JP4477496B2 - レチクル取り扱い装置 - Google Patents
レチクル取り扱い装置 Download PDFInfo
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- JP4477496B2 JP4477496B2 JP2004529197A JP2004529197A JP4477496B2 JP 4477496 B2 JP4477496 B2 JP 4477496B2 JP 2004529197 A JP2004529197 A JP 2004529197A JP 2004529197 A JP2004529197 A JP 2004529197A JP 4477496 B2 JP4477496 B2 JP 4477496B2
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- reticle
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Public Health (AREA)
- Robotics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Library & Information Science (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
Claims (28)
- 内部でクリーンルーム状態を維持する少なくとも実質的に密閉されたハウジングを備え、各々が前記ハウジング内でレクチルに対して少なくとも1つの機能を果たすいくつかの着脱可能なモジュール式機能ユニットを有するモジュール式レチクル取り扱い装置であって、
第1の機能ユニットが、前記ハウジング内へかつ外へレチクルを導入し且つ送出する入力/出力ステーションとして構成されており、
前記ハウジング内に配置されて、前記入力/出力ステーションから少なくとも1つの他の機能ユニットにまたはその逆に前記レチクルを運ぶ取り扱い装置が、前記機能ユニットのインタフェースによって特徴付けられ、前記インタフェースによって少なくとも1つの機能ユニットが前記レチクル取り扱い装置に、前記ハウジング内の開口部を介して着脱可能に接続されて前記ハウジング内で少なくとも1つの機能を果たし得ることを特徴とするレチクル取り扱い装置。 - 前記機能ユニットと前記レチクル取り扱い装置との取り外しできる接続を可能にする機械的及び電気的部分を有するインタフェースによってさらに特徴付けられる請求項1記載のレチクル取り扱い装置。
- いくつかの入力/出力ユニットが取り外しできる方法で取り付けられる入力/出力ステーションによってさらに特徴づけられ、前記入力/出力ユニットのうち少なくともいくつかの高さが基本グリッドサイズの自然数の倍数に毎回対応することを特徴とする請求項1記載のレチクル取り扱い装置。
- 請求項1記載のレチクル取り扱い装置及び前記第1機能ユニットとその構成において異なる少なくとも1つの第2機能ユニットを含み、それによって前記第1機能ユニットが前記第2機能ユニットと交換され得るレチクル取り扱い装置システム。
- 様々なタイプの機能の機能ユニットによってさらに特徴付けられる請求項4記載のレチクル取り扱い装置システム。
- 同じタイプの機能のいくつかの機能ユニットによってさらに特徴付けられる請求項4記載のレチクル取り扱い装置システム。
- 保管装置を、前記ハウジング内部のいくつかのレチクルの同時の中間保管用機能ユニットとして設けることをさらに特徴とする請求項4記載のレチクル取り扱い装置システム。
- 電子部品製造用の露光マスクを中間保管するレチクルストッカーであって、密閉されたハウジングを有し、前記ハウジング内に露光マスクの中間保管用に設けられている中間保管装置を有し、請求項1記載のレチクル取り扱い装置によって特徴付けられるレチクルストッカー。
- レチクル取り扱い装置であって、
内部に制御された環境を有することができるハウジングと、
前記ハウジングに接続されてレチクルを処理することができる少なくとも1つの処理モジュールと、
前記ハウジングに接続されて、前記少なくとも1つのモジュールと前記ハウジングの他の部分との間で前記レチクルを搬送する搬送装置と、
を含み、
前記少なくとも1つのモジュールが前記ハウジングに取り外し可能に接続することができ、前記少なくとも1つのモジュールが、前記モジュールを前記ハウジングに取り外し可能に接続することによって前記少なくとも1つのモジュールが前記ハウジング内で前記レチクルを処理することを可能とするインタフェースを有し、さらに前記少なくとも1つのモジュールが、各々が異なる所定の特徴を有しかつ前記ハウジングに接続できる多数の様々な交換可能なモジュールから選択可能であることを特徴とするレチクル取り扱い装置。 - 請求項9記載の統合レチクル取り扱い装置を含むことを特徴とする処理ツール。
- 少なくとも1つのリソグラフィツール、レチクルパターニングツール、ポッドストッカー、単一レチクルの搬送装置または複数レチクルの搬送装置のうちの少なくとも1つであることを特徴とする請求項10記載のツール。
- 前記ハウジングが前記ツールの別の部分と通じるようにその中に形成された開口部を有し、前記開口部が前記ハウジングと前記ツールのもう1つの部分との間で前記レチクルが通過可能な大きさになされており、前記ハウジングと前記ツールの前記別の部分との間で前記レチクルが前記開口部を通過するときに、前記ハウジング内部で制御された環境を維持するようなされていることを特徴とする請求項11記載のツール。
- 前記少なくとも1つのモジュールが、ガスベース、ウェットベース、または電磁放射線ベースのクリーニング方法のうちの少なくとも1つを用いて、前記レチクルをクリーニングするようなされていることを特徴とする請求項9記載の装置。
- 前記ハウジングがその中に不活性ガスまたは圧縮ガス空気を保持することができることを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記レチクル上の電荷または空気中の分子汚染のうちの少なくとも1つを検出するようなされた検出器を有することを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記レチクルの拡大目視検査用カメラを有することを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記少なくとも1つのモジュール内に位置するペリクル上のしるしを読み出すリーダーを有することを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記少なくとも1つのモジュール内に位置する前記レチクルまたはペリクルの平坦を検出する検出器を有することを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記ツールが使用されていないときオフラインのレチクル検証を実施するようなされていることを特徴とする請求項10記載のツール。
- 前記少なくとも1つのモジュールが、前記レチクルを試験し、前記ツールによって設けられる処理システムの完全性を検証するようなされていることを特徴とする請求項10記載のツール。
- 前記少なくとも1つのモジュールが、その中に前記レチクルを保存するようになされており、前記レチクルが極端紫外線露光レチクル、157mmレチクル、x線レチクル、またはSCALPELレチクルのうちの少なくとも1つであることを特徴とする請求項9記載の装置。
- 前記モジュールが、予知保全を実施し且つ前記レチクルが光に晒された回数を追跡するプログラミングを備えたプロセッサを有することを特徴とし、さらに前記プログラミングはレチクルの点検、クリーニングまたは処分の予測用実績モデルを含むことを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記少なくとも1つのモジュール内で温度または湿度の少なくとも1つを制御する制御装置を有することを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記ハウジングの前記少なくとも1つのモジュールからもう1つの部分へ前記レチクルを搬送する前に前記レチクルをあらかじめ調整するようなされていることを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記レチクルから粒子を集めるようなされていることを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、1つ以上のレチクルをバッファリングするようになされていることを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、前記レチクル上のしるしを刻むスクライビング装置を有することを特徴とする請求項9記載の装置。
- 前記少なくとも1つのモジュールが、ペリクルを取り付け且つ取り外すようになされていることを特徴とする請求項9記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH01328/02A CH695872A5 (de) | 2002-07-29 | 2002-07-29 | Reticle-Handhabungsvorrichtung. |
PCT/US2003/023445 WO2004017366A2 (en) | 2002-07-29 | 2003-07-29 | Reticle manipulating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006515111A JP2006515111A (ja) | 2006-05-18 |
JP4477496B2 true JP4477496B2 (ja) | 2010-06-09 |
Family
ID=31722373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004529197A Expired - Lifetime JP4477496B2 (ja) | 2002-07-29 | 2003-07-29 | レチクル取り扱い装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7699573B2 (ja) |
EP (1) | EP1540459B1 (ja) |
JP (1) | JP4477496B2 (ja) |
AU (1) | AU2003254198A1 (ja) |
CH (1) | CH695872A5 (ja) |
WO (1) | WO2004017366A2 (ja) |
Families Citing this family (20)
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JP4841939B2 (ja) * | 2005-11-22 | 2011-12-21 | 株式会社ディスコ | 半導体ウェハの加工装置 |
TWM304619U (en) * | 2006-04-28 | 2007-01-11 | Fortrend Taiwan Scient Corp | Nitrogen cabinet with distinguishing and inflating apparatuses |
JP4966693B2 (ja) * | 2007-02-28 | 2012-07-04 | 株式会社日立ハイテクノロジーズ | 試料搬送装置及び方法 |
US9177843B2 (en) * | 2007-06-06 | 2015-11-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Preventing contamination in integrated circuit manufacturing lines |
WO2009114193A2 (en) * | 2008-03-13 | 2009-09-17 | Fortrend Engineering Corporation | Bare reticle storage chamber and stocker |
US7962242B1 (en) * | 2008-03-18 | 2011-06-14 | N&K Technology Inc. | Automated spatial flipping apparatus and system for photomasks and photomasks with pellicles |
CN102870158B (zh) * | 2010-03-23 | 2016-05-18 | 泰拉丁公司 | 使用手动装载进行存储设备的成批转移 |
WO2012150644A1 (ja) * | 2011-05-02 | 2012-11-08 | 村田機械株式会社 | 自動倉庫 |
US9646858B2 (en) * | 2011-06-23 | 2017-05-09 | Brooks Automation, Inc. | Semiconductor cleaner systems and methods |
US9454158B2 (en) | 2013-03-15 | 2016-09-27 | Bhushan Somani | Real time diagnostics for flow controller systems and methods |
US10411431B2 (en) | 2015-11-12 | 2019-09-10 | LMD Power of Light Corporation | Infrared laser system |
US9786536B2 (en) * | 2015-12-07 | 2017-10-10 | Microchip Technology Incorporated | Reticle rack system |
JP6434443B2 (ja) * | 2016-04-15 | 2018-12-05 | ファナック株式会社 | ファイバレーザ発振器 |
US10607879B2 (en) | 2016-09-08 | 2020-03-31 | Brooks Automation, Inc. | Substrate processing apparatus |
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SG11202004931PA (en) * | 2017-11-27 | 2020-06-29 | Murata Machinery Ltd | Storage device |
KR102316946B1 (ko) * | 2019-12-17 | 2021-10-25 | 세메스 주식회사 | 스토커 및 이의 레티클 처리 방법 |
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-
2002
- 2002-07-29 CH CH01328/02A patent/CH695872A5/de not_active IP Right Cessation
-
2003
- 2003-07-29 EP EP03788279.2A patent/EP1540459B1/en not_active Expired - Lifetime
- 2003-07-29 AU AU2003254198A patent/AU2003254198A1/en not_active Abandoned
- 2003-07-29 WO PCT/US2003/023445 patent/WO2004017366A2/en active Application Filing
- 2003-07-29 US US10/628,980 patent/US7699573B2/en active Active
- 2003-07-29 JP JP2004529197A patent/JP4477496B2/ja not_active Expired - Lifetime
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US20040091341A1 (en) | 2004-05-13 |
WO2004017366A3 (en) | 2004-07-15 |
US7699573B2 (en) | 2010-04-20 |
AU2003254198A8 (en) | 2004-03-03 |
JP2006515111A (ja) | 2006-05-18 |
US20100292826A1 (en) | 2010-11-18 |
WO2004017366A2 (en) | 2004-02-26 |
EP1540459A4 (en) | 2006-03-01 |
EP1540459A2 (en) | 2005-06-15 |
US8425172B2 (en) | 2013-04-23 |
AU2003254198A1 (en) | 2004-03-03 |
CH695872A5 (de) | 2006-09-29 |
EP1540459B1 (en) | 2020-05-27 |
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