CN100556260C - 冷却系统和方法 - Google Patents

冷却系统和方法 Download PDF

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Publication number
CN100556260C
CN100556260C CN200580042255.3A CN200580042255A CN100556260C CN 100556260 C CN100556260 C CN 100556260C CN 200580042255 A CN200580042255 A CN 200580042255A CN 100556260 C CN100556260 C CN 100556260C
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CN
China
Prior art keywords
coolant
cooling
cooling circuit
heat
electronics
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN200580042255.3A
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English (en)
Chinese (zh)
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CN101091424A (zh
Inventor
莱维·坎贝尔
朱兆凡
迈克尔·埃尔斯沃斯
马德胡苏丹·英加尔
罗格·施米德
罗伯特·西蒙斯
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Lenovo International Ltd
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International Business Machines Corp
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Publication of CN101091424A publication Critical patent/CN101091424A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
CN200580042255.3A 2004-12-09 2005-12-07 冷却系统和方法 Expired - Lifetime CN100556260C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/008,711 2004-12-09
US11/008,711 US6973801B1 (en) 2004-12-09 2004-12-09 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack

Publications (2)

Publication Number Publication Date
CN101091424A CN101091424A (zh) 2007-12-19
CN100556260C true CN100556260C (zh) 2009-10-28

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Family Applications (1)

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CN200580042255.3A Expired - Lifetime CN100556260C (zh) 2004-12-09 2005-12-07 冷却系统和方法

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US (1) US6973801B1 (https=)
EP (1) EP1829441B1 (https=)
JP (1) JP4511601B2 (https=)
CN (1) CN100556260C (https=)
AT (1) ATE391406T1 (https=)
DE (1) DE602005005859T2 (https=)
WO (1) WO2006061404A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105144861A (zh) * 2013-03-29 2015-12-09 惠普发展公司，有限责任合伙企业 具有冷却装置的电子装置
TWI877838B (zh) * 2023-07-26 2025-03-21 廣達電腦股份有限公司 用於電腦系統之液冷機架組合及包含其之電信系統

Families Citing this family (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
US20070051126A1 (en) * 2004-11-29 2007-03-08 Seiichi Okuda Air refrigerant type freezing and heating apparatus
US8424885B2 (en) 2005-12-22 2013-04-23 Elliptical Mobile Solutions, LLC Method and apparatus for an environmentally-protected electronic equipment enclosure
US7578337B2 (en) * 2005-04-14 2009-08-25 United States Thermoelectric Consortium Heat dissipating device
US7298617B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7992625B1 (en) 2006-08-18 2011-08-09 United States Thermoelectric Consortium Fluid-operated heat transfer device
US7814965B1 (en) 2005-10-27 2010-10-19 United States Thermoelectric Consortium Airflow heat dissipation device
US7365973B2 (en) 2006-01-19 2008-04-29 American Power Conversion Corporation Cooling system and method
US8672732B2 (en) 2006-01-19 2014-03-18 Schneider Electric It Corporation Cooling system and method
TW200809477A (en) * 2006-03-30 2008-02-16 Cooligy Inc Integrated fluid pump and radiator reservoir
EP2032907B1 (en) * 2006-06-01 2018-05-16 Google LLC Warm cooling for electronics
US8327656B2 (en) 2006-08-15 2012-12-11 American Power Conversion Corporation Method and apparatus for cooling
US8322155B2 (en) 2006-08-15 2012-12-04 American Power Conversion Corporation Method and apparatus for cooling
US9568206B2 (en) 2006-08-15 2017-02-14 Schneider Electric It Corporation Method and apparatus for cooling
US20080043442A1 (en) * 2006-08-16 2008-02-21 Strickland Travis C Computer system with thermal conduction
US7665325B2 (en) * 2006-09-12 2010-02-23 International Business Machines Corporation Multi-fluid cooling system and method with freeze protection for cooling an electronic device
US7681404B2 (en) 2006-12-18 2010-03-23 American Power Conversion Corporation Modular ice storage for uninterruptible chilled water
US8425287B2 (en) 2007-01-23 2013-04-23 Schneider Electric It Corporation In-row air containment and cooling system and method
US8141620B1 (en) 2007-02-26 2012-03-27 United States Thermoelectric Consortium (USTC) Method for conditioning a cooling loop of a heat exchange system
US7511959B2 (en) * 2007-04-25 2009-03-31 Hewlett-Packard Development Company, L.P. Scalable computing apparatus
US7477514B2 (en) * 2007-05-04 2009-01-13 International Business Machines Corporation Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
DK2147585T3 (en) 2007-05-15 2017-01-16 Schneider Electric It Corp PROCEDURE AND SYSTEM FOR HANDLING EQUIPMENT AND COOLING
US7602609B2 (en) * 2007-05-31 2009-10-13 Liebert Corporation Cooling system and method of use
TW200912621A (en) * 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US20090229283A1 (en) * 2007-08-24 2009-09-17 Joseph Marsala Method and apparatus for isothermal cooling of hard disk drive arrays using a pumped refrigerant loop
US7963119B2 (en) * 2007-11-26 2011-06-21 International Business Machines Corporation Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center
US8553416B1 (en) * 2007-12-21 2013-10-08 Exaflop Llc Electronic device cooling system with storage
US8175753B2 (en) * 2008-02-15 2012-05-08 The Pnc Financial Services Group, Inc. Systems and methods for computer equipment management
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
WO2010017321A1 (en) 2008-08-05 2010-02-11 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7903404B2 (en) * 2009-04-29 2011-03-08 Hewlett-Packard Development Company, L.P. Data centers
US8219362B2 (en) 2009-05-08 2012-07-10 American Power Conversion Corporation System and method for arranging equipment in a data center
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
CN102626006B (zh) * 2009-05-12 2016-02-03 爱思欧托普有限公司 被冷却的电子系统
US8081461B2 (en) * 2009-06-25 2011-12-20 International Business Machines Corporation Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein
US8490419B2 (en) * 2009-08-20 2013-07-23 United States Thermoelectric Consortium Interlocked jets cooling method and apparatus
US8522569B2 (en) 2009-10-27 2013-09-03 Industrial Idea Partners, Inc. Utilization of data center waste heat for heat driven engine
US8144467B2 (en) 2010-05-26 2012-03-27 International Business Machines Corporation Dehumidifying and re-humidifying apparatus and method for an electronics rack
US7905096B1 (en) * 2010-05-26 2011-03-15 International Business Machines Corporation Dehumidifying and re-humidifying air cooling for an electronics rack
US8189334B2 (en) 2010-05-26 2012-05-29 International Business Machines Corporation Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack
US9038406B2 (en) 2010-05-26 2015-05-26 International Business Machines Corporation Dehumidifying cooling apparatus and method for an electronics rack
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8514575B2 (en) 2010-11-16 2013-08-20 International Business Machines Corporation Multimodal cooling apparatus for an electronic system
US8274790B2 (en) 2010-11-16 2012-09-25 International Business Machines Corporation Automatically reconfigurable liquid-cooling apparatus for an electronics rack
US8688413B2 (en) 2010-12-30 2014-04-01 Christopher M. Healey System and method for sequential placement of cooling resources within data center layouts
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US8760863B2 (en) 2011-10-31 2014-06-24 International Business Machines Corporation Multi-rack assembly with shared cooling apparatus
US8817474B2 (en) 2011-10-31 2014-08-26 International Business Machines Corporation Multi-rack assembly with shared cooling unit
US20130112378A1 (en) * 2011-11-04 2013-05-09 Dell Products L.P. System and Method for Cooling Information Handling Resources
EP2796025A4 (en) 2011-12-22 2016-06-29 Schneider Electric It Corp SYSTEM AND METHOD FOR PREDICTING TEMPERATURE VALUES IN AN ELECTRONIC SYSTEM
US9952103B2 (en) 2011-12-22 2018-04-24 Schneider Electric It Corporation Analysis of effect of transient events on temperature in a data center
US9167728B2 (en) * 2012-07-18 2015-10-20 International Business Machines Corporation Information technology equipment cooling method
US8964384B2 (en) * 2012-07-27 2015-02-24 Hewlett-Packard Development Company, L.P. Component cooling
US20140048993A1 (en) * 2012-08-17 2014-02-20 Apple Inc. Selective placement of coolant to undercut areas
US8925333B2 (en) 2012-09-13 2015-01-06 International Business Machines Corporation Thermoelectric-enhanced air and liquid cooling of an electronic system
US9351431B2 (en) 2012-10-11 2016-05-24 International Business Machines Corporation Cooling system with automated seasonal freeze protection
US9648784B2 (en) 2013-03-15 2017-05-09 Inertech Ip Llc Systems and assemblies for cooling server racks
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
TW201515563A (zh) * 2013-10-08 2015-04-16 Hon Hai Prec Ind Co Ltd 散熱系統
US10197310B2 (en) 2014-06-20 2019-02-05 Nortek Air Solutions Canada, Inc. Systems and methods for managing conditions in enclosed space
US10168061B2 (en) * 2014-11-11 2019-01-01 Emerson Network Power S.R.L. Conditioning system of the free cooling type for environments, method of operation of a said conditioning system, and apparatus for carrying out such method
US10638641B2 (en) 2014-11-14 2020-04-28 Hewlett Packard Enterprise Development Lp Cooling rack
US11092349B2 (en) 2015-05-15 2021-08-17 Nortek Air Solutions Canada, Inc. Systems and methods for providing cooling to a heat load
US11143430B2 (en) 2015-05-15 2021-10-12 Nortek Air Solutions Canada, Inc. Using liquid to air membrane energy exchanger for liquid cooling
WO2017052628A1 (en) * 2015-09-25 2017-03-30 Intel Corporation Computing apparatus with closed cooling loop
EP3400407A4 (en) 2016-01-08 2019-08-07 Nortek Air Solutions Canada, Inc. INTEGRATED AIR SYSTEM IN A 100% AIR RECIRCULATION SYSTEM
SG10202107907YA (en) 2016-03-16 2021-08-30 Inertech Ip Llc System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
EP3236725B8 (en) * 2016-04-18 2020-03-11 Rolls-Royce plc Power electronics module
JP6907592B2 (ja) 2017-02-28 2021-07-21 富士通株式会社 冷却装置及び電子機器システム
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
DE202018102582U1 (de) 2018-01-23 2018-05-22 MEGWARE Computer Vertrieb und Service GmbH Hochtemperatur-direktflüssigkeitsgekühltes Hochleistungsrechnersystem
US10681846B2 (en) 2018-04-19 2020-06-09 Google Llc Cooling electronic devices in a data center
US10645847B2 (en) 2018-04-20 2020-05-05 Google Llc Cooling electronic devices in a data center
US10966352B2 (en) 2018-09-24 2021-03-30 Google Llc Cooling electronic devices in a data center
US10548239B1 (en) * 2018-10-23 2020-01-28 Google Llc Cooling electronic devices in a data center
GB201916771D0 (en) 2019-11-18 2020-01-01 Iceotope Group Ltd Heat sink for liquid cooling
US10548240B1 (en) 2019-01-11 2020-01-28 Google Llc Cooling electronic devices in a data center
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
WO2020210587A1 (en) 2019-04-10 2020-10-15 Jetcool Technologies, Inc. Thermal management of electronics using co-located microjet nozzles and electronic elements
WO2020214493A1 (en) 2019-04-14 2020-10-22 Jetcool Technologies, Inc. Direct contact fluid based cooling module
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
CA3140764C (en) 2019-06-27 2025-06-10 Hypertechnologie Ciara Inc. MICRO-SLOT SYSTEM FOR DIRECT CONTACT COOLING ELECTRONICS
US11801733B2 (en) 2019-09-25 2023-10-31 Baidu Usa Llc Liquid cooling loop design for high performance processors in harsh vehicle environment
GB201916763D0 (en) 2019-11-18 2020-01-01 Iceotope Group Ltd Nozzle arrangement and cooling module
US10959352B1 (en) * 2020-01-03 2021-03-23 Quanta Computer Inc. Cooling system with floating cold plate with single pipes
US11212943B2 (en) 2020-02-21 2021-12-28 Nvidia Corporation Universal pluggable datacenter cooling system
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
WO2022060898A1 (en) 2020-09-15 2022-03-24 Jetcool Technologies Inc. High temperature electronic device thermal management system
US12289871B2 (en) 2020-09-15 2025-04-29 Jetcool Technologies Inc. High temperature electronic device thermal management system
US11211538B1 (en) 2020-12-23 2021-12-28 Joseph L. Pikulski Thermal management system for electrically-powered devices
US11950396B2 (en) * 2020-12-30 2024-04-02 Nvidia Corporation Intelligent swappable modular unit for local cooling loops in a datacenter cooling system
WO2022159447A1 (en) 2021-01-20 2022-07-28 Jetcool Technologies Inc. Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies
US11903166B2 (en) * 2021-02-01 2024-02-13 Microsoft Technology Licensing, Llc Systems and methods for immersion cooling with subcooled spray
US12082382B2 (en) * 2021-04-23 2024-09-03 Nvidia Corporation Intelligent in-rack pump or compressor unit for datacenter cooling systems
US11812589B2 (en) * 2021-05-12 2023-11-07 Nvidia Corporation Intelligent refrigerant distribution unit for datacenter cooling systems
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US11627687B2 (en) * 2021-06-22 2023-04-11 Baidu Usa Llc Multiple phase multiple system architecture
US12048118B2 (en) * 2021-08-13 2024-07-23 Jetcool Technologies Inc. Flow-through, hot-spot-targeting immersion cooling assembly
US12464675B2 (en) 2021-11-09 2025-11-04 Hoffman Enclosures Inc. Controlling high density liquid cooling system to liquid cool components
US12289861B2 (en) 2021-11-12 2025-04-29 Jetcool Technologies Inc. Liquid-in-liquid cooling system for electronic components
US20230180436A1 (en) * 2021-12-08 2023-06-08 Treis Blockchain, Llc System for cooling electrical components and recycling heat
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
TW202407925A (zh) 2022-03-04 2024-02-16 美商捷控技術有限公司 用於電腦處理器及處理器組件之主動冷卻散熱蓋
US12520452B2 (en) 2022-05-04 2026-01-06 Hoffman Enclosures Inc. Replaceable pump unit for cooling systems
WO2024091481A1 (en) 2022-10-24 2024-05-02 Jetcool Technologies Inc. Cooling module with integrated pump for immersion cooling in electronics

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195264A (zh) * 1997-03-27 1998-10-07 日本电气株式会社 具有带散热结构的插入单元的电子装置
CN1485906A (zh) * 2002-09-24 2004-03-31 ������������ʽ���� 电子装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3032590A1 (de) * 1980-08-27 1982-04-01 Siemens AG, 1000 Berlin und 8000 München Anordnung zur kuehlung einer gas- oder fluessigkeitsgekuehlten elektrischen maschine
JPS62119620A (ja) * 1985-11-20 1987-05-30 Fujitsu Ltd 冷却水供給装置
US5131233A (en) 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
SE505272C2 (sv) * 1994-12-14 1997-07-28 Ericsson Telefon Ab L M Kylsystem för telekommunikationsutrustning
US5924482A (en) 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US6019165A (en) 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US20020134544A1 (en) * 2000-09-07 2002-09-26 Thermotek, Inc. Passive cooling system and method
US6408937B1 (en) 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
US7225864B2 (en) * 2001-02-08 2007-06-05 Oriol Inc. Multi-channel temperature control system for semiconductor processing facilities
US6604370B2 (en) 2001-02-22 2003-08-12 Hewlett-Packard Development Company, L.P. Variably configured sprayjet cooling system
US6498725B2 (en) 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
TW561226B (en) 2001-09-25 2003-11-11 Matsushita Electric Industrial Co Ltd Ultra-thin pump and cooling system including the pump
US6587345B2 (en) 2001-11-09 2003-07-01 International Business Machines Corporation Electronic device substrate assembly with impermeable barrier and method of making
US6628520B2 (en) * 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
US6625023B1 (en) 2002-04-11 2003-09-23 General Dynamics Land Systems, Inc. Modular spray cooling system for electronic components
US6604571B1 (en) 2002-04-11 2003-08-12 General Dynamics Land Systems, Inc. Evaporative cooling of electrical components
US6940712B2 (en) 2002-07-17 2005-09-06 International Business Machines Corporation Electronic device substrate assembly with multilayer impermeable barrier and method of making
US7146822B2 (en) 2002-12-30 2006-12-12 Intel Corporation Centrifugal liquid pump with perimeter magnetic drive
CN100338983C (zh) * 2003-12-03 2007-09-19 国际商业机器公司 确保冷却多个电子设备子系统的冷却系统和方法
US7106590B2 (en) * 2003-12-03 2006-09-12 International Business Machines Corporation Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195264A (zh) * 1997-03-27 1998-10-07 日本电气株式会社 具有带散热结构的插入单元的电子装置
CN1485906A (zh) * 2002-09-24 2004-03-31 ������������ʽ���� 电子装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105144861A (zh) * 2013-03-29 2015-12-09 惠普发展公司，有限责任合伙企业 具有冷却装置的电子装置
US9713285B2 (en) 2013-03-29 2017-07-18 Hewlett Packard Enterprise Development Lp Electronic apparatus having a cooling apparatus
CN105144861B (zh) * 2013-03-29 2018-04-17 慧与发展有限责任合伙企业 具有冷却装置的电子装置
TWI877838B (zh) * 2023-07-26 2025-03-21 廣達電腦股份有限公司 用於電腦系統之液冷機架組合及包含其之電信系統
US12369282B2 (en) 2023-07-26 2025-07-22 Quanta Computer Inc. Liquid cooling rack assembly for computing system and telecommunication system including the same

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Publication number Publication date
EP1829441B1 (en) 2008-04-02
EP1829441A1 (en) 2007-09-05
WO2006061404A1 (en) 2006-06-15
CN101091424A (zh) 2007-12-19
JP2008523599A (ja) 2008-07-03
US6973801B1 (en) 2005-12-13
ATE391406T1 (de) 2008-04-15
DE602005005859T2 (de) 2009-05-20
JP4511601B2 (ja) 2010-07-28
DE602005005859D1 (de) 2008-05-15

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