JP4515805B2 - Defective part marking method, defective part marking method for bumped parts, and multi-cavity wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method for marking a defective portion of a component having a plurality of conductor portions on a substrate, a method for marking a defective portion of a bumped component, and a method for manufacturing a multi-cavity wiring board.

  In recent years, as a technique for efficiently producing a wiring board, a technique called so-called multi-cavity is well known. In this method, first, a multi-piece wiring board is manufactured using a rectangular large-sized insulating base material as a starting material. Next, the multi-piece wiring board is divided along the boundary line of the wiring board region so that a plurality of pieces of the wiring board are obtained simultaneously. A wiring layer is formed in each wiring substrate region, and a plurality of solder bumps, for example, are arranged in an array on the semiconductor element mounting portion on the surface of each insulating substrate.

  By the way, in this kind of multi-piece wiring board, a defective part may be included in one or a plurality of wiring board regions due to manufacturing variations and problems. In this case, for the convenience of discriminating non-defective products and defective products in a subsequent process, conventionally, a bad mark is previously attached to a wiring board region having a defective portion. Specifically, ink is applied to a predetermined portion (for example, a cavity on the surface) of the surface of the wiring board region using a dispenser or a magic pen.

  However, for example, when ink is applied to a multi-cavity wiring board having no cavity portion, the ink may flow out to other wiring board regions or may be scattered. Therefore, a bad mark is also given to a product that is originally a good product, and the yield may be lowered due to such secondary defects. In addition, the above-described marking method can be applied only to a part of a multi-piece wiring board having a specific structure, and has a drawback that it is inferior in versatility.

Under such circumstances, an alignment mark is formed in advance in the wiring board area, and if there is a defective wiring board area, the alignment mark in the wiring board area is removed by laser processing. A marking method has been proposed in the past (see, for example, Patent Document 1). In this marking method, by observing the wiring board region with an appearance inspection apparatus, a product having an alignment mark is determined as a non-defective product, and a product having no alignment mark is determined as a defective product. And since this marking method does not involve the application of ink which is a foreign substance, it can be said that it is basically more versatile than a method using a dispenser or a magic pen.
JP 2001-127399 A (FIG. 1 etc.)

  By the way, in the marking method described in Patent Document 1, it is necessary to set the laser to a high output in order to completely remove the alignment mark.

  However, when a high-power laser is irradiated aiming at the alignment mark, there is a possibility that the laser is reflected at or near the alignment mark and hits another part of the wiring board. As a result, a product that was originally a good product is converted into a defective product through a marking process, which may reduce the yield. Further, if the laser output is suppressed to be low in order to avoid the occurrence of such secondary defects, the alignment mark cannot be completely removed, and there is a possibility that the defective product will not be identified as a defective product in a later process.

  Furthermore, the conductor pattern of the wiring board tends to become finer, and it is necessary to improve the laser irradiation position accuracy accordingly. However, since higher output of the laser leads to lowering of irradiation position accuracy, there is a possibility that this method cannot cope with finer progress. Further, if it is attempted to simultaneously improve the laser irradiation position accuracy and increase the output of the laser, it is inevitable that the facility will be complicated and expensive.

  The present invention has been made in view of the above-mentioned problems, and its purpose is that there is no risk of yield reduction due to the occurrence of secondary defects, and a method for marking a defective part of a component having excellent versatility, and a defective part of a bumped component. It is to provide a marking method and a manufacturing method of a multi-piece wiring board.

And as a means for solving the above-mentioned problem, it is a defective part marking method for a part having a plurality of conductor parts on a substrate, and a part of the plurality of conductor parts in the part having a defective part A first contact step in which the first reference surface of the pressing means is brought into contact with the part; a moving distance setting step for presetting a moving distance of the pressing means when crushing the part of the conductor portion by the pressing means; The crushing step of crushing the part of the conductor portions by moving the pressing means by the movement distance set in advance and deteriorating the flatness between the plurality of conductor portions; and the step before the movement distance setting step A step of calculating a height of the part of the conductor part to be crushed through the crushing step, and a step of calculating the height of the part of the conductor part in the moving distance setting step. Calculation There is a part defect location marking method characterized in that the moving distance is calculated and set based on the result .

  In this marking method, a part of the conductor portions is crushed to deteriorate the flatness (coplanarity) between the plurality of conductor portions, thereby substantially attaching a bad mark. Therefore, this marking method can be carried out regardless of the presence or absence of a cavity, and is excellent in versatility compared with a conventional method of applying a foreign substance such as ink. In addition, since this marking method is a method that mechanically crushes some conductors using a pressing means, secondary defects caused by reflection of high-power lasers and ink flow do not occur, and yield is improved. To do. Moreover, even if the finer parts and further the finer conductor patterns are advanced, the marking method can relatively easily and reliably attach bad marks. In addition, since the crushing is performed after the movement distance is set in advance, the amount of crushing can be set arbitrarily and accurately.

  Here, the parts to be marked should not be particularly limited. Any component having a plurality of conductor portions on a substrate can be selected as a marking target regardless of its type. Among them, for example, it is preferable to select a bumped component having a plurality of bumps as a plurality of conductor portions as a marking target. This is because the bump (projection electrode) has a sufficient height as compared with a normally formed conductor pattern, and is therefore suitable as an object to be crushed. For example, the height of the bump is preferably 30 μm or more, and particularly preferably 70 μm or more. The reason is that when the thickness is less than 30 μm, it becomes difficult to make a difference in level between the crushed and non-crushed ones.

Furthermore, as another means for solving the above-described problem, a large number of units each including a base material partitioned into a plurality of wiring board regions and a plurality of conductor portions respectively disposed in the plurality of wiring board regions is obtained. A method of manufacturing a wiring board, the first contact step of bringing a first reference surface of the pressing means into contact with a tip of a part of the plurality of conductors in the wiring board region having a defective portion A moving distance setting step for presetting a moving distance of the pressing means when crushing the part of the conductor portions by the pressing means, and moving the pressing means by the preset moving distance to move the part Crushing the conductor part of the plurality of conductor parts, the crushing process to deteriorate the flatness between the plurality of conductor parts, and the part of the part to be crushed through the crushing process at a stage before the moving distance setting process Conductor A conductor portion height calculating step for calculating a height, and in the moving distance setting step, a defective portion marking step for calculating and setting the moving distance based on a calculation result of the height of the part of the conductor portions is performed. There is a method of manufacturing a multi-piece wiring board characterized by this. A method for manufacturing a multi-piece wiring board comprising a base material partitioned into a plurality of wiring board areas and a plurality of bumps respectively disposed in the plurality of wiring board areas, wherein the wiring has a defective portion. A first contact step of bringing the first reference surface of the pressing means into contact with the tips of some of the plurality of bumps in the substrate region, and crushing the some of the bumps by the pressing means A moving distance setting step for setting the moving distance of the pressing means in advance, and moving the pressing means by the preset moving distance to crush the part of the bumps to deteriorate the flatness between the plurality of bumps. a step crushing, the mobile distance setting than process stage before, and a conductor portion height calculation step of calculating the height of the crushing step of said portion to be crushed through the bumps, before In the moving distance setting step is a process for making a multi-piece wiring substrate and performing defective portion marking process the calculated setting the moving distance based on the calculation result of the height of the portion of the bump.

  In the marking process in this manufacturing method, some bumps are crushed, and the flatness (coplanarity) between the plurality of bumps is deteriorated to substantially attach a bad mark. Therefore, this method can be carried out regardless of the presence or absence of a cavity, and is excellent in versatility as compared with the conventional method of applying a foreign substance such as ink. Further, in this marking step, some bumps are mechanically crushed using the pressing means, so that secondary defects due to reflection of high-power laser, ink flow out or scattering do not occur. Therefore, the yield is improved. Moreover, even if the refinement of the conductor pattern of the wiring board is advanced, according to this marking process, a bad mark can be attached relatively easily and reliably. In addition, since the crushing is performed after the movement distance is set in advance, the bump crushing amount can be arbitrarily and accurately set.

  Hereinafter, a method for manufacturing the multi-piece wiring board will be described in detail.

  In this manufacturing method, a new defective portion marking process is performed. The marking target in the same process is a multi-piece wiring board including a base material partitioned into a plurality of wiring board regions and a plurality of bumps respectively arranged in the plurality of wiring board regions. The kind of base material should not be specifically limited, For example, the substantially plate-shaped insulation base material which uses resin, ceramic, glass, etc. as a material is used. It is also possible to use a substantially plate-like substrate having a metal core. The plurality of wiring board regions are set, for example, in a rectangular shape in plan view, and the plurality of bumps are arranged in an array in each wiring board region. The bump is formed using, for example, solder. The shape of the bump is not particularly limited, and is, for example, spherical, hemispherical, columnar, or the like.

  The defective portion marking method includes at least the following steps (first contact step, moving distance setting step, crushing step).

  In the first contact step, the first reference surface of the pressing means is brought into contact with the tips of some of the plurality of bumps in the wiring board region having the defective portion. In this case, it is preferable to temporarily stop the pressing unit before the pressing unit applies a large pressing force to the bump. At this time, the first reference surface is preferably arranged in parallel to the main surface of the substrate having a plurality of bumps.

  As the pressing means, it is preferable to use one having a head having a first reference surface at the tip. The area of the first reference surface is not particularly limited, but is preferably larger than at least the area of the bump to be crushed in plan view. The reason is that in order to ensure contact with the bumps, it is preferable to use a head having a first reference surface that is somewhat large.

  If the head alignment accuracy is worse than the bump pitch, the head may contact an unrelated bump or the head may contact a bump in another adjacent wiring board region. In such a case, the bump cannot be crushed well, and the height of the bump after being crushed cannot be measured accurately. Therefore, the area of the first reference surface may be a minimum necessary size. For example, the area of the bumps to be crushed in a plan view or less, more specifically, the area of the bumps to be crushed in a plan view. It is good that they are 1 times or more and 30 times or less.

  In the movement distance setting step, the movement distance of the pressing means when the partial bumps are crushed by the pressing means is set in advance. The said moving distance means the suitable distance at the time of moving a press means along the thickness direction of a base material for bump crushing. In the crushing step, the pressing means is moved by a preset moving distance to crush some of the bumps, and the flatness between the plurality of bumps is deteriorated.

  That is, in this defective portion marking method, since an appropriate movement distance is set in advance and then crushed, the bump crushed amount can be set arbitrarily and accurately. Incidentally, if the bumps are crushed without setting an appropriate movement distance, the movement distance varies, which may adversely affect the discrimination accuracy between non-defective products and defective products.

  In the crushing step, it is possible to crush any one or more bumps among a plurality of bumps in the same wiring board region. However, it is excluded to crush all bumps in the same wiring board region. This is because the flatness between the bumps does not decrease in this case.

  In addition, the bump determined as a target to be crushed may be basically any bump in the bump group. However, it is preferable that the bump is the longest distance from other bumps. The reason for this is that the probability of crushing other surrounding bumps by mistake is reduced, and it becomes easy to make the bumps have a desired height. For example, when a plurality of bumps are arranged in an array, it is preferable that the bumps located at the corners be crushed.

  The defective part marking step should be crushed through a second contact step in which the second reference surface of the pressing means is brought into contact with the surface of the base material at a stage prior to the crushing step, and the crushing step. Preferably, the method includes a bump height calculating step of calculating the height of the part of the bumps based on a positional relationship between the first reference surface and the second reference surface.

  According to this method, the height of the bump before being crushed can be grasped in advance before the crushing step is performed. Therefore, the movement distance of the pressing means when crushing the bump can be set accurately. Instead of such a method, the height of the bump before being crushed may be calculated using, for example, a laser type or contact type displacement meter.

  The second reference surface may be provided on a member other than the head in the pressing unit. Further, the position where the second reference surface contacts is preferably an arbitrary position in the same wiring board region as the bump to be crushed, and particularly a position in the vicinity of the bump to be crushed. preferable. This is because the bump height after crushing can be calculated more accurately as the distance from the crushing object becomes smaller.

  After performing the defective part marking process as described above, a plurality of bumps are observed for each wiring board area by an appearance inspection apparatus, and a wiring board area where the flatness between the plurality of bumps is deteriorated is determined as a defective product. A defective product discrimination process may be performed.

  According to this method, a wiring board region having a good flatness between a plurality of bumps is determined as a non-defective product, and a wiring board region having a poor flatness between a plurality of bumps is determined as a defective product. In addition, the appearance inspection apparatus is an apparatus that is usually used in the final stage of the wiring board manufacturing process. If defective products can be identified using such existing equipment, the equipment cost can be kept low.

  Hereinafter, the manufacturing method of the multi-piece wiring board of embodiment which actualized this invention is demonstrated in detail based on FIGS. FIG. 1 is a schematic plan view showing a multi-piece wiring board 11 before an inspection process. FIG. 2 is a schematic cross-sectional view showing the multi-piece wiring board 11 before the inspection process. FIG. 3 is a flowchart for explaining a method of manufacturing the multi-piece wiring board 11. FIG. 4 is a schematic front view showing the bump pressing device 31 (pressing means) used in the defective portion marking step and the multi-piece wiring substrate 11 to be marked. FIG. 5 is a schematic front view showing the bump pressing device 31 and the multi-cavity wiring board 11 in the second contact step. FIG. 6 is a schematic front view showing the bump pressing device 31 and the multi-piece wiring board 11 in the first contact step. FIG. 7 is a schematic front view showing the bump pressing device 31 and the multi-cavity wiring board 11 in the crushing process. FIG. 8 is a schematic front view showing the appearance inspection device 61 used in the defective product discrimination process and the multi-piece wiring board 11 to be inspected.

  1 and 2 show the multi-piece wiring board 11 of the present embodiment. The ceramic base material 12 (base material) constituting the multi-piece wiring board 11 is a rectangular plate material made of an alumina sintered body, and has an upper surface 13 (first main surface) and a lower surface 14 (second main surface). )have. The ceramic substrate 12 is partitioned into a plurality of wiring board regions 15 having a square shape or a rectangular shape. The dashed-dotted line drawn in FIG. 1, FIG. In each wiring board region 15, the central portion of the upper surface 13 is a semiconductor element mounting portion, and a plurality of solder bumps 17 (conductor portions) are arranged in an array in that portion. The solder bumps 17 have a diameter of about 150 μm to 250 μm, a height of about 50 μm to 150 μm, and the number of solder bumps 17 of about 5 to 20. In the present embodiment, 4 × 4 substantially hemispherical solder bumps 17 having a diameter of about 200 μm and a height of about 150 μm are provided. The heights of the plurality of solder bumps 17 in the same wiring board region 15 are each designed to be in the range of 150 μm ± 15 μm. That is, in this embodiment, a product that satisfies at least this condition can be a good product.

  In each wiring board region 15, a metallized wiring layer (not shown) mainly composed of tungsten or Ag is formed in a predetermined pattern on the upper surface 13 and the lower surface 14. A plurality of through-hole conductors (not shown) mainly composed of tungsten or Ag are formed inside the wiring board region 15. These through-hole conductors connect the metallized wiring layers on the upper surface 13 and the lower surface 14 to each other.

  Such a multi-cavity wiring board 11 is manufactured, for example, by the following procedure. First, a large green sheet is prepared by a conventionally known method (for example, a doctor blade method), and a through hole is formed by drilling the green sheet. Next, a tungsten or Ag paste prepared in advance is printed by a screen printing method. Thereby, the paste of tungsten or Ag is filled in the through hole, and a paste printing layer having a predetermined pattern is formed on the front surface and the back surface of the green sheet. Next, the green sheet is heated under a predetermined temperature condition (for example, 1650 ° C. to 1950 ° C.), and the metallizing paste and the green sheet are sintered simultaneously. Next, a solder paste is printed on a predetermined portion (for example, the upper end surface of the through-hole conductor) of the upper surface 13 of the obtained sintered body, and the printed paste solder is heated to a predetermined temperature and reflowed. As a result, a multi-piece wiring board 11 having a plurality of solder bumps 17 is obtained. Note that the solder bump height may be adjusted within a range of 150 μm ± 15 μm by performing a fluttering process of the solder bump 17 at this stage. Moreover, you may give nickel-gold plating etc. to the surface of the solder bump 17 as needed.

  Here, the wiring board region 15 in the multi-cavity wiring board 11 may include a defective portion due to manufacturing variations or problems. Specific examples of defects include defective filling of through-hole conductors, voids, disconnection or short of metallized wiring layers, bridging (connection) of solder bumps, dirt on the substrate surface, cracks or chipping on the substrate, and the like. Therefore, in the next various inspection processes, an electrical inspection or a visual inspection is performed to find a defective portion in the multi-piece wiring board 11 (see S101 in FIG. 3).

  Next, a step of marking a number of defective portions found in the above various inspection steps on the wiring substrate 11 for each wiring substrate region 15 is performed (see S102 to S106 in FIG. 3).

  In the defective portion marking process of the present embodiment, a bump pressing device 31 (pressing means) as schematically shown in FIG. 4 or the like is used. The bump pressing device 31 includes a head 41, a stopper 42, a first movable member 43, a second movable member 44, a spring 45, and a cylinder 46. In particular, the stopper 42, the second movable member 44, and the cylinder 46 are respectively supported on the lower surface side of the support body 32 via a fixing member (not shown).

  The head 41 has a first reference surface 51, which is a substantial pressing surface, at the center of the lower end. In the present embodiment, the size of the first reference surface 51 is set to about 1.5 times the area of one solder bump 17 in plan view. The head 41 is preferably formed using a metal material harder than solder. The upper end surface of the head 41 is fixed to the central portion of the lower end surface of the first movable member 43. The first movable member 43 has a through hole at the center of the upper end surface, and is disposed inside the second movable member 44 that is slightly larger than itself. The first movable member 43 is movable in the vertical direction by a predetermined length inside the second movable member 44. The second movable member 44 has a through hole in each of an upper end surface central portion and a lower end surface central portion. The second movable member 44 is also movable in the vertical direction by a predetermined length. A spring 45 with a spring constant k is disposed in the first movable member 43. The upper end of the spring 45 is fixed to the tip of the rod portion 47 of the cylinder 46, and the lower end is fixed to the bottom of the first movable member 43. Normally, the rod portion 47 is biased upward by the biasing force of the spring 45, and a part of the rod portion 47 comes into contact with the upper portion of the first movable member 43. When the cylinder 46 extends, the rod portion 47 moves downward against the urging force of the spring 45 and compresses the spring 45. Here, when the initial length of the spring 45 is L0 and the length at the time of compression is L, the spring 45 generates a drag of F = k × (L0−L). Therefore, when this drag acts on the first movable member 43, the head 41 presses the solder bump 17 with a force having the same magnitude as the drag. That is, the pressing force provided by the head 41 is proportional to the compression amount of the spring 45. A stopper 42 having a through hole in the center is disposed below the second movable member 44. The stopper 42 is driven independently from the rod portion 47, the first movable member 43, the spring 45 and the head 41. When the cylinder 46 is extended, the lower end of the head 41 protrudes downward through the through hole of the stopper 42. However, when the second movable member 44 moves down to some extent, the lower part of the second movable member 44 comes into contact with the upper surface side of the stopper 42, and further downward movement of the second movable member 44 and the like is restricted. A second reference surface 52 is provided at a portion of the stopper 42 that protrudes downward. In the present embodiment, the size of the second reference surface 52 is set to about one time the area of the solder bump 17 in plan view.

  In the marking process using the bump pressing device 31 having the above configuration, first, the wiring board region 15 having a defective portion is specified. In the present embodiment, description will be made on the assumption that there is a defective portion only in the wiring board region 15 located at the position of the uppermost row and the rightmost row in FIG. In FIG. 1, the solder bumps 17 to be crushed are painted in black to distinguish them from the others. That is, in the present embodiment, one of the solder bumps 17 located at the corner portion is to be crushed. This makes it possible to prevent other solder bumps 17 in the vicinity from being crushed by mistake.

  Then, the second contact step is performed in the following manner (see S102 in FIG. 3). In this case, the entire bump pressing device 31 is moved in the horizontal direction in advance, and is arranged above the wiring board region 15 having the defective portion. Further, the head 41 is positioned directly above the specific solder bump 17 that is the object to be crushed. In this state, the entire bump pressing device 31 is moved downward, and the second reference surface 52 of the stopper 42 is brought into contact with the upper surface 13 of the ceramic base 12 in the wiring board region 15 having a defective portion (see FIG. 5). In the present embodiment, the second reference surface 52 is brought into contact with a position that is 0.1 mm to 1.0 mm apart from the specific solder bump 17 that is the object to be crushed. Thereby, the distance from the object to be crushed is reduced, and the bump height can be accurately calculated.

  Then, a 1st contact process is implemented in the following ways (refer S103 of FIG. 3). That is, the cylinder 46 is driven to extend the rod portion 47 by a predetermined amount. Then, the first movable member 43, the spring 45, and the head 41 move together with the rod portion 47 downward, and the first reference surface 51 of the head 41 contacts the tip of the solder bump 17 (see FIG. 6). Then, before the head 41 applies a large pressing force to the solder bump 17, the cylinder 46 is stopped and the head 41 is temporarily stopped.

  Then, a bump height calculation step is performed in the following manner (see S104 in FIG. 3). The bump pressing device 31 includes a position detection sensor that can detect the difference between the height position of the first reference surface 51 and the height position of the second reference surface 52. In this step, the output signal of the position detection sensor is input to a computer (not shown), and the computer calculates the difference in height position between the first reference surface 51 and the second reference surface 52. As a result, the height of the specific solder bump 17 to be crushed (the height before being crushed) is obtained.

  Next, a moving distance setting step is performed in the following manner (see S105 in FIG. 3). In this step, the movement distance of the head 41 when crushing a specific solder bump 17 to be crushed is calculated and set in advance. The computer stores target value data in advance in order to crush a specific solder bump 17 to be crushed to a predetermined height. The computer compares the height data before crushing and the target value data to obtain the difference, and based on this, calculates and sets the distance to which the head 41 should be moved downward. Further, the computer calculates a driving amount of the cylinder 46 necessary for moving the head 41 downward by the moving distance. For example, when the height before crushing is 120 μm and the target value is 70 μm, the difference of 50 μm is calculated as the moving distance of the head 41, and the head 41 is further moved down by 50 μm. The required drive amount is calculated. Further, when the height before crushing is 115 μm and the target value is 70 μm, the difference of 45 μm is calculated as the moving distance of the head 41, and the head 41 is further moved down by 45 μm. The required drive amount is calculated. Of course, in this case, the driving amount is reduced by the amount of movement distance.

  Next, a crushing process is performed in the following manner (see S106 in FIG. 3). In this step, a computer (not shown) outputs a predetermined control signal to the cylinder 46. As a result, the cylinder 46 is driven, the rod portion 47 is extended by a predetermined amount, and the spring 45, the first movable member 43, and the head 41 are integrally moved downward. By the integral movement of these members, the first reference surface 51 of the head 41 crushes the solder bumps 17 (see FIG. 7). For this reason, the height of the crushed solder bump 17 becomes a target value of 70 μm, and the coplanarity between the plurality of bumps can be surely deteriorated.

  That is, in the defective portion marking method of the present embodiment, the crushing is performed after setting an appropriate movement distance in advance, so that the bump crushing amount can be arbitrarily and accurately set.

  The multi-cavity wiring board 11 that has undergone the above-described defective portion marking process can be shipped as a final product. Then, at the shipping destination, a defective product discrimination step is performed on the multi-piece wiring board 11 in the following manner (see S107 in FIG. 3). In this step, for example, a conventionally known solder bump appearance inspection device 61 having a laser scanning means 62 is used (see FIG. 8). In this appearance inspection apparatus 61, a plurality of solder bumps 17 in the same wiring board region 15 are irradiated while scanning with laser light. Then, the coplanarity for each wiring board region 15 is measured by measuring the bump shape three-dimensionally. In this case, the wiring board region 15 that does not have the crushed solder bumps 17 is determined as a non-defective product because all the solder bump heights are within the range of 150 μm ± 15 μm. On the other hand, for the wiring board region 15 having the crushed solder bumps 17, the crushed solder bump height is outside the range of 150 μm ± 15 μm. Therefore, the wiring board region 15 in which the defective portion is marked at the shipping source can be reliably grasped even at the shipping destination.

  Finally, by carrying out the substrate dividing step, the multi-piece wiring substrate 11 is divided along the planned cutting line 16 and separated into pieces (see S107 in FIG. 3). As a result, pieces of a plurality of wiring boards can be obtained simultaneously, and only defective products can be removed from them.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In this embodiment, a bad mark is substantially attached by crushing a part of the solder bumps 17 to deteriorate the coplanarity. Therefore, the marking process of the present embodiment can be performed regardless of the presence or absence of a cavity, and is excellent in versatility as compared with the conventional method of applying a foreign substance such as ink. Further, since the solder bumps 17 are mechanically crushed by using the bump pressing device 31, secondary defects caused by reflection of high-power laser and ink flow do not occur. Therefore, the yield is improved. In addition, even when the fineness of the wiring board is advanced, according to the present embodiment, it is possible to attach a bad mark relatively easily and reliably.

  (2) Moreover, in the marking process of this embodiment, since the crushing is performed after the movement distance of the head 41 is set in advance, the bump crushing amount can be set arbitrarily and accurately. This contributes to the improvement of the discrimination accuracy in the defective product discrimination process.

  (3) Further, in the present embodiment, the defective product discrimination process is performed by using the existing appearance inspection apparatus 61 that is usually used in the final stage of the wiring board manufacturing process. Therefore, it is not necessary to newly add equipment, and equipment costs can be kept low.

  In addition, you may change embodiment of this invention as follows.

  In the above embodiment, the number of solder bumps 17 to be crushed using the bump pressing device 31 is one for each wiring board region 15, but may be two or more.

  In the above embodiment, the bump pressing device 31 having the structure shown in FIG. 4 is used. However, the solder bump 17 may be crushed by using a device having a different structure.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) A method for manufacturing a multi-piece wiring board comprising a base material partitioned into a plurality of wiring board areas and a plurality of bumps respectively arranged in the plurality of wiring board areas, and is individually movable A pressing jig in which a first reference surface is formed on one member and a second reference surface is formed on the other member, and the second reference surface of the pressing jig is used A second contact step in which the surface of the base material is brought into contact with the surface of the base material in the wiring board region having a defective portion; and a tip of some of the plurality of bumps in the wiring substrate region having the defective portion, After performing the first contact step of contacting the first reference surface of the pressing means, the first contact step, and the second contact step, the height of the partial bumps to be crushed is set as the first reference step. Based on the positional relationship between the surface and the second reference surface Bump height calculation step to be taken out, and after performing the bump height calculation step, a movement distance setting step for presetting the movement distance of the pressing means when crushing the part of the bumps by the pressing means, And performing a defective portion marking step including a crushing step of crushing the part of the bumps by moving the pressing unit by the movement distance set in advance to deteriorate flatness between the plurality of bumps. A method for manufacturing a multi-piece wiring board.

  (2) After performing the defective portion marking step, the plurality of bumps are observed for each of the wiring substrate regions by an appearance inspection apparatus, and the wiring substrate region in which the flatness between the plurality of bumps is deteriorated is regarded as a defective product. The method of manufacturing a multi-cavity wiring board according to (1), wherein a defective product determination step for determining is performed.

1 is a schematic plan view showing a multi-cavity wiring board before an inspection process in a manufacturing method of a multi-cavity wiring board according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view showing a multi-piece wiring board before an inspection process. The flowchart for demonstrating the manufacturing method of a multi-piece wiring board. The schematic front view which shows the bump press apparatus (pressing means) used in a defect location marking process, and a multi-piece wiring board. The schematic front view which shows the bump press apparatus in the case of a 2nd contact process, and a multi-piece wiring board. The schematic front view which shows the bump press apparatus in the case of a 1st contact process, and a multi-piece wiring board. The schematic front view which shows the bump press apparatus in the case of a crushing process, and a multi-piece wiring board. The schematic front view which shows the external appearance inspection apparatus used in a defective-goods discrimination | determination process, and a multi-piece wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Multi-piece wiring board as a component (with bump) 12 ... Ceramic base material as a base material 15 ... Wiring board area | region 17 ... Solder bump as a conductor part 31 ... Bump press apparatus as a press means 51 ... 1st reference | standard Surface 52 ... Second reference surface 61 ... Visual inspection device

Claims (8)

A method for marking a defective portion of a component having a plurality of conductor portions on a substrate,
A first contact step of bringing the first reference surface of the pressing means into contact with a part of the plurality of conductors in the part having a defective portion;
A moving distance setting step for presetting a moving distance of the pressing means when crushing the part of the conductors by the pressing means;
The crushing step of crushing the part of the conductor parts by moving the pressing means by the movement distance set in advance and deteriorating the flatness between the plurality of conductor parts ,
Conductor height calculation step for calculating the height of the part of the conductor portion to be crushed through the crushing step at a stage prior to the moving distance setting step;
In the moving distance setting step, the moving distance is calculated and set based on the calculation result of the height of the part of the conductors . A method for marking a defective portion of a component having a plurality of bumps on a substrate,
A first contact step of bringing the first reference surface of the pressing means into contact with the tip of some of the plurality of bumps in the component having a defective portion;
A movement distance setting step for presetting a movement distance of the pressing means when crushing the part of the bumps by the pressing means;
The crushing step of crushing the part of the bumps by moving the pressing means by the movement distance set in advance, and deteriorating the flatness between the plurality of bumps ,
Bump height calculation step for calculating the height of the part of the bumps to be crushed through the crushing step at a stage prior to the moving distance setting step;
A defect location marking method for a bumped component , wherein the moving distance setting step calculates and sets the moving distance based on a calculation result of the height of the part of the bumps . A method of manufacturing a multi-piece wiring board comprising a base material partitioned into a plurality of wiring board regions and a plurality of bumps respectively disposed in the plurality of wiring board regions,
A first contact step of bringing the first reference surface of the pressing means into contact with the tips of some of the plurality of bumps in the wiring board region having the defective portion;
A movement distance setting step for presetting a movement distance of the pressing means when crushing the part of the bumps by the pressing means;
The crushing step of crushing the part of the bumps by moving the pressing means by the movement distance set in advance, and deteriorating the flatness between the plurality of bumps ,
Bump height calculation step for calculating the height of the part of the bumps to be crushed through the crushing step at a stage prior to the moving distance setting step;
In the moving distance setting step, a defective part marking step is performed in which the moving distance is calculated and set based on a calculation result of the height of the part of the bumps. A method for manufacturing a wiring board.   4. The defect marking step, wherein a bump having the largest separation distance from another bump among the plurality of bumps in the same wiring board region is determined as a crushing target. A method for producing the multi-cavity wiring board described. After the defective portion marking step, the plurality of bumps are observed for each of the wiring board regions with an appearance inspection apparatus, and the wiring board region in which the flatness between the plurality of bumps deteriorates is determined as a defective product. 5. The method for producing a multi-piece wiring board according to claim 3 , wherein a non-defective product discrimination step is performed.   A method of manufacturing a multi-piece wiring board comprising a base material partitioned into a plurality of wiring board regions and a plurality of conductor portions respectively disposed in the plurality of wiring board regions,
  A first contact step in which a first reference surface of the pressing means is brought into contact with a tip of a part of the plurality of conductors in the wiring board region having a defective portion;
  A moving distance setting step for presetting a moving distance of the pressing means when crushing the part of the conductors by the pressing means;
  The crushing step of crushing the part of the conductor parts by moving the pressing means by the movement distance set in advance and deteriorating the flatness between the plurality of conductor parts,
  Conductor height calculation step for calculating the height of the part of the conductor portion to be crushed through the crushing step at a stage prior to the moving distance setting step;
In the moving distance setting step, the moving distance is calculated and set based on the calculation result of the height of the part of the conductor portions.
A method for manufacturing a multi-piece wiring board, wherein a defective portion marking step is performed.   In the defective portion marking step, among the plurality of conductor portions in the same wiring board region, a conductor portion having a longest separation distance from other conductor portions is determined as a target to be crushed. Item 7. A method for manufacturing a multi-cavity wiring board according to Item 6.   After the defective portion marking step, the plurality of conductor portions are observed for each of the wiring substrate regions by an appearance inspection apparatus, and the wiring substrate region in which the flatness between the plurality of conductor portions is deteriorated is determined as a defective product. 8. The method for manufacturing a multi-cavity wiring board according to claim 6, wherein a defective product discrimination step is performed.

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