JP2004328409A - Communication device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a communication device for transmitting a signal by allowing a plurality of elements to relay a signal without forming individual wiring. <P>SOLUTION: The communication device 300 comprises first and second signal layers 20, 30, a communication element electromagnetically connected to the layers, and a dielectric layer arranged between the layers. The communication element is connected to the first signal layer 20 via a capacitor 80. The capacitor 80 can reduce the reactance component of output impedance in a drive circuit 82, and reduce the electrode of the communication element. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

Ｂ_０は磁場の強さを表す定数である。ここで、上記一般解における各パラメータの値を、以下のように設定する。
【数２】

Ｒｅ［ｋ］は、誘電層２２中の電磁波動の波数であり、ｃは誘電層２２における光速である。Ｉｍ［ｋ］は伝播する電磁波動の減衰を与えるパラメータである。Ｒｅ［ｐ］は表皮深さを与えるパラメータである。
【００３８】
また、
Ｈ_１ ^（２）（ｚ）≡Ｊ_１（ｚ）−ｊＮ_１（ｚ）
である（ハンケル関数）。
なお、マイクロ波を伝達し、上記の解が成立するためには、以下の条件を満たす必要がある。
１）｜σ／ω｜＞＞ε_０（σは導体層の導電率）を満たすこと。
２）表皮深さが導電層の厚みよりも小さいこと。
３）減衰距離が、その周波数に対応する真空中の電磁波長よりも大きいこと。すなわち、−Ｉｍ［ｋ］がＲｅ［ｋ］と同程度か、それより小さいこと。
４）導電層の間隔が、
【数３】

を満たすこと。
なお、透磁率は誘電層２２、導体層ともにμであることと仮定した。
【００３９】
以上の伝達条件を満たすことにより、誘電層２２において２次元放射状にマイクロ波を伝達させることが可能となる。例えば、周波数を１０〜１００ＧＨｚ程度、伝達距離を１０ｃｍ程度、ｄ＝１〜０．１ｍｍ程度とすることにより、以上のマイクロ波伝達条件を満足するような導電率の材料を容易に見つけることができる。なお、表皮深さが導電層の厚みよりも大きい場合であっても電磁作用は伝達するが、その場合には、電磁波は、導電層の外にも漏出することになる。
【００４０】
電磁波動をマイクロ波として伝達することにより信号伝達速度は光速となる。このように、本実施の形態における通信装置１００は、１ビットの情報を送るのに１波長分程度の幅をもったリング状の電磁場を生成し、この電磁場を利用して通信を行うため、少ない消費電力で１ＧＨｚをこえる信号伝達を行うことが可能となる。これにより、通信装置１００は、コンピュータなどのクロックと同期して高周波数の論理信号を伝送可能となる。
【００４１】
中心から距離ｒの点における上側導体層表面、すなわち第１信号層２０表面と、下側導体層表面、すなわち第２信号層３０表面との電位差をＶ（ｒ）とすると、半径ｒの円柱面を横切って流れる電流Ｉ（ｒ）とＶ（ｒ）（その地点での電極間の電位差２ｄＥ_ｚ）の比は、
【数４】

で与えられる。この値は、通信素子２００からみた出力インピーダンスに相当する。ここで、関数Ｐ（ｘ）を
【数５】

と設定する。
【００４２】
図９は、実数ｘに対するＰ（ｘ）のプロットを示す。Ｐ（ｘ）の虚部（Ｉｍ［Ｐ（ｘ）］）はリアクタンス成分を意味し、原点近くで対数的に発散する。このことは、電流経路となる円柱の半径ｒ_０が小さくなると、リアクタンス成分が増大し、電圧を印加しても電磁波のエネルギーに有効に変換されないことを意味している。そのため、この構造をとる場合には、半径ｒ_０、すなわち円形の電極２０４の半径を小さく構成することが難しくなる。
【００４３】
図１０は、電極２０４の半径を小さく形成することに考慮した通信デバイス３００の構成例を示す。通信デバイス３００は、通信素子２００を駆動するための駆動回路８２と、通信素子２００と第１信号層２０とを接続するコンデンサ８０を備える。駆動回路８２は通信素子２００内に存在してもよい。既述のごとく、駆動回路８２はスイッチ２６を有する。電極２０４の半径ｒ_０が小さいときに生じるリアクタンス成分（図９に示すＩｍ）は誘導性である。半径ｒ_０の円形電極２０４のスイッチングによって電磁波動を放出する場合、第１信号層２０のインピーダンスは、抵抗とインダクタンスを直列接続した回路のそれと等価であるから、通信素子２００をコンデンサ８０を介して第１信号層２０に接続することにより、リアクタンス成分を低くすることが可能となる。コンデンサ８０は、通信素子２００の内部において構成することができる。容量Ｃは、
【数６】

となるように選べばよい。これにより、回路の直列共振状態をつくることができ、インピーダンスを最小に設定することができる。
【００４４】
例えば、周波数を１０ＧＨｚ、２ｄ＝１ｍｍ、ｒ_０＝０．１ｍｍとすると、ｋｒ_０＝０．０２であるため、Ｉｍ［Ｐ（ｘ）］＝４．０となり、リアクタンス成分は抵抗成分より３倍近く大きくなる。このときのリアクタンスは５０Ωであるから、Ｃ＝０．３ｐＦの容量をもつコンデンサ８０を付加して駆動することにより、駆動回路８２からみたインピーダンスは実数、すなわち抵抗となり、そこで消費されるエネルギーは２次元的に放射される電場または電磁場のエネルギーに効率的に変換されることになる。
【００４５】
図１１は、電極２０４の半径を小さく形成することに考慮した通信デバイス３００の構成の変形例を示す。この変形例では、通信素子２００の電極２０４を絶縁層２１０を介して第１信号層２０に接続する。図１０に関連して説明したように、コンデンサ８０は通信素子２００の内部に構成されてもよいが、図１１に示すように、絶縁層２１０として通信素子２００の外部に設けられてもよい。この場合、通信素子２００と第１信号層２０との接続に非導電性の接着剤を利用することができ、製造工程を簡略化することができる。いずれの場合であっても、電極２０４と第１信号層２０とを容量を介して結合させることにより、電流経路の円柱半径を小さく構成した場合におけるリアクタンス成分を低減することができる。そのため、電極２０４の小規模化を実現することができ、通信素子２００を容易に実装して、通信装置１００を作成することが可能となる。
【００４６】
図１２は、実施の形態に係る通信装置１００における信号伝達方法の説明図を示す。実施の形態においては、各通信素子２００が、空間内の自身の位置を示す座標をアドレスとしてメモリに保持する。座標は、２次元座標であっても３次元座標であってもよい。通信素子２００の座標は外部のコンピュータなどにより設定されてもよく、各々で自律的に設定してもよい。この例では、座標（１，１）に位置する通信素子から、座標（７，７）に位置する通信素子まで信号を伝達することを目的とする。以下、座標（Ｍ，Ｎ）に位置する通信素子を「通信素子（Ｍ，Ｎ）」と表現する。なお図示の例では、説明の便宜上、通信素子が規則的に配列されているが、この配列形態はランダムであってよい。
【００４７】
図１３は、送信元の通信素子により生成される信号のパケットを示す。このパケットには、コマンド、送信元アドレス、送信先アドレスおよび送信データの項目が設けられる。この信号はデータを通信素子（７，７）に転送するためのものであり、コマンドには転送パケットであることを指示するコードが記述される。送信元アドレスには、送信元通信素子の座標である（１，１）が記述され、送信先アドレスには、送信先通信素子の座標である（７，７）が記述される。送信データは、伝達すべきデータである。このように、通信素子（１，１）は送信元座標と送信先座標とを含んだ信号のパケットを生成する。パケットの生成は処理部６０（図３参照）により行われる。
【００４８】
図１２に戻って、送信元の通信素子（１，１）が信号を送信すると、その信号は周辺の通信素子、すなわち座標（０，０）、（２，０）、（３，１）、（２，２）、（０，２）、（−１，１）に位置する通信素子に伝達される。これらの通信素子は、信号を受け取ると、自身が位置する座標をもとに信号を中継するか否かを決定する。この決定は、送信元座標（１，１）と送信先座標（７，７）との間に、空間的に自身が位置するか否かを判定することにより行われ、具体的には、送信元の通信素子（１，１）と、送信先の通信素子（７，７）とを結ぶ経路上に自身が位置するか否かを判定することにより行われる。
【００４９】
この例では、通信素子（２，２）が、通信素子（１，１）と通信素子（７，７）を結ぶ経路上に位置することを判定し、信号を中継することを決定する。通信素子（２，２）は、受け取った信号を送信し、それ以外の通信素子は応答しない。以後、信号は、通信素子（３，３）、通信素子（４，４）、通信素子（５，５）、通信素子（６，６）により中継されて通信素子（７，７）に伝達される。
【００５０】
本実施の形態においては、各通信素子が、自身の座標と、送信元および送信先の座標との関係により、信号を中継すべきか否かを判断する。通信経路を予め定めておく必要はなく、単純なアルゴリズムで動的に最短経路を設定し、信号を伝達することが可能となる。
【００５１】
以上のように、通信装置１００は、通信素子２００間で信号を伝達することが可能となる。各通信素子２００の有効通信距離の範囲内には、既述のような通信素子２００間で要求される通信機能を有しないシンプルな通信素子を配置してもよい。このシンプルな通信素子は、通信素子２００の管理下におかれる。この関係から、通信素子２００を親素子と呼び、その管理下にある通信素子を子素子と呼ぶ。上記のごとく、親素子となる通信素子２００は、自身の二次元座標などのＩＤを有している。
【００５２】
この親子関係は、親素子が応答要求を定期的に発行し、それに子素子が応答することで動的に形成される。具体的にはまず親素子は自分のＩＤをパケットに埋め込んだ「応答要求コマンド」を送信する。すでに親素子が確定している子素子はそれに応答することはなく、まだ親素子が確定していない子素子は、乱数による待機時間の後、自分がその親素子に子供になることを意思表示するパケットを発行する。このパケットを受け取った親素子は直ちにＩＤ確定コマンドを送出し、その子素子に、自分の管轄内でのＩＤを割り当てる。このようにして任意の子素子は動的に近傍の１次素子とユニークな親子関係を確立する。なお子素子は組み込みの素子でもよいし、コネクタを介して信号層に接続された情報機器であってもよい。
【００５３】
通信装置１００において、子素子は、親素子との間でのみ通信を可能とする。親素子である通信素子２００は、子素子から発信された信号を、周辺の通信素子２００に伝達する役割と、また別の通信素子２００から送信された信号を、子素子に伝達する役割をもつ。親素子は、複数の子素子を管理してもよく、割り当てたＩＤにより、管理下の子素子を特定する。
【００５４】
＜第２の実施の形態＞
図１４は、本発明の第２の実施の形態に係る通信装置４００の構成を示す。通信装置４００には、信号を伝達する複数の信号層４１０ａ、４１０ｂ、４１０ｃ、４１０ｄ、４１０ｅ、４１０ｆ、４１０ｇ、４１０ｈ、４１０ｉ（以下、総称する場合は「信号層４１０」と呼ぶ）が形成される。信号層４１０は導電性材料により形成され、近傍の信号層４１０とは互いに絶縁される。隣り合う信号層４１０の間には高抵抗層４２０が設けられてもよく、また各信号層４１０は、互いに離間して高抵抗層４２０上に設けられてもよい。
【００５５】
通信装置４００には、２つ以上の信号層４１０に接続して、当該２つ以上の信号層４１０間における信号の送受信を行う計１２の通信素子５００ｅ、５００ｆ、５００ｈ、５００ｉ、５００ｊ、５００ｌ、５００ｍ、５００ｏ、５００ｐ、５００ｑ、５００ｓ、５００ｔが設けられる。図１４の例では、縦横３×３個の信号層４１０が形成されているが、中央の信号層４１０ｅを除く周囲の信号層４１０には、１つの信号層４１０にのみ接続する計１２の通信素子５００ａ、５００ｂ、５００ｃ、５００ｄ、５００ｇ、５００ｋ、５００ｎ、５００ｒ、５００ｕ、５００ｖ、５００ｗ、５００ｘが設けられる。以下、通信素子を総称する場合は「通信素子５００」と呼ぶ。通信素子５００は、第１の実施の形態で説明した通信素子２００と同様の機能を有してもよく、また同様の構成を有してもよい。このように、通信装置４００においては、信号層４１０内または信号層４１０間における信号の送受信を担うべく、計２４の通信素子５００が設けられている。図１４においては、計１２の通信素子５００が、隣り合う２つの信号層４１０を接続するべく設けられているが、別の例においては、そのうちの一部の通信素子５００が省略されてもよい。また図示の例では、信号層４１０の個数が少ないため、通信素子５００の全体の個数（計２４）に対して、複数の信号層４１０にまたがる通信素子５００の個数（計１２）の占める割合が５０％に過ぎないが、信号層４１０の個数が増えるにつれて、その割合は高くなる。説明の便宜上、以下では、特に断らない限り、通信素子５００が、複数の信号層４１０に接続する場合を想定して、第２の実施の形態に係る通信装置４００の説明を行う。
【００５６】
第２の実施の形態において通信素子５００は、隣り合う２つの信号層４１０に電気的に接続し、接続する信号層４１０内に設けられた他の通信素子５００との間で信号を送受信する機能を有し、また接続する２つの信号層４１０間において信号を送受信する機能も有する。信号層４１０内における通信機能として、例えば通信素子５００ｅは信号層４１０ａと信号層４１０ｂとに接続するが、信号層４１０ａ内に設けられた他の通信素子５００ａ、５００ｄおよび５００ｈとの間で信号を送受信することができ、また信号層４１０ｂ内に設けられた他の通信素子５００ｂ、５００ｆおよび５００ｉとの間でも信号を送受信することができる。この信号層４１０内における通信を、内方向の通信と呼ぶ。また、信号層４１０間における通信機能として、通信素子５００ｅは、信号層４１０ａを伝達される信号を信号層４１０ｂに伝達することができ、また信号層４１０ｂを伝達される信号を信号層４１０ａに伝達することもできる。この信号層４１０間における通信を、外方向の通信と呼ぶ。例えば通信素子５００ｅは、信号層４１０ａにおける通信素子５００ａから信号を受信して、信号層４１０ｂにおける通信素子５００ｆに送信することができ、また、その逆も可能とする。各通信素子５００が上記のような機能をもつことにより、第２の実施の形態における通信装置４００は、配線を形成することなく、任意の通信素子５００間における通信を実現することができる。
【００５７】
通信装置４００における信号伝達方法を、通信素子５００ｄから通信素子５００ｆに信号を伝達する場合を例に説明する。ここでは、通信素子５００ｄが信号の送信元であり、通信素子５００ｆが信号の最終目的地であることを仮定する。この場合、まず通信素子５００ｄが、信号層４１０ａを介して通信素子５００ｅに信号を伝達し、通信素子５００ｅが、信号層４１０ｂを介して通信素子５００ｆに信号を転送する。通信素子５００ｅに注目すると、通信素子５００ｅは、通信素子５００ｄとの間で信号層４１０ａ内通信を行い、また通信素子５００ｆとの間で信号層４１０ｂ内通信を行うことによって、結果として信号層４１０ｂと信号層４１０ｃの間の通信を実現することになる。このように各通信素子５００が、互いに絶縁された複数の信号層４１０に接続して、信号層４１０間の通信を行うことにより、信号を送信元の信号層４１０から所期の目的地となる信号層４１０まで順次伝達することができ、送信元および最終目的地間の信号伝達を実現することが可能となる。
【００５８】
各信号層４１０には、センシングユニット、パワーユニット、また表示ユニットなど、各種機能を実現するための構成が備えられてもよい。特に、これらのユニットを容易に置換可能とすることで、応用性の高い通信装置４００を実現することができる。また、各通信素子５００はコネクタなどの機能を備え、外部機器との接続を可能としてもよい。通信素子５００に外部機器とのインタフェース機能をもたせることにより、通信装置４００を様々な環境で利用することが可能となる。
【００５９】
図１５（ａ）は通信装置４００の断面の一例を示し、この例では、隣り合う信号層４１０が高抵抗層４２０により絶縁されている。隣り合う信号層４１０間は、通信素子５００により接続され、信号層４１０間の通信が実現される。
【００６０】
図１５（ｂ）は通信装置４００の断面の別の例を示し、この例では、隣り合う信号層４１０が互いに離間して高抵抗層４２０上に設けられる。隣り合う信号層４１０間は、通信素子５００により接続され、信号層４１０間の通信が実現される。
【００６１】
図１６（ａ）は、通信装置４００の構成の変形例を示す。この通信装置４００は、６角形の複数の信号層４１０と、信号層４１０間における信号の送受信を行う複数の通信素子５００とを有する。図１５に示す通信装置４００と同様に、各信号層４１０は、高抵抗層４２０により絶縁されている。
【００６２】
図１６（ｂ）は、通信装置４００の構成の変形例を示す。この通信装置４００では、信号層４１０内に高抵抗領域４３０が形成されて、信号層４１０内の導電領域が部分的に形成されている。なお、図１５に示す通信装置４００と同様に、各信号層４１０は、高抵抗層４２０により絶縁されている。
【００６３】
図１６（ｃ）は、通信装置４００の構成の変形例を示す。この通信装置４００は、４角形の複数の信号層４１０と、４つの信号層４１０に接続する複数の通信素子５００とを有する。信号層４１０の形状は、図１５に示す通信装置４００における信号層４１０の形状と同様であるが、通信素子５００の配置位置が異なっている。なお、各信号層４１０は、高抵抗層４２０により絶縁されている。
【００６４】
以上のように、通信装置４００は様々な形状および構造の信号層４１０を備えることができ、また通信素子５００が接続する信号層４１０の個数は任意であってもよい。上記した例において、信号層４１０の形状は正多角形であるが、これに限定するものではない。通信装置４００において、各通信素子５００は、送信するパケットに最終目的地となる信号層４１０の識別番号を含めることにより、そのパケットを最終目的地まで伝達する。第２の実施の形態において、信号層４１０は平面上に形成されているため、各信号層４１０の識別番号として、各信号層４１０の２次元座標を利用することとする。なお、別の例においては、識別番号として、信号層４１０に固有のシリアル番号を割り振ることも可能であり、また信号層４１０が３次元的に形成される場合には、信号層４１０の識別番号を３次元座標で表現することも可能である。
【００６５】
図１７は、図１４に示した通信装置４００の模式図を示す。図１７において、各通信素子５００を結ぶように描かれている実線は、隣り合う信号層４１０が絶縁されている状態を意味する。信号層４１０ａを原点とするＸＹ軸を設定することにより、信号層４１０ａの座標すなわち識別番号を（０，０）、信号層４１０ｂの識別番号を（１，０）、信号層４１０ｃの識別番号を（２，０）、信号層４１０ｄの識別番号を（０，１）、信号層４１０ｅの識別番号を（１，１）、信号層４１０ｆの識別番号を（２，１）、信号層４１０ｇの識別番号を（０，２）、信号層４１０ｈの識別番号を（１，２）、信号層４１０ｉの識別番号を（２，２）と定めることができる。信号層４１０の識別番号は、通信装置４００の製造時に予め設定してもよく、また後述するアルゴリズムにより自律的に設定してもよい。信号層４１０間の信号の伝達は、信号層４１０の識別番号を利用して実現される。以下、信号層４１０の識別番号を、「信号層ＩＤ」と呼ぶ。なお、各通信素子５００は、自身が接続する信号層４１０の信号層ＩＤを記憶しており、したがって複数の信号層４１０に接続する場合は、複数の信号層ＩＤを記憶することになる。
【００６６】
各通信素子５００には、自身が接続する信号層４１０ごとに、信号層４１０内のローカルな識別番号が割り振られる。図示の例では、信号層４１０が四角形に形成されており、信号層４１０において、右側に位置する通信素子５００のローカル識別番号が「１」、上側に位置する通信素子５００のローカル識別番号が「２」、下側に位置する通信素子５００のローカル識別番号が「３」、左側に位置する通信素子５００のローカル識別番号が「４」に設定される。信号層４１０内の信号の伝達は、このローカル識別番号を利用して実現される。例えば、通信素子５００ｅに注目すると、信号層ＩＤ（０，０）の信号層４１０ａにおいては、右側に位置しているためローカル識別番号「１」を有し、一方で、信号層ＩＤ（１，０）の信号層４１０ｂにおいては、左側に位置しているためローカル識別番号「４」が割り当てられている。以下、通信素子５００のローカル識別番号を「ローカルＩＤ」と呼ぶ。
【００６７】
以上のように、各通信素子５００は、自身が接続する信号層４１０の信号層ＩＤと、各信号層４１０におけるローカルＩＤとを保持する。この前提のもと、第２の実施の形態における通信方法を説明する。この通信方法においては、３種類のパケットを使用する。
【００６８】
（１）ＲＴＳ（ｒｅｑｕｅｓｔ ｔｏ ｓｅｎｄ−ｓｔｒｅａｍ）パケット
信号層４１０内の通信素子５００に対してコネクションの確立を要求するパケット
（２）ＣＴＳ（ｃｌｅａｒ ｔｏ ｓｅｎｄ−ｓｔｒｅａｍ）パケット
ＲＴＳ送信元に対してコネクションの確立許可を示すパケット
（３）ＤＴ（ｄａｔａ ｔｒａｎｓｍｉｓｓｉｏｎ−ｓｔｒｅａｍ）パケット
データ転送のパケット
【００６９】
図１８（ａ）は、ＲＴＳパケットのデータフォーマットを示す。ＲＴＳパケットは３つのフィールドを有する。以下、各フィールドの項目を示す。
第１フィールド：反応すべき通信素子５００のローカルＩＤ
第２フィールド：コマンド（ＲＴＳ）
第３フィールド：ＲＴＳパケットの送信元の通信素子５００のローカルＩＤ
【００７０】
図１８（ｂ）は、ＣＴＳパケットのデータフォーマットを示す。ＣＴＳパケットは２つのフィールドを有する。以下、各フィールドの項目を示す。
第１フィールド：反応すべき通信素子５００のローカルＩＤ
第２フィールド：コマンド（ＣＴＳ）
【００７１】
図１８（ｃ）は、ＤＴパケットのデータフォーマットを示す。以下、各フィールドの項目を示す。
第１フィールド：反応すべき通信素子５００のローカルＩＤ
第２フィールド：コマンド（ＤＴ）
第３フィールド：ホップリミット、すなわち通信素子１０の中継回数の上限値
第４フィールド：データ長
第５フィールド：最終目的地のＸ座標
第６フィールド：最終目的地のＹ座標
第７フィールド：送信元のＸ座標
第８フィールド：送信元のＹ座標
第９フィールド：目的地でのアプリケーション
第１０フィールド以降：データ
なお、図１８（ａ）〜（ｃ）の例では、各フィールドが８ビットで構成されている。
【００７２】
図１９は、通信装置４００における通信方法を説明するための図を示す。図１９では、送信元である通信素子５００ｄから最終目的地である通信素子５００ｇに信号を伝達する場合を例にとる。
【００７３】
（ステップ１）
通信素子５００ｄは、自身の信号層ＩＤ（０，０）と、最終目的地である通信素子５００ｇの信号層ＩＤ（２，０）の位置関係から、ＤＴパケットを送信する方向を計算し、信号層４１０ａ内でＤＴパケットを伝達すべき通信素子を決定する。すなわち通信素子５００ｄは、通信素子５００ｇまでの最短経路を演算し、ＤＴパケットを、信号層４１０ａ、４１０ｂを経由して信号層４１０ｃに伝達するルートが最短であることを判定する。この経路上に存在する素子は通信素子５００ｅであるため、通信素子５００ｄは、通信素子５００ｅとコネクションを確立するべく、通信素子５００ｅに対してＲＴＳパケットを送信する。このとき、ＲＴＳパケットの第１フィールドは「１」に設定される。なお、通信素子５００ｄは、信号の衝突を避けるため、信号層４１０ａ内で他の通信素子が通信を行っているか否かを監視し、通信が行われていない場合にＲＴＳパケットを送信することが好ましい。
【００７４】
（ステップ２）
通信素子５００ｅは、ＲＴＳパケットに含まれる第１フィールドを参照し、ＲＴＳパケットが自身宛てであることを判定すると、通信素子５００ｄに対してＣＴＳパケットを送信する。このとき、ＣＴＳパケットの第１フィールドは「４」に設定される。
【００７５】
（ステップ３）
通信素子５００ｄは、一定時間内に自身宛てのＣＴＳパケットを受け取ると、ＤＴパケットを送信する。ＤＴパケットの第１フィールドは「１」に設定される。通信素子５００ｅは、ＤＴパケットを受け取る。通信素子５００ｄが一定時間内にＣＴＳパケットを受け取れない場合は、ステップ１に戻って、再度ＲＴＳパケットを送信する。なお、複数回にわたり通信素子５００ｅからの応答がない場合には、送信先を変更したＲＴＳパケットを送信してもよい。これにより、通信経路を自律的に変更することが可能となる。図１７に戻って、この場合は、ＲＴＳパケットの第１フィールドを「２」に設定することが好ましい。
【００７６】
（ステップ４）
通信素子５００ｅは、ＤＴパケットを受け取ると、ＤＴパケットを転送する方向を決定する。この場合、通信素子５００ｅは、ＤＴパケットを信号層４１０ａ側の通信素子５００ｄより受け取ったため、転送する方向が信号層４１０ｂ側であること、すなわち外方向であることを決定する。これにより、続くＤＴパケットの送信を、信号層４１０ｂにおいて行うことが定められる。
【００７７】
通信素子５００ｅは、自身の信号層ＩＤ（１，０）と、最終目的地である通信素子５００ｇの信号層ＩＤ（２，０）の位置関係から、信号層４１０ｂ内でＤＴパケットを伝達すべき通信素子を決定する。最短経路上に存在する素子は通信素子５００ｆであるため、通信素子５００ｅは、通信素子５００ｆとコネクションを確立するべく、通信素子５００ｆに対してＲＴＳパケットを送信する。このとき、ＲＴＳパケットの第１フィールドは「１」に設定される。通信素子５００ｅは、信号の衝突を避けるため、信号層４１０ｂ内で他の通信素子が通信を行っているか否かを監視し、通信が行われていない場合にＲＴＳパケットを送信してもよい。
【００７８】
（ステップ５）
通信素子５００ｆは、ＲＴＳパケットに含まれる第１フィールドを参照し、ＲＴＳパケットが自身宛てであることを判定すると、通信素子５００ｅに対してＣＴＳパケットを送信する。このとき、ＣＴＳパケットの第１フィールドは「４」に設定される。
【００７９】
（ステップ６）
通信素子５００ｅは、一定時間内に自身宛てのＣＴＳパケットを受け取ると、ＤＴパケットを送信する。ＤＴパケットの第１フィールドは「１」に設定される。通信素子５００ｆは、ＤＴパケットを受け取る。
【００８０】
（ステップ７）
通信素子５００ｆは、ＤＴパケットを受け取ると、ＤＴパケットを転送する方向を決定する。通信素子５００ｆは、ＤＴパケットを信号層４１０ｂ側の通信素子５００ｅより受け取ったため、転送する方向が信号層４１０ｃ側であること、すなわち外方向であることを決定する。これにより続くＤＴパケットの送信を、信号層４１０ｃにおいて行うことが定められる。
【００８１】
通信素子５００ｆは、ＤＴパケットの第５および第６フィールドの目的地座標から、最終目的地が信号層４１０ｃにおける通信素子５００ｇであることを認識する。なお、第５および第６フィールドの目的地座標には、信号層４１０ｃを特定する座標と、通信素子５００ｇを特定するローカルＩＤとが含まれるものとする。これにより、通信素子５００ｆは、通信素子５００ｇとコネクションを確立するべく、通信素子５００ｇに対してＲＴＳパケットを送信する。このとき、ＲＴＳパケットの第１フィールドは「１」に設定される。
【００８２】
（ステップ８）
通信素子５００ｇは、ＲＴＳパケットに含まれる第１フィールドを参照し、ＲＴＳパケットが自身宛てであることを判定すると、通信素子５００ｆに対してＣＴＳパケットを送信する。このとき、ＣＴＳパケットの第１フィールドは「４」に設定される。
【００８３】
（ステップ９）
通信素子５００ｆは、一定時間内に自身宛てのＣＴＳパケットを受け取ると、ＤＴパケットを送信する。ＤＴパケットの第１フィールドは「１」に設定される。これにより、最終目的地である通信素子５００ｇは、ＤＴパケットを受け取ることができる。例えば、通信素子５００ｇに外部機器が接続されている場合は、ＤＴパケットに含まれるデータを外部に送信することが可能となる。
【００８４】
以上の通信方法によると、信号の送信元から最終目的地までの経路を予め設定することなく、信号を中継する各通信素子５００が信号層ＩＤをもとに、動的に経路を設定することが可能となる。そのため、通信装置４００においては、例えば一部の通信素子５００が故障した場合であっても、その通信素子５００を回避して、最終目的地までＤＴパケットを伝送することが可能となる。
【００８５】
なお、図１９の例では、信号を一軸方向すなわちＸ軸方向に伝達する場合を示すが、信号は、斜め方向であっても当然に伝達することができる。例えば、信号層ＩＤ（０，０）の信号層４１０ａから信号層ＩＤ（１，１）の信号層４１０ｅに信号を伝達する場合、途中の経路として、信号層ＩＤ（１，０）の信号層４１０ｂまたは信号層ＩＤ（０，１）の信号層４１０ｄのいずれを経由することも可能である。いずれの経路を選択するかは、ランダムに決定されてもよく、また例えばＸ軸方向への信号伝達をＹ軸方向への信号伝達よりも優先的に行うなどの所定の規則に沿って決定されてもよい。
【００８６】
図２０（ａ）は、信号層４１０を流れる信号の波形フォーマットを示す。各パケットの先頭には、スタートビットと、フィールド開始を示すデータが付加される。スタートビットは、一定時間、ここではデジタル回路の動作クロック周期の３０倍の時間、「０１」のパターンが周期的に繰り返される。この周期パターンにより、サンプリング時間を決定する。通信データは１０ビットをひとまとまりとして取り扱い、これを１フレームと呼ぶ。
【００８７】
図２０（ｂ）は、１フレームの構成を示す。１フレームは、８ビットの実データと２ビットのフレーム区切りからなる。例えば、１０進数のデータ「１０」を出力する場合には、フレーム区切り「１０」を先頭に付加して、フレームは、１０００００１０１０として表現される。また、信号には２０フレームごとに、ビット列１１１１１１１１を挿入する。このとき、フレーム区切りは挿入しない。フィールド開始指示用データは、フィールド区切り「１０」にビット列１１１１１１１１を付加した１０１１１１１１１１として表現される。スタートビット後に必ずこのデータ列が挿入され、このデータ列の後が、各パケットの先頭となる。
【００８８】
図２１は、通信素子５００のデジタル回路の実現例を示す。デジタル回路におけるポート定義は以下のとおりである。
（入力ポート）
Ａｉｎｐ＿ａ：入力信号（常時観測型コンパレータからの出力）
Ａｉｎｐ＿ｂ：入力信号（常時観測型コンパレータからの出力）
Ｉｎｉｔ＿ｆｌｇ：初期化フラグ
ｃｌｋ：マスタークロック
ｉｎ：サンプリングされた信号
ｍｓ：信号層選択
ｓｅｌｅｃｔＩＤ： ０：ローカルＩＤ＿ａ＝１ １：ローカルＩＤ＿ａ＝２
ｓｌｅｅｐｍｏｄｅ： ０：スリープモードなし
ｔＳｉｔｅ＿ｘ：信号層Ｘ座標
ｔＳｉｔｅ＿ｙ：信号層Ｙ座標
【００８９】
（出力ポート）
Ｉｎｐ＿ａ：信号層内方向入力判定フラグ ０：入力なし １：入力あり
Ｉｎｐ＿ｂ：信号層外方向入力判定フラグ ０：入力なし １：入力あり
ＯｕｔＢｉｔ＿ａ：信号層内方向出力データ
ＯｕｔＢｉｔ＿ｂ：信号層外方向出力データ
ＯｕｔＢｉｔ＿ｎａ：ＯｕｔＢｉｔ＿ａの反転
ＯｕｔＢｉｔ＿ｎｂ：ＯｕｔＢｉｔ＿ｂの反転
ｅｎａ＿ＡｐｐＬ：アプリケーション層プロセスイネーブル
ｅｎａ＿ｄｗｎＤａｔＬ：データリンク層プロセスイネーブル
ｅｎａ＿ｄｗｎＮｅｔＬ：ネットワーク層プロセスイネーブル
ｅｎａ＿ｕｐＤａｔＬ：データリンク層プロセスイネーブル
ｅｎａ＿ｕｐＮｅｔＬ：ネットワーク層プロセスイネーブル
ｉｎｍｏｎｉｔｏｒ：物理層プロセス監視フラグ １：スタートビット検出
【００９０】
図２２は、通信素子５００のデジタル回路におけるプロセスの状態遷移図を示す。通信素子５００は、以下に示す各状態をとることができる。
（状態０）開始・初期化
各レイヤのプロセスを初期化したのち、状態１へ遷移する。このとき、通信素子５００はいずれの方向からの入力も受け入れることができる。
【００９１】
（状態１）ＲＴＳ待ち・受け入れ
信号層４１０の内方向または外方向の通信のうち、早く到達した方向のデータを受け入れるように、Ｉｎｐ＿ａ、Ｉｎｐ＿ｂのいずれかを１にする。以後１になった方のデータをサンプリングする。なお信号層４１０の内方向の通信とは、信号層４１０内の他の通信素子５００とのデータの送受信を意味し、信号層４１０の外方向の通信とは、その信号層４１０とは異なる信号層における通信素子との間のデータの送受信を意味する。
【００９２】
入力データの第１フィールドより順にＲＴＳフォーマットに準じた判定を行い、コネクションを確立するかどうか決定する。ＲＴＳパケットを正しく受け取った場合は状態２へ遷移する。プロセスエラーを検出した場合は状態０へ戻る。
【００９３】
（状態２）ＣＴＳ出力
ＣＴＳパケットを出力する。出力方向はＲＴＳパケットを受け取った方向と同じである。このとき、他の方向からの信号がきてもすべて無視される。出力中にエラーが生じた場合は状態０へ遷移する。出力が完了したら状態３へ遷移する。
【００９４】
（状態３）ＤＴ待ち・受け入れ
ＤＴパケットを受け入れる。受け入れ方向はＣＴＳパケット出力の方向と同じ方向である。一定時間内（１００Ｔ：Ｔはマスタークロック周期）にＤＴパケットがこない場合はエラーとし、状態０へ遷移する。ＤＴパケットを取得中にエラーが発生した場合、すでに１０バイト以上データを取得した場合は状態４へ遷移し、それ以外の場合は状態０へ遷移する。
【００９５】
（状態４）ルーティング
ネットワーク層のプロセスであり、ＤＴパケットのヘッダ部より、目的地の座標を取得する。取得データと、自身の座標と比較して、目的地が、自身の信号層４１０の座標と一致していればアプリケーション層へプロセスを渡す。目的地ではない場合は次のコネクション先（方向、ローカルＩＤ）を決定する。このとき、ＤＴパケットのヘッダ部の第１フィールド（反応すべきローカルＩＤ）と第３フィールド（ホップリミット）を書き換え、状態５へ遷移する。ホップリミットの書き換えは、中継数の上限値を１デクリメントすることにより行う。
【００９６】
（状態５）ＲＴＳ出力
次のコネクション先へＲＴＳパケットを出力する。このとき物理層では出力方向のネットワークの占有状況を監視し、時間１６Ｔ（２バイト）の間に周囲の素子が通信を行っていなければ、出力を開始する。ＲＴＳパケットの出力が完了すると、状態６へ遷移する。周囲の素子が通信を行っていて、一定時間（１００Ｔ）まっても出力が開始されない場合は状態８へ遷移する。
【００９７】
（状態６）ＣＴＳ待ち・受け入れ
自身宛のＣＴＳパケットを待ちうける。一定時間（１００Ｔ）内にＣＴＳパケットを受け取ると、状態７へ遷移する。一定時間内にＣＴＳパケットを受け取らなければ、状態８へ遷移する。
【００９８】
（状態７）ＤＴ出力
ＤＴパケットを出力する。出力方向はＲＴＳ出力方向と同じである。データが正しく出力できたら状態９へ遷移する。途中、エラーを検出したら状態８へ遷移する。
【００９９】
（状態８）再ルーティング
コネクションが正しく確立できなかった場合、５回までは同じ通信素子に対してコネクションを確立しようとする。５回の挑戦でもコネクションが確立されなかった場合、ネットワーク層で別なルートを計算する。ルートを再計算後、状態５へ遷移する。
【０１００】
（状態９）終了・初期化
全てのフラグを初期化して状態０へ遷移する。
【０１０１】
以上、第２の実施の形態においては、各信号層４１０に予め信号層ＩＤが付与されていることを前提としてきたが、各信号層４１０に含まれる通信素子５００は、自身の接続する信号層ＩＤを動的に取得することも可能である。
【０１０２】
以下に「ＩＤ決定コマンド」を使用する例を示す。ＩＤ決定コマンドには、信号層４１０の座標（Ｘ，Ｙ）が記述される。ＩＤ決定コマンドを受け取った通信素子５００は、自身の属する信号層４１０の座標が（Ｘ，Ｙ）であることを認識する。
【０１０３】
各通信素子５００は、ＩＤ決定コマンドを、同一信号層４１０内におけるローカルＩＤが「１」および「２」の通信素子５００に送信する。このとき、送信先の通信素子５００が通信中である場合は、ＩＤ決定コマンドの送信を停止する。ＩＤ決定コマンドを受信した通信素子５００は、受信した方向とは別の方向、すなわち内方向とは逆向きの外方向に存在する別の信号層４１０にＩＤ決定コマンドを送信する。具体的に、「１」のローカルＩＤでＩＤ決定コマンドを受信した通信素子５００は、隣り合う信号層４１０において、「４」のローカルＩＤをもつ通信素子５００として座標（Ｘ＋１，Ｙ）を記述したＩＤ決定コマンドを送信する。また、「２」のローカルＩＤでＩＤ決定コマンドを受信した通信素子５００は、隣り合う信号層４１０において、「３」のローカルＩＤをもつ通信素子５００として座標（Ｘ，Ｙ＋１）を記述したＩＤ決定コマンドを送信する。
【０１０４】
以上のように通信素子５００が機能することにより、通信装置４００への電源投入後に、左下隅の信号層４１０ａの座標を（０，０）として、信号層４１０ａに属する通信素子５００からＩＤ決定コマンドを送信することによって、全ての信号層４１０に信号層ＩＤを動的に割り振ることが可能となる。
【０１０５】
このように、少なくとも一つの信号層４１０、この例では信号層４１０ａに基準となる信号層ＩＤ（０，０）を予め設定し、その基準となる信号層ＩＤをもとに、他の信号層４１０の識別番号を順次設定することにより、通信装置４００内の信号層４１０の信号層ＩＤを設定することが可能となる。基準となる信号層ＩＤは、通信装置４００における左下隅の信号層４１０ａに限らず、他の信号層４１０に設定してもよい。例えば、図１７の通信装置４００において、中央の信号層４１０ｅを信号層ＩＤを決定するための基準信号層として定めた場合には、信号層４１０ｅに属する通信素子５００ｍ、５００ｐ、５００ｉ、５００ｌが、外方向にＩＤ決定コマンドを送信して、周囲の信号層４１０の信号層ＩＤを順次設定していけばよい。このアルゴリズムにおいては、通信素子５００は、自身が接続する信号層４１０の信号層ＩＤを含んだ信号（ＩＤ決定コマンド）を受け取ると、その信号を伝達した信号層４１０の信号層ＩＤを保持し、続いて自身が接続する他の信号層４１０の信号層ＩＤを設定して、設定した信号層ＩＤを含むＩＤ決定コマンドを、当該他の信号層４１０に送信する。第２の実施の形態における通信装置４００によると、通信素子５００がローカルＩＤを保持し、信号層４１０における自身の位置関係を把握することによって、座標で表現する信号層ＩＤを簡易なアルゴリズムによって自律的に設定することが可能となる。
【０１０６】
また、第２の実施の形態では、通信素子５００が、一旦信号を受信してから転送することとしたが、信号の受信が完了する前に、信号の転送を開始してもよい。ＤＴパケットにおいては、パケットの先頭にコマンドや目的地の座標などのヘッダ項目が記述されているため、ヘッダ項目を受け取った時点から、信号の転送先となる通信素子５００を特定して、コネクションの確立を行い、ＤＴパケットを受信しながら、そのＤＴパケットを転送先となる通信素子５００に順次転送することが可能である。これにより、データが最終目的地に到達するまでの遅延時間を減らすことができ、またスループットを向上することが可能となる。
【０１０７】
以上、本発明をいくつかの実施の形態をもとに説明した。これらの実施の形態は例示であり、実施の形態の組み合わせ、またそれらの各構成要素や各処理プロセスの組合せにいろいろな変形例が可能なこと、またそうした変形例も本発明の範囲にあることは当業者に理解されるところである。
【０１０８】
【発明の効果】
本発明によれば、新規な通信デバイスおよび通信装置などを提供することができる。
【図面の簡単な説明】
【図１】実施の形態に係る通信技術の方式を説明するための図である。
【図２】実施の形態にかかる通信装置の外観構成を示す図である。
【図３】通信素子の機能ブロック図である。
【図４】（ａ）は通信装置の断面図であり、（ｂ）は通信装置の別の例を示す断面図である。
【図５】（ａ）は通信デバイスが信号を発信する基本原理を説明するための図であり、（ｂ）は通信デバイスが信号を発信する原理の別の例を説明するための図である。
【図６】通信素子を備えた通信デバイスを示す図である。
【図７】（ａ）は通信デバイスを実現する回路動作の概要を示す図であり、（ｂ）は第１信号層に印加する交流電圧の振幅を制限する回路の例を示す図である。
【図８】（ａ）は通信素子の具体的な構成例を示す図であり、（ｂ）および（ｃ）は、通信素子による信号発信の原理を説明するための図である。
【図９】Ｐ（ｘ）のプロットを示す図である。
【図１０】電極の半径を小さく形成することに考慮した通信デバイスの構成例を示す図である。
【図１１】電極の半径を小さく形成することに考慮した通信デバイスの構成の変形例を示す図である。
【図１２】通信装置における信号伝達方法の説明図である。
【図１３】送信元の通信素子により生成される信号のパケットを示す図である。
【図１４】第２の実施の形態に係る通信装置の構成を示す図である。
【図１５】（ａ）は通信装置の断面の一例を示す図であり、（ｂ）は通信装置の断面の別の例を示す図である。
【図１６】（ａ）は通信装置の構成の変形例を示す図であり、（ｂ）は通信装置の構成のさらなる変形例を示す図であり、（ｃ）は通信装置の構成のさらなる変形例を示す図である。
【図１７】通信装置の模式図である。
【図１８】（ａ）はＲＴＳパケットのデータフォーマットを示す図であり、（ｂ）はＣＴＳパケットのデータフォーマットを示す図であり、（ｃ）はＤＴパケットのデータフォーマットを示す図である。
【図１９】通信装置における通信方式を説明するための説明図である。
【図２０】（ａ）は信号層を流れる信号の波形フォーマットを示す図であり、（ｂ）は１フレームの構成を示す図である。
【図２１】通信素子のデジタル回路の実現例を示す図である。
【図２２】通信素子のデジタル回路におけるプロセスの状態遷移図である。
【符号の説明】
１６、１８・・・導電層、２０・・・第１信号層、２２・・・誘電層、２４・・・導電層、２６・・・スイッチ、３０・・・第２信号層、４３・・・誘電層、４４・・・電源層、５０・・・通信部、５２・・・入力部、５４・・・電圧制限素子、６０・・・処理部、７０・・・メモリ、８０・・・コンデンサ、８２・・・駆動回路、１００・・・通信装置、２００・・・通信素子、２０２・・・デジタル回路、２０４・・・電極、２１０・・・絶縁層、３００・・・通信デバイス、４００・・・通信装置、４１０・・・信号層、４２０・・・高抵抗層、４３０・・・高抵抗領域、５００・・・通信素子。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a communication device for transmitting a signal and a communication device for realizing the signal transmission, and more particularly to a communication technology for transmitting a signal using a plurality of communication devices.
[0002]
[Prior art]
In a communication network such as a LAN (Local Area Network) and a WAN (Wide Area Network), a plurality of communication terminals are connected by a coaxial cable, an optical fiber, or the like. These communication terminals transmit signals to desired communication terminals by designating addresses in the network. In a conventional network, communication terminals are generally connected by wire. In recent years, a system for connecting the terminals wirelessly has been proposed. For example, an ad hoc network has been proposed in which all nodes that are mobile devices have a predetermined transmission radius and perform wireless communication between nodes (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP 2001-268127 A
[0004]
[Problems to be solved by the invention]
In a communication network or mounting board, terminals and elements are physically connected by individual wiring, so if the wiring is cut, signals cannot be transmitted and the communication function may stop. sell.
[0005]
Therefore, an object of the present invention is to provide a novel communication technology relating to a communication device and a communication device, and further provide a power supply technology in order to solve such a conventional problem.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, one embodiment of the present invention is a communication device that transmits a signal, a ground layer and a power supply layer, a communication element that is electromagnetically connected to the ground layer and the power supply layer, The communication device includes a dielectric layer and a signal layer stacked between power supply layers, and the communication element provides a communication device connected to the signal layer via a capacitor. The communication element preferably emits a signal by generating an electric or electromagnetic field in the dielectric layer. It is preferable that the communication device further includes a drive circuit that connects the ground layer or the power supply layer to the signal layer, and the capacitor has a capacitance set so as to reduce a reactance component of an output impedance of the drive circuit. The capacitance of the capacitor may be set so that the output impedance of the drive circuit is a resistance component.
[0007]
In another aspect of the invention, a plurality of communication elements are distributed and arranged, each communication element being electromagnetically connected to a first signal layer, a dielectric layer, and a second signal layer, wherein the dielectric layer is connected to the first signal layer. Each communication element is disposed between the second signal layers, and each communication element is connected to the first signal layer via a capacitor, and emits a signal by flowing a current between the first signal layer and the second signal layer. A communication device characterized by the following.
[0008]
According to still another aspect of the present invention, a plurality of signal layers for transmitting signals are formed, and a plurality of communication elements connected to two or more signal layers and transmitting and receiving signals between the two or more signal layers are provided. Provided communication device. The communication element may transmit and receive signals to and from a communication element provided in a signal layer to which the communication element is connected. Further, the communication element receives a signal from a communication element provided in a signal layer to which the communication element is connected, and transmits a signal to a communication element provided in another signal layer to which the communication element is connected, thereby forming a signal. The signal may be sequentially transmitted to the signal layer of the second period. Each signal layer has an identification number, signal transmission may be realized using the identification number of the signal layer, and each communication element has a local layer in the signal layer for each signal layer to which it is connected. The transmission of the signal in the signal layer may be realized using a local identification number.
[0009]
In the communication device according to this aspect, it is preferable that an identification number serving as a reference is set in at least one signal layer, and identification numbers of other signal layers are sequentially set based on the reference identification number. At this time, when the communication element receives a signal including the identification number of the signal layer to which the communication element itself is connected, the communication element sets and holds the identification number of the signal layer to which the communication element is transmitted, and subsequently, sets the other signal layer to which the communication element itself is connected. May be set, and a signal including the set identification number may be transmitted to the other signal layer. The identification number may be expressed as coordinates indicating a two-dimensional or three-dimensional position of the signal layer with respect to the signal layer for which the reference identification number is set. Further, when the communication element receives the data signal, it is preferable that the communication element can specify the communication element to which the signal is to be transferred, and transmit the data signal to the communication element to be the transfer destination while receiving the data signal.
[0010]
It should be noted that the expression of the present invention converted between an apparatus, a method, a system, or a program is also effective as an aspect of the present invention.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
<First embodiment>
FIG. 1 is a diagram for explaining a communication technique according to the first embodiment of the present invention. FIG. 1 shows a state where a plurality of communication elements indicated by small circles are dispersedly arranged in a space. Each communication element has a local communication function of transmitting a signal to another communication element arranged around the communication element. By this local communication, a signal is successively relayed between adjacent communication elements in a sequential manner, and the signal is transmitted to the communication element which is the final destination. This communication method is called a chain transfer communication method.
[0012]
When the source of the signal is the communication element 200a and the final destination is the communication element 200b, the signal is transmitted from the communication element 200a to the communication element 200b via the communication elements 200c and 200d according to the chain communication method. You. As a signal transmission method, for example, the communication element 200a transmits a signal to all peripheral communication elements in a range where the signal reaches, and all the communication elements that have received this signal further transmit the signal to peripheral communication elements. By doing so, the signal may be concentrically transmitted to the final destination. As a more preferable method, a path between the communication elements 200a and 200b may be set in advance or in real time, and a signal may be transmitted only through a specific communication element through this path. In particular, when the latter method is adopted, only the communication elements necessary for signal transmission transmit, so that power consumption can be reduced and interference with communication of other communication elements can be reduced. . An example of a signal transmission method in the chain transmission type communication method will be described later.
[0013]
In the communication device according to the present invention, it is preferable that a plurality of communication elements are arranged in a space, and no individual wiring for physically connecting the communication elements is formed in the space. For example, these communication elements may be connected to a flat conductive layer or a conductive substrate, an electromagnetic transmission layer capable of transmitting an AC signal, or the like. The conductive layer and the electromagnetic transmission layer may be formed on a silicon wafer. Transmission of the signal may be realized by discharge of electric charge in the conductive layer. Here, the communication element is not limited to an element configured as a chip, but is a concept including an element having a communication function described in the embodiment of the present invention, and its form and shape are not limited.
[0014]
It is preferable that each communication element has a relatively short signal transmission distance (hereinafter also referred to as “effective communication distance”) set relatively short. Increasing the communication distance of a signal may increase power consumption and adversely affect other communication elements that do not contribute to communication. According to the chain communication type communication method, it is sufficient if a signal can be transmitted to a communication element existing in the vicinity of itself, and therefore, the effective communication distance is preferably set according to the average distance to the surrounding communication elements.
[0015]
The communication technology of the present invention can be applied to various uses. For example, by providing an electronic component (circuit element) such as an LSI or a memory with the communication function of the present invention, it is possible to provide a technique of mounting a plurality of electronic components on a board without individually wiring each electronic component. It is. In recent years, robots with skin sensations have been actively researched, but a technology has been provided to provide the robot's tactile sensor with the communication function of the present invention and transmit detection information from the tactile sensor to the robot's brain computer. It is also possible. Further, by scattering the sensor having the communication function of the present invention on the floor of a building, it is possible to monitor the behavior of an elderly person living alone and to use it for crime prevention during absence. In addition, by providing the light emitting element with the communication function of the present invention, a cloth display device or the like can be manufactured. In addition, by providing the tag with the communication function of the present invention, it is possible to manufacture a tag that can read information at low cost and with high accuracy. Further, the communication function of the present invention is provided to the wireless communication element, for example, the computer is equipped with the communication function, and the wireless communication element of the other computer is disposed near the wireless communication element, thereby facilitating the transmission and reception of information between the computers. It is also possible. In addition, a communication device having the communication function of the present invention is embedded in a conductive inner wall of an automobile, so that a communication device that does not require cumbersome individual wiring can be realized.
[0016]
In this communication technique, a signal is transmitted between communication elements arranged at a relatively short distance, so that signal attenuation and deterioration due to the distance are small, and high-speed transmission can be performed at a high throughput regardless of the number of nodes. Also, by dispersing and arranging many communication elements in the space, a wide range of signal transmission area is realized as an information exchange medium with a chip having a predetermined function such as a sensor. Further, since the communication element can be arranged at a relatively free position, it is possible to generate an artificial skin, a display device, or the like having a desired function by a simple design. Further, it is not necessary to design a substrate circuit such as wiring, and it is also possible to manufacture a substrate circuit with a small number of processes. When the communication element is sandwiched between conductive layers, electromagnetic noise emission is eliminated, and therefore, its usefulness is high particularly in public places such as hospitals. Further, even when a failure occurs in the conductive layer or the like, a self-healing function that a path between chips can be reset and a new communication path can be established is also provided.
[0017]
FIG. 2 shows an example of an external configuration of the communication device 100 according to the first embodiment of the present invention. In this communication device 100, a plurality of communication elements 200 are sandwiched between two conductive layers 16 and 18. Each communication element 200 is electromagnetically connected to the two conductive layers 16 and 18. The conductive layers 16 and 18 may have a single-layer structure or a multi-layer structure. In this example, the conductive layers 16 and 18 have a two-dimensionally spread structure. FIG. 2 shows a state in which the conductive layers 16 and 18 are open to explain that the communication element 200 is sandwiched.
[0018]
For example, when the communication device 100 according to the present invention is applied as an artificial skin covering the surface of a robot, the conductive layers 16 and 18 are formed of a conductive rubber material. By forming the artificial skin with a flexible rubber material, the artificial skin can freely expand and contract in accordance with the operation of the robot. In addition, since there is no individual wiring and a signal is transmitted through the conductive layers 16 and 18 having elasticity, the possibility of a failure in the communication function due to disconnection or the like is reduced, and stable communication capability can be provided. When the communication device 100 according to the present invention is applied as a circuit board, a flexible circuit board can be realized by forming the conductive layers 16 and 18 from a conductive rubber material.
[0019]
Each communication element 200 may have another function in addition to the communication function. When the communication device 100 is applied as an artificial skin of a robot, some of the communication elements 200 also have a function as a tactile sensor, and after detecting an externally applied stimulus, detect in cooperation with other communication elements. The transmitted signal is transmitted to a target communication element. When the communication device 100 is applied as a mounting technology of a substrate, the communication element 200 may have a function as a circuit element such as an LSI or a memory. As described above, the term “communication device” is used in the present specification to mean a device having at least a communication function, and has other functions added thereto, such as a sensor function as an artificial skin and an arithmetic function as an electronic circuit. It may be understood by those skilled in the art that this may be done.
[0020]
FIG. 3 is a functional block diagram of the communication element 200. The communication element 200 includes a communication unit 50, a processing unit 60, and a memory 70. The communication unit 50 may transmit and receive signals to and from other communication elements via the conductive layers 16 and 18 (see FIG. 2). Although not shown in FIG. 2, the communication device 100 includes a dielectric layer disposed around the communication element 200 and sandwiched between the conductive layers 16 and 18, and the communication unit 50 is generated in the dielectric layer. Signals may be transmitted to and received from another communication element 200 by an electric or electromagnetic field. The processing unit 60 controls the communication function of the communication element 200. Specifically, the processing unit 60 performs processing related to signal transmission with other communication elements 200, such as monitoring surrounding signals, analyzing received signals, controlling transmission signals, and controlling transmission timing. Further, the processing unit 60 may realize functions other than the communication function such as the sensor function and the calculation function. The memory 70 records information necessary for realizing the communication function and other functions in advance, and records the information as needed.
[0021]
FIG. 4A is a diagram illustrating a cross-section of the communication apparatus 100 and illustrating an example of a structure of a communication device 300 that realizes local communication. In this specification, a “communication device” is used to mean a structure that realizes a local communication function.
[0022]
In this example, the communication device 300 includes a first signal layer 20 and a second signal layer 30, a communication element 200 electromagnetically connected to the first signal layer 20 and the second signal layer 30, and a first signal layer 20 and a second signal layer. And a dielectric layer 22 disposed between the two signal layers 30. As illustrated, the first signal layer 20 and the second signal layer 30 sandwich the dielectric layer 22 and the plurality of communication elements 200. The communication element 200 and the dielectric layer 22 are electromagnetically connected. The second signal layer 30 may be a grounded ground layer.
[0023]
The communication device 300 generates an alternating current I by repeatedly sucking and discharging charges from the surfaces of the first signal layer 20 and the second signal layer 30 on the communication element 200 side to transmit a signal. By appropriately setting conditions such as the layer thickness, an electric field or an electromagnetic field generated by the alternating current I can be confined in the dielectric layer 22, and electromagnetic waves can be transmitted in the dielectric layer 22 in a two-dimensional radial manner. The current flowing in the first signal layer 20 and the second signal layer 30 flows only near the surface on the dielectric layer 22 side, and the transmission distance of the electromagnetic wave depends on the electrical conductivity of the first signal layer 20 and the second signal layer 30. I'm sorry. The higher the electrical conductivity, the smaller the attenuation and the longer the transmission distance, ie, the effective communication distance.
[0024]
The first signal layer 20 and the second signal layer 30 may be made of a conductor such as a metal or a conductive rubber material, but may be made of a dielectric. When the first signal layer 20 and the second signal layer 30 are made of a dielectric, the first signal layer 20 and the second signal layer 30 are made of a material having a dielectric constant smaller than that of the dielectric layer 22. You. This makes it possible to confine an electric or electromagnetic field in the dielectric layer 22. Note that the first signal layer 20 and the second signal layer 30 may have a configuration such as air or vacuum.
[0025]
The alternating current I for generating an electric field or an electromagnetic field may be a uniform current or a displacement current. In order to generate an electromagnetic field, it is also possible to use an electromagnetic wave such as light from a laser or an LED.
[0026]
FIG. 4B is a diagram for explaining another example of the structure of the communication device 300 that realizes local communication. In this example, the communication device 300 includes a first signal layer 20 and a second signal layer 30, a communication element 200 electromagnetically connected to the first signal layer 20 and the second signal layer 30, It has dielectric layers 22a and 22b disposed between the second signal layers 30, and a conductive layer 24 disposed between the dielectric layers 22a and 22b. Even when the communication device 300 has such a structure, the communication using the electric field or the electromagnetic field can be performed by generating the alternating current in the communication element 200.
[0027]
FIG. 5A is a diagram illustrating a basic principle of transmitting a signal by communication device 300 according to the embodiment. The communication device 300 alternately switches the switches 26 to suck and discharge electric charges between the first signal layer 20 and the second signal layer 30 to generate an alternating current, thereby generating an electromagnetic field. This electromagnetic field propagates through the dielectric layer 22 sandwiched between the first signal layer 20 and the second signal layer 30, and is transmitted to a communication device 300 located nearby.
[0028]
FIG. 5B is a diagram for explaining another example of the principle in which the communication device 300 transmits a signal. The communication device 300 generates an alternating current between the first signal layer 20 and the second signal layer 30 by simultaneously and alternately switching the pair of switches 26a and 26b to generate an electromagnetic field.
[0029]
FIG. 6 shows a specific implementation example of the communication device 300 including the communication element 200. The communication device 300 includes a second signal layer 30 and a power supply layer 44 which are ground layers, a communication element 200 electromagnetically connected to the second signal layer 30 and the power supply layer 44, and a second signal layer 30 and a power supply layer 44. A dielectric layer 22, a first signal layer 20, and a dielectric layer 43 laminated therebetween. As shown, the second signal layer 30, the dielectric layer 22, the first signal layer 20, the dielectric layer 43, and the power supply layer 44 are stacked in this order. The communication element 200 transmits a signal by generating an electric or electromagnetic field in the dielectric layer 22 and the dielectric layer 43. The communication element 200 is sandwiched between the second signal layer 30 and the power supply layer 44, and is surrounded by the dielectric layer 22, the first signal layer 20, and the dielectric layer 43. The dielectric layer 22, the first signal layer 20, and the dielectric layer 43 are electromagnetically connected to the communication element 200. With this structure, the communication element 200 detects an electric field or an electromagnetic field in the dielectric layer 22 and the dielectric layer 43, respectively, and detects a signal with high accuracy by detecting a difference between the electric field or the electromagnetic field in the dielectric layer 22 and the dielectric layer 43. It is possible to do. By taking the difference, the influence of noise mixed in from the outside can be minimized, and the SN ratio can be increased. By providing a switch 26 as shown in FIG. 5A between the first signal layer 20, the power supply layer 44 and the second signal layer 30, the first signal layer 20, the power supply layer 44, and the first signal layer 20 are provided. And the second signal layer 30 can be short-circuited, and the potential of the first signal layer 20 can be easily turned on. This is an advantage that the communication element 200 is connected to the power supply layer 44 and the second signal layer 30 which is a ground layer.
[0030]
FIG. 7A shows an outline of a circuit operation for realizing the communication device 300. Communication device 300 may be formed on silicon using semiconductor manufacturing techniques. The communication device 300 has a switch 26 such as a MOS switch in which a pMOS and an nMOS are connected in parallel. The switch 26 is an electromagnetic connection between the communication element 200 and the second signal layer 30 and the power supply layer 44 which are ground layers. Alternately. Specifically, the switch 26 switches between the connection between the first signal layer 20 and the second signal layer 30 and the connection between the first signal layer 20 and the power supply layer 44 according to the logical value of the signal to be transmitted, Transmits signals as electromagnetic waves. As described above, the dielectric layer 22 is provided between the first signal layer 20 and the second signal layer 30. Similarly, another dielectric layer is provided between the first signal layer 20 and the power supply layer 44. Is provided. A voltage corresponding to a logical value of a signal to be transmitted is applied to the input unit 52, and the switch 26 performs a switching operation. The processing unit 60 (see FIG. 3) in the communication element 200 supplies an input signal to the input unit 52.
[0031]
As a result of the switching operation by the switch 26, a current is generated from the first signal layer 20 to the second signal layer 30 and a current is generated from the power supply layer 44 to the first signal layer 20, and a current is generated between the first signal layer 20 and the second signal layer 30. , And an electric field or an electromagnetic field that spreads in a two-dimensional radial manner is generated in the dielectric layer 22 existing between the power supply layer 44 and the first signal layer 20. This electric or electromagnetic field is propagated to the adjacent communication element 200.
[0032]
The adjacent communication element 200 observes a change in an electric or electromagnetic field and detects a signal. The adjacent communication element 200 may detect a signal from an electric or electromagnetic field generated in the dielectric layer 22, or may detect a signal from an electric or electromagnetic field generated in the dielectric layer 43. Note that, as described above, the communication element 200 may detect a signal from an electric or electromagnetic field generated in both the dielectric layer 22 and the dielectric layer 43. By detecting the electric field or the electromagnetic field in the dielectric layer 22 and the dielectric layer 43, respectively, and detecting the difference between the electric field or the electromagnetic field in the dielectric layer 22 and the dielectric layer 43, it is possible to minimize the influence of noise mixed in from the outside, The S / N ratio can be increased.
[0033]
FIG. 7B illustrates an example of a circuit that limits the amplitude of the AC voltage applied to the first signal layer 20. In each of the power paths for applying a voltage from the power supply layer 44 and the second signal layer 30 to the first signal layer 20, a voltage limiting element 54 for limiting the voltage, in this example, a diode row is arranged. The voltage applied to the first signal layer 20 can be limited by inserting one or a plurality of diodes as the voltage limiting element 54 in each power path in the forward direction. When the voltage limiting element 54 is not provided, the ground voltage (0 [V]) from the second signal layer 30 and the power supply voltage (E [V]) from the power supply layer 44 are alternately applied to the first signal layer 20. However, when n diode rows are inserted in the power path from the second signal layer 30 and the power path from the power supply layer 44 in the forward direction, the first signal layer 20 has ne [V] And (E-ne) [V] are alternately applied. Here, e [V] indicates a forward voltage of the diode.
[0034]
By providing the voltage limiting element 54, even when the power supply voltage is sufficiently higher than the voltage required for signal transmission, the applied voltage can be reduced to a required level. In addition, by inserting the voltage limiting element 54 into the power path, the amount of current is reduced, so that power consumption can be reduced, which contributes to power saving of the communication device 300. The resistance of the voltage limiting element 54a provided between the second signal layer 30 and the first signal layer 20 and the resistance of the voltage limiting element 54b provided between the power supply layer 44 and the first signal layer 20 may be different. .
[0035]
FIG. 8A shows a specific configuration example of the communication element 200. The communication element 200 is configured as an LSI having the above-described communication function, and FIG. 8A illustrates an upper surface of the LSI that contacts the first signal layer 20. The communication element 200 has a digital circuit 202 having the functions of the processing unit 60 and the memory 70 shown in FIG. The circular electrode 204 functions as the communication unit 50. When mounting the communication element 200, the electrode 204 is preferably formed small. The electrode on the back surface of the LSI (not shown) is electromagnetically connected to the second signal layer 30. The power supply voltage is applied to the electrode 204 from the power supply layer 44 via the first signal layer 20 by the switching operation of the switch 26 (see FIG. 5 or FIG. 7), and the ground voltage is applied from the second signal layer 30 on the back surface. Is done. As described above, the communication element 200 alternately switches the switches 26 to generate an alternating current, thereby changing an electric or electromagnetic field and transmitting a signal.
[0036]
FIGS. 8B and 8C are views for explaining the principle of signal transmission by the communication element 200. FIG. In the figure, the region indicated by S indicates the electrode 204 of the communication element 200. Let σ be the conductivity of the first signal layer 20 and the second signal layer 30 and ε be the dielectric constant of the dielectric layer 22.₀And As described above, a structure in which the dielectric layer 22 is sandwiched between the first signal layer 20 and the second signal layer 30 will be considered. 8 (b) and 8 (c), the illustration of the dielectric layer 22 is omitted. In this structure, an electromagnetic wave is generated, and the generated electromagnetic wave is transmitted into the dielectric layer 22.
[0037]
As shown in the drawing, cylindrical coordinates are taken, and a solution around the z-axis in a direction perpendicular to each layer is obtained. The origin of the cylindrical coordinates is set at a midpoint between the lower surface of the first signal layer 20 and the upper surface of the second signal layer 30 which is vertically downward from the center point of the circular electrode 204. The distance between the first signal layer 20 and the second signal layer 30, that is, the thickness of the dielectric layer 22 is 2d, and the radius of the electrode 204 is r.₀And In a solution symmetric with respect to the z-axis, the magnetic field vector B has only a θ component, which is expressed as B (r, z). In such a structure, the radius r from the first signal layer 20 to the second signal layer 30 in the communication element 200 is₀It is assumed that a current flows along the surface of the column. The current path does not need to have a strictly cylindrical shape, and does not need to have a strictly uniform current. The sum of the skin currents that traverse outwardly through a cylindrical surface having a radius r with the z-axis as the axis of symmetry is expressed as I (r). Assuming that the frequency of the electromagnetic wave is ω, the general solution is expressed as follows. Note that the first signal layer 20 and the second signal layer 30 are both conductors, and in the following description of the transmission principle, the respective layers are referred to as conductor layers without distinction.
(Equation 1)

B₀Is a constant representing the strength of the magnetic field. Here, the values of the parameters in the general solution are set as follows.
(Equation 2)

Re [k] is the wave number of the electromagnetic wave in the dielectric layer 22, and c is the speed of light in the dielectric layer 22. Im [k] is a parameter that gives attenuation of the propagating electromagnetic wave. Re [p] is a parameter that gives the skin depth.
[0038]
Also,
H₁ ⁽²⁾(Z) @J₁(Z) -jN₁(Z)
(Hankel function).
Note that the following conditions must be satisfied for transmitting the microwave and establishing the above solution.
1) | σ / ω | >> ε₀(Σ is the conductivity of the conductor layer).
2) The skin depth is smaller than the thickness of the conductive layer.
3) The attenuation distance is larger than the electromagnetic wavelength in vacuum corresponding to the frequency. That is, -Im [k] is equal to or smaller than Re [k].
4) The distance between the conductive layers is
(Equation 3)

To meet.
The magnetic permeability was assumed to be μ for both the dielectric layer 22 and the conductor layer.
[0039]
By satisfying the above transmission conditions, the microwave can be transmitted in the dielectric layer 22 in a two-dimensional radial manner. For example, by setting the frequency to about 10 to 100 GHz, the transmission distance to about 10 cm, and d = 1 to 0.1 mm, it is possible to easily find a material having conductivity satisfying the above microwave transmission conditions. . Although the electromagnetic action is transmitted even when the skin depth is larger than the thickness of the conductive layer, in that case, the electromagnetic wave leaks out of the conductive layer.
[0040]
By transmitting electromagnetic waves as microwaves, the signal transmission speed becomes equal to the speed of light. As described above, the communication device 100 according to the present embodiment generates a ring-shaped electromagnetic field having a width of about one wavelength to transmit 1-bit information, and performs communication using this electromagnetic field. Signal transmission over 1 GHz can be performed with low power consumption. Thus, the communication device 100 can transmit a high-frequency logic signal in synchronization with a clock of a computer or the like.
[0041]
Assuming that the potential difference between the surface of the upper conductor layer at a point r from the center, ie, the surface of the first signal layer 20, and the surface of the lower conductor layer, ie, the surface of the second signal layer 30, is V (r), a cylindrical surface having a radius r I (r) and V (r) flowing across the electrode (potential difference 2dE_z) Ratio is
(Equation 4)

Given by This value corresponds to the output impedance seen from the communication element 200. Here, the function P (x) is
(Equation 5)

And set.
[0042]
FIG. 9 shows a plot of P (x) against real number x. The imaginary part of P (x) (Im [P (x)]) means a reactance component, and diverges logarithmically near the origin. This means that the radius r of the cylinder serving as the current path is₀Decreases, the reactance component increases, which means that even if a voltage is applied, it is not effectively converted into electromagnetic wave energy. Therefore, when this structure is adopted, the radius r₀That is, it is difficult to reduce the radius of the circular electrode 204.
[0043]
FIG. 10 shows a configuration example of a communication device 300 in which the radius of the electrode 204 is reduced. The communication device 300 includes a driving circuit 82 for driving the communication element 200, and a capacitor 80 connecting the communication element 200 and the first signal layer 20. The drive circuit 82 may be present in the communication element 200. As described above, the drive circuit 82 has the switch 26. Radius r of electrode 204₀Is small, the reactance component (Im shown in FIG. 9) is inductive. Radius r₀When the electromagnetic wave is emitted by the switching of the circular electrode 204, the impedance of the first signal layer 20 is equivalent to that of a circuit in which a resistor and an inductance are connected in series. By connecting to the layer 20, the reactance component can be reduced. The capacitor 80 can be configured inside the communication element 200. The capacity C is
(Equation 6)

You can choose to be. Thereby, a series resonance state of the circuit can be created, and the impedance can be set to a minimum.
[0044]
For example, if the frequency is 10 GHz, 2d = 1 mm, r₀= 0.1 mm, kr₀= 0.02, Im [P (x)] = 4.0, and the reactance component is nearly three times larger than the resistance component. Since the reactance at this time is 50Ω, the impedance seen from the drive circuit 82 becomes a real number, that is, a resistance by driving by adding a capacitor 80 having a capacitance of C = 0.3 pF. It will be efficiently converted to the energy of a dimensionally radiated electric or electromagnetic field.
[0045]
FIG. 11 shows a modification of the configuration of the communication device 300 in which the radius of the electrode 204 is reduced. In this modification, the electrode 204 of the communication element 200 is connected to the first signal layer 20 via the insulating layer 210. As described with reference to FIG. 10, the capacitor 80 may be configured inside the communication element 200, but may be provided outside the communication element 200 as the insulating layer 210 as shown in FIG. In this case, a non-conductive adhesive can be used for connection between the communication element 200 and the first signal layer 20, and the manufacturing process can be simplified. In any case, by coupling the electrode 204 and the first signal layer 20 via a capacitor, the reactance component can be reduced when the column radius of the current path is reduced. Therefore, the size of the electrode 204 can be reduced, and the communication device 200 can be easily mounted and the communication device 100 can be manufactured.
[0046]
FIG. 12 is an explanatory diagram of a signal transmission method in the communication device 100 according to the embodiment. In the embodiment, each communication element 200 holds the coordinates indicating its own position in the space as an address in the memory. The coordinates may be two-dimensional coordinates or three-dimensional coordinates. The coordinates of the communication element 200 may be set by an external computer or the like, or may be set autonomously by each. In this example, an object is to transmit a signal from a communication element located at coordinates (1, 1) to a communication element located at coordinates (7, 7). Hereinafter, the communication element located at the coordinates (M, N) is referred to as “communication element (M, N)”. In the illustrated example, the communication elements are regularly arranged for convenience of explanation, but this arrangement may be random.
[0047]
FIG. 13 shows a packet of a signal generated by the communication element of the transmission source. This packet is provided with items of a command, a source address, a destination address, and transmission data. This signal is for transferring data to the communication element (7, 7), and a code describing a transfer packet is described in the command. The source address describes (1, 1) which is the coordinates of the source communication element, and the destination address describes (7, 7) which is the coordinates of the destination communication element. The transmission data is data to be transmitted. Thus, the communication element (1, 1) generates a packet of a signal including the source coordinates and the destination coordinates. The generation of the packet is performed by the processing unit 60 (see FIG. 3).
[0048]
Returning to FIG. 12, when the communication element (1, 1) of the transmission source transmits a signal, the signal is transmitted to neighboring communication elements, that is, coordinates (0, 0), (2, 0), (3, 1), It is transmitted to the communication element located at (2, 2), (0, 2), (-1, 1). Upon receiving the signal, these communication elements determine whether to relay the signal based on the coordinates where the communication element is located. This determination is made by determining whether or not the device itself is spatially located between the source coordinates (1, 1) and the destination coordinates (7, 7). This is performed by determining whether or not the communication device itself is located on a path connecting the original communication element (1, 1) and the destination communication element (7, 7).
[0049]
In this example, it is determined that the communication element (2, 2) is located on a path connecting the communication element (1, 1) and the communication element (7, 7), and it is determined that a signal is to be relayed. The communication element (2, 2) transmits the received signal, and the other communication elements do not respond. Thereafter, the signal is relayed by the communication elements (3, 3), (4, 4), (5, 5), and (6, 6) and transmitted to the communication elements (7, 7). You.
[0050]
In the present embodiment, each communication element determines whether or not to relay a signal based on the relationship between its own coordinates and the coordinates of the source and destination. It is not necessary to determine a communication path in advance, and a shortest path can be dynamically set by a simple algorithm and a signal can be transmitted.
[0051]
As described above, the communication device 100 can transmit a signal between the communication elements 200. Within the range of the effective communication distance of each communication element 200, a simple communication element that does not have the communication function required between the communication elements 200 as described above may be arranged. This simple communication element is under the control of the communication element 200. From this relationship, the communication element 200 is called a parent element, and the communication element under its management is called a child element. As described above, the communication element 200 serving as the parent element has its own ID such as two-dimensional coordinates.
[0052]
This parent-child relationship is formed dynamically by the parent element periodically issuing a response request and the child element responding to the request. Specifically, first, the parent element transmits a “response request command” in which its own ID is embedded in a packet. A child element whose parent element has already been determined will not respond to it, and a child element whose parent element has not been determined will indicate that it will become a child of its parent element after a random number waiting time Issue a packet to be sent. The parent element that has received this packet immediately sends an ID determination command, and assigns an ID within its own jurisdiction to the child element. In this way, any child element dynamically establishes a unique parent-child relationship with the neighboring primary element. The child element may be a built-in element or an information device connected to a signal layer via a connector.
[0053]
In the communication device 100, the child element enables communication only with the parent element. The communication element 200 as a parent element has a role of transmitting a signal transmitted from a child element to a peripheral communication element 200 and a role of transmitting a signal transmitted from another communication element 200 to the child element. . The parent element may manage a plurality of child elements, and specifies the child element under management by the assigned ID.
[0054]
<Second embodiment>
FIG. 14 shows a configuration of a communication device 400 according to the second embodiment of the present invention. The communication device 400 includes a plurality of signal layers 410a, 410b, 410c, 410d, 410e, 410f, 410g, 410h, and 410i (hereinafter, collectively referred to as a "signal layer 410") for transmitting signals. . The signal layer 410 is formed of a conductive material, and is insulated from neighboring signal layers 410. The high-resistance layer 420 may be provided between the adjacent signal layers 410, and the signal layers 410 may be provided on the high-resistance layer 420 so as to be separated from each other.
[0055]
The communication device 400 includes a total of twelve communication elements 500e, 500f, 500h, 500i, 500j, 500l, which are connected to two or more signal layers 410 and transmit and receive signals between the two or more signal layers 410. 500 m, 500 o, 500 p, 500 q, 500 s, and 500 t are provided. In the example of FIG. 14, 3 × 3 signal layers 410 are formed in the vertical and horizontal directions. However, in the surrounding signal layers 410 excluding the central signal layer 410 e, a total of 12 communication layers connected to only one signal layer 410 are provided. Elements 500a, 500b, 500c, 500d, 500g, 500k, 500n, 500r, 500u, 500v, 500w, and 500x are provided. Hereinafter, the communication elements are collectively referred to as “communication elements 500”. Communication element 500 may have the same function as communication element 200 described in the first embodiment, or may have the same configuration. As described above, in the communication device 400, a total of 24 communication elements 500 are provided to perform transmission and reception of signals within the signal layer 410 or between the signal layers 410. In FIG. 14, a total of 12 communication elements 500 are provided to connect two adjacent signal layers 410, but in another example, some of the communication elements 500 may be omitted. . In the illustrated example, the number of the signal layers 410 is small, so that the ratio of the number of communication elements 500 (total 12) over the plurality of signal layers 410 to the total number of communication elements 500 (total 24). Although this is only 50%, the ratio increases as the number of signal layers 410 increases. For convenience of description, the communication device 400 according to the second embodiment will be described below on the assumption that the communication element 500 connects to a plurality of signal layers 410 unless otherwise specified.
[0056]
In the second embodiment, the communication element 500 has a function of electrically connecting to two adjacent signal layers 410 and transmitting / receiving a signal to / from another communication element 500 provided in the connected signal layer 410. And also has a function of transmitting and receiving signals between the two signal layers 410 to be connected. As a communication function in the signal layer 410, for example, the communication element 500e is connected to the signal layer 410a and the signal layer 410b, but a signal is transmitted between the other communication elements 500a, 500d, and 500h provided in the signal layer 410a. It can transmit and receive signals, and can also transmit and receive signals to and from the other communication elements 500b, 500f, and 500i provided in the signal layer 410b. The communication in the signal layer 410 is called inward communication. As a communication function between the signal layers 410, the communication element 500e can transmit a signal transmitted through the signal layer 410a to the signal layer 410b, and transmits a signal transmitted through the signal layer 410b to the signal layer 410a. You can also. The communication between the signal layers 410 is called outward communication. For example, communication element 500e can receive a signal from communication element 500a in signal layer 410a and transmit it to communication element 500f in signal layer 410b, and vice versa. Since each communication element 500 has the above-described function, the communication device 400 according to the second embodiment can realize communication between arbitrary communication elements 500 without forming a wiring.
[0057]
A signal transmission method in the communication device 400 will be described with an example in which a signal is transmitted from the communication element 500d to the communication element 500f. Here, it is assumed that communication element 500d is the source of the signal and communication element 500f is the final destination of the signal. In this case, first, the communication element 500d transmits a signal to the communication element 500e via the signal layer 410a, and the communication element 500e transfers the signal to the communication element 500f via the signal layer 410b. Focusing on the communication element 500e, the communication element 500e performs communication in the signal layer 410a with the communication element 500d, and performs communication in the signal layer 410b with the communication element 500f. And the signal layer 410c. As described above, each communication element 500 is connected to the plurality of signal layers 410 that are insulated from each other, and performs communication between the signal layers 410, so that a signal becomes a desired destination from the signal layer 410 of the transmission source. The signal can be sequentially transmitted to the signal layer 410, and signal transmission between the transmission source and the final destination can be realized.
[0058]
Each signal layer 410 may be provided with a configuration for realizing various functions, such as a sensing unit, a power unit, and a display unit. In particular, by making these units easily replaceable, a highly applicable communication device 400 can be realized. In addition, each communication element 500 may have a function such as a connector, and may be connected to an external device. When the communication element 500 has an interface function with an external device, the communication device 400 can be used in various environments.
[0059]
FIG. 15A shows an example of a cross section of the communication device 400. In this example, adjacent signal layers 410 are insulated by a high-resistance layer 420. The adjacent signal layers 410 are connected by the communication element 500, and communication between the signal layers 410 is realized.
[0060]
FIG. 15B shows another example of the cross section of the communication device 400. In this example, adjacent signal layers 410 are provided on the high-resistance layer 420 while being separated from each other. The adjacent signal layers 410 are connected by the communication element 500, and communication between the signal layers 410 is realized.
[0061]
FIG. 16A shows a modification of the configuration of the communication device 400. The communication device 400 has a plurality of hexagonal signal layers 410 and a plurality of communication elements 500 for transmitting and receiving signals between the signal layers 410. As in the communication device 400 shown in FIG. 15, each signal layer 410 is insulated by the high-resistance layer 420.
[0062]
FIG. 16B shows a modification of the configuration of the communication device 400. In the communication device 400, the high resistance region 430 is formed in the signal layer 410, and the conductive region in the signal layer 410 is partially formed. Note that each signal layer 410 is insulated by the high-resistance layer 420 as in the communication device 400 shown in FIG.
[0063]
FIG. 16C shows a modification of the configuration of the communication device 400. The communication device 400 includes a plurality of quadrangular signal layers 410 and a plurality of communication elements 500 connected to the four signal layers 410. The shape of the signal layer 410 is the same as the shape of the signal layer 410 in the communication device 400 shown in FIG. 15, but the arrangement position of the communication element 500 is different. Note that each signal layer 410 is insulated by the high resistance layer 420.
[0064]
As described above, the communication device 400 can include the signal layers 410 having various shapes and structures, and the number of the signal layers 410 connected to the communication element 500 may be arbitrary. In the above-described example, the shape of the signal layer 410 is a regular polygon, but is not limited thereto. In the communication device 400, each communication element 500 transmits the packet to the final destination by including the identification number of the signal layer 410 that is the final destination in the packet to be transmitted. In the second embodiment, since the signal layer 410 is formed on a plane, the two-dimensional coordinates of each signal layer 410 are used as the identification number of each signal layer 410. In another example, a unique serial number can be assigned to the signal layer 410 as the identification number. When the signal layer 410 is formed three-dimensionally, the identification number of the signal layer 410 can be used. Can be represented by three-dimensional coordinates.
[0065]
FIG. 17 shows a schematic diagram of the communication device 400 shown in FIG. In FIG. 17, a solid line drawn to connect each communication element 500 means a state where adjacent signal layers 410 are insulated. By setting the XY axes with the signal layer 410a as the origin, the coordinates of the signal layer 410a, that is, the identification number is (0, 0), the identification number of the signal layer 410b is (1, 0), and the identification number of the signal layer 410c is (2,0), identification number of signal layer 410d is (0,1), identification number of signal layer 410e is (1,1), identification number of signal layer 410f is (2,1), identification of signal layer 410g The number can be defined as (0,2), the identification number of the signal layer 410h as (1,2), and the identification number of the signal layer 410i as (2,2). The identification number of the signal layer 410 may be set in advance when the communication device 400 is manufactured, or may be set autonomously by an algorithm described later. Signal transmission between the signal layers 410 is realized using the identification numbers of the signal layers 410. Hereinafter, the identification number of the signal layer 410 is referred to as “signal layer ID”. Each communication element 500 stores the signal layer ID of the signal layer 410 to which the communication element 500 is connected. Therefore, when connecting to a plurality of signal layers 410, each communication element 500 stores a plurality of signal layer IDs.
[0066]
Each communication element 500 is assigned a local identification number in the signal layer 410 for each signal layer 410 to which the communication element 500 is connected. In the illustrated example, the signal layer 410 is formed in a rectangular shape, and in the signal layer 410, the local identification number of the communication element 500 located on the right side is “1”, and the local identification number of the communication element 500 located on the upper side is “1”. 2 ", the local identification number of the lower communication element 500 is set to" 3 ", and the local identification number of the left communication element 500 is set to" 4 ". The transmission of the signal in the signal layer 410 is realized using this local identification number. For example, focusing on the communication element 500e, the signal layer 410a of the signal layer ID (0,0) has the local identification number “1” because it is located on the right side, while the signal layer ID (1,0) In the signal layer 410b of 0), the local identification number “4” is assigned because it is located on the left side. Hereinafter, the local identification number of the communication element 500 is referred to as “local ID”.
[0067]
As described above, each communication element 500 holds the signal layer ID of the signal layer 410 to which the communication element 500 is connected and the local ID of each signal layer 410. Based on this premise, a communication method according to the second embodiment will be described. In this communication method, three types of packets are used.
[0068]
(1) RTS (request to send-stream) packet
A packet requesting the communication element 500 in the signal layer 410 to establish a connection
(2) CTS (clear to send-stream) packet
A packet indicating permission to establish a connection to the RTS source
(3) DT (data transmission-stream) packet
Data transfer packets
[0069]
FIG. 18A shows the data format of the RTS packet. The RTS packet has three fields. The items of each field are shown below.
First field: Local ID of communication element 500 to be reacted
Second field: Command (RTS)
Third field: local ID of the communication element 500 of the transmission source of the RTS packet
[0070]
FIG. 18B shows the data format of the CTS packet. The CTS packet has two fields. The items of each field are shown below.
First field: Local ID of communication element 500 to be reacted
Second field: Command (CTS)
[0071]
FIG. 18C shows the data format of the DT packet. The items of each field are shown below.
First field: Local ID of communication element 500 to be reacted
Second field: command (DT)
Third field: hop limit, that is, the upper limit of the number of relays of the communication element 10
Fourth field: Data length
Fifth field: X coordinate of final destination
6th field: Y coordinate of final destination
7th field: X coordinate of transmission source
8th field: Y coordinate of transmission source
Ninth field: Application at destination
10th and subsequent fields: Data
In the examples of FIGS. 18A to 18C, each field is composed of 8 bits.
[0072]
FIG. 19 is a diagram illustrating a communication method in communication device 400. FIG. 19 shows an example in which a signal is transmitted from communication element 500d as a transmission source to communication element 500g as a final destination.
[0073]
(Step 1)
The communication element 500d calculates the direction of transmitting the DT packet from the positional relationship between its own signal layer ID (0, 0) and the signal layer ID (2, 0) of the communication element 500g, which is the final destination, and A communication element to transmit the DT packet is determined in the layer 410a. That is, the communication element 500d calculates the shortest path to the communication element 500g, and determines that the route for transmitting the DT packet to the signal layer 410c via the signal layers 410a and 410b is the shortest. Since the element existing on this path is the communication element 500e, the communication element 500d transmits an RTS packet to the communication element 500e to establish a connection with the communication element 500e. At this time, the first field of the RTS packet is set to “1”. The communication element 500d monitors whether or not another communication element is performing communication in the signal layer 410a in order to avoid collision of signals, and may transmit an RTS packet when communication is not performed. preferable.
[0074]
(Step 2)
The communication element 500e refers to the first field included in the RTS packet and determines that the RTS packet is addressed to itself, and transmits a CTS packet to the communication element 500d. At this time, the first field of the CTS packet is set to “4”.
[0075]
(Step 3)
When receiving the CTS packet addressed to itself within a certain time, the communication element 500d transmits a DT packet. The first field of the DT packet is set to “1”. The communication element 500e receives the DT packet. If the communication element 500d cannot receive the CTS packet within a predetermined time, the process returns to step 1 and transmits the RTS packet again. When there is no response from the communication element 500e a plurality of times, an RTS packet whose transmission destination is changed may be transmitted. This makes it possible to autonomously change the communication path. Referring back to FIG. 17, in this case, it is preferable to set the first field of the RTS packet to “2”.
[0076]
(Step 4)
Upon receiving the DT packet, the communication element 500e determines the direction in which the DT packet is to be transferred. In this case, since the communication element 500e receives the DT packet from the communication element 500d on the signal layer 410a side, the communication element 500e determines that the transfer direction is the signal layer 410b side, that is, the outward direction. Accordingly, it is determined that the transmission of the subsequent DT packet is performed in the signal layer 410b.
[0077]
The communication element 500e should transmit a DT packet in the signal layer 410b based on the positional relationship between its own signal layer ID (1, 0) and the signal layer ID (2, 0) of the communication element 500g that is the final destination. Determine the communication element. Since the element existing on the shortest path is the communication element 500f, the communication element 500e transmits an RTS packet to the communication element 500f to establish a connection with the communication element 500f. At this time, the first field of the RTS packet is set to “1”. The communication element 500e may monitor whether or not another communication element is performing communication in the signal layer 410b to avoid a signal collision, and may transmit an RTS packet when no communication is performed.
[0078]
(Step 5)
The communication element 500f refers to the first field included in the RTS packet and determines that the RTS packet is addressed to itself, and transmits a CTS packet to the communication element 500e. At this time, the first field of the CTS packet is set to “4”.
[0079]
(Step 6)
When receiving the CTS packet addressed to itself within a certain time, the communication element 500e transmits a DT packet. The first field of the DT packet is set to “1”. The communication element 500f receives the DT packet.
[0080]
(Step 7)
Upon receiving the DT packet, the communication element 500f determines the direction in which the DT packet is to be transferred. Since the communication element 500f receives the DT packet from the communication element 500e on the signal layer 410b side, the communication element 500f determines that the transfer direction is the signal layer 410c side, that is, the outward direction. This determines that the subsequent transmission of the DT packet is performed in the signal layer 410c.
[0081]
The communication element 500f recognizes from the destination coordinates in the fifth and sixth fields of the DT packet that the final destination is the communication element 500g in the signal layer 410c. Note that the destination coordinates of the fifth and sixth fields include coordinates specifying the signal layer 410c and a local ID specifying the communication element 500g. As a result, the communication element 500f transmits an RTS packet to the communication element 500g to establish a connection with the communication element 500g. At this time, the first field of the RTS packet is set to “1”.
[0082]
(Step 8)
The communication element 500g refers to the first field included in the RTS packet and determines that the RTS packet is addressed to itself, and transmits a CTS packet to the communication element 500f. At this time, the first field of the CTS packet is set to “4”.
[0083]
(Step 9)
When receiving the CTS packet addressed to itself within a certain period of time, the communication element 500f transmits a DT packet. The first field of the DT packet is set to “1”. Thus, the communication element 500g, which is the final destination, can receive the DT packet. For example, when an external device is connected to the communication element 500g, data included in the DT packet can be transmitted to the outside.
[0084]
According to the above communication method, each communication element 500 that relays a signal dynamically sets a route based on a signal layer ID without previously setting a route from a signal transmission source to a final destination. Becomes possible. Therefore, in the communication device 400, for example, even when some of the communication elements 500 fail, the DT packet can be transmitted to the final destination by avoiding the communication elements 500.
[0085]
Although the example of FIG. 19 shows a case where a signal is transmitted in one axis direction, that is, the X-axis direction, a signal can be transmitted naturally even in an oblique direction. For example, when transmitting a signal from the signal layer 410a of the signal layer ID (0,0) to the signal layer 410e of the signal layer ID (1,1), the signal layer of the signal layer ID (1,0) is set as an intermediate route. It is also possible to go through either the signal layer 410b or the signal layer 410d of the signal layer ID (0, 1). Which path is to be selected may be determined at random, or may be determined in accordance with a predetermined rule such as performing signal transmission in the X-axis direction prior to signal transmission in the Y-axis direction. May be.
[0086]
FIG. 20A shows a waveform format of a signal flowing through the signal layer 410. At the head of each packet, a start bit and data indicating the start of a field are added. For the start bit, the pattern of “01” is periodically repeated for a certain period of time, here, 30 times the operation clock period of the digital circuit. The sampling time is determined based on this periodic pattern. The communication data handles 10 bits as a unit, and this is called one frame.
[0087]
FIG. 20B shows the configuration of one frame. One frame is composed of 8-bit real data and 2-bit frame delimiters. For example, when outputting decimal data “10”, a frame is represented as 1000001010 by adding a frame delimiter “10” to the beginning. Also, a bit sequence 11111111 is inserted into the signal every 20 frames. At this time, no frame break is inserted. The field start instruction data is expressed as 1011111111 in which a bit string 11111111 is added to a field delimiter “10”. This data string is always inserted after the start bit, and the end of this data string is the head of each packet.
[0088]
FIG. 21 shows an implementation example of a digital circuit of the communication element 500. The port definitions in the digital circuit are as follows.
(Input port)
Ainp_a: Input signal (output from the constant observation type comparator)
Ainp_b: input signal (output from the constant observation type comparator)
Init_flg: Initialization flag
clk: Master clock
in: sampled signal
ms: Signal layer selection
selectID: 0: Local ID_a = 1 1: Local ID_a = 2
sleepmode: 0: No sleep mode
tSite_x: signal layer X coordinate
tSite_y: signal layer Y coordinate
[0089]
(Output port)
Inp_a: signal layer direction input determination flag 0: no input 1: input
Inp_b: Out-of-signal-layer direction input determination flag 0: No input 1: Input
OutBit_a: Data output in the signal layer direction
OutBit_b: Out-of-signal-layer output data
OutBit_na: Inversion of OutBit_a
OutBit_nb: Inversion of OutBit_b
ena_AppL: Application layer process enable
ena_dwnDatL: Data link layer process enable
ena_dwnNetL: Network layer process enable
ena_upDatL: Data link layer process enable
ena_upNetL: Network layer process enable
inmonitor: Physical layer process monitoring flag 1: Start bit detection
[0090]
FIG. 22 shows a state transition diagram of a process in the digital circuit of the communication element 500. The communication element 500 can take the following states.
(State 0) Start / initialization
After the process of each layer is initialized, the state transits to the state 1. At this time, the communication element 500 can accept an input from any direction.
[0091]
(State 1) RTS wait / accept
One of Inp_a and Inp_b is set to 1 so as to accept data in the direction that arrives earlier among the inward or outward communication of the signal layer 410. Thereafter, the data which has become 1 is sampled. Note that the communication in the inward direction of the signal layer 410 means the transmission and reception of data to and from the other communication elements 500 in the signal layer 410, and the outward communication of the signal layer 410 is a signal different from the signal layer 410. Means the transmission and reception of data to and from the communication elements in the layer.
[0092]
The determination according to the RTS format is performed in order from the first field of the input data to determine whether to establish a connection. If the RTS packet is correctly received, the state transits to state 2. When a process error is detected, the process returns to the state 0.
[0093]
(State 2) CTS output
Output the CTS packet. The output direction is the same as the direction in which the RTS packet was received. At this time, all signals from other directions are ignored. If an error occurs during output, the state transits to state 0. Upon completion of the output, the state transits to the state 3.
[0094]
(State 3) DT wait / accept
Accept the DT packet. The receiving direction is the same as the direction of the CTS packet output. If a DT packet does not arrive within a predetermined time (100T: T is a master clock cycle), an error occurs and the state transits to state 0. If an error occurs during the acquisition of the DT packet, the state transitions to state 4 if data of 10 bytes or more has already been acquired, and transitions to state 0 otherwise.
[0095]
(State 4) Routing
This is a network layer process that acquires the coordinates of the destination from the header of the DT packet. The acquired data is compared with its own coordinates, and if the destination matches the coordinates of its own signal layer 410, the process is passed to the application layer. If it is not the destination, the next connection destination (direction, local ID) is determined. At this time, the first field (local ID to be reacted) and the third field (hop limit) of the header part of the DT packet are rewritten, and the state transits to state 5. Rewriting of the hop limit is performed by decrementing the upper limit of the number of relays by one.
[0096]
(State 5) RTS output
An RTS packet is output to the next connection destination. At this time, the physical layer monitors the occupation status of the network in the output direction, and starts output if peripheral devices are not communicating during time 16T (2 bytes). When the output of the RTS packet is completed, the state transits to the state 6. If the peripheral elements are communicating and the output is not started within a certain time (100T), the state transits to the state 8.
[0097]
(State 6) CTS waiting / accepting
Waits for a CTS packet addressed to itself. When a CTS packet is received within a predetermined time (100T), the state transits to the state 7. If a CTS packet is not received within a predetermined time, the state transits to state 8.
[0098]
(State 7) DT output
Output a DT packet. The output direction is the same as the RTS output direction. When the data is correctly output, the state transits to state 9. If an error is detected on the way, the state transits to state 8.
[0099]
(State 8) Rerouting
If the connection cannot be established correctly, an attempt is made to establish a connection to the same communication element up to five times. If the connection is not established after five attempts, another route is calculated at the network layer. After recalculating the route, the state transits to state 5.
[0100]
(State 9) Termination / initialization
All flags are initialized and the state transits to state 0.
[0101]
As described above, in the second embodiment, it has been assumed that the signal layer ID is assigned to each signal layer 410 in advance. However, the communication element 500 included in each signal layer 410 is connected to its own signal layer. It is also possible to obtain the ID dynamically.
[0102]
An example using the “ID determination command” will be described below. In the ID determination command, coordinates (X, Y) of the signal layer 410 are described. The communication element 500 that has received the ID determination command recognizes that the coordinates of the signal layer 410 to which the communication element 500 belongs are (X, Y).
[0103]
Each communication element 500 transmits an ID determination command to communication elements 500 whose local IDs are “1” and “2” in the same signal layer 410. At this time, if the communication element 500 of the transmission destination is communicating, the transmission of the ID determination command is stopped. The communication element 500 that has received the ID determination command transmits the ID determination command to another signal layer 410 that exists in a direction different from the direction in which the command was received, that is, in an outward direction opposite to the inward direction. Specifically, the communication element 500 that has received the ID determination command with the local ID of “1” describes the coordinates (X + 1, Y) as the communication element 500 having the local ID of “4” in the adjacent signal layer 410. An ID determination command is transmitted. Also, the communication element 500 that has received the ID determination command with the local ID of “2”, in the adjacent signal layer 410, determines the coordinates (X, Y + 1) as the communication element 500 having the local ID of “3”. Send a command.
[0104]
By operating the communication element 500 as described above, after turning on the power to the communication apparatus 400, the coordinates of the signal layer 410a at the lower left corner are set to (0, 0), and the ID determination command is issued from the communication element 500 belonging to the signal layer 410a. , It is possible to dynamically allocate the signal layer ID to all the signal layers 410.
[0105]
As described above, the reference signal layer ID (0, 0) is preset in at least one signal layer 410, in this example, the signal layer 410a, and the other signal layers are determined based on the reference signal layer ID. By sequentially setting the identification numbers of 410, the signal layer ID of the signal layer 410 in the communication device 400 can be set. The reference signal layer ID is not limited to the signal layer 410a at the lower left corner of the communication device 400, and may be set to another signal layer 410. For example, in the communication device 400 of FIG. 17, when the central signal layer 410e is defined as a reference signal layer for determining a signal layer ID, the communication elements 500m, 500p, 500i, and 500l belonging to the signal layer 410e are: The ID determination command may be transmitted outward to sequentially set the signal layer IDs of the surrounding signal layers 410. In this algorithm, when receiving a signal (ID determination command) including the signal layer ID of the signal layer 410 to which the communication element 500 is connected, the communication element 500 holds the signal layer ID of the signal layer 410 that has transmitted the signal, Subsequently, a signal layer ID of another signal layer 410 to which it is connected is set, and an ID determination command including the set signal layer ID is transmitted to the other signal layer 410. According to the communication device 400 according to the second embodiment, the communication element 500 holds the local ID, grasps its own positional relationship in the signal layer 410, and autonomously converts the signal layer ID expressed by coordinates using a simple algorithm. It becomes possible to set it up.
[0106]
Further, in the second embodiment, the communication element 500 receives the signal once and then transfers the signal. However, the signal transfer may be started before the reception of the signal is completed. In the DT packet, since a header item such as a command or the coordinates of a destination is described at the beginning of the packet, the communication element 500 to which the signal is to be transferred is specified from the time when the header item is received, and the connection of the connection is specified. It is possible to sequentially transfer the DT packet to the transfer destination communication element 500 while establishing and receiving the DT packet. As a result, the delay time until the data reaches the final destination can be reduced, and the throughput can be improved.
[0107]
The present invention has been described based on some embodiments. These embodiments are exemplifications, and various modifications can be made to combinations of the embodiments, combinations of the respective components and respective processing processes, and such modifications are also within the scope of the present invention. Is understood by those skilled in the art.
[0108]
【The invention's effect】
According to the present invention, a novel communication device, a new communication device, and the like can be provided.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a method of a communication technique according to an embodiment.
FIG. 2 is a diagram illustrating an external configuration of the communication device according to the embodiment;
FIG. 3 is a functional block diagram of a communication element.
FIG. 4A is a cross-sectional view of a communication device, and FIG. 4B is a cross-sectional view illustrating another example of the communication device.
5A is a diagram for explaining a basic principle of a communication device transmitting a signal, and FIG. 5B is a diagram for explaining another example of a principle of a communication device transmitting a signal. .
FIG. 6 is a diagram illustrating a communication device including a communication element.
FIG. 7A is a diagram showing an outline of a circuit operation for realizing a communication device, and FIG. 7B is a diagram showing an example of a circuit for limiting the amplitude of an AC voltage applied to a first signal layer.
FIG. 8A is a diagram illustrating a specific configuration example of a communication element, and FIGS. 8B and 8C are diagrams for explaining the principle of signal transmission by the communication element.
FIG. 9 is a diagram showing a plot of P (x).
FIG. 10 is a diagram showing an example of the configuration of a communication device in which a reduction in the radius of an electrode is considered.
FIG. 11 is a diagram showing a modification of the configuration of the communication device in consideration of forming the radius of the electrode to be small.
FIG. 12 is an explanatory diagram of a signal transmission method in the communication device.
FIG. 13 is a diagram illustrating a packet of a signal generated by a communication element of a transmission source.
FIG. 14 is a diagram illustrating a configuration of a communication device according to a second embodiment.
15A is a diagram illustrating an example of a cross section of a communication device, and FIG. 15B is a diagram illustrating another example of a cross section of the communication device.
16A is a diagram illustrating a modification of the configuration of the communication device, FIG. 16B is a diagram illustrating a further modification of the configuration of the communication device, and FIG. 16C is a diagram illustrating a further modification of the configuration of the communication device. It is a figure showing an example.
FIG. 17 is a schematic diagram of a communication device.
18A is a diagram showing a data format of an RTS packet, FIG. 18B is a diagram showing a data format of a CTS packet, and FIG. 18C is a diagram showing a data format of a DT packet.
FIG. 19 is an explanatory diagram illustrating a communication method in a communication device.
20A is a diagram illustrating a waveform format of a signal flowing through a signal layer, and FIG. 20B is a diagram illustrating a configuration of one frame.
FIG. 21 is a diagram illustrating an implementation example of a digital circuit of a communication element.
FIG. 22 is a state transition diagram of a process in a digital circuit of a communication element.
[Explanation of symbols]
16, 18 ... conductive layer, 20 ... first signal layer, 22 ... dielectric layer, 24 ... conductive layer, 26 ... switch, 30 ... second signal layer, 43 ... -Dielectric layer, 44 ... power supply layer, 50 ... communication unit, 52 ... input unit, 54 ... voltage limiting element, 60 ... processing unit, 70 ... memory, 80 ... Capacitor, 82 drive circuit, 100 communication device, 200 communication element, 202 digital circuit, 204 electrode, 210 insulating layer, 300 communication device, 400: communication device, 410: signal layer, 420: high resistance layer, 430: high resistance region, 500: communication element.

[0024]
The first signal layer 20 and the second signal layer 30 may be made of a conductor such as a metal or a conductive rubber material, but may be made of a dielectric. When the first signal layer 20 and the second signal layer 30 are made of a dielectric, the first signal layer 20 and the second signal layer 30 are made of a material having a dielectric constant smaller than that of the dielectric layer 22. You. This makes it possible to confine an electric or electromagnetic field in the dielectric layer 22. Note that the first signal layer 20 and the second signal layer 30 may have a configuration such as air or vacuum. In this specification, a layer formed of a conductor or a dielectric is referred to as a “signal layer”.

[0048]
Returning to FIG. 12, when the communication element (1, 1) of the transmission source transmits a signal, the signal is transmitted to neighboring communication elements, that is, coordinates (0, 0), (2, 0), (3, 1), It is transmitted to the communication element located at (2, 2), (0, 2), (-1, 1). Upon receiving the signal, these communication elements determine whether to relay the signal based on the coordinates where the communication element is located. This determination is made by determining whether or not the device itself is spatially located between the source coordinates (1, 1) and the destination coordinates (7, 7). This is performed by determining whether or not the communication element itself is located on a path that linearly connects the original communication element (1, 1) and the communication element (7, 7) of the destination.

[0052]
This parent-child relationship is formed dynamically by the parent element periodically issuing a response request and the child element responding to the request. Specifically, first, the parent element transmits a “response request command” in which its own ID is embedded in a packet. A child element whose parent element has already been determined will not respond to it, and a child element whose parent element has not been determined will indicate that it will become a child of its parent element after a random number waiting time Issue a packet to be sent. The parent element that has received this packet immediately sends an ID determination command, and assigns an ID within its own jurisdiction to the child element. In this way, any child element dynamically establishes a unique parent-child relationship with a nearby parent element. The child element may be a built-in element or an information device connected to a signal layer via a connector.

[0055]
The communication device 400 includes a total of twelve communication elements 500e, 500f, 500h, 500i, 500j, 500l, which are connected to two or more signal layers 410 and transmit and receive signals between the two or more signal layers 410. 500 m, 500 o, 500 p, 500 q, 500 s, and 500 t are provided. In the example of FIG. 14, 3 × 3 signal layers 410 are formed in the vertical and horizontal directions. Elements 500a, 500b, 500c, 500d, 500g, 500k, 500n, 500r, 500u, 500v, 500w, and 500x are provided. Hereinafter, the communication elements are collectively referred to as “communication elements 500”. The communication element 500 has the same function as the communication element 200 described in the first embodiment, and has the same configuration . As described above, in the communication device 400, a total of 24 communication elements 500 are provided to perform transmission and reception of signals within the signal layer 410 or between the signal layers 410. In FIG. 14, a total of 12 communication elements 500 are provided to connect two adjacent signal layers 410, but in another example, some of the communication elements 500 may be omitted. . In the illustrated example, the number of the signal layers 410 is small, so that the ratio of the number of communication elements 500 (total 12) over the plurality of signal layers 410 to the total number of communication elements 500 (total 24). Although this is only 50%, the ratio increases as the number of signal layers 410 increases. For convenience of description, the communication device 400 according to the second embodiment will be described below on the assumption that the communication element 500 connects to a plurality of signal layers 410 unless otherwise specified.

Claims (12)

A communication device for transmitting a signal, comprising: a ground layer and a power layer; a communication element electromagnetically connected to the ground layer and the power layer; and a dielectric layer and a signal layer laminated between the ground layer and the power layer. A communication device, wherein the communication element is connected to the signal layer via a capacitor. The communication device according to claim 1, wherein the communication element transmits a signal by generating an electric field or an electromagnetic field in the dielectric layer. A driving circuit for connecting the ground layer or the power supply layer to the signal layer;
The communication device according to claim 1, wherein a capacitance of the capacitor is set so as to reduce a reactance component of an output impedance of the drive circuit. A plurality of communication elements are distributed and each communication element is electromagnetically connected to a first signal layer, a dielectric layer, and a second signal layer, and the dielectric layer is disposed between the first signal layer and the second signal layer. And
A communication device, wherein each communication element is connected to the first signal layer via a capacitor, and transmits a signal by flowing a current between the first signal layer and the second signal layer. A communication device, comprising: a plurality of signal layers for transmitting signals; and a plurality of communication elements connected to two or more signal layers for transmitting and receiving signals between the two or more signal layers. The communication device according to claim 5, wherein the communication element transmits and receives a signal to and from a communication element provided in a signal layer to which the communication element is connected. A communication element receives a signal from a communication element provided in a signal layer to which the communication element is connected, and transmits a signal to a communication element provided in another signal layer to which the communication element is connected, whereby the signal is expected. 7. The communication device according to claim 6, wherein the signal is sequentially transmitted to a signal layer. The communication device according to any one of claims 5 to 7, wherein each signal layer has an identification number, and transmission of a signal is realized using the identification number of the signal layer. Each communication element has a local identification number in the signal layer for each signal layer to which the communication element is connected, and transmission of signals in the signal layer is realized using the local identification number. The communication device according to claim 5. 10. An identification number as a reference for at least one signal layer, and identification numbers for other signal layers are sequentially set based on the reference identification number. Communication device. Upon receiving a signal including the identification number of the signal layer to which the communication element itself is connected, the communication element holds the identification number of the signal layer to which the communication signal is transmitted, and then sets the identification numbers of the other signal layers to which the communication element is connected The communication apparatus according to claim 10, wherein the communication apparatus transmits a signal including the set identification number to the other signal layer. The communication element, upon receiving the data signal, specifies a communication element to which the signal is to be transferred, and transmits the data signal to the communication element to be transferred while receiving the data signal. 12. The communication device according to any one of 5 to 11.

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