JP4836660B2 - Chip mounting connector, signal transmission board, and communication device - Google Patents

Description

  The present invention relates to a chip mounting connector for mounting a chip on a flexible substrate. The present invention also relates to a signal transmission board to which such a chip mounting connector is attached. In particular, the present invention relates to a signal transmission board for transmitting signals by two-dimensional spread signal transmission technology. The present invention also relates to a communication apparatus capable of transmitting a signal using two-dimensional spread signal transmission technology.

  2. Description of the Related Art In recent years, a technology (hereinafter referred to as two-dimensional spread signal transmission (2D (Dimension)) in which a plurality of elements (hereinafter referred to as DST (Diffusive Signal-Transmission) chips) are relayed and signals are transmitted in packets toward a destination. -Called DST) technology). In the two-dimensional spread signal transmission technology, a signal is transmitted in a layer extending on a two-dimensional plane based on a predetermined algorithm. Therefore, no separate wiring (pattern drawn on the substrate, jumper line, etc.) is required to transmit the signal.

  For example, Patent Document 1 below discloses a communication apparatus that employs two-dimensional spread signal transmission technology. As an example of a signal transmission board that constitutes a communication device, one having a conductive layer composed of a plurality of low resistance regions and high resistance regions is cited. Here, the low resistance region means a region having conductivity, and the high resistance region means a region having insulation.

In the signal transmission board of the above example, each DST chip is mounted between low resistance regions arranged adjacent to each other. The DST chip here is, for example, a pin chip having a plurality of pins. A plurality of mounting holes corresponding to the pins are formed on the signal transmission board. The DST chip is mounted on the signal transmission board by fitting each pin into each mounting hole. A signal to be controlled is relayed to each DST chip arranged on a predetermined path, flows in the low resistance region, and is transmitted to the destination. In Patent Document 1 below, each layer of the signal transmission board is formed of, for example, a flexible rubber material. It has been proposed to construct artificial skin having a communication function by laminating freely stretchable rubber material and mounting a DST chip on the layer.
JP 2004-328409 A

  However, when the signal transmission board is formed using a material having elasticity or elasticity, for example, the signal transmission board may be deformed and twisted or bent near the DST chip mounting portion. At this time, the relative positions of the mounting holes may change. If the relative position of each hole changes, the load can be concentrated on a part of the corresponding pin. When the load is concentrated, the pins that cannot withstand the load may be deformed or broken, and in some cases, the DST chip itself may be detached from the signal transmission board.

  Therefore, in view of the above circumstances, an object of the present invention is to provide a chip mounting connector, a signal transmission board, and a communication device that improve durability against deformation of the signal transmission board.

  A chip mounting connector according to one embodiment of the present invention that solves the above problems is a chip mounting connector for mounting a chip on a flexible substrate. The chip mounting connector includes a sandwiching portion that holds the substrate sandwiched from the front and back surfaces thereof, and is formed integrally with the sandwiching portion to hold the chip. The conductive portion on the sandwiched substrate and the chip And a connection part for electrically connecting the two.

  In the above-described chip mounting connector, the connecting portion may be installed so that a part of the connecting portion comes into contact with the conductive portion on the substrate when the substrate is held.

  In the above chip mounting connector, the connection portion may be exposed on the holding portion over substantially the entire contact area between the holding portion and the conductive portion on the substrate.

  Moreover, the chip mounting connector which concerns on another aspect of this invention which solves said subject is a connector for chip mounting for mounting a chip | tip on the board | substrate which has flexibility. The chip mounting connector includes a surface contact portion that is in close contact with the surface of the substrate, a back surface contact portion that is in close contact with the back surface of the substrate, and a narrow space for sandwiching the substrate between the surface contact portion and the back surface contact portion. A sandwiching force imparting means that imparts a gripping force, and is formed integrally with at least one of the front surface contact portion and the back surface contact portion, holds the chip, and electrically connects the conductive portion on the sandwiched substrate and the chip. And a connecting portion to be connected.

  In the above-described chip mounting connector, the connecting portion may be installed so that a part of the connecting portion comes into contact with the conductive portion on the substrate when the substrate is held.

  Further, in the above chip mounting connector, the connection portion is at least one of the front surface contact portion and the back surface contact portion over substantially the entire contact area between at least one of the front surface contact portion and the back surface contact portion and the conductive portion on the substrate. It may be exposed on the contact surface with the conductive part on one side.

  Further, in the above chip mounting connector, the connecting portion may have a pin shape. In this case, the connection portion can achieve mechanical and electrical connection with the chip due to the pin shape.

  Moreover, the chip mounting connector which concerns on another aspect of this invention which solves said subject is a connector for chip mounting for mounting a chip | tip on the board | substrate which has flexibility. The chip mounting connector includes a disk-shaped main body part, an upper surface side lid part that is installed to face the main body part across the board, and the main body part and the upper surface side lid part sandwich the substrate. At least one having a first holding force applying means for applying a holding force, an annular shape formed in an annular shape on the upper surface of the main body, and a pin shape to which the chip is fitted An electrode comprising: an electrode disposed so that the annular shape comes into contact with a conductive portion on the substrate when the substrate is held between the main body portion and the upper surface side lid portion. Is.

  The above-described chip mounting connector provides a lower surface side lid portion that is installed opposite to the main body portion across the substrate, and a holding force for sandwiching the substrate between the main body portion and the lower surface side lid portion. And at least one electrode having an annular shape formed in an annular shape on the lower surface of the main body portion, and a pin shape to which the chip is fitted, and the main body portion, It may further include an electrode installed so that the annular shape comes into contact with the conductive portion on the substrate when the substrate is held by the lower surface side lid portion.

  In addition, a signal transmission board according to an aspect of the present invention that solves the above-described problem is a signal transmission board for transmitting a signal using a two-dimensional spread signal transmission technology to which the chip mounting connector is attached. The signal transmission board includes at least one conductive layer laminated in a state of being insulated from each other, and each of the at least one conductive layer has a plurality of holes for attaching a chip mounting connector. It is what.

  A signal transmission board according to another aspect of the present invention that solves the above-described problems is a signal transmission board for transmitting a signal using a two-dimensional spread signal transmission technology to which the above-described chip mounting connector is attached. The signal transmission board includes at least one conductive layer laminated in a state of being insulated from each other, and each of the at least one conductive layer is a hole for attaching a chip mounting connector to the outside of the main body. A plurality of circular holes having a diameter equivalent to the diameter are formed.

  In the signal transmission board, the conductive part on the board may be formed so as to follow the ring shape of the electrode.

  In the signal transmission board, the conductive portion on the board may be formed in the peripheral portion of the edge of the circular hole.

  The signal transmission board may further include an insulating layer formed corresponding to each of the circular holes and formed with a plurality of large-diameter holes having a larger diameter. In this case, align the insulating layer and the conductive layer so that each circular hole and the corresponding large-diameter hole are concentric, and around the edge of each circular hole on the contact surface side with the connection part Lamination may be performed so that the conductive portion is exposed only at the portion.

  A communication device according to an aspect of the present invention that solves the above problems includes the signal transmission board and the chip mounting connector, wherein the plurality of chip mounting connectors are attached to the holes of the signal transmission board. And a plurality of DST chips that are attached to each of the plurality of chip mounting connectors and transmit signals using two-dimensional spread signal transmission technology.

  When the chip mounting connector, signal transmission board, and communication device of the present invention are employed, durability against deformation of the signal transmission board is improved. Thereby, for example, the chip cannot be easily detached from the signal transmission board.

  Hereinafter, a communication apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a top view showing the communication device 100 of the present embodiment. The communication device 100 includes a signal transmission board 110 and a plurality of DST chips 200 mounted on the signal transmission board 110. In FIG. 1, for convenience of explanation, the number of DST chips 200 mounted on the signal transmission board 110 is relatively small, but a larger number of DST chips 200 are mounted in practical use.

  FIG. 2 is a diagram showing a cross section taken along the line AA of FIG. The signal transmission board 110 of this embodiment has an eight-layer structure. Each layer is laminated in the order of an insulating layer 112, a power supply layer 114, insulating layers 116 and 118, a signal layer 120, an insulating layer 122, a ground layer 124, and an insulating layer 126. A part of each layer is held by connector units 130 (described later) scattered on the board in the assembled state of the signal transmission board 110. For this reason, each layer is in a state of being fixed to other layers around each connector unit 130. Therefore, each layer forms the signal transmission board 110 without being separated. In addition, after assembling the signal transmission board 110, the layers can be adhered and relatively fixed to each other by applying an adhesive to the entire area of each layer and bonding the layers.

  The power supply layer 114 and the ground layer 124 are sheets having flexibility, stretchability, and conductivity. For example, it is made of a conductive rubber or a cloth woven with a conductor. In these layers, a conductive material is uniformly kneaded or woven into the sheet. The power supply layer 114 is a layer for supplying power to each DST chip 200. The ground layer 124 is a layer that becomes a ground potential in the signal transmission substrate 110.

  FIG. 3 is a top view of the signal layer 120 extracted from the signal transmission board 110. The signal layer 120 is a signal layer in which a 2D-DST signal is transmitted between the DST chips 200.

  The signal layer 120 is a sheet having flexibility and stretchability like the power supply layer 114 and the ground layer 124. For example, a conductive material is kneaded or woven into a part of the region based on a cloth having high insulation (in other words, non-conductive). Specifically, the signal layer 120 includes a high resistance region 120a having a high resistance and a plurality of low resistance regions 120b having a low resistance.

  The high resistance region 120a is composed only of a base substrate (for example, the cloth). The high resistance regions 120a are arranged to insulate the low resistance regions 120b adjacent to each other.

  The low resistance region 120b is configured by kneading or weaving a conductive material into a base substrate in a predetermined region. In the low resistance region 120b, the material is uniformly distributed. The low resistance region 120b is formed in a rectangular shape. The low resistance regions 120b are arranged on the signal layer 120 in a matrix. A plurality of holes 120h are formed so as to contact the midpoint of each side of the low resistance region 120b. That is, the hole 120h is located between the low resistance regions 120b arranged adjacent to each other and is in contact with the midpoints of the sides of both regions.

  The insulating layers 112, 116, 118, 122, and 126 are sheets having flexibility and insulating properties. For example, it is made of an insulating rubber, an insulating film or an insulating cloth. The insulating layer 112 is a layer exposed on the front surface (or back surface) of the signal transmission substrate 110 and insulates the power supply layer 114 from the outside. The insulating layers 116 and 118 insulate the power supply layer 114 and the signal layer 120. The insulating layer 122 insulates the signal layer 120 and the ground layer 124. The insulating layer 126 is a layer exposed on the front surface (or back surface) of the signal transmission substrate 110 and insulates the outside from the ground layer 124.

  In the present embodiment, the power supply layer 114 and the ground layer 124 are stacked so as to sandwich the signal layer 120. This is because the power supply layer 114 and the ground layer 124 have a relatively low impedance and can function as a shield.

  As shown in FIG. 2, the DST chip 200 is mounted on the signal transmission board 110 via the connector unit 130. The signal transmission board 110 will be described with reference to FIGS. In particular, the connector unit 130 will be described in detail.

  FIG. 4 is an exploded cross-sectional view of the signal transmission board 110. For example, a plurality of holes are formed in each layer of the signal transmission board 110, such as the hole 120h shown in FIG. Specifically, the insulating layer 112, the power supply layer 114, the insulating layers 116 and 118, the signal layer 120, the insulating layer 122, the ground layer 124, and the insulating layer 126 have holes 112h, 114h, 116h, 118h, 120h, 122h, 124h and 126h are formed. These holes are formed in each layer corresponding to the number and position of the DST chips 200 to be mounted.

  Each layer is positioned and laminated so that the holes formed in each layer are concentric. In the example shown in FIG. 4 and the like, the hole of each layer is positioned so that the center thereof coincides with the axis O. A single hole that penetrates from the insulating layer 112 to the insulating layer 126 at the mounting position corresponding to each of the plurality of DST chips 200 by positioning each layer in a similar manner with respect to the other holes. Is formed.

  In addition, the diameter of a hole changes with layers. The holes 112h and 114h have the same diameter, and the smallest diameter among the holes in each layer. The hole 116h is formed to have a slightly larger diameter than the hole 112h or the like. Since the holes 114h and 116h are concentric and have different diameters, a part of the power supply layer 114 is exposed. Hereinafter, this exposed portion is referred to as “power supply layer exposed portion”.

  The holes 118h and 120h have the same diameter, and are slightly larger than the hole 116h, for example. The hole 122h has the largest diameter among the holes in each layer. The holes 124h and 126h have the same diameter and are slightly smaller than the hole 122h or the like. Since the holes 122h and 124h are concentric circles and have different diameters, a part of the ground layer 124 is exposed. Hereinafter, this exposed portion is referred to as a “ground layer exposed portion”.

  Next, the connector unit 130 will be described. The connector unit 130 has a structure for fixing itself to the signal transmission board 110. After being inserted into the hole portion constituted by the hole of each layer, it is fixed to the signal transmission board 110 by this structure. The structure of the connector unit 130 will be described in detail later.

  Four pins protrude from the uppermost surface of the connector unit 130. Each of these pins is a wire forming an electrode described later. A recess 210 corresponding to each pin is formed on the lower surface of the DST chip 200. Each pin is inserted into the corresponding recess 210 by the operator. Next, the DST chip 200 is pushed to a position where the lower surface of the DST chip 200 and the uppermost surface of the connector unit 130 come into contact with each other. As a result, the DST chip 200 and the connector unit 130 are mechanically coupled, and the DST chip 200 and the signal transmission board 110 are electrically connected. That is, the DST chip 200 is mounted on the signal transmission board 110. Accordingly, the communication device 100 can perform signal transmission using the two-dimensional spread signal transmission technology. The DST chip 200 is held by the connector unit 130 by fitting each pin with the recess 210.

  The connector unit 130 is mainly constituted by a three piece of a connector main body 132, a connector lower lid 134, and a connector upper lid 136. These parts are, for example, resin-molded parts.

  Here, FIG. 5A shows a top view of the connector main body 132. FIG. 5B shows a bottom view of the connector main body 132. FIG. 6 is a cross-sectional view taken along the line BB in FIG. FIG. 7 is a cross-sectional view taken along the line CC in FIG.

  The connector main body 132 has a shape in which a plurality of cylinders having different diameters are concentrically stacked around the axis O. In other words, it has a disk shape having a plurality of step structures. The connector main body 132 has a main body first lower surface 132b, a main body second lower surface 132c, a main body first upper surface 132d, a main body second upper surface 132e, and a main body third upper surface 132f. A claw portion 132g is formed on the side surface between the main body second upper surface 132e and the main body third upper surface 132f over the entire circumference of the connector main body 132. Further, a screw hole 132 a centering on the axis O is formed at the center of the connector main body 132. The screw hole 132a extends from the main body first upper surface 132d to the main body first lower surface 132b.

  The connector main body 132 is provided with a ground layer electrode 142, signal layer electrodes 144 a and 144 b, and a power supply layer electrode 146. These electrodes are, for example, metal wires. Some of these electrodes are exposed from the connector main body 132. The parts other than the exposed part are embedded in the connector main body 132. Each electrode is solidified inside the connector main body 132 by insert molding, for example.

  The ground layer electrode 142 is exposed on the main body second lower surface 132c so as to draw an arc centered on the axis O. The arc is exposed over substantially the entire circumference on the main body second lower surface 132c. One end of the arc portion of the ground layer electrode 142 is bent and extends toward the axis O. The extension portion is further bent, extends inside the connector main body 132, and protrudes from the main body first upper surface 132d.

  The signal layer electrodes 144a and 144b are exposed so as to draw an arc centered on the axis O on the third upper surface 132f of the main body. The arc is exposed on the third upper surface 132f of the main body, for example, in a range from 90 degrees to 180 degrees. The signal layer electrodes 144a and 144b extend toward the axis O with one end of an arc portion thereof being bent. The extension portion is further bent, extends inside the connector main body 132, and protrudes from the main body first upper surface 132d.

  The power supply layer electrode 146 is exposed on the main body second upper surface 132e so as to draw an arc centered on the axis O. The arc is exposed over substantially the entire circumference on the main body second upper surface 132e. One end of the arc portion of the power layer electrode 146 is bent and extends toward the axis O. The extension portion is further bent, extends inside the connector main body 132, and protrudes from the main body first upper surface 132d.

  For convenience of explanation below, a portion of each electrode protruding from the main body first upper surface 132d is referred to as an “electrode pin”.

  The connector lower cover 134 is formed in a disk shape with the axis O as the center. The connector lower lid 134 has a lower lid lower surface 134b, a lower lid upper surface 134c, and a lower lid concave surface 134d. The lower lid upper surface 134c is a surface on the back side of the lower lid lower surface 134b, and is directed toward the connector main body 132 when the connector unit 130 is assembled. The lower lid upper surface 134c has a recess. The lower lid concave surface 134d is the surface of this concave portion.

  Further, a guide hole 134 a centering on the axis O is formed at the center of the connector lower lid 134. The guide hole 134a extends from the lower lid lower surface 134b to the lower lid concave surface 134d. Its side is tapered.

  The connector upper cover 136 is formed in a disk shape with the axis O as the center. The connector upper lid 136 has an upper lid upper surface 136c, an upper lid lower surface 136d, an upper lid first concave surface 136e, and an upper lid second concave surface 136f. The upper lid upper surface 136c is the uppermost surface of the connector unit 130, and the DST chip 200 is placed thereon. The upper lid lower surface 136d is a surface on the back side of the upper lid upper surface 136c, and is directed toward the connector main body 132 when the connector unit 130 is assembled. The upper lid lower surface 136d has a recess. The upper lid first concave surface 136e is a surface of this concave portion. A step is formed in the recess. The upper lid second concave surface 136f is a surface further depressed than the upper lid first concave surface 136e.

  A guide hole 136 a centering on the axis O is formed at the center of the connector upper cover 136. The guide hole 136a extends through the upper lid upper surface 136c and the upper lid second concave surface 136f. Its side is tapered. Further, around the guide hole 136a, four electrode holes 136b are formed on a virtual circumference at intervals of 90 degrees.

  Next, assembly of the communication device 200 will be described. The assembly described below is performed by an operator.

  First, assembly of the connector main body 132 and the connector lower cover 134 is performed. The connector main body 132 and the connector lower cover 134 are assembled so as to sandwich the insulating layer 122, the ground layer 124, and the insulating layer 126.

  First, a part of the connector main body 132 is inserted into the holes 122h, 124h, and 126h. The part of the connector main body 132 inserted here is a cylindrical portion having a diameter of the main body first lower surface 132b (hereinafter referred to as a “lower surface side cylindrical portion”).

  A part of the lower surface side cylindrical portion protrudes from the hole 126h, and is inserted into the holes 122h, 124h, and 126h so that the ground layer exposed portion of the ground layer 124 and the ground layer electrode 142 are in contact with each other. .

  Next, the connector lower cover 134 is attached from the insulating layer 126 side. In the connector lower lid 134, the lower lid upper surface 134 c is in surface contact with part of the insulating layer 126 (periphery of the edge of the hole 126 h), and the protruding portion of the lower surface side cylindrical portion is accommodated in the recess of the connector lower lid 134. It is attached as follows.

  Each component is designed in consideration of manufacturing errors, assembly errors, and the like. For example, the connector main body 132 and the connector lower cover 134 are sandwiched between the main body first lower surface 132b and the lower cover concave surface 134d when they are attached to each other in order to securely hold the layers by the main body second lower surface 132c and the lower cover upper surface 134c. Is designed to allow a slight clearance. For example, when the clearance is designed so as not to allow the clearance, the main body first lower surface 132b and the lower cover concave surface 134d can come into contact with each other before the main body second lower surface 132c and the lower cover upper surface 134c sandwich each layer. Such a case can occur, for example, when the lower cylindrical portion is formed longer in the axis O direction than the design value. As a factor of such a manufacturing error, for example, wear of a mold for the connector main body 132 can be cited.

  Following the attachment of the connector lower lid 134, the tapping screw 150 is inserted into the guide hole 134a. When the tapping screw 150 is turned by an operator, the tapping screw 150 taps the screw hole 132a. By fastening the tapping screw 150, the connector main body 132 and the connector lower cover 134 are fixed.

  The insulating layer 122, the ground layer 124, and the insulating layer 126 are firmly held between the main body second lower surface 132c and the lower lid upper surface 134c by the fastening of the tapping screw 150. This is because each layer is sandwiched between the connector main body 132 and the connector lower cover 134 in the peripheral portion of the hole edge of each layer over the entire circumference. Therefore, even if the signal transmission board 110 is bent or twisted, these three layers cannot be easily detached from the connector unit 130.

  In addition, the ground layer exposed portion of the ground layer 124 and the ground layer electrode 142 are pressure-bonded by the fastening of the tapping screw 150. Accordingly, the ground layer electrode 142 is electrically connected to the ground layer 124.

  Here, as described above, the ground layer electrode 142 is exposed over substantially the entire circumference of the main body second lower surface 132c. Thus, when the connector main body 132 and the connector lower cover 134 are combined, the ground layer exposed portion and the ground layer electrode 142 are in contact with each other over substantially the entire circumference of the ground layer exposed portion. In other words, in the present embodiment, the shape of the exposed portion of the ground layer electrode 142 is an arc so that the contact area between the two is as large as possible. By increasing the contact area, the effect of reducing the contact resistance is produced.

  Next, the connector main body 132 and the connector upper cover 136 are assembled. The connector body 132 and the connector upper lid 136 are assembled so as to sandwich the insulating layer 112, the power supply layer 114, the insulating layers 116 and 118, and the signal layer 120.

  First, a part of the connector main body 132 is inserted into the holes 118h and 120h, and the edges of the holes are hooked on the claw portion 132g. Thereby, a part of the signal layer 120 comes into contact with the third upper surface 132f of the main body, the signal layer electrodes 144a and 144b, and the insulating layer 118 and the signal layer 120 are temporarily fixed to the connector main body 132. .

  Next, a part of the connector main body 132 is inserted into the holes 112h, 114h, and 116h. As a result, the insulating layer 116 comes into surface contact with the insulating layer 118 and a part thereof (a peripheral portion of the edge of the hole 116h) comes into surface contact with the main body second upper surface 132e. In addition, the exposed portion of the power supply layer 114 contacts the power supply layer electrode 146.

  In FIG. 4, the insulating layers 116 and 118 are shown apart. Such a layer state is only in the vicinity of the DST chip 200 as in the state of the signal layer 120 and the insulating layer 122. In the signal transmission board 110, the insulating layers 116 and 118 are laminated in a state of being in close contact with each other at a place away from the place where the DST chip 200 is mounted. The mutual layers are bonded, for example, at the close contact portions. For this reason, each of the eight layers is in a relatively fixed state. Therefore, each layer is not relatively displaced.

  After a part of the connector main body 132 is inserted into each hole, the connector upper cover 136 is attached from the insulating layer 112 side. First, each electrode pin is inserted into each electrode hole 136 b of the connector upper lid 136. Next, the upper lid lower surface 136d and the upper lid first concave surface 136e are in surface contact with part of the insulating layer 112 (the peripheral portion of the edge of the hole 112h), and the main body first upper surface 132d and the upper lid second concave surface 136f are close to each other. It is attached to do. A clearance can be provided between the main body first upper surface 132d and the upper lid second concave surface 136f for the same reason as in the main body first lower surface 132b and the lower lid concave surface 134d.

  Following the attachment of the connector upper lid 136, the tapping screw 150 is inserted through the guide hole 136a. When the tapping screw 150 is turned by an operator, the tapping screw 150 taps the screw hole 132a. By fastening the tapping screw 150, the connector main body 132 and the connector upper cover 136 are fixed.

  The insulating layer 112, the power supply layer 114, the insulating layers 116 and 118, and the signal layer 120 are connected to the main body second upper surface 132 e and the main body third upper surface 132 f, the upper lid lower surface 136 d, and the upper lid first through the fastening of the tapping screw 150. It is firmly held by the concave surface 136e. This is because each layer is held between the connector main body 132 and the connector upper lid 136 over the entire circumference in the peripheral portion of the hole of each layer. Therefore, even if the signal transmission board 110 is bent or twisted, these five layers cannot be easily detached from the connector unit 130.

  The signal layer 120 and the signal layer electrodes 144a and 144b are pressure-bonded by the fastening of the tapping screw 150. Therefore, the signal layer electrodes 144 a and 144 b are electrically connected to the signal layer 120.

  The signal layer electrodes 144a and 144b are in contact with separate low resistance regions 120b. These signal layer electrodes have, for example, symmetrical arc shapes across the line L in FIG. However, in order to make it contact with each separate low resistance area | region 120b, the range of the circular arc needs to be less than 180 degree | times. In addition, in order to ensure a wide contact area for the same reason as that of the ground layer electrode 142, it is desirable that the range of the arc is, for example, 90 degrees or more.

  Further, due to the fastening of the tapping screw 150, the exposed portion of the power supply layer 114 and the power supply layer electrode 146 are pressure-bonded. Therefore, the power supply layer electrode 146 is electrically connected to the power supply layer 114.

  Here, as described above, the power supply layer electrode 146 is exposed over substantially the entire circumference of the main body second upper surface 132e. Thus, when the connector main body 132 and the connector upper cover 136 are combined, the power supply layer exposed portion and the power supply layer electrode 146 come into contact with each other over substantially the entire circumference of the power supply layer exposed portion. That is, in the present embodiment, the shape of the exposed portion of the power supply layer electrode 146 is an arc so that the contact area between the two is made as wide as possible. By increasing the contact area, the effect of reducing the contact resistance is produced.

  The above is the embodiment of the present invention. The present invention is not limited to these examples and can be modified in various ranges. For example, the DST chip 200 may be built in the connector upper cover 136. In this case, the number of parts and the assembly process can be reduced.

It is the top view which showed the communication apparatus of embodiment of this invention. It is the figure which showed the AA cross section of FIG. It is a top view of the signal layer extracted and shown from the signal transmission board | substrate of embodiment of this invention. It is sectional drawing which decomposed | disassembled and showed the signal transmission board | substrate of embodiment of this invention. It is the figure which showed the connector main body of embodiment of this invention. The figure of the BB cross section of Fig.5 (a) is shown. The figure of CC section of Drawing 5 (a) is shown.

Explanation of symbols

100 Communication Device 110 Signal Transmission Board 120 Signal Layer 130 Connector Unit 132 Connector Main Body 134 Connector Lower Cover 136 Connector Upper Cover 200 DST Chip

Claims (5)

In a chip mounting connector for mounting a chip on a flexible substrate in which a plurality of conductive layers insulated from each other are laminated ,
A main body having a shape in which a plurality of cylinders having different diameters are concentrically stacked, and a plurality of annular zones having different height positions appear on the upper surface side ;
An electrode corresponding to each of the conductive layers, an arc portion having an exposed portion embedded in different annular zones and exposed in a circular arc shape, and a base end of the arc portion being bent, A plurality of electrodes formed by projecting on the upper surface side, the pin portion to which the chip is fitted, and
And the upper surface cover portion that is disposed to face the upper surface of the main body portion across the substrate,
Have
The upper surface side lid portion has a stepped shape corresponding to the plurality of annular zone surfaces on the substrate side surface,
The step shape corresponds to the entire exposed portion of the arc portion on each annular surface by pressing the plurality of conductive layers when the substrate is held between the main body portion and the upper surface side lid portion. A chip mounting connector, wherein the connector is brought into contact with a conductive layer . A circular arc portion having an exposed portion that is embedded in the lower surface of the main body portion and exposed in an arc shape, and a tip that is bent on the base end of the circular arc portion and protrudes from the upper surface side of the main body portion is fitted. A bottom surface side electrode comprising:
And the lower surface side lid which is installed to face the lower surface of the main body portion across the substrate,
Have
The lower surface side lid portion has a shape corresponding to the lower surface of the main body portion on the surface on the substrate side,
The shape corresponding to the lower surface of the main body portion is formed by pressing the conductive layer corresponding to the electrode on the lower surface side when the substrate is held between the main body portion and the lower surface side lid portion, and the shape on the lower surface of the main body portion is 2. The chip mounting connector according to claim 1 , wherein the entire exposed portion of the arc portion is brought into contact with the conductive layer . A signal transmission board for transmitting a signal by two-dimensional spread signal transmission technology, to which the chip mounting connector according to claim 1 or 2 is attached,
A plurality of conductive layers insulated from each other are laminated,
A plurality of circular holes having a diameter equivalent to the outer diameter of the main body portion are formed in each of the plurality of conductive layers, the holes being for attaching the connector for chip mounting. Signal transmission board. 4. The signal transmission board according to claim 3 , wherein each of the plurality of conductive layers is not covered with an insulating material in a peripheral portion of the hole so as to be in contact with the corresponding electrode . The signal transmission board according to claim 3 or claim 4 ,
The chip mounting connector according to claim 1 or 2 , wherein a plurality of chip mounting connectors attached to each hole of the signal transmission board,
A plurality of DST chips attached to each of the plurality of chip mounting connectors and transmitting signals by two-dimensional spread signal transmission technology;
A communication device characterized by comprising:

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