JP4463000B2 - 高周波線路−導波管変換器 - Google Patents
高周波線路−導波管変換器 Download PDFInfo
- Publication number
- JP4463000B2 JP4463000B2 JP2004142700A JP2004142700A JP4463000B2 JP 4463000 B2 JP4463000 B2 JP 4463000B2 JP 2004142700 A JP2004142700 A JP 2004142700A JP 2004142700 A JP2004142700 A JP 2004142700A JP 4463000 B2 JP4463000 B2 JP 4463000B2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric layer
- waveguide
- layer
- ground conductor
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 219
- 238000006243 chemical reaction Methods 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 15
- 239000003989 dielectric material Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000008859 change Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 230000005672 electromagnetic field Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000006112 glass ceramic composition Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 230000005428 wave function Effects 0.000 description 1
Images
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- Waveguides (AREA)
Description
2・・・・・第一の誘電体層
3・・・・・線路導体
4・・・・・同一面接地導体層
5・・・・・スロット
6・・・・・導波管
7・・・・・シールド導体部
8・・・・・下部接地導体層
9・・・・・上部接地導体層
10・・・・第二の誘電体層
12・・・・内部接地導体層
13・・・・貫通導体
Claims (5)
- 第一の誘電体層と、
前記第一の誘電体層の下面に設けられた第二の誘電体層と、
前記第一の誘電体層の上面に設けられた高周波線路と、
前記高周波線路と電磁的に結合されており、前記第一の誘電体層の前記上面に設けられたスロットと、
前記スロットに対向する開口部を有しており、前記第二の誘電体層の内部に設けられた接地導体層と、
前記スロットと前記接地導体層の前記開口部との間の領域を囲んでおり、前記接地導体層に電気的に接続された複数のシールド導体と、
前記第二の誘電体層を取り囲んでおり、前記第一の誘電体層の前記下面に設けられた導波管と、
を備えた高周波線路―導波管変換器。 - 前記第二の誘電体層は、予め成形されており、前記第一の誘電体層の前記下面に接合されていることを特徴とする請求項1記載の高周波線路−導波管変換器。
- 前記接地導体層は、開口部を有しており前記第一の誘電体層の前記下面に形成された下部接地導体層と、開口部を有しており前記第二の誘電体層の前記上面に形成された上部接地導体層とからなることを特徴とする請求項2記載の高周波線路−導波管変換器。
- 前記上部接地導体層の前記開口部の面積は、前記下部接地導体層の前記開口部の面積より大きいことを特徴とする請求項3記載の高周波−導波管変換器。
- 前記下部接地導体層の前記開口部に露出した前記第一の誘電体層の前記下面と、前記上部接地導体層の前記開口部に露出した前記第二の誘電体層の前記上面との間に空隙を有することを特徴とする請求項3記載の高周波−導波管変換器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004142700A JP4463000B2 (ja) | 2004-05-12 | 2004-05-12 | 高周波線路−導波管変換器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004142700A JP4463000B2 (ja) | 2004-05-12 | 2004-05-12 | 高周波線路−導波管変換器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005328188A JP2005328188A (ja) | 2005-11-24 |
JP2005328188A5 JP2005328188A5 (ja) | 2007-06-28 |
JP4463000B2 true JP4463000B2 (ja) | 2010-05-12 |
Family
ID=35474206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004142700A Expired - Fee Related JP4463000B2 (ja) | 2004-05-12 | 2004-05-12 | 高周波線路−導波管変換器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4463000B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007235235A (ja) * | 2006-02-27 | 2007-09-13 | Kyocera Corp | 開口面アンテナ |
JP4606351B2 (ja) * | 2006-03-09 | 2011-01-05 | 京セラ株式会社 | 高周波線路−導波管変換器 |
-
2004
- 2004-05-12 JP JP2004142700A patent/JP4463000B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
---|---|
JP2005328188A (ja) | 2005-11-24 |
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