 to 99.5 parts by mass and (B) component 0.5 to 30 parts by mass. tape.