JP4475741B2 - 薄型積層電気部品の製造装置 - Google Patents
薄型積層電気部品の製造装置 Download PDFInfo
- Publication number
- JP4475741B2 JP4475741B2 JP2000155299A JP2000155299A JP4475741B2 JP 4475741 B2 JP4475741 B2 JP 4475741B2 JP 2000155299 A JP2000155299 A JP 2000155299A JP 2000155299 A JP2000155299 A JP 2000155299A JP 4475741 B2 JP4475741 B2 JP 4475741B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- station
- support material
- conductive
- pitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 239000004020 conductor Substances 0.000 claims description 164
- 239000000463 material Substances 0.000 claims description 106
- 229920000642 polymer Polymers 0.000 claims description 21
- 210000000078 claw Anatomy 0.000 claims description 15
- 238000006116 polymerization reaction Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 239000011230 binding agent Substances 0.000 claims description 13
- 238000011144 upstream manufacturing Methods 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 238000011084 recovery Methods 0.000 claims description 5
- 238000012840 feeding operation Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 description 36
- 239000010408 film Substances 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 12
- 238000004804 winding Methods 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 230000009975 flexible effect Effects 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000000875 corresponding effect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000155299A JP4475741B2 (ja) | 2000-05-25 | 2000-05-25 | 薄型積層電気部品の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000155299A JP4475741B2 (ja) | 2000-05-25 | 2000-05-25 | 薄型積層電気部品の製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001338539A JP2001338539A (ja) | 2001-12-07 |
| JP2001338539A5 JP2001338539A5 (enExample) | 2007-03-29 |
| JP4475741B2 true JP4475741B2 (ja) | 2010-06-09 |
Family
ID=18660266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000155299A Expired - Lifetime JP4475741B2 (ja) | 2000-05-25 | 2000-05-25 | 薄型積層電気部品の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4475741B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023145440A1 (ja) * | 2022-01-31 | 2023-08-03 | 株式会社プロテリアル | フィルム配線の製造方法 |
-
2000
- 2000-05-25 JP JP2000155299A patent/JP4475741B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001338539A (ja) | 2001-12-07 |
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