JP4502941B2 - Conductive layer, signal transmission board, and communication device - Google Patents

Description

  The present invention relates to a conductive layer included in a signal transmission board for transmitting a signal by two-dimensional spread signal transmission technology, a signal transmission board including the conductive layer, and a communication apparatus including the signal transmission board.

In recent years, each of a plurality of elements (hereinafter referred to as a DST (Diffusive Signal-Transmission) chip) relays a signal and transmits the signal in a packet toward a destination without requiring individual wiring. Various techniques (hereinafter referred to as two-dimensional spread signal transmission (2D (Dimension) -DST) technology) are disclosed in Patent Document 1 and Non-Patent Document 2, for example. Patent Document 1 discloses a communication device having a plurality of low resistance layers and a conductive layer made up of high resistance layers.
JP 2004-328409 A Cellcross, Inc. [Searched in November 2004], Internet, <http://www.utri.co.jp/venture/venture2.html>

  In the communication device as shown in the above-mentioned Patent Document 1, DST chips are arranged in all the low resistance layers in order to execute signal transmission. Such a DST chip has a lower unit price due to mass production, and therefore does not increase the cost of the communication apparatus as described above. However, in order to widely spread such communication apparatuses, it is considered that further cost reduction is desirable.

  Here, for example, a method of reducing the cost of the communication device by not arranging the DST chip between several low resistance layers is conceivable. However, when the DST chip is partially thinned and disposed as described above, problems such as a decrease in selectable transmission paths and loss of the shortest path may occur.

  Therefore, in view of the above circumstances, the present invention provides a communication device that can realize cost reduction without lowering transmission efficiency, a signal transmission board for constructing the communication apparatus, and a conductive material included in the signal transmission board. The purpose is to provide a layer.

  A conductive layer according to one embodiment of the present invention that solves the above problem includes a plurality of low-resistance regions that transmit signals and a high-resistance region that insulates adjacent low-resistance regions from each other. For signal transmission using technology, either a communication chip that transmits signals using two-dimensional diffusion signal transmission technology or a connection member that electrically connects adjacent low-resistance regions is selectively inserted A plurality of possible holes are formed. In the conductive layer, the low resistance region may be formed in a square shape, and the communication chip may be disposed in contact with the four sides of the low resistance region. Further, the low resistance region is formed in a cross shape, and a communication chip may be disposed at the boundary of the low resistance region.

  In addition, a signal transmission board according to one embodiment of the present invention that solves the above problems includes a plurality of low resistance regions that transmit signals and a high resistance region that insulates adjacent low resistance regions from each other, and is two-dimensional. For transmitting signals using spread signal transmission technology, select either communication chip that transmits signals using two-dimensional spread signal transmission technology or a connection member that electrically connects adjacent low-resistance regions There are a plurality of holes that can be inserted.

  In addition, a communication device according to an aspect of the present invention that solves the above problem includes the signal transmission board, and either the communication chip or the connection member is inserted into each of the plurality of holes. .

  When the conductive layer, signal transmission board, and communication device of the present invention are employed, the number of DST chips can be reduced without reducing the number of selectable transmission paths and disappearance of the shortest path, so the cost is not reduced without reducing the transmission efficiency. Down can be realized.

  Hereinafter, a communication apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram illustrating a configuration of a signal transmission board 100 for constructing the communication device of the present embodiment. FIG. 1A is a top view of a part of the signal transmission board 100 of the present embodiment. FIG. 1B is a cross-sectional view of the signal transmission board 100 of the present embodiment, and is a cross-sectional view taken along line AA in FIG.

  The signal transmission board 100 of the present embodiment is a seven-layered board, and in the order from the bottom, the insulating layer 112, the ground layer 120, the insulating layer 114, the signal layer 130, the insulating layer 116, the power supply layer 140, and the insulating layer 118. It is a laminated one.

  The insulating layers 112, 114, 116, and 118 are made of, for example, a cloth having insulating properties and flexibility. The insulating layer 112 insulates the outside of the signal transmission substrate 100 from the ground layer 120. The insulating layer 114 insulates the ground layer 120 and the signal layer 130 from each other. The insulating layer 116 insulates the signal layer 130 and the power supply layer 140 from each other. The insulating layer 118 insulates the power supply layer 140 from the outside of the signal transmission board 100. In these insulating layers, holes 112a, 114a, 116a, and 118a through which either a DST chip mounting connector 210 or a connector 230 (shown by a broken line in FIG. 1B), which will be described later, are inserted, respectively. A plurality of are formed.

  The ground layer 120 and the power supply layer 140 are made of a cloth having conductivity and flexibility, for example. The ground layer 120 is a layer that becomes a ground potential when the two-dimensional spread signal transmission technology is implemented. The signal layer 130 is a layer that becomes a potential of a signal transmitted between the DST chips by the two-dimensional spread signal transmission technology. The power supply layer 140 is a layer for supplying a power supply voltage to each DST chip. In these layers, a plurality of holes 120a, 130a, and 140a through which either the DST chip mounting connector 210 or the connector 230 is inserted are formed. The material of the signal layer 130 will be described later.

  Each layer is laminated so that the holes formed in each layer are concentric. In addition, the hole diameter is large according to the layer laminated | stacked on the upper side. Specifically, the hole 118a is the largest, the holes 140a and 116a are smaller and have the same diameter, and the holes 130a, 114a, and 120a are further smaller and have the same diameter. Therefore, the hole 150 constituted by the holes of each layer has a step shape as shown in FIG. However, the hole 112a of the insulating layer 112 which is the lowermost layer is formed larger than the hole 130a or the like in order to engage a claw portion (described later) of the DST chip mounting connector 210 or the connector 230 with the layer structure. By setting the hole diameter of each layer as described above, in each hole portion 150, a part of the signal layer 130 and the power supply layer 140 is exposed upward, and a part of the ground layer 120 is exposed downward. Thereby, when the DST chip mounting connector 210 or the connector 230 is set in each hole 150, it is electrically connected to each conductive layer.

  FIG. 2 is a diagram showing an extracted signal layer 130 included in the signal transmission board 100 of the present embodiment. FIG. 2A is a top view of a part of the signal layer 130 of the present embodiment. FIG. 2B is a cross-sectional view of the signal layer 130 of the present embodiment, and is a cross-sectional view taken along the line BB in FIG.

  The signal layer 130 of the present embodiment is obtained by sewing a conductive thread 136 on a predetermined region with a cloth having insulation and flexibility as a base. And it has the some low resistance area | region 132 which has a function similar to the low resistance layer of the said patent document 1, and the high resistance area | region 134 which has a function similar to the high resistance layer of the said patent document 1. Each of the plurality of low resistance regions 132 in the present embodiment is a region where a conductive thread 136 using a conductive fiber is sewn, and the sewn region forms a substantially square shape on the signal layer 130. Further, the high resistance region 134 is a region where the conductive thread 136 is not sewn. Further, the plurality of low resistance regions 132 are arranged in a matrix, and each of them is located at a predetermined interval from each of the adjacent low resistance regions 132 in the vertical and horizontal directions. The predetermined interval here is substantially equal to the diameter of the hole 130a.

  Here, in FIGS. 2A and 2B, the conductive thread 136 is shown as being sewn at a predetermined interval in the thread along the X direction adjacent to the Y direction. . However, this is shown for ease of explanation, and the conductive thread 136 is actually sewn so that the adjacent threads are in close contact with each other.

  FIG. 3 is a diagram for explaining a method of manufacturing the signal layer 130 included in the signal transmission board 100 of the present embodiment. In FIG. 3, for convenience of explanation, a part of the signal layer 130 is extracted and shown.

  When the low resistance region 132 is formed on the fabric forming the high resistance region 134, an operator (for example, an operator who operates a machine such as a sewing machine) first places the conductive yarn 136 along the X direction with the square. Sew the length corresponding to one side. Then, the conductive thread 136 is shifted in the Y direction by the diameter of the thread so as to be in close contact with the thread along the X direction that is sewn last, and is similarly sewn along the X direction. This is repeated, and when the length of the sewn portion in the Y direction reaches the length of one side of the square, the forming operation of one low resistance region 132 is completed. When one forming operation is completed, the operator sends the yarn to the location of the low resistance region 132 that can be formed next.

  Referring to FIG. 3, the operator sews the conductive thread 136 to the fabric to form the low resistance area 132A, and sews the thread to the end point 136e to form the low resistance area 132A. Complete the forming operation. Then, the yarn is sent to the start point 136s without cutting, and the low resistance region 132B is formed in the same manner as the low resistance region 132A. By repeating such an operation, a plurality of low resistance regions 132 are formed on the fabric forming the high resistance region 134.

  Here, in order to insulate the low resistance regions 132 in the signal layer 130 from each other, it is necessary to cut the yarn from the start point to the end point that connects the low resistance regions 132. In the present embodiment, when the plurality of holes 130a are formed in the signal layer 130 by pressing, each of the yarns from the start point to the end point as described above is also pressed and cut by a press machine die. Thus, the manufacturing process is reduced by combining the work of forming the hole 130a and the cutting work. In the press working, the press machine positions and presses the signal layer 130 so that the punched shape is in contact with the midpoint of one side of each of the two adjacent low resistance regions 132, thereby forming each hole 130a.

  FIG. 4 is a cross-sectional view of a part of the communication apparatus 300 of the present embodiment, and is a cross-sectional view showing a state where the DST chip mounting connector 210 is embedded in the hole 150.

  The DST chip mounting connector 210 is a connector on which a DST chip 212 for executing signal transmission by the two-dimensional spread signal transmission technology is mounted. In addition to the DST chip 212, the DST chip-mounted connector 210 has a connector part 220 that is embedded in the hole 150 to achieve electrical connection with each layer. The connector part 220 has a shape in which three different cylindrical parts 220a, 220b, and 220c are arranged coaxially and stepwise, and the tip of the thinnest cylindrical part 220c is engaged in all directions. A claw portion 220d having a portion is formed.

  The cylindrical portion 220a has the largest diameter among the three different cylindrical portions, has substantially the same diameter as the hole 118a of the insulating layer 118, and exposes the metal piece 222 below the cylindrical portion 220a. When the DST chip mounting connector 210 is embedded in the hole 150, the metal piece 222 contacts a part of the power supply layer 140 exposed in the hole 150. A DST chip 212 is mounted above the cylindrical portion 220 a, and one end of the metal piece 222 is connected to the DST chip 212. Therefore, when the DST chip mounting connector 210 is embedded in the hole 150, the power supply layer 140 and the DST chip 212 are electrically connected. As a result, the DST chip 212 can obtain the power supply voltage from the power supply layer 140.

  The cylindrical portion 220b has a smaller diameter than the cylindrical portion 220a and a larger diameter than the cylindrical portion 220c. The power supply layer 140 and the insulating layer 116 have substantially the same diameter as the holes 140a and 116a, and the two metal pieces 224a and 224b are exposed below the holes 140a and 116a. Each of the metal pieces 224a and 224b is one of two adjacent low resistance regions 132 exposed in the hole 150 when the DST chip mounting connector 210 is embedded in the hole 150, It contacts a part of a different low resistance region 132. In addition, one end of each of the metal pieces 224a and 224b is independently connected to the DST chip 212. Therefore, when the DST chip mounting connector 210 is embedded in the hole 150, the metal piece 224a and one low resistance region 132, and the metal piece 224b and the low resistance region 132 adjacent to the low resistance region 132, respectively. Electrically connected.

  The cylindrical portion 220c has substantially the same diameter as the holes 130a, 114a, and 120a of the signal layer 130, the insulating layer 114, and the ground layer 120. The cylindrical portion 220c does not have a metal exposed portion, and exists mainly to form a guide for positioning and a claw portion 220d described below.

  The claw portion 220d is for engaging the DST chip mounting connector 210 with the layer structure, and the outer periphery thereof is formed larger than the hole 120a and smaller than the hole 112a. When the DST chip mounting connector 210 is embedded in the hole 150, each of the signal layer 130, the insulating layer 114, and the ground layer 120 is bent by the claw portion 220d so that the hole diameter is widened. When inserted through 120a, the original shape is restored. The upper surface of the claw portion 220d comes into contact with the ground layer 120, and the DST chip mounting connector 210 is engaged with the layer structure. Here, a metal piece 226 whose one end is connected to the DST chip 212 is exposed on the upper surface of the claw portion 220d. Therefore, when the DST chip mounting connector 210 is embedded in the hole 150, the ground layer 120 and the DST chip 212 are electrically connected. Since the DST chip 212 is connected to the low resistance region 132 and the ground layer 120, a signal can be transmitted to the adjacent low resistance region 132 by a two-dimensional diffusion signal transmission technology.

  FIG. 5 is a cross-sectional view of a part of the communication apparatus 300 of the present embodiment, and is a cross-sectional view showing a state where the connector 230 is embedded in the hole 150.

  The connector 230 has the same shape as the connector part 220 of the DST chip mounting connector 210. That is, the DST chip mounting connector 210 and the connector 230 have the same shape in the portion embedded in the signal transmission board 100. Therefore, the DST chip mounting connector 210 and the connector 230 can be selectively embedded in each hole 150.

  In the connector 230, the metal piece 232 is exposed only on the entire lower surface of the cylindrical portion corresponding to the cylindrical portion 220 b of the connector portion 220. When the connector 230 is embedded in the hole 150, the metal piece 232 contacts a part of each of the two adjacent low resistance regions 132 exposed in the hole 150. Therefore, when the connector 230 is embedded in the hole 150, the two adjacent low resistance regions 132 are electrically connected via the metal piece 232. Since the connector 230 does not have the DST chip 212 and does not have the metal pieces 222 and 226, the manufacturing cost is lower than that of the DST chip mounting connector 210.

  FIG. 6 is a diagram for explaining the advantages of the communication apparatus 300 according to the present embodiment, and is a top view illustrating a conventional example and a part of the communication apparatus according to the present embodiment. For easy understanding, in FIG. 6A showing the communication device of the conventional example, the DST chip and the low resistance region existing in the layer structure are indicated by broken lines. In FIG. 6B showing the communication apparatus 300 of the present embodiment, the low resistance region 132 is indicated by a broken line, the DST chip mounted connector 210 is indicated by a white circle, and the connector 230 is indicated by a black circle.

  In the communication device of the conventional example shown in FIG. 6A, in order to reduce the cost by reducing the number of DST chips, the DST chips are arranged except for several places including the position P. Here, when the signal transmission source is the DST chip 400A and the final destination is the DST chip 400F, the communication apparatus sets, for example, the DST chips 400A, 400B, 400C, 400D, 400E, and 400F as the shortest transmission path. To do. That is, in this case, the communication apparatus transmits signals using the four DST chips as relay points.

  In the communication apparatus 300 of the present embodiment shown in FIG. 6B, connectors 230 are arranged at several places including the place corresponding to the position P in order to reduce the cost by reducing the number of DST chips. The DST chip mounting connector 210 is disposed at other locations. Here, when the signal transmission source is the DST chip mounting connector 210A corresponding to the DST chip 400A and the final destination is the DST chip mounting connector 210C corresponding to the DST chip 400F, the communication apparatus 300 is connected to the shortest transmission path. For example, DST chip mounting connectors 210A, 210B, 230A, and 210C are set. That is, in this case, the communication apparatus 300 transmits signals using a total of two relay stations including one DST chip and one connector.

  Although both of the above two examples can reduce the cost by reducing the number of DST chips, in the case of the communication apparatus 300 of the present embodiment, the transmission path is relayed as compared with the conventional example of FIG. The number of points can be reduced. Furthermore, since the connector 230A connects two adjacent low resistance regions 132, the number of transmission paths that can be set by the communication apparatus 300 is large. That is, according to the communication apparatus 300 of the present embodiment, the number of DST chips can be reduced without a decrease in the selectable transmission path and the loss of the shortest path, thereby realizing a reduction in cost without lowering the transmission efficiency.

  In addition, the communication device 300 according to the present embodiment, which can selectively arrange the DST chip and the short-circuit member (connector 230), has an arrangement condition of the DST chip (an arrangement interval or a difference depending on a use of a product or a product grade). It is possible to easily handle diversified products with different numbers.

  When the signal layer 130 is manufactured, the number of DST chips is reduced by selectively connecting the low resistance regions 132 to each other without selectively cutting the yarns connecting the low resistance regions 132. A method of reducing the amount is conceivable. However, in the signal layer 130 that is expected to be mass-produced, if the location where the press processing for forming the hole 130a and thread cutting is changed for each product, it is necessary to manufacture various press dies, which increases costs. Leads to. Further, when the connection between the low resistance regions 132 is achieved with a thin thread, the throughput is lowered, and as a result, the transmission efficiency is deteriorated. For this reason, it is necessary to connect each low resistance region 132 with either the DST chip mounting connector 210 or the connector 230.

  The above is the embodiment of the present invention. The present invention is not limited to these embodiments and can be modified in various ranges. For example, the number, size, or shape of the low-resistance regions in each drawing is shown for convenience of explanation, and can actually be appropriately changed according to the design.

  For example, FIG. 7 is a diagram showing an extracted signal layer included in a signal transmission board according to another embodiment of the present invention. In the low resistance region 132s of another embodiment, basically a plurality of threads along the X direction are sewn so as to be in close contact with each other as in the low resistance region 132 of this embodiment. Yes. However, in this embodiment, the hole 130a is formed larger than that of this embodiment (or the low resistance region 132s is formed smaller than the low resistance region 132). For this reason, the conductive thread 136 is sewn so as to avoid the hole 130a, and as a result, the low resistance region 132s has a concave shape that avoids the hole 130a on each side of the square. In this case, the interval between adjacent low resistance regions 132s is narrower than the diameter of the hole 130a.

  The signal layer 130 is not limited to the one using the yarn 136 as in the present embodiment, as long as the signal layer 130 has a plurality of low resistance regions 132 insulated from each other. For example, a conductive sheet-like material may be bonded to an insulating sheet-like material serving as a base for the signal layer, or a low-resistance material may be embedded in a high-resistance material.

  In addition, each insulating layer, the ground layer 120, the base of the signal layer 130, and the power source layer 140 are made of cloth in this embodiment, but these layers are insulating and stretchable, and can be sewn. In other embodiments, an insulating rubber, a sponge, a stretchable film (particularly a urethane film), or the like is assumed.

  Further, in this embodiment, the shape of the low resistance region is a square. However, in another embodiment, other useful various shapes such as a cross shape may be employed. In this case, the low-resistance regions of the crossed characters are arranged so that each of the holes 130a in contact with the four sides of the square is in contact with the top, bottom, left and right ends of the crossed characters. Therefore, the adjacent low resistance regions are electrically connected via the DST chip mounting connector 210 or the connector 230 embedded between the end portions of the cross.

It is the figure which showed the structure of the signal transmission board | substrate which can construct | assemble the communication apparatus of embodiment of this invention. It is the figure which extracted and showed the signal layer contained in the signal transmission board | substrate of embodiment of this invention. It is a figure for demonstrating the manufacturing method of the signal layer contained in the signal transmission board | substrate of embodiment of this invention. FIG. 4 is a partial cross-sectional view of the communication device according to the embodiment of the present invention, and is a cross-sectional view illustrating a state in which a DST chip mounting connector is embedded in a hole. 1 is a partial cross-sectional view of a communication device according to an embodiment of the present invention, showing a state where a connector is embedded in a hole. It is a figure for demonstrating the advantage of the communication apparatus of embodiment of this invention, and is the top view which showed a part of communication apparatus of the prior art example and this embodiment. It is the upper side figure which extracted and showed a part of signal layer contained in the signal transmission board of another embodiment of the present invention.

Explanation of symbols

100 Signal Transmission Board 130 Signal Layer 130a Hole 132 Low Resistance Area 134 High Resistance Area 136 Conductive Thread 150 Hole 210 DST Chip Mounted Connector 230 Connector 300 Communication Device

Claims (5)

A conductive layer included in a signal transmission board for transmitting a signal by two-dimensional diffusion signal transmission technology, having a plurality of low resistance areas for transmitting signals and a high resistance area for insulating adjacent low resistance areas from each other In
A plurality of holes into which either a communication chip for transmitting a signal by two-dimensional diffusion signal transmission technology or a connection member for electrically connecting adjacent low resistance regions can be selectively inserted are formed. A conductive layer. The conductive layer according to claim 1, wherein the low resistance region is formed in a quadrangular shape, and the holes are arranged in contact with four sides of the low resistance region. 2. The conductive layer according to claim 1, wherein the low resistance region is formed in a cross shape and the hole is disposed at a boundary of the low resistance region. In a signal transmission board for transmitting signals by two-dimensional diffusion signal transmission technology, having a plurality of low resistance regions for transmitting signals and a high resistance region for insulating adjacent low resistance regions from each other,
A plurality of holes into which either a communication chip for transmitting a signal by two-dimensional diffusion signal transmission technology or a connection member for electrically connecting adjacent low resistance regions can be selectively inserted are formed. A signal transmission board. A communication device comprising the signal transmission board according to claim 4,
One of the said communication chip or the said connection member was inserted in each of these holes, The communication apparatus characterized by the above-mentioned.

Images