JP4486976B2 - リソグラフィ装置およびデバイス製造方法 - Google Patents
リソグラフィ装置およびデバイス製造方法 Download PDFInfo
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- JP4486976B2 JP4486976B2 JP2007027473A JP2007027473A JP4486976B2 JP 4486976 B2 JP4486976 B2 JP 4486976B2 JP 2007027473 A JP2007027473 A JP 2007027473A JP 2007027473 A JP2007027473 A JP 2007027473A JP 4486976 B2 JP4486976 B2 JP 4486976B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims description 130
- 238000005259 measurement Methods 0.000 claims description 53
- 230000005855 radiation Effects 0.000 claims description 46
- 238000000059 patterning Methods 0.000 claims description 30
- 238000006073 displacement reaction Methods 0.000 claims description 22
- 238000005286 illumination Methods 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 3
- 210000003128 head Anatomy 0.000 description 62
- 230000003287 optical effect Effects 0.000 description 14
- 239000010410 layer Substances 0.000 description 6
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- 238000001459 lithography Methods 0.000 description 5
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- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 241000183024 Populus tremula Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000002245 particle Substances 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Description
Claims (17)
- 放射ビームを調整するように構成された照明システムと、
パターニングデバイスを支持するように構成され、前記放射ビームの断面にパターンを与えてパターン化した放射ビームを形成することができる支持構造と、
基板を保持するように構成された基板テーブルと、
前記パターン化した放射ビームを前記基板のターゲット部分に投影するように構成された投影システムと、
前記リソグラフィ装置の基準フレームに対する可動オブジェクトの位置を、前記可動オブジェクト上に中心を有する直交x−y−z座標系の少なくとも3共面自由度(x、y、Rz)で測定するように構成された変位測定システムとを備え、
前記可動オブジェクトが、前記支持構造または前記基板テーブルの一方を含み、
前記変位測定システムが、
それぞれが測定方向を有する少なくとも3つのセンサヘッドを備え、各センサヘッドが、前記座標系のx−y平面とほぼ同一面にある測定方向に沿って配置され、前記測定方向が、前記センサヘッドと前記可動オブジェクトの中心とを結び且つ前記x−y平面と同一面に延在する線に対してほぼ垂直であり、且つ、前記座標系のx軸及びy軸に対して45°である、リソグラフィ装置。 - 前記変位測定システムが少なくとも4つのセンサヘッドを備える、請求項1に記載のリソグラフィ装置。
- 前記変位測定システムが、前記可動オブジェクトの位置に応じて、前記4つのセンサヘッドのうち3つを選択的に使用して、前記少なくとも3共面自由度(x、y、Rz)において前記可動オブジェクトの位置を求めるように構成される、請求項2に記載のリソグラフィ装置。
- 前記線が、前記x−y−z座標系のx−y方向に対して約±45°に配向される、請求項2に記載のリソグラフィ装置。
- 前記センサヘッドの少なくとも1つが、前記可動オブジェクトおよび前記基準フレームの一方に装着されたエンコーダであり、前記変位測定システムがさらに前記可動オブジェクトおよび前記基準フレームの他方に装着された少なくとも1つの格子プレートを備え、前記格子プレート上で少なくとも1方向に測定を行うことができる、請求項1ないし4のいずれか一項に記載のリソグラフィ装置。
- 前記格子プレートが前記基準フレームに装着され、前記エンコーダが前記可動オブジェクトに装着される、請求項5に記載のリソグラフィ装置。
- 前記格子プレートがグリッドを備え、前記グリッド上で幾つかの方向で測定することができる、請求項5に記載のリソグラフィ装置。
- 前記可動オブジェクトが前記基板テーブルである、請求項1ないし7のいずれか一項に記載のリソグラフィ装置。
- 前記センサヘッドが、前記可動オブジェクトの前記中心のまわりに等しく分割されるように前記中心のまわりに配置される、請求項1に記載のリソグラフィ装置。
- 前記センサヘッドが相互にほぼ等距離である、請求項1に記載のリソグラフィ装置。
- 前記センサヘッドの少なくとも1つが、少なくともx方向またはy方向に隣接するセンサヘッドに対してずれている、請求項1に記載のリソグラフィ装置。
- 前記可動オブジェクトの前記中心が、前記オブジェクトの最も弱い方向の交差点にほぼ対応する、請求項1ないし11のいずれか一項に記載のリソグラフィ装置。
- 前記可動オブジェクトの前記中心が前記オブジェクトの重心である、請求項1ないし11のいずれか一項に記載のリソグラフィ装置。
- 前記可動オブジェクトの前記中心が前記オブジェクトの熱中心である、請求項1ないし11のいずれか一項に記載のリソグラフィ装置。
- 前記センサヘッドが、前記x−y平面とほぼ同一面にある前記測定方向を計算することができ且つz方向の測定方向を計算することができるように、斜め上方向に位置決めされた感知方向を有する2つのセンサを含む、請求項1に記載のリソグラフィ装置。
- 前記変位測定システムが、6自由度(x、y、z、Rx、Ry、Rz)で前記可動オブジェクトの前記位置を測定するように構成される、請求項1に記載のリソグラフィ装置。
- パターン化した放射ビームを基板のターゲット部分に投影し、前記基板はパターン化した放射ビームの投影中に基板テーブル上に支持され、
リソグラフィ装置の基準フレームに対する基板テーブルの位置を、変位測定システムで前記基板テーブル上に中心を有する直交x−y−z座標系の少なくとも3共面自由度(x、y、Rz)で測定する、ここで、前記変位測定システムが、それぞれが測定方向を有する少なくとも3つのセンサヘッドを備え、各センサヘッドが、前記座標系のx−y平面とほぼ同一面にある測定方向で配置され、前記測定方向が前記ヘッドと前記可動オブジェクトの中心とを結び且つ前記x−y平面と同一面に延在する線に対してほぼ垂直であり、且つ、前記座標系のx軸及びy軸に対して45°である、デバイス製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/358,725 US7602489B2 (en) | 2006-02-22 | 2006-02-22 | Lithographic apparatus and device manufacturing method |
Publications (2)
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JP2007266581A JP2007266581A (ja) | 2007-10-11 |
JP4486976B2 true JP4486976B2 (ja) | 2010-06-23 |
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JP2007027473A Active JP4486976B2 (ja) | 2006-02-22 | 2007-02-07 | リソグラフィ装置およびデバイス製造方法 |
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Country | Link |
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US (1) | US7602489B2 (ja) |
EP (1) | EP1826615A3 (ja) |
JP (1) | JP4486976B2 (ja) |
KR (1) | KR100855075B1 (ja) |
CN (1) | CN101055425B (ja) |
SG (1) | SG135129A1 (ja) |
TW (1) | TW200745770A (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008530057A (ja) * | 2005-02-16 | 2008-08-07 | ビーエーエスエフ ソシエタス・ヨーロピア | 5−アルコキシアルキル−6−アルキル−7−アミノアゾロピリミジン、それらの製造方法、有害菌類を防除するためのそれらの使用、および上記物質を含む組成物 |
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US7602489B2 (en) | 2006-02-22 | 2009-10-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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CN104375390B (zh) * | 2006-08-31 | 2017-10-13 | 株式会社尼康 | 移动体驱动系统及方法、图案形成装置及方法、曝光装置及方法、组件制造方法 |
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TWI574125B (zh) | 2006-09-01 | 2017-03-11 | 尼康股份有限公司 | Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, and component manufacturing method |
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US7999918B2 (en) * | 2006-09-29 | 2011-08-16 | Nikon Corporation | Movable body system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
KR101427071B1 (ko) * | 2007-07-24 | 2014-08-07 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
EP2187430B1 (en) * | 2007-07-24 | 2018-10-03 | Nikon Corporation | Position measuring system, exposure apparatus, position measuring method, exposure method, and device manufacturing method |
US8237919B2 (en) | 2007-08-24 | 2012-08-07 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads |
WO2009028157A1 (ja) * | 2007-08-24 | 2009-03-05 | Nikon Corporation | 移動体駆動方法及び移動体駆動システム、並びにパターン形成方法及びパターン形成装置 |
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NL1036618A1 (nl) * | 2008-03-24 | 2009-09-25 | Asml Netherlands Bv | Encoder-type measurement system, lithograpic apparatus and method to detect an error on or in a grid or grating of an encoder-type measurement system. |
NL1036662A1 (nl) * | 2008-04-08 | 2009-10-09 | Asml Netherlands Bv | Stage system and lithographic apparatus comprising such stage system. |
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US8817236B2 (en) | 2008-05-13 | 2014-08-26 | Nikon Corporation | Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method |
US8786829B2 (en) * | 2008-05-13 | 2014-07-22 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
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US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
JP2010205867A (ja) * | 2009-03-03 | 2010-09-16 | Canon Inc | 位置検出装置及び露光装置 |
NL2005013A (en) * | 2009-07-31 | 2011-02-02 | Asml Netherlands Bv | Positioning system, lithographic apparatus and method. |
US8493547B2 (en) * | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
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JP2011054694A (ja) * | 2009-08-31 | 2011-03-17 | Canon Inc | 計測装置、露光装置およびデバイス製造方法 |
US20110102761A1 (en) * | 2009-09-28 | 2011-05-05 | Nikon Corporation | Stage apparatus, exposure apparatus, and device fabricating method |
US20110096312A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110096306A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US20110096318A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110128523A1 (en) * | 2009-11-19 | 2011-06-02 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US20110123913A1 (en) * | 2009-11-19 | 2011-05-26 | Nikon Corporation | Exposure apparatus, exposing method, and device fabricating method |
US8488106B2 (en) * | 2009-12-28 | 2013-07-16 | Nikon Corporation | Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method |
JP5482347B2 (ja) * | 2010-03-18 | 2014-05-07 | 凸版印刷株式会社 | フォトマスク及び露光装置 |
EP2423749B1 (en) | 2010-08-24 | 2013-09-11 | ASML Netherlands BV | A lithographic apparatus and device manufacturing method |
DE102011005885A1 (de) | 2011-03-22 | 2012-09-27 | Carl Zeiss Smt Gmbh | Lithographievorrichtung |
US9207549B2 (en) | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
CN103246172B (zh) | 2012-02-10 | 2016-12-28 | 约翰内斯﹒海德汉博士有限公司 | 具有位置测量装置的多个扫描单元的装置 |
US10551751B2 (en) * | 2012-04-26 | 2020-02-04 | Asml Netherlands B.V. | Lithography apparatus and device manufacturing method |
DE102012210309A1 (de) | 2012-06-19 | 2013-12-19 | Dr. Johannes Heidenhain Gmbh | Positionsmesseinrichtung |
TWI627379B (zh) | 2013-10-07 | 2018-06-21 | 德商強那斯海登翰博士有限公司 | 光學位置測量裝置 |
DE102013220196A1 (de) | 2013-10-07 | 2015-04-09 | Dr. Johannes Heidenhain Gmbh | Optische Positionsmesseinrichtung |
DE102013220214A1 (de) | 2013-10-07 | 2015-04-09 | Dr. Johannes Heidenhain Gmbh | Anordnung zur Positionierung eines Werkzeugs relativ zu einem Werkstück |
JP6496017B2 (ja) | 2014-11-13 | 2019-04-03 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置およびデバイス製造方法 |
CN105783847B (zh) * | 2014-12-23 | 2018-10-23 | 丹东华通测控有限公司 | 一种角位移传感器校准装置 |
KR20230107706A (ko) | 2015-02-23 | 2023-07-17 | 가부시키가이샤 니콘 | 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고디바이스 제조 방법 |
CN111158220A (zh) | 2015-02-23 | 2020-05-15 | 株式会社尼康 | 测量装置及方法、光刻系统、曝光装置及方法 |
KR20240010551A (ko) | 2015-02-23 | 2024-01-23 | 가부시키가이샤 니콘 | 기판 처리 시스템 및 기판 처리 방법, 그리고 디바이스 제조 방법 |
CN108139694B (zh) * | 2015-09-30 | 2021-08-03 | 株式会社尼康 | 曝光装置、曝光方法以及平面显示器制造方法 |
CN113267964B (zh) * | 2015-09-30 | 2023-05-23 | 株式会社尼康 | 曝光装置及曝光方法、以及平面显示器制造方法 |
NL2025372A (en) | 2020-04-20 | 2020-05-07 | Asml Netherlands Bv | System, lithographic apparatus and method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05129184A (ja) * | 1991-10-30 | 1993-05-25 | Canon Inc | 投影露光装置 |
JPH07270122A (ja) * | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
US6686991B1 (en) * | 2000-11-06 | 2004-02-03 | Nikon Corporation | Wafer stage assembly, servo control system, and method for operating the same |
JP2005203483A (ja) * | 2004-01-14 | 2005-07-28 | Nikon Corp | ステージ装置及び露光装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI231405B (en) * | 1999-12-22 | 2005-04-21 | Asml Netherlands Bv | Lithographic projection apparatus, position detection device, and method of manufacturing a device using a lithographic projection apparatus |
EP1111472B1 (en) | 1999-12-22 | 2007-03-07 | ASML Netherlands B.V. | Lithographic apparatus with a position detection system |
US7289212B2 (en) * | 2000-08-24 | 2007-10-30 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufacturing thereby |
TWI246114B (en) * | 2002-09-24 | 2005-12-21 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
US7102729B2 (en) * | 2004-02-03 | 2006-09-05 | Asml Netherlands B.V. | Lithographic apparatus, measurement system, and device manufacturing method |
US7256871B2 (en) * | 2004-07-27 | 2007-08-14 | Asml Netherlands B.V. | Lithographic apparatus and method for calibrating the same |
US7515281B2 (en) | 2005-04-08 | 2009-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7602489B2 (en) | 2006-02-22 | 2009-10-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
-
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- 2007-02-15 EP EP07075136A patent/EP1826615A3/en not_active Withdrawn
- 2007-02-15 CN CN200710085250XA patent/CN101055425B/zh not_active Expired - Fee Related
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05129184A (ja) * | 1991-10-30 | 1993-05-25 | Canon Inc | 投影露光装置 |
JPH07270122A (ja) * | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
US6686991B1 (en) * | 2000-11-06 | 2004-02-03 | Nikon Corporation | Wafer stage assembly, servo control system, and method for operating the same |
JP2005203483A (ja) * | 2004-01-14 | 2005-07-28 | Nikon Corp | ステージ装置及び露光装置 |
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SG135129A1 (en) | 2007-09-28 |
EP1826615A2 (en) | 2007-08-29 |
US7602489B2 (en) | 2009-10-13 |
CN101055425A (zh) | 2007-10-17 |
JP2007266581A (ja) | 2007-10-11 |
KR100855075B1 (ko) | 2008-08-29 |
TW200745770A (en) | 2007-12-16 |
KR20070085158A (ko) | 2007-08-27 |
EP1826615A3 (en) | 2007-09-12 |
US20070195296A1 (en) | 2007-08-23 |
CN101055425B (zh) | 2012-11-28 |
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