JP4514327B2 - Packaging container for semiconductor element storage package - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a packaging container for housing and transporting a semiconductor element housing package having a metal heat dissipating member as a heat sink and a lead terminal extending downward.
[0002]
[Prior art]
FIG. 2 shows a semiconductor element housing package (hereinafter referred to as a semiconductor package) 5 having a metal heat radiating member as a conventional heat sink and lead terminals extending downward. In the figure, reference numeral 1 denotes an insulating substrate made of ceramics such as alumina (Al ₂ O ₃ ) ceramics or resin, 2 denotes a metal heat dissipating member made of oxygen-free copper or the like provided through the center of the insulating substrate, 3 Is a lead terminal (lead pin) provided on the outer peripheral portion of the lower surface of the insulating substrate 1 so as to extend substantially vertically downward from the lower surface. A semiconductor element mounting portion (not shown) on which a semiconductor element such as an IC or LSI is mounted is formed at the center of the upper surface of the insulating substrate 1.
[0003]
FIG. 3 shows a tray of a packaging container for accommodating such semiconductor package 5 and packaging it for transport. The figure is a partial enlarged sectional view showing a semiconductor package 5 for trays stacked seen more product houses a semiconductor package in the recessed portion, reference numeral 20 is substantially the shape in the plan view a resin plate made of square The tray 20a is a recess for receiving the semiconductor package 5 upside down. The inner surface of the recess 20a has a shape that follows the outer shape of the semiconductor package 5 upside down. A step portion on which the outer peripheral portion of the upper surface of the insulating substrate 1 is placed is formed. The distance to the upper surface of the tray 20 is set such that the lead terminals 3 do not protrude upward from the upper surface of the tray 20.
[0004]
Further, the lower end of the recess 20a is set so that a gap is formed between the lower end of the recess 20a and the metal heat radiating member 2 so as not to contact the metal heat radiating member 2 of the semiconductor package 5 accommodated in the recess 20a of the lower tray 20. .
[0005]
[Problems to be solved by the invention]
However, in the conventional tray 20, after stacking several to ten or more stages, the whole is put in a bag made of a metal foil such as Al, the inside is evacuated, put into a plastic container and transported as a vacuum pack. However, when stacked or vacuum packed, the tray 20 is deformed so that the lower part of the recess 20a comes into contact with the lead terminal 3 of the semiconductor package 5 below it, the lead terminal 3 is bent, or the insulating substrate 1 is pressed. As a result, the insulating substrate 1 is broken.
[0006]
Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and its purpose is to deform a tray when a plurality of stacked or vacuum packs are formed, and lead terminals are bent or an insulating substrate is destroyed. It is to prevent it.
[0007]
[Means for Solving the Problems]
The packaging container for a semiconductor element storage package according to the present invention has a recess formed on the upper main surface of the resin plate, the semiconductor element mounting portion on the upper surface of the insulating substrate, the metal heat radiating member at the center portion of the lower surface, and the outer peripheral portion of the lower surface. A semiconductor element storage package provided with a lead terminal extending downward is disposed between the trays, which are accommodated in the concave portion with the lower surface facing up, and stacked vertically, and the lower main surface said inner convex on the lower side in a portion corresponding to the metal heat radiating member comprises a plate in the resin-made convex portion of the concave is formed, upper main in said plate said inside the concave the convex portion The inside plate is closed on the same surface as the surface, and an air pocket is included in the inside plate.
[0008]
According to the present invention, since the resin intermediate plate is arranged between the trays according to the above configuration, the strength of the trays is improved, and the trays are not easily deformed when stacked or vacuum packed. It is possible to prevent the terminals from being bent and the insulating substrate from being destroyed. In addition, the presence of the intermediate plate prevents the concave portion of the tray from coming into direct contact with the semiconductor package directly below it, so even if the tray is deformed and the concave portion is pushed downward, Direct pressure is eliminated. Furthermore, since the inside with a downward convex in a portion corresponding to a metal heat sink member of the lower major surface of the intermediate plate has a convex portion of the concave is formed, a middle plate upon or vacuum packed stacked or convex The part functions in such a manner as to fix the semiconductor package in contact with the metal heat dissipating member and prevent the positional deviation. As a result, it is possible to prevent the insulating substrate or the like from being damaged due to the semiconductor package moving vigorously in the recess due to vibration or impact during transportation. In addition, since the concave inner side of the convex portion is closed with the same surface as the upper main surface of the intermediate plate and the air reservoir is included in the intermediate plate, the pressure on the semiconductor package can be relieved by the cushion effect of the air reservoir. it can.
[0009]
In the present invention, preferably characterized in that in a state in which the tray stacking a predetermined number is in contact with the lower surface of the convex portion in said plate and said metallic heat radiating member.
[0010]
The present invention, by the above configuration, the projecting portion of the middle plate trays when stacked viewed product is a semiconductor package is fixed in contact with the metal heat radiating member functions to reliably prevent the positional deviation, the result Further, it is possible to prevent the semiconductor substrate or the like from violently moving in the recess due to vibration or impact during transportation and damaging the insulating substrate or the like.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
The semiconductor package packaging container of the present invention will be described in detail below. 1 and 4 to 6 show a packaging container according to the present invention, and FIG. 1 is a partially enlarged sectional view of a semiconductor package portion of a packaging container in a state where a semiconductor package is accommodated and stacked. a) is a plan view of the tray, (b) is a cross-sectional view taken along line AA in (a), (a) in FIG. 5 is a plan view of the intermediate plate, and (b) is taken along line BB in (a). It is sectional drawing.
[0012]
In FIG. 1, 1 is an insulating substrate made of ceramics such as alumina (Al ₂ O ₃ ) ceramics or resin, and 2 is a metal made of oxygen-free copper (Cu) or the like provided through the center of the insulating substrate 1. A heat radiating member 3 is a lead terminal (lead pin) provided on the outer peripheral portion of the lower surface of the insulating substrate 1 so as to extend substantially vertically downward from the lower surface. In addition, a semiconductor element mounting portion (not shown) on which a semiconductor element such as an IC or LSI is mounted is provided at the center of the upper surface of the insulating substrate 1.
[0013]
In FIG. 4, 10 is a tray made of a resin plate and having a substantially quadrangular shape in plan view. The tray 10 is formed by vacuum press molding into a thin plate having a thickness of about 0.5 to 2 mm made of a thermoplastic resin such as a polystyrene resin, a polyvinyl chloride resin, or a polyester resin, and the concave portion 10a is vertically and horizontally formed on the upper main surface thereof. A large number are formed. Reference numeral 10a denotes a recess for receiving the semiconductor package 5 upside down. The inner surface of the recess 10a is shaped to follow the outer shape of the semiconductor package 5 upside down, and a step portion on which the outer peripheral portion of the upper surface of the insulating substrate 1 is placed is formed. The distance to the upper surface of the tray 10 is set such that the lead terminals 3 do not protrude upward from the upper surface of the tray 10.
[0014]
In addition, an outer peripheral wall is formed on the outer peripheral portion of the tray 10 so as to surround the base portion where the concave portion 10a is formed and protrudes to a position higher than the base portion, and whose outer peripheral edge is lowered to a position lower than the lower end of the concave portion 10a. The plurality of trays 10 can be stacked vertically by fitting the outer peripheral walls together.
[0015]
In FIG. 5, reference numeral 11 denotes a resin intermediate plate made of the same material as that of the tray 10 and manufactured by the same manufacturing method as the tray 10, and has a substantially same outer shape as the tray 10 and slightly smaller than the tray 10. ing. The intermediate plate 11 has a convex portion 11 a that is convex downward and concave on the inside at a portion corresponding to the metal heat radiating member 2 on the lower main surface between the trays 10.
[0016]
The intermediate plate 11 of the present invention is disposed so as to cover the trays 10 and the uppermost tray 10.
[0017]
In addition, the tray 10 of the present invention is preferably stacked about 8 to 12 steps. If the tray 10 is less than 8 steps, the number of the semiconductor packages 5 to be transferred is reduced, which is not suitable in terms of transfer efficiency. In addition, the height of the tray 10 becomes high and the holding state becomes unstable, which is inappropriate in terms of work efficiency such as vacuum packing, packaging, and subsequent conveyance.
[0018]
In the present invention, it is preferable that the lower surface of the convex portion 11a of the intermediate plate 11 and the metal heat radiating member 2 are in contact with each other in a state where a predetermined number (8 to 12 steps) of trays 10 are stacked. That is, in one stage, there is a slight gap between the lower surface of the convex portion 11a of the intermediate plate 11 and the metal heat radiating member 2, or the lower surface of the convex portion 11a and the metal heat radiating member 2 are almost free of pressure. This is because the bottom surface of the convex portion 11a is preferably in contact with the metal heat radiating member 2 with a small pressure in a state where a predetermined number of trays 10 are stacked.
[0019]
In the first stage, when there is a slight gap between the lower surface of the convex portion 11a of the intermediate plate 11 and the metal heat radiating member 2, the gap is preferably 0.5 mm or less. When the thickness exceeds 0.5 mm, the lower surface of the convex portion 11 a is difficult to contact the metal heat radiating member 2 in a state where a predetermined number of trays 10 are stacked.
[0020]
In addition, the pressure when the lower surface of the convex portion 11a is in contact with the metal heat radiating member 2 in a state where a predetermined number of trays 10 are stacked depends on the thickness of the insulating substrate 1 of the semiconductor package 5 and the shape of the through hole for installing the metal heat radiating member 2. It is set according to the size, and may be set so that the semiconductor package 5 can be fixed and the deformation of the tray 10 is prevented.
[0021]
Various embodiments of the convex portion 11a of the intermediate plate 11 of the present invention are shown in FIG. (A) of the figure is the one in which the width of the convex portion 11a is gradually reduced from the upper end side (base portion) to the lower end side, the strength of the convex portion 11a increases, and the vertical direction is crushed or laterally expanded. Deformation can be prevented. In this case, the inclination angle θ of the side surface of the convex portion 11a is preferably 5 to 30 °, and if it is less than 5 °, the strength of the convex portion 11a is not sufficiently increased, and the vertical direction is crushed or deformed in the lateral direction. May occur. If it exceeds 30 °, the ground pressure (pressure per unit area) against the metal heat radiating member 2 on the lower surface of the convex portion 11a may increase and damage the semiconductor package 5 in some cases. Further, although the convex portion 11a is not easily deformed in the lateral direction, the vertical portion is easily crushed.
[0022]
(B) is a structure in which the concave inner side of the convex portion 11a that is convex downward and concave on the inner side is closed with the same surface as the upper main surface of the middle plate to enclose the air reservoir 11b. The pressure on the semiconductor package 5 can be relieved by the cushion effect.
[0023]
(C) is obtained by roughening the lower surface of the convex portion 11a, and the friction coefficient of the lower surface is increased to make it difficult for lateral displacement with respect to the metal heat radiating member 2 to occur.
[0024]
(D) enlarges the lower part of the convex part 11a and enlarges the contact area of the lower surface, thereby reducing the ground pressure against the metal heat radiating member 2 and making it difficult to cause lateral displacement.
[0025]
Thus, the present invention improves the strength of the tray 10, prevents the tray 10 from being deformed when stacked or vacuum packed, and prevents the lead terminals 3 of the semiconductor package 5 from being bent or the insulating substrate 1 from being destroyed. Can do. Further, the presence of the intermediate plate 11 prevents the recess 10a of the tray 10 from coming into direct contact with the semiconductor package immediately below, so even if the tray 10 is deformed and the recess 10a is pushed downward, Direct pressure is eliminated from the semiconductor package 5 immediately below. Further, when stacked or vacuum packed, the convex portion 11a of the intermediate plate 11 contacts the metal heat radiating member 2 to fix the semiconductor package 5 and function to prevent the displacement. As a result, it is possible to prevent the semiconductor substrate 5 from moving violently in the recess 10a due to vibrations or shocks during transportation and damaging the insulating substrate 1 or the like.
[0026]
Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention.
[0027]
【The invention's effect】
In the present invention, a concave portion is formed on the upper main surface of a resin plate, a semiconductor element mounting portion is provided on the upper surface of the insulating substrate, a metal heat radiating member is provided in the central portion of the lower surface, and a lead terminal extending downward is provided on the outer peripheral portion of the lower surface. The semiconductor element storage package is placed in the recess with the lower surface facing upward and stacked vertically, and is disposed between the trays and protrudes downward to a portion corresponding to the metal heat dissipation member on the lower main surface. in the inner provided with a plate in the resin-made convex portion of the concave is formed and encasing an air pocket in the intermediate plate and closed at the same plane as the upper surface of the intermediate plate inside the concave projecting portion As a result, the strength of the tray is improved, the tray becomes difficult to deform when stacked or vacuum packed, and the lead terminals of the semiconductor package can be prevented from being bent or the insulating substrate being destroyed. In addition, the presence of the intermediate plate prevents the concave portion of the tray from coming into direct contact with the semiconductor package directly below it, so even if the tray is deformed and the concave portion is pushed downward, Direct pressure is eliminated. Further, the convex portion of the intermediate plate upon or vacuum packed or stacked is a semiconductor package is fixed in contact with the metal heat radiating member functions to prevent the positional deviation. As a result, it is possible to prevent the insulating substrate or the like from being damaged due to the semiconductor package moving vigorously in the recess due to vibration or impact during transportation. In addition, since the concave inner side of the convex portion is closed with the same surface as the upper main surface of the intermediate plate and the air reservoir is included in the intermediate plate, the pressure on the semiconductor package can be relieved by the cushion effect of the air reservoir. it can.
[0028]
The present invention is, preferably by the lower surface and the metal heat radiating member of the convex portion of the intermediate plate tray in a predetermined number of states product seen superimposed are in contact, the convex portion of the intermediate plate trays when stacked viewed product is metal The semiconductor package is fixed in contact with the heat dissipating member and functions to reliably prevent its displacement. As a result, the semiconductor package moves violently in the recess due to vibration and shock during transportation, and the insulating substrate is damaged. Can be prevented.
[Brief description of the drawings]
FIG. 1 is a partially enlarged cross-sectional view showing a semiconductor package part of a packaging container in which a semiconductor package of the present invention is accommodated and stacked.
FIG. 2 is a side view of a semiconductor package.
FIG. 3 is a partially enlarged cross-sectional view showing a semiconductor package portion of a tray of a packaging container in a state where conventional semiconductor packages are accommodated and stacked.
4A is a plan view of a tray, and FIG. 4B is a cross-sectional view taken along the line AA in FIG. 4A.
5A is a plan view of an intermediate plate, and FIG. 5B is a sectional view taken along line BB in FIG. 5A.
6 show various embodiments of the projecting portion of the plate in the present invention, (a) is a cross-sectional view despite gradually smaller toward the lower end side of the width of the convex portion from the upper end, (b) it is convex to the lower side Sectional drawing of the concave inner side of the convex portion with the same surface as the upper main surface of the middle plate to enclose the air pocket, (c) is a cross section of the roughened lower surface of the convex portion FIG. 4D is a cross-sectional view of the lower portion of the convex portion enlarged to increase the contact area of the lower surface.
[Explanation of symbols]
1: Insulating substrate 2: Metal heat dissipation member 3: Lead terminal 5: Semiconductor package 10: Tray 10a: Concave portion 11: Middle plate 11a: Convex portion

Claims (2)

A semiconductor element in which a concave portion is formed on the upper main surface of a resin plate, a semiconductor element mounting portion on the upper surface of the insulating substrate, a metal heat dissipation member in the central portion of the lower surface, and a lead terminal extending downward on the outer peripheral portion of the lower surface A storage package is accommodated in the recess with the lower surface facing upward and stacked vertically, and is disposed between the trays and protrudes downward to a portion corresponding to the metal heat dissipation member on the lower main surface. in the inner provided with a plate in the resin-made convex portion of the concave is formed, air in said plate said inside of said concave of the convex portion and closed at the same plane as the upper major surface of the insertion plate A packaging container for a package for housing a semiconductor element, characterized by containing a reservoir. Packaging container for housing a semiconductor element package according to claim 1, wherein the lower surface of the convex portion in said plate and said metallic heat radiating member is in contact in a state in which the tray stacking a predetermined number.

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