JP4489310B2 - 研磨装置用下定盤受け - Google Patents

研磨装置用下定盤受け Download PDF

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Publication number
JP4489310B2
JP4489310B2 JP2001006077A JP2001006077A JP4489310B2 JP 4489310 B2 JP4489310 B2 JP 4489310B2 JP 2001006077 A JP2001006077 A JP 2001006077A JP 2001006077 A JP2001006077 A JP 2001006077A JP 4489310 B2 JP4489310 B2 JP 4489310B2
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Japan
Prior art keywords
surface plate
convex
plate receiver
receiver
polishing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001006077A
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English (en)
Japanese (ja)
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JP2002210651A5 (enExample
JP2002210651A (ja
Inventor
由夫 中村
毅 長谷川
惇 鍛治倉
忠一 宮下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
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Fujikoshi Machinery Corp
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Publication date
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Priority to JP2001006077A priority Critical patent/JP4489310B2/ja
Publication of JP2002210651A publication Critical patent/JP2002210651A/ja
Publication of JP2002210651A5 publication Critical patent/JP2002210651A5/ja
Application granted granted Critical
Publication of JP4489310B2 publication Critical patent/JP4489310B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2001006077A 2001-01-15 2001-01-15 研磨装置用下定盤受け Expired - Lifetime JP4489310B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001006077A JP4489310B2 (ja) 2001-01-15 2001-01-15 研磨装置用下定盤受け

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001006077A JP4489310B2 (ja) 2001-01-15 2001-01-15 研磨装置用下定盤受け

Publications (3)

Publication Number Publication Date
JP2002210651A JP2002210651A (ja) 2002-07-30
JP2002210651A5 JP2002210651A5 (enExample) 2008-02-14
JP4489310B2 true JP4489310B2 (ja) 2010-06-23

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ID=18874029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001006077A Expired - Lifetime JP4489310B2 (ja) 2001-01-15 2001-01-15 研磨装置用下定盤受け

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JP (1) JP4489310B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7218731B2 (ja) * 2020-01-09 2023-02-07 信越半導体株式会社 ラッピング装置の洗浄装置

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Publication number Publication date
JP2002210651A (ja) 2002-07-30

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