JP4489344B2 - Stage member - Google Patents
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- JP4489344B2 JP4489344B2 JP2002343132A JP2002343132A JP4489344B2 JP 4489344 B2 JP4489344 B2 JP 4489344B2 JP 2002343132 A JP2002343132 A JP 2002343132A JP 2002343132 A JP2002343132 A JP 2002343132A JP 4489344 B2 JP4489344 B2 JP 4489344B2
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Description
【０００１】
【発明の属する技術分野】
本発明は、半導体製造装置、検査機器等に用いられるステージ部材に関するもので、さらに詳しくは、低熱膨張セラミックスからなる軽量なステージ部材に関するものである。
【０００２】
【従来技術】
近年、半導体回路は益々精細化する傾向にあり、例えば、ステージ部材を搭載した半導体露光装置では、極めて高精度な位置決めが要求されるため、各部材の構成に種々の工夫が鋭意検討されている。（たとえば、特許文献１参照）
【０００３】
このような状況下で、周囲の温度変化による熱膨張によるわずかな変形でも製品歩留まりの低下を招くことから、半導体製造装置の構成部材としてコージエライトを主成分とする低熱膨張材料が用いられるようになってきた。（たとえば、特許文献２参照）
【０００４】
また、半導体製造装置の大型化、高速移動化にともない、このような構成部材の軽量化が要求されており、軽量化の手段として、部材を中空構造にすることが検討されている。具体的には、内部をくり抜いたセラミックス同士を接合することで内部空間を確保し、これにより大幅な重量減少を図ろうとしている。
このように低熱膨張セラミックス同士を接合する技術が求められており、このような場合には、従来、接合材としてガラスが多用されていた。
【０００５】
【特許文献１】
特開２００２−１１８０５０号公報
【特許文献２】
特開平１１−２０９１７１号公報
【０００６】
【発明が解決しようとする課題】
しかしながら、従来から接合材として用いられているガラスは低熱膨張材でないため、接合部にガラスの溶融温度から室温まで冷却する間に応力が残留するという問題がある。また、ガラスは剛性が低いため、接合後の部材全体の剛性が低下し、半導体製造において精細な描画が困難となる。さらには、接着強度が弱いという欠点も抱えている。
【０００７】
本発明はかかる事情に鑑みてなされたものであって、熱膨張係数が低く、接合部に内部応力が残留せず、通常のセラミックスと同程度の剛性を有し、接合強度が高い低熱膨張セラミックスからなる軽量なステージ部材を提供することを目的とする。
【０００８】
【課題を解決するための手段】
本発明の目的は、以下の（１）〜（４）によって達成される。
（１）少なくとも一方が箱蓋構造を有する低熱膨張セラミックス底板材と同材質の上板材とを、該板材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で接合してなるステージ部材であって、前記板材を構成する複合材料が、β−ユークリプタイト５０〜９５質量％と炭化珪素５〜５０質量％とからなり、前記接合材を構成する複合材料が、β−ユークリプタイト４０〜８５質量％と窒化珪素１５〜６０質量％とからなることを特徴とするステージ部材。
（２）上記（１）において、低熱膨張セラミックス底板材と一端から一端まで連通する溝部を有する同材質の上板材とを、該板材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で接合してなることを特徴とするステージ部材。
（３）上記（１）、（２）において、板材および接合材の２０〜３０℃における平均の熱膨張係数が−１×１０−６〜１×１０−６／℃であることを特徴とするステージ部材。
（４）上記（１）〜（３）において、板材と接合材との間の、２０〜３０℃における平均の熱膨張係数の差が±０．１×１０−６／℃以内であることを特徴とするステージ部材。
【０００９】
【発明の実施の形態】
以下、本発明について詳細に説明する。
本発明に係るステージ部材は、低熱膨張セラミックスからなる板材を、該板材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で接合してなる。
【００１０】
このように接合材として板材よりも溶融温度の低い低熱膨張セラミックスを用いることにより、接合に際して接合材の溶融温度よりも高く、板材の溶融温度よりも低い温度で加熱することにより、接合材のみが溶融して複数の母材同士を接合することができる。この場合に、接合材が低熱膨張セラミックスであるから、接合部に残留する応力が小さく、接合部の剛性が高いため材料全体の剛性が高く、かつ接合部自体の強度がガラスより大きいから接合強度が大きい。
【００１１】
ここで、前記板材および前記接合材の２０〜３０℃における平均の熱膨張係数が−１×１０-6〜１×１０-6／℃であることが好ましい。この範囲であれば、半導体製造装置部材として用いられた場合に、半導体回路の精細化に適合可能である。また、板材と接合材との間の、２０〜３０℃における平均の熱膨張係数の差が±０．１×１０-6／℃以内であることが好ましい。熱膨張係数の差がこの範囲を超えると、接合のための熱処理後、冷却過程で内部応力がたまり、強度低下を招くおそれがある。
【００１２】
前記板材および前記接合材を構成する複合材料としては、リチウムアルミノシリケート、コーディエライト、リン酸ジルコニウムカリウムから選ばれる１種以上の第１の材料と、炭化珪素、窒化珪素、炭化ホウ素、サイアロン、アルミナ、ジルコニア、ムライト、ジルコン、窒化アルミニウム、ケイ酸カルシウムから選ばれる１種以上の第２の材料とからなるものが好適である。これら構成材料のうち第１の材料は熱膨張が極めて小さく、第２の材料は熱膨張係数は第１の材料よりも大きいがヤング率が高く、これらを複合化することにより、所望の低熱膨張および高剛性を兼備した材料とすることができる。
【００１３】
上記第１の材料としては、リチウムアルミノシリケートであるβ−ユークリプタイトやスポジューメンが好ましい。また、その中でもβ−ユークリプタイトはマイナスの熱膨張を示すので、プラスの熱膨張を示す第２の材料と組み合わせることにより、極めて低い熱膨張係数を得ることが可能であるし、また、配合を調節することにより熱膨張係数をマイナスからプラスの広い範囲で調節することが可能となる。なお、β−ユークリプタイトやスポジューメンに代表されるリチウムアルミノシリケートは、Ｃａ、Ｍｇ、Ｆｅ、Ｋ、Ｔｉ、Ｚｎ等の他の成分と固溶体を形成するが、本発明ではこのような固溶体も適用可能である。
【００１４】
一方、接合材における第２の材料の選択は、接合材の溶融温度が板材の溶融温度よりも低くなるように上記材料の中から適宜選択される。
【００１５】
なお、接合材および板材を構成する複合材料において、実質的な化学的反応が生じなければ、第１の材料として複数の材料を組み合わせて用いることも可能である。また、第２の材料も同様に、実質的な化学的反応が生じなければ、複数の材料を組み合わせて用いることも可能である。
【００１６】
ここで、板材を構成する複合材料の構成材料のうち１種以上が、接合材を構成する複合材料の構成材料と共通であることが好ましい。これにより、共通の構成材料が拡散しやすく強固に接合することができるとともに、接合面がきれいである。
【００１７】
この場合に、板材の組成としてはβ−ユークリプタイト５０〜９５質量％と炭化珪素５〜５０質量％であり、接合材の組成としてはβ−ユークリプタイト４０〜８５質量％と窒化珪素１５〜６０質量％であることが好ましい。
【００１８】
次に、本発明のステージ部材の製造方法について説明する。
本発明のステージ部材は、軽量化を目的として、基本的には板材に中空構造を有している。
より具体的には、少なくとも一方が箱蓋構造（いわゆる弁当箱の箱蓋形状の構造）を有する低熱膨張セラミックス底板材と同材質の上板材とを、該板材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で接合してステージ部材を製造する。ここで、底板材と上板材は両方とも外形寸法が略同一の箱蓋構造を有していても良いし（箱蓋と箱蓋が接合面でお互いに対象となり、内部に中空構造を形成するように側板同士を接合する。）、いずれか一方が箱蓋構造を有し、他方が平板であっても良い（平板に箱蓋をかぶせて内部に中空構造を形成するように接合する。）ことは勿論である。
また本発明のステージ部材は、低熱膨張セラミックス底板材と一端から一端まで連通する溝部を有する同材質の上板材とを、該板材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で接合して製造しても良い。ここで、一端から一端まで連通する溝部とは、一端から他の一端まで連通する溝部であっても良いし、一端から蛇行して同一の一端まで戻って連通する溝部であっても良い。このような溝部を形成した場合、この溝部に水や空気を冷却媒体として流せば、ステージの冷却をすることも可能となる。
【００１９】
つぎに板材同士の接合は、接合材粉末を適宜のバインダーとともに混練して粘糊性のあるペーストとし、このペーストを板材の接合面に塗布し、脱脂した後に接合面同士を密着させ、接合材は溶融するけれども板材は溶融しない温度で熱処理することによる。これにより、接合材が溶融し、一部は板材に拡散して板材同士を接合できる。
この際の熱処理雰囲気は、材料が全て酸化物系のものであれば、大気雰囲気を用いることができるが、非酸化物系の材料が含まれている場合には、非酸化雰囲気を用いることが好ましい。
【００２０】
【実施例】
以下、本発明の実施例について説明する。
（実施例Ａ）
まず、β−ユークリプタイト粉末と炭化珪素粉末とを表１の割合でポットミル混合して乾燥させ、板材セラミックスの原料混合粉末を作製した。この混合粉末を一軸加圧成形して、３００ｍｍ×１５０ｍｍ×厚み１０ｍｍの板状成形体を作製し、１５０ＭＰａでＣＩＰ処理した。窒素雰囲気において、表１に示す温度で焼成し、底板材となる低熱膨張セラミックス焼結体を得た。同様にして、３００ｍｍ×１５０ｍｍ×６０ｍｍ（肉厚：１０ｍｍ）の箱蓋構造を有する上板成形体を作製し、同様に焼成して上板材を得た。
ここで、焼成して得られた板材から試験片を切り出し、レーザー干渉式熱膨張測定装置（アルバック理工社製 LIX-1）を用いて熱膨張係数を求めた。また、共振法にてこれら板材のヤング率を測定した。これらの評価結果についても表１にまとめて示した。
【００２１】
【表１】
次に、β−ユークリプタイトと窒化珪素を表２に示す割合でポットミル混合して乾燥させ、接合材用の混合粉末を作製した。この混合粉末を無機分が３０ｖｏｌ％となるようにエチルセルロースの１５％α−テルピネオール溶液と混合し、三本ロールを用いてペースト状にした。なお、この接合材について同じ組成の焼結体を作製して板材と同様にして熱膨張係数を求めた。その結果についても表２にまとめて示した。
【００２３】
【表２】
次に、上記底板材と上板材の接合する面に、上記接合材ペーストをスクリーンマスクを用いて厚さ３０μｍに印刷し５００℃で脱脂した後、印刷面同士を密着して０．５ｇ／ｍｍ2の荷重をかけた。引き続き、窒素雰囲気で、表２に示した温度で熱処理し、接合材を溶融させて底板材と上板材を接合してステージ部材を得た。
【００２５】
図１に本実施例で得られたステージ部材の模式的な斜視図（ａ）とその横断面図（ｂ）を示した。ここで、１は低熱膨張セラミックスからなる底板材で、２は、箱蓋構造を有する底板材と同材質の上板材であり、３は、該板材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で底板材と上板材を接合した接合部である。
【００２６】
次に、以上のようにして得られたステージ部材から接合部を含む試験片を切り出して曲げ強度とヤング率を評価した結果を表３に示した。
本発明のステージ部材は、全体の熱膨張係数が小さく、また、板材と接合材との熱膨張差が著しく小さいため接合部に内部応力がほとんど残留せず、また、表３に示したように、接合部は板材の剛性を維持し、しかも板材の強度からの大幅な低下を招かない程度の大きな曲げ強度を有していることが確認された。
【００２７】
【表３】
さらに、本発明のステージ部材は、中空構造を有しているために、中空構造でない場合と比較して約４０％だけ軽量化できた。
【００２９】
（実施例Ｂ）
実施例Ａに示した方法と同様にして５１０ｍｍ×３００ｍｍ×厚み１０ｍｍの底板状成形体と一端から反対の他の一端まで連通する５個の溝部（溝形状：９０ｍｍ×３００ｍｍ×溝深さ５０ｍｍ）を有する同材質の上板成形体（外形寸法：５１０ｍｍ×３００ｍｍ×６０ｍｍ、肉厚：１０ｍｍ）とを作製し、１５０ＭＰａでＣＩＰ処理した。次に、窒素雰囲気において、実施例Ａと同じ温度で焼成した。
【００３０】
次に、上記底板材と上板材の接合する面に、実施例Ａと同様にして接合材ペーストを塗布し脱脂した後、印刷面同士を密着して０．５ｇ／ｍｍ2の荷重をかけた。引き続き、窒素雰囲気で実施例Ａと同じ温度で熱処理し、接合材を溶融させて底板材と上板材を接合してステージ部材を得た。
【００３１】
図２に実施例Ｂで得られたステージ部材の模式的な横断面を示した。ここで、１は低熱膨張セラミックスからなる底板材で、４は、上板材の一端から反対の他の一端まで連通する溝部であり、５は溝部を有する上板材であり、３は、該板材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で接合した接合部である。
【００３２】
得られたステージ部材を実施例Ａと同様にして評価した結果、ステージ部材の熱膨張係数は十分に低く、かつ、通常のセラミックスと同程度の剛性を有し、接合部の曲げ強度が高いことが確認できた。さらに、本実施例のステージ部材は、上板材の一端から反対の他端まで連通した溝部を有しているために、溝部を有しない場合と比較して約６０％だけ軽量化できた。
【００３３】
【発明の効果】
以上説明したように、本発明によれば、低い熱膨張係数を維持しつつ、通常のセラミックスと同程度の剛性を有し、接合部の曲げ強度が高いステージ部材を得ることができる。
さらには、本発明のステージ部材は、中空構造または一端から反対の他の一端まで連通した溝部を有しているために、そうでない場合と比較して大幅に軽量化できる効果がある。
また、一端から一端まで連通した溝部を有しているため、この溝部に水や空気を冷却媒体として流せば、ステージを冷却できる効果がある。
【図面の簡単な説明】
【図１】本発明の実施例を模式的に示した斜視図と断面図である。
【図２】本発明の他の実施例を模式的に示した断面図である。
【符号の説明】
１ 底板材
２ 箱蓋構造を有する上板材
３ 接合材で接合した接合部
４ 溝部
５ 溝部を有する上板材[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a stage member used for a semiconductor manufacturing apparatus, inspection equipment, and the like, and more particularly to a lightweight stage member made of low thermal expansion ceramics.
[0002]
[Prior art]
In recent years, semiconductor circuits have been increasingly refined. For example, in a semiconductor exposure apparatus equipped with a stage member, since extremely high-precision positioning is required, various devices have been intensively studied for the configuration of each member. . (For example, see Patent Document 1)
[0003]
Under such circumstances, even a slight deformation due to thermal expansion due to a change in ambient temperature leads to a decrease in product yield. Therefore, a low thermal expansion material mainly composed of cordierite has been used as a component of semiconductor manufacturing equipment. I came. (For example, see Patent Document 2)
[0004]
In addition, with the increase in size and movement of semiconductor manufacturing equipment, there is a demand for weight reduction of such components, and as a means for weight reduction, it has been studied to make the member a hollow structure. Specifically, an internal space is secured by bonding ceramics that have been hollowed out, thereby reducing the weight significantly.
Thus, a technique for joining low thermal expansion ceramics is required. In such a case, conventionally, glass is often used as a joining material.
[0005]
[Patent Document 1]
JP 2002-1118050 A [Patent Document 2]
Japanese Patent Laid-Open No. 11-209171 [0006]
[Problems to be solved by the invention]
However, since glass conventionally used as a bonding material is not a low thermal expansion material, there is a problem that stress remains in the bonded portion while cooling from the melting temperature of the glass to room temperature. In addition, since the rigidity of glass is low, the rigidity of the entire member after bonding is lowered, and fine drawing becomes difficult in semiconductor manufacturing. Furthermore, it has the disadvantage that the adhesive strength is weak.
[0007]
The present invention has been made in view of such circumstances, and has a low thermal expansion coefficient, no internal stress remains in the joint, has a rigidity comparable to that of ordinary ceramics, and has a high joint strength. It aims at providing the lightweight stage member which consists of.
[0008]
[Means for Solving the Problems]
The object of the present invention is achieved by the following (1) to ( 4 ).
(1) A stage member formed by joining at least one of a low thermal expansion ceramic bottom plate having a box lid structure and an upper plate of the same material with a bonding material made of low thermal expansion ceramic having a melting temperature lower than that of the plate. The composite material constituting the plate material is composed of 50 to 95% by mass of β-eucryptite and 5 to 50% by mass of silicon carbide, and the composite material constituting the bonding material is β-eucryptite 40 to 85%. stage member characterized by comprising a weight percent and the silicon nitride 15 to 60% by weight.
(2) In (1) above, the bottom plate material of low thermal expansion ceramic and the upper plate material of the same material having a groove communicating from one end to the other end are joined by a joining material made of low thermal expansion ceramic having a melting temperature lower than that of the plate material. A stage member characterized by comprising:
(3) above (1), characterized in that (2) in a plate member and an average thermal expansion coefficient of -1 × 10 -6 ~1 × 10 -6 / ℃ at 20 to 30 ° C. of the bonding material Stage member.
(4) In said (1)-(3), the difference of the average thermal expansion coefficient in 20-30 degreeC between a board | plate material and a joining material is less than +/- 0.1x10 < -6 > / degreeC. A featured stage member.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail.
The stage member according to the present invention is formed by joining a plate material made of low thermal expansion ceramics with a bonding material made of low thermal expansion ceramics having a melting temperature lower than that of the plate material.
[0010]
Thus, by using a low thermal expansion ceramic having a lower melting temperature than the plate material as the bonding material, only the bonding material is heated by heating at a temperature higher than the melting temperature of the bonding material and lower than the melting temperature of the plate material at the time of bonding. A plurality of base materials can be joined by melting. In this case, since the bonding material is a low thermal expansion ceramic, the residual stress in the bonded portion is small, the rigidity of the bonded portion is high, the rigidity of the entire material is high, and the strength of the bonded portion itself is larger than glass, so the bonding strength Is big.
[0011]
Here, it is preferable thermal expansion coefficient of the mean at 20 to 30 ° C. of the plate and said bonding material is -1 × 10 -6 ~1 × 10 -6 / ℃. Within this range, when used as a semiconductor manufacturing apparatus member, it can be adapted to refinement of a semiconductor circuit. Moreover, it is preferable that the difference of the average thermal expansion coefficient in 20-30 degreeC between a board | plate material and a joining material is less than +/- 0.1x10 < -6 > / degreeC . If the difference in thermal expansion coefficient exceeds this range, internal stress accumulates during the cooling process after heat treatment for bonding, which may lead to a decrease in strength.
[0012]
As the composite material constituting the plate material and the bonding material, one or more first materials selected from lithium aluminosilicate, cordierite, potassium zirconium phosphate, silicon carbide, silicon nitride, boron carbide, sialon, What consists of 1 or more types of 2nd materials chosen from an alumina, a zirconia, a mullite, a zircon, aluminum nitride, and a calcium silicate is suitable. Of these constituent materials, the first material has a very low thermal expansion, and the second material has a higher coefficient of thermal expansion than the first material, but has a higher Young's modulus. And it can be set as the material which has high rigidity.
[0013]
As the first material, lithium aluminosilicate β-eucryptite and spodumene are preferable. Of these, β-eucryptite exhibits a negative thermal expansion, so that it can be combined with a second material exhibiting a positive thermal expansion to obtain an extremely low thermal expansion coefficient. It is possible to adjust the thermal expansion coefficient in a wide range from minus to plus by adjusting. In addition, although lithium aluminosilicate represented by β-eucryptite and spodumene forms a solid solution with other components such as Ca, Mg, Fe, K, Ti, and Zn, such a solid solution is also applied in the present invention. Is possible.
[0014]
On the other hand, the selection of the second material in the bonding material is appropriately selected from the above materials so that the melting temperature of the bonding material is lower than the melting temperature of the plate material.
[0015]
In addition, in the composite material which comprises a joining material and a board | plate material, if a substantial chemical reaction does not arise, it is also possible to use combining several materials as a 1st material. Similarly, the second material can be used in combination with a plurality of materials as long as no substantial chemical reaction occurs.
[0016]
Here, it is preferable that at least one of the constituent materials of the composite material constituting the plate material is the same as the constituent material of the composite material constituting the bonding material. As a result, the common constituent material can be easily diffused and firmly bonded, and the bonding surface is clean.
[0017]
In this case, the composition of the plate material is 50 to 95% by mass of β-eucryptite and 5 to 50% by mass of silicon carbide, and the composition of the bonding material is 40 to 85% by mass of β-eucryptite and 15% of silicon nitride. It is preferable that it is -60 mass%.
[0018]
Next, the manufacturing method of the stage member of this invention is demonstrated.
The stage member of the present invention basically has a hollow structure in the plate material for the purpose of weight reduction.
More specifically, a low thermal expansion ceramic bottom plate material having at least one of a box lid structure (a so-called box lid shape structure of a lunch box) and an upper plate material of the same material are combined with a low thermal expansion ceramic having a melting temperature lower than that of the plate material. A stage member is manufactured by bonding with a bonding material comprising: Here, both the bottom plate material and the top plate material may have a box lid structure having substantially the same external dimensions (the box lid and the box lid are mutually targeted at the joint surface, and form a hollow structure inside). The side plates may be joined to each other as described above.) Either one may have a box lid structure and the other may be a flat plate (the flat plate is covered with a box lid and joined so as to form a hollow structure inside). Of course.
The stage member of the present invention is formed by joining a low thermal expansion ceramic bottom plate material and an upper plate material of the same material having a groove communicating from one end to one end with a bonding material made of low thermal expansion ceramic having a melting temperature lower than that of the plate material. It may be manufactured. Here, the groove part communicating from one end to one end may be a groove part communicating from one end to the other end, or may be a groove part meandering from one end and returning to the same one end. When such a groove is formed, the stage can be cooled by flowing water or air as a cooling medium in the groove.
[0019]
Next, the bonding between the plate materials is performed by kneading the bonding material powder together with an appropriate binder to obtain a paste having a sticky property, applying this paste to the bonding surface of the plate material, degreasing the bonding surfaces, and bonding the bonding materials together. Is due to heat treatment at a temperature that melts but does not melt the plate. As a result, the bonding material is melted, and part of the bonding material is diffused into the plate material so that the plate materials can be bonded to each other.
As the heat treatment atmosphere in this case, an air atmosphere can be used if the material is all oxide-based, but if a non-oxide-based material is included, a non-oxidizing atmosphere should be used. preferable.
[0020]
【Example】
Examples of the present invention will be described below.
(Example A)
First, β-eucryptite powder and silicon carbide powder were mixed in a pot mill at a ratio shown in Table 1 and dried to prepare a raw material mixed powder of plate ceramics. The mixed powder was uniaxially pressed to prepare a plate-like molded body of 300 mm × 150 mm × thickness 10 mm, and CIP-treated at 150 MPa. Firing was performed at a temperature shown in Table 1 in a nitrogen atmosphere to obtain a low thermal expansion ceramic sintered body serving as a bottom plate material. Similarly, an upper plate molded body having a box lid structure of 300 mm × 150 mm × 60 mm (thickness: 10 mm) was produced and fired in the same manner to obtain an upper plate material.
Here, a test piece was cut out from the plate material obtained by firing, and the thermal expansion coefficient was determined using a laser interference thermal expansion measurement device (LIX-1 manufactured by ULVAC-RIKO). Further, the Young's modulus of these plate materials was measured by a resonance method. These evaluation results are also summarized in Table 1.
[0021]
[Table 1]
Next, β-eucryptite and silicon nitride were mixed in a pot mill at a ratio shown in Table 2 and dried to prepare a mixed powder for a bonding material. This mixed powder was mixed with a 15% α-terpineol solution of ethyl cellulose so that the inorganic content was 30 vol%, and made into a paste using a three roll. In addition, the sintered compact of the same composition was produced about this joining material, and the thermal expansion coefficient was calculated | required like the board | plate material. The results are also summarized in Table 2.
[0023]
[Table 2]
Next, after printing the bonding material paste to a thickness of 30 μm using a screen mask on the surface where the bottom plate material and the upper plate material are bonded and degreasing at 500 ° C., the printed surfaces are adhered to each other at 0.5 g / mm. A load of 2 was applied. Subsequently, heat treatment was performed at a temperature shown in Table 2 in a nitrogen atmosphere, the joining material was melted, and the bottom plate material and the upper plate material were joined to obtain a stage member.
[0025]
FIG. 1 shows a schematic perspective view (a) and a cross-sectional view (b) of the stage member obtained in this example. Here, 1 is a bottom plate material made of low thermal expansion ceramics, 2 is an upper plate material made of the same material as the bottom plate material having a box cover structure, and 3 is a bonding made of low thermal expansion ceramics having a lower melting temperature than the plate material. This is a joined portion obtained by joining the bottom plate material and the top plate material.
[0026]
Next, Table 3 shows the results of cutting out a test piece including a joint from the stage member obtained as described above and evaluating the bending strength and Young's modulus.
The stage member of the present invention has a small coefficient of thermal expansion as a whole, and the thermal expansion difference between the plate material and the bonding material is extremely small, so that almost no internal stress remains in the bonded portion. As shown in Table 3, It has been confirmed that the joint has a bending strength that maintains the rigidity of the plate and does not cause a significant decrease from the strength of the plate.
[0027]
[Table 3]
Furthermore, since the stage member of the present invention has a hollow structure, the weight can be reduced by about 40% compared to the case without the hollow structure.
[0029]
(Example B)
Similarly to the method shown in Example A, the bottom plate-like molded body having a size of 510 mm × 300 mm × thickness 10 mm and five grooves communicating from one end to the other opposite end (groove shape: 90 mm × 300 mm × groove depth 50 mm) An upper plate molded body (outer dimensions: 510 mm × 300 mm × 60 mm, wall thickness: 10 mm) of the same material having a thickness of 10 mm was produced and CIP-treated at 150 MPa. Next, it was fired at the same temperature as Example A in a nitrogen atmosphere.
[0030]
Next, a bonding material paste was applied and degreased on the surface where the bottom plate material and the upper plate material were joined in the same manner as in Example A, and then the printed surfaces were brought into close contact with each other and a load of 0.5 g / mm 2 was applied. . Subsequently, heat treatment was performed at the same temperature as in Example A in a nitrogen atmosphere, the joining material was melted, and the bottom plate material and the top plate material were joined to obtain a stage member.
[0031]
FIG. 2 shows a schematic cross section of the stage member obtained in Example B. Here, 1 is a bottom plate material made of low thermal expansion ceramics, 4 is a groove portion communicating from one end of the upper plate material to the other opposite end, 5 is an upper plate material having a groove portion, and 3 is from the plate material Is also a joint portion joined by a joining material made of a low thermal expansion ceramic having a low melting temperature.
[0032]
As a result of evaluating the obtained stage member in the same manner as in Example A, the coefficient of thermal expansion of the stage member is sufficiently low, the rigidity is comparable to that of ordinary ceramics, and the bending strength of the joint is high. Was confirmed. Furthermore, since the stage member of the present example has a groove portion that communicates from one end of the upper plate material to the other end, the weight can be reduced by about 60% compared to the case without the groove portion.
[0033]
【The invention's effect】
As described above, according to the present invention, it is possible to obtain a stage member having the same degree of rigidity as that of ordinary ceramics while maintaining a low thermal expansion coefficient and having a high bending strength at the joint.
Furthermore, since the stage member of the present invention has a hollow structure or a groove portion communicating from one end to the other opposite end, there is an effect that the weight can be significantly reduced as compared with the case where it is not.
Moreover, since the groove part communicated from one end to the other end is provided, there is an effect that the stage can be cooled by flowing water or air as a cooling medium in the groove part.
[Brief description of the drawings]
FIG. 1 is a perspective view and a sectional view schematically showing an embodiment of the present invention.
FIG. 2 is a cross-sectional view schematically showing another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002343132A JP4489344B2 (en) | 2002-11-27 | 2002-11-27 | Stage member |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002343132A JP4489344B2 (en) | 2002-11-27 | 2002-11-27 | Stage member |
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| JP2004179353A JP2004179353A (en) | 2004-06-24 |
| JP4489344B2 true JP4489344B2 (en) | 2010-06-23 |
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| JP2002343132A Expired - Lifetime JP4489344B2 (en) | 2002-11-27 | 2002-11-27 | Stage member |
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| JP4382586B2 (en) * | 2004-06-17 | 2009-12-16 | 国立大学法人東北大学 | Exposure equipment |
| JP4870455B2 (en) * | 2006-03-15 | 2012-02-08 | 太平洋セメント株式会社 | Low thermal expansion ceramic joined body having hollow structure |
| JP4870454B2 (en) * | 2006-03-15 | 2012-02-08 | 太平洋セメント株式会社 | Ceramic bonded body having hollow structure |
| GB2445573B (en) * | 2007-01-10 | 2009-08-26 | Vistec Lithography Ltd | Apparatus support structure |
| JP5270306B2 (en) * | 2008-11-10 | 2013-08-21 | 太平洋セメント株式会社 | Ceramic bonded body and manufacturing method thereof |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS60141667A (en) * | 1983-12-28 | 1985-07-26 | 日本碍子株式会社 | Material for ceramic honeycomb structure |
| JPS6126572A (en) * | 1984-07-16 | 1986-02-05 | 株式会社日本自動車部品総合研究所 | Ceramic product and manufacture |
| JP4416191B2 (en) * | 1997-08-29 | 2010-02-17 | 京セラ株式会社 | Low thermal expansion ceramics, manufacturing method thereof, and semiconductor manufacturing component |
| JPH11142555A (en) * | 1997-11-11 | 1999-05-28 | Canon Inc | Positioning device, exposure device and manufacture of the device |
| JP2000120973A (en) * | 1998-10-14 | 2000-04-28 | Asahi Glass Co Ltd | Jointing method for ceramic pipe and jointing structure |
| JP2001302338A (en) * | 2000-04-24 | 2001-10-31 | Taiheiyo Cement Corp | Composite ceramic and manufacturing method thereof |
| JP2002160972A (en) * | 2000-11-21 | 2002-06-04 | Hitachi Chem Co Ltd | High rigidity and low thermal expansion ceramic and its manufacturing method |
| JP4803872B2 (en) * | 2000-11-28 | 2011-10-26 | 京セラ株式会社 | JOINT BODY AND MANUFACTURING METHOD THEREOF |
| JP4610076B2 (en) * | 2000-12-06 | 2011-01-12 | 京セラ株式会社 | Lithium aluminosilicate ceramics |
| JP2002321967A (en) * | 2001-04-24 | 2002-11-08 | Toray Ind Inc | Low thermal expansion ceramic |
| JP4082953B2 (en) * | 2002-07-31 | 2008-04-30 | 太平洋セメント株式会社 | Low thermal expansion ceramic joined body |
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