JP4471015B2 - 電子素子パッケージ - Google Patents
電子素子パッケージ Download PDFInfo
- Publication number
- JP4471015B2 JP4471015B2 JP2008099061A JP2008099061A JP4471015B2 JP 4471015 B2 JP4471015 B2 JP 4471015B2 JP 2008099061 A JP2008099061 A JP 2008099061A JP 2008099061 A JP2008099061 A JP 2008099061A JP 4471015 B2 JP4471015 B2 JP 4471015B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- substrate
- device package
- adhesive
- container member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 29
- 230000001070 adhesive effect Effects 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 8
- 239000003230 hygroscopic agent Substances 0.000 claims description 5
- 239000002923 metal particle Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 45
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000007789 sealing Methods 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000010897 surface acoustic wave method Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Description
ッキを利用することメッキ層である金属膜を容易に形成することができる。さらに、接着剤3に銀粒子が含まれているため、接着剤3の外側の表面においてニッケルメッキ層が安定して成長しやすく(メッキが乗りやすく)、金属膜をより容易に形成することができる。
2 カバー部材
3 接着剤
4 被膜
9 基板
21 鍔部
22 吸湿剤
23 凹部
71 半導体素子
90 内部空間
S11〜S14 ステップ
Claims (5)
- 電子素子パッケージであって、
電子素子と、
前記電子素子が収納される空間を形成する第1の容器部材および第2の容器部材と、
樹脂を主成分とし、前記第1の容器部材と前記第2の容器部材とを接着して前記空間を密閉する接着剤と、
前記接着剤の外側の表面を覆う金属膜と、
を備え、
前記電子素子が前記第1の容器部材に実装され、
前記第1の容器部材が平坦な部材であり、
前記第2の容器部材は前記第1の容器部材を覆う凹部を有し、前記凹部の縁に前記空間側へ向いて形成された鍔部は前記接着剤を介して前記第1の容器部材に接着され、
前記第2の容器部材の外側の表面も金属膜により覆われていることを特徴とする電子素子パッケージ。 - 請求項1に記載の電子素子パッケージであって、
前記金属膜がメッキ層であることを特徴とする電子素子パッケージ。 - 請求項2に記載の電子素子パッケージであって、
前記接着剤が、金属粒子を含むことを特徴とする電子素子パッケージ。 - 請求項1ないし3のいずれかに記載の電子素子パッケージであって、
前記電子素子が半導体素子であることを特徴とする電子素子パッケージ。 - 請求項1ないし4のいずれかに記載の電子素子パッケージであって、
前記空間内に吸湿剤をさらに備えることを特徴とする電子素子パッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008099061A JP4471015B2 (ja) | 2008-04-07 | 2008-04-07 | 電子素子パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008099061A JP4471015B2 (ja) | 2008-04-07 | 2008-04-07 | 電子素子パッケージ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003407232A Division JP4134893B2 (ja) | 2003-12-05 | 2003-12-05 | 電子素子パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008177610A JP2008177610A (ja) | 2008-07-31 |
JP4471015B2 true JP4471015B2 (ja) | 2010-06-02 |
Family
ID=39704337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008099061A Expired - Lifetime JP4471015B2 (ja) | 2008-04-07 | 2008-04-07 | 電子素子パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4471015B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5673850B2 (ja) | 2012-04-23 | 2015-02-18 | 株式会社村田製作所 | 水晶振動装置及びその製造方法 |
WO2020049732A1 (ja) * | 2018-09-07 | 2020-03-12 | 三菱電機株式会社 | 気密パッケージ |
-
2008
- 2008-04-07 JP JP2008099061A patent/JP4471015B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2008177610A (ja) | 2008-07-31 |
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