JP4511601B2 - 冷却システム及び方法 - Google Patents

冷却システム及び方法 Download PDF

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Publication number
JP4511601B2
JP4511601B2 JP2007544912A JP2007544912A JP4511601B2 JP 4511601 B2 JP4511601 B2 JP 4511601B2 JP 2007544912 A JP2007544912 A JP 2007544912A JP 2007544912 A JP2007544912 A JP 2007544912A JP 4511601 B2 JP4511601 B2 JP 4511601B2
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Japan
Prior art keywords
cooling
coolant
loop
subsystem
cooling loop
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Expired - Lifetime
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JP2007544912A
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English (en)
Japanese (ja)
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JP2008523599A (ja
JP2008523599A5 (https=
Inventor
キャンベル、リーバイ
チュー、リチャード
エルスワース、マイケル
アイアンガー、マドゥスーダン
シュミット、ロジャー
サイモンズ、ロバート
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International Business Machines Corp
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International Business Machines Corp
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Publication date
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Publication of JP2008523599A publication Critical patent/JP2008523599A/ja
Publication of JP2008523599A5 publication Critical patent/JP2008523599A5/ja
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Publication of JP4511601B2 publication Critical patent/JP4511601B2/ja
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/2079Liquid cooling without phase change within rooms for removing heat from cabinets
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
JP2007544912A 2004-12-09 2005-12-07 冷却システム及び方法 Expired - Lifetime JP4511601B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/008,711 US6973801B1 (en) 2004-12-09 2004-12-09 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
PCT/EP2005/056581 WO2006061404A1 (en) 2004-12-09 2005-12-07 Cooling system and method

Publications (3)

Publication Number Publication Date
JP2008523599A JP2008523599A (ja) 2008-07-03
JP2008523599A5 JP2008523599A5 (https=) 2008-10-23
JP4511601B2 true JP4511601B2 (ja) 2010-07-28

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ID=35452409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007544912A Expired - Lifetime JP4511601B2 (ja) 2004-12-09 2005-12-07 冷却システム及び方法

Country Status (7)

Country Link
US (1) US6973801B1 (https=)
EP (1) EP1829441B1 (https=)
JP (1) JP4511601B2 (https=)
CN (1) CN100556260C (https=)
AT (1) ATE391406T1 (https=)
DE (1) DE602005005859T2 (https=)
WO (1) WO2006061404A1 (https=)

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Also Published As

Publication number Publication date
EP1829441B1 (en) 2008-04-02
EP1829441A1 (en) 2007-09-05
WO2006061404A1 (en) 2006-06-15
CN101091424A (zh) 2007-12-19
JP2008523599A (ja) 2008-07-03
US6973801B1 (en) 2005-12-13
ATE391406T1 (de) 2008-04-15
DE602005005859T2 (de) 2009-05-20
CN100556260C (zh) 2009-10-28
DE602005005859D1 (de) 2008-05-15

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