JP4459847B2 - Component mounting head and component mounting method - Google Patents

Description

  The present invention relates to a component mounting head and a component mounting method for mounting a component holding member for releasably holding a component in an aligned arrangement, and mounting the component held by each component holding member on a circuit board. The present invention relates to a component mounting head and a component mounting method in which a component imaging device for capturing an image of a holding posture of the component by the component holding member is used.

  Conventionally, various types of component mounting heads or component mounting methods are known. In such component mounting, an image of a component sucked and held by a suction nozzle that is a component holding member is picked up by a component imaging device, the suction holding posture of the component is recognized from the picked-up image, and the recognition result Based on the above, the suction holding posture is corrected, and the mounting operation of the component on the board is performed. Further, the component imaging device provided in the component mounting head that performs such a series of component mounting operations includes an imaging camera for capturing an image of the component, and a component that is an imaging target at the time of the imaging. And an illumination unit that irradiates with a light amount necessary for the imaging.

  2. Description of the Related Art In recent years, electronic circuits formed by mounting components on a substrate have been increased in density and functionality, and accordingly, mounting accuracy in mounting components has been demanded. For this reason, it is necessary to recognize the component with high accuracy when mounting the component, and accordingly, it is possible to stably set the illuminance and light amount of the light irradiated when imaging the component to predetermined values. There is a need.

  For this reason, conventionally, the illuminance and light intensity (or collectively referred to as luminance) of light emitted from the illumination unit provided in the component imaging device is periodically measured to detect an abnormality of the illumination unit at an early stage. The maintenance is done regularly. As a method for measuring luminance in such a conventional lighting unit, for example, there is a method described in Patent Document 1. A method of measuring luminance in such a conventional lighting unit will be specifically described below with reference to a schematic explanatory diagram of the component mounting apparatus shown in FIG.

  As shown in FIG. 16, in a conventional component mounting apparatus 500, nozzles 502 that hold components are arranged circumferentially, and a rotary table 501 that can rotate intermittently, and a holding posture of components held by the nozzles 502 are recognized. And a lighting unit 505 that illuminates the surface of the component that can be imaged by the recognition camera 504. Further, the component mounting apparatus 500 includes a reflection plate 503 disposed and fixed in a part of the imaging field of the recognition camera 504, an illuminance measurement unit that measures the illuminance of the reflection plate 503 with the recognition camera 504, and And a warning generating unit that generates a warning when the measurement result is out of a predetermined range.

  Since the component mounting apparatus 500 has such a configuration, when the image of the component held by the nozzle 502 is captured by the recognition camera 504, a reflector disposed in a part of the imaging field of view. The illuminance measurement unit can measure the illuminance by capturing an image of the reflected light of the light emitted from the illumination unit 505 with respect to the 503.

JP 2000-36697 A

  In the conventional component mounting apparatus, the reflection plate 503 is disposed in a part of the imaging field of the recognition camera 504, and only the luminance of illumination in a partial region in the imaging field of view can be measured. For this reason, the luminance of the illumination in the entire imaging field is estimated based on the luminance of the illumination in a partial area in the imaging field, and the quality of the luminance is determined.

  However, the partial measurement within the imaging field has a problem that the amount of reflected light is small, the measurement result is likely to be influenced by external factors, and the measurement is not stable.

  In recent years, LEDs have been increasingly used as light sources used in such illumination units. However, due to the characteristics of LEDs, there are variations in light quantity and lifetime in each individual light source. In the measurement method in which the entire state is estimated by the partial measurement as described above, there is a problem that the measurement result becomes unstable and inaccurate, and reliable measurement cannot be performed.

  In particular, in the imaging field of view, even if the luminance near the center and the surrounding area is more important, the measurement can only be performed with a configuration that can measure only the field near the edge of the imaging field. May not be possible.

  In addition to the method for measuring the luminance of the illumination as described above, the reflecting plate is sucked and held by the suction nozzle, and the reflecting plate in the holding state is irradiated with light, and an image formed by the reflected light is displayed. There is also a method for measuring the brightness of the illumination by taking an image. However, in such a method, there is a problem that it is necessary to suck and hold the reflection plate on the suction nozzle, which takes time for measurement and cannot perform efficient measurement.

  Accordingly, an object of the present invention is to provide a component mounting head and a component mounting method capable of reliably and efficiently measuring illuminance in a component imaging device used in component mounting, in order to solve the above problems. There is.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the component mounting head includes a plurality of component holding members that hold the components in a releasable manner, and that mounts the components held by the component holding members on the circuit board. In
An illumination device that irradiates light from the direction along the axis of the component holding member with respect to the components held by each of the component holding members;
A component imaging device capable of imaging an image of each of the components formed by the light irradiated by the illumination device in a direction along the axis of the component holding member;
It is arranged adjacent to the component holding member at one end in the arrangement direction of the respective component holding members, and is formed by reflected light of light emitted by the illumination device in a direction along the axis of the component holding member. A reflective member that reflects the light so that an image can be captured in the imaging field of view of the component imaging device;
An imaging moving device that integrally moves the component imaging device and the illumination device between the imaging position of the reflecting member and the imaging position of the component held by the component holding member at the other end;
The illumination device and the component imaging device can be controlled so that an image of the reflecting member formed by the reflected light of the irradiated light can be captured, and the reflected light is reflected based on the captured image. Compares the illuminance measurement means that measures illuminance with the illuminance measurement result by the illuminance measurement means and the illuminance reference range data, and outputs an illuminance abnormality warning when the measurement result exceeds the illuminance reference range data A component mounting head comprising a control device having an illuminance abnormality warning output means.

According to a second aspect of the present invention, in the control device, the illuminance measuring means measures the illuminance of the reflected light in the entire imaging field based on the captured image. A component mounting head is provided.

According to the third aspect of the present invention, the apparatus further comprises a board imaging device that takes an image on the component mounting surface of the circuit board in the direction along the axis of the component holding member.
The substrate imaging device is
A light irradiation unit that irradiates light for imaging the component mounting surface of the circuit board that is the imaging target;
A diffusion plate that is disposed between the light irradiation unit and the imaging target, diffuses the irradiated light, and transmits the light to irradiate the imaging target;
The component mounting head according to the first aspect or the second aspect, in which the diffusion plate is used as the reflection member.

According to the fourth aspect of the present invention, the diffuser plate is a reflective region having a size capable of reflecting the light emitted from the illumination device at the imaging position in the entire imaging field of the component imaging member. The component mounting head according to the third aspect is provided.

  According to the fifth aspect of the present invention, the control device measures the adjusted illuminance using the reflecting member by the illuminance measuring means for the illuminating device in a state where the illuminance is adjusted, A component mounting head according to any one of the first to fourth aspects is provided, comprising a storage unit for storing the illuminance measurement result as the illuminance reference range data.

According to the sixth aspect of the present invention, in the control device,
The illuminance measuring means can calculate an average value of illuminance in the entire imaging field as the measurement result of the illuminance,
The storage unit can store, as the illuminance reference range data, an average value of the adjusted illuminance in the entire imaging field calculated by the illuminance measurement unit,
The illuminance abnormality warning output means determines whether or not the illuminance reference range data is exceeded by comparing the average illuminance calculated by the illuminance measurement means with the average illuminance value in the illuminance reference range data. A component mounting head according to a fifth aspect is provided.

According to the seventh aspect of the present invention, the lighting device comprises:
A first light irradiation unit that irradiates a first light along a direction along the axis of the component holding member;
A second light irradiation unit that emits second light along a direction inclined from the direction along the axis,
The control device includes a first image formed by reflected light of the first light emitted from the component imaging device toward the diffusion plate by the first light irradiation unit, and the second image. The second image formed by the reflected light of the second light irradiated toward the diffusion plate by the light irradiation unit is individually captured, and the captured first image and second Based on the image, the illuminance measurement means measures the illuminance of each reflected light, and the illuminance abnormality warning output means either illuminance measurement result exceeds the illuminance reference range data. In such a case, the component mounting head according to the third aspect is provided to output the illuminance abnormality warning.

According to the eighth aspect of the present invention, a plurality of component holding members that are arranged in an aligned manner and releasably hold the components, and the component holding member shafts with respect to the components held by the respective component holding members. An illuminating device that emits light from a direction along the center, and a component imaging device that can capture an image of each of the components formed by the light irradiated by the illuminating device in a direction along the axis of the component holding member By using the component mounting head comprising the above, the illumination device and the component imaging device are integrally moved along the arrangement direction of the respective component holding members, and images of the respective components are captured, In the component mounting method of mounting the component on the circuit board while correcting the holding posture of each component based on the imaging result,
With respect to the reflecting member disposed adjacent to the component holding member at one end in the arrangement direction of the respective component holding members, the light irradiated by the illumination device in the direction along the axis of the component holding member Capture an image formed by reflected light,
Based on the captured image, measure the illuminance of the reflected light,
Compare the measurement result of the illuminance with the illuminance reference range data, and output an illuminance abnormality warning when the measurement result exceeds the illuminance reference range data,
When the measurement result is within the illuminance reference range data, there is provided a component mounting method characterized in that the component mounting operation by the component mounting head can be started.

According to the ninth aspect of the present invention, when capturing an image formed by the reflected light of the light irradiated by the illumination device, the entire imaging field of view of the component imaging device is imaged.
Based on the captured image, measure the illuminance of the reflected light in the entire imaging field,
The component mounting method according to the eighth aspect is provided for comparing the measurement result with the illuminance reference range data.

According to a tenth aspect of the present invention, the component mounting head further includes a board imaging device that captures an image on the component mounting surface of the circuit board in a direction along the axis of the component holding member.
The substrate imaging device is
A light irradiation unit that irradiates light for imaging the component mounting surface of the circuit board that is the imaging target;
A diffusion plate that is disposed between the light irradiation unit and the imaging target, diffuses the irradiated light, and transmits the light to irradiate the imaging target;
The diffusing plate is used as the reflecting member, and the illumination device irradiates the diffusing plate with light, thereby measuring the illuminance of the reflected light of the diffusing plate according to the eighth aspect or the ninth aspect. Provide a component mounting method.

  According to the eleventh aspect of the present invention, the adjusted illuminance is measured by capturing the image using the reflective member with respect to the illumination device in a state where the illuminance is adjusted, and the illuminance measurement is performed. The component mounting method according to any one of the eighth aspect to the tenth aspect, in which the result is the illuminance reference range data.

According to the twelfth aspect of the present invention, the axis of the component holding member with respect to the first reflecting member disposed adjacent to the component holding member at one end in the arrangement direction of the respective component holding members. A first image formed by the reflected light of the light irradiated by the illumination device in the direction along the image is taken in the entire imaging field of the component imaging device;
At the same time, in the direction along the axial center of the component holding member, the second reflecting member disposed adjacent to the component holding member at the other end in the arrangement direction of the respective component holding members. The second image formed by the reflected light of the light irradiated by the illumination device is imaged in the entire imaging field of view of the component imaging device,
Based on the captured first image and second image, the illuminance of the reflected light of the first reflecting member and the illuminance of the reflected light of the second reflecting member in the entire imaging field are measured. ,
The eighth aspect to the eleventh aspect, in which the respective illuminance measurement results and the illuminance reference range data are compared and an illuminance abnormality warning is output when both of the respective measurement results exceed the illuminance reference range data. A component mounting method according to any one of the above is provided.

According to the thirteenth aspect of the present invention, based on the output of the illuminance abnormality warning, the illuminance is adjusted in the illumination device,
The component mounting method according to any one of the eighth to twelfth aspects is provided, in which the component mounting head can start the mounting operation of the respective components on the circuit board after the adjustment is completed.

According to the fourteenth aspect of the present invention, when the illuminance abnormality warning is output, the component holding member holds the reflector,
Irradiate light in the direction along the axis by the lighting device to the held reflector,
Taking an image formed by the reflected light on the reflector,
The component mounting method according to any one of the eighth aspect to the twelfth aspect, in which the illuminance of the lighting device is measured again based on the image.

  According to the present invention, in the case of diagnosing the illuminance, luminance, and light quantity of the illumination device included in the component imaging device, the imaging position of the reflecting member disposed adjacent to the component holding member at one end is used. Illumination measurement can be performed based on the image by positioning the illumination device, irradiating the reflective member with light, and capturing an image formed by the reflected light with the component imaging device.

  Specifically, based on the image data formed by the reflected light, illuminance is measured by the illuminance measurement means provided in the control device, and the measurement result exceeds the illuminance reference range data by the illuminance abnormality warning output means. By determining whether or not the image is captured, it is possible to reliably determine the quality of the illuminance state of the captured image.

  In addition, with such a configuration, there is no need to measure the illuminance more easily and efficiently without the need to measure the illuminance using the reflector by sucking and holding the reflector to the suction nozzle as in the conventional measurement method. It can be performed.

  In addition, by locating substantially the entire imaging field of the component imaging device with respect to the reflecting member and acquiring an image in the almost entire imaging field, the illuminance is measured in almost the entire imaging field. Can do. In particular, since the LED used as the light source has a characteristic that its life varies, it is possible to determine the overall illuminance with a partial image of the imaging field as in the past. Although the reliability of measurement is lowered, stable and reliable illuminance measurement can be realized with a simpler configuration by measuring the illuminance over substantially the entire imaging field as in the present invention.

  Further, as the reflection member that reflects light used for performing such illuminance measurement, the illuminance can be obtained by using a diffuser plate included in a board imaging device that is generally provided in a component mounting head. Efficient illuminance measurement can be realized by the hardware and software configuration of the control device without installing a new equipment configuration for measurement.

  Further, by using the diffusion plate in this way, it is possible to measure the illuminance with respect to the light irradiated from various directions, which is suitable for the illuminance measurement with respect to the illumination device of the component imaging device. Can be.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 shows a schematic side view (with a partial cross section) of a head unit 100 which is an example of a component mounting head according to an embodiment of the present invention.

  As shown in FIG. 1, the head unit 100 is a suction nozzle 11 that is an example of a component holding member that can releasably hold an electronic component 1 that is an example of a component on a holding surface 11 a that is a tip of the electronic component 1. A plurality of, for example, 8, are arranged in a line at a constant interval pitch. Note that the head unit 100 is not limited to the case where the suction nozzles 11 are arranged in a row in this way, and may be a case in which they are arranged in a plurality of rows, for example.

  Such a head unit 100 is provided in an XY robot or the like in an electronic component mounting apparatus (not shown), thereby performing an electronic component mounting operation on a circuit board held on the stage of the electronic component mounting apparatus. be able to. Specifically, the plurality of electronic components 1 supplied by the electronic component supply unit in the electronic component supply apparatus are sucked and held by the respective suction nozzles 11 included in the head unit 100, and the head unit 100 is driven by the XY robot. Is moved above the circuit board to align the mounting position of the electronic component 1 on the circuit board with the electronic component 1 sucked and held by the suction nozzle 11 of the head part 100, and then the head part. By lowering the suction nozzle 11 at 100, the electronic component 1 can be mounted at the mounting position of the circuit board.

  When such an electronic component 1 is mounted, an image of the electronic component 1 sucked and held by each suction nozzle 11 of the head unit 100 is picked up by a component image pickup device provided in the head unit 100, and each electronic component 1 is picked up. The suction holding posture of the component 1 is recognized, and based on these recognition results, the positional deviation between the respective suction holding posture and the mounting posture of each electronic component 1 on the circuit board is corrected, respectively. The electronic component 1 is mounted on the circuit board.

  The structure of the head unit 100 will be described in detail below, focusing on the structure of the component imaging device. FIG. 2 is a schematic cross-sectional view along a plane orthogonal to the arrangement direction of the suction nozzles 11 of the head unit 100.

  As shown in FIGS. 1 and 2, in the head portion 100, eight shaft portions 51 are arranged in a line at a constant interval, and the suction nozzle 11 is disposed at the tip of each shaft portion 51. Each is detachably equipped. Each shaft portion 51 is supported on a head frame 52 formed of a rigid body through a spline nut, a bearing, and the like so as to be able to move up and down along its axis and to be rotatable around the axis. . Further, the head unit 100 includes an elevating device 53 that performs the elevating operation of each shaft unit 51 and a rotating device 54 that performs the rotating operation. The elevating device 53 and the rotating device 54 are heads. It is fixed to the frame 52. Each lifting / lowering device 53 includes a mechanism using a ball screw shaft and a nut portion (used in this embodiment), which is a mechanism generally used in such a head portion, and a mechanism using an air cylinder. Etc. can be used. In addition, a mechanism for rotating the shaft portion 51 via a belt (used in the present embodiment), a mechanism for directly rotating the shaft portion 51, or the like can be used for each rotating device 54.

  Further, as shown in FIGS. 1 and 2, each suction nozzle 11 provided in the head unit 100 has a holding surface 11 a that is a tip part thereof exposed from a lower frame 52 a that is a lower part of the head frame 52. It is in a state. The lower frame is provided with a component imaging device 20 that can capture an image of a mounting surface on a circuit board on the lower surface side of the electronic component 1 held by the suction nozzle 11. A partial enlarged cross-sectional view of the component imaging apparatus 20 is shown in FIG.

  As shown in FIG. 3, the component imaging device 20 is arranged on the left side of the respective suction nozzles 11 in the figure, and the two suction mirrors 21 and 22 are arranged on the optical axis of the suction nozzles 11. An image pickup camera 23 is provided that can pick up an image of the electronic component 1 sucked and held on the holding surface 11a from the lower side of the drawing, that is, an image of the mounting surface of the electronic component 1. In addition, the component imaging device 20 includes an imaging frame 24 having a substantially U-shaped cross-sectional shape arranged so as to surround the suction nozzle 11 without interfering with the suction nozzle 11, and the imaging camera 23, The reflecting mirrors 21 and 22 are fixed to the imaging frame 24 in a state in which the respective arrangement relations are maintained.

  As shown in FIG. 3, the imaging camera 23 is arranged downward in the figure with its optical axis inclined about 40 degrees toward the suction nozzle 11 side with respect to the axis of the suction nozzle 11. ing. Further, the reflection mirror 21 arranged on the left side of the drawing is arranged with its reflection surface inclined toward the suction nozzle 11 on the optical axis and inclined by about 65 degrees with respect to the axis. The reflection mirror 22 disposed on the right side is inclined at approximately 45 degrees with respect to the axis so that the reflection surface of the reflection mirror 22 faces the reflection surface of the reflection mirror 21, and suction on the axis of the suction nozzle 11. It arrange | positions so that it may be located under the nozzle 11. FIG.

  Also, as shown in FIGS. 1 and 3, the component imaging device 20 faces each other through the suction nozzles 11 along the arrangement direction of the suction nozzles 11 provided in the head unit 100. , Two linear guide rails 25 having an elongated bar shape fixed to the lower surface of the lower frame 52a are provided, and each of the linear guide rails 25 has the substantially U-shaped cross-sectional shape of the imaging frame 24. The linear guide sliders 26 having a substantially concave cross-sectional shape fixed to the upper end of each are engaged. In addition, each linear guide slider 26 is engaged with each linear guide rail 25 and extends along the longitudinal direction of each linear guide rail 25 (that is, the arrangement direction of each suction nozzle 11). The slide movement is possible. That is, the imaging frame 24 that fixes and supports the imaging camera 23 and the respective reflection mirrors 21 and 22 is supported by the lower frame 52a via the respective linear guide sliders 26 and the respective linear guide rails 25. In addition, while being guided by the respective linear guide rails 25, it is possible to slide along the direction in which the respective suction nozzles 11 are arranged.

  Further, as shown in FIGS. 1 and 3, the component imaging apparatus 20 slides the imaging frame 24 along the arrangement direction of the respective suction nozzles 11 while being guided by the respective linear guide rails 25. The slide drive unit 27 is provided as an example of the apparatus. The slide drive unit 27 includes a drive motor 28. The drive motor 28 is driven to rotate in either the forward or reverse rotation direction, whereby the above-described arrangement of the imaging frames 24 is provided. It is possible to perform sliding movement (reciprocating movement) along the direction.

  Further, as shown in FIGS. 1 and 3, the slide drive unit 27 includes a drive belt 29 that is engaged with the drive shaft of the drive motor 28 and can travel by the rotational drive of the drive motor 28. The drive belt 29 is disposed along the arrangement direction of the suction nozzles 11, and a part of the drive belt 29 is fixed to an arm 24 a that is a portion protruding upward in the upper right of the imaging frame 24 in FIG. 3. Thereby, the slide drive of the imaging frame 24 is enabled by the rotational drive of the drive motor 28 via the drive belt 29 and the arm 24a.

  Further, the range of the slide movement of the imaging frame 24 by the slide drive unit 27 is from the position of the imaging frame 24 on the left side (shown in the solid line in the figure) shown in FIG. ), And further includes an illuminance measurement position (or an illuminance measurement position adjacent to each end) that is adjacent to the suction nozzle 11 at one end, as will be described later. It is a range. Therefore, the sliding movement of the imaging frame 24 is possible so that all the eight suction nozzles 11 included in the head unit 100 pass through the inside of the imaging frame 24 in the substantially U-shaped cross section.

  In addition, since the imaging frame 24 is slidable in this way, the imaging camera 23 and the reflection mirrors 21 and 22 fixed to the imaging frame 24 have a positional relationship with the imaging frame 24. The slide movement is possible in a held state. As a result, the respective electronic components 1 sucked and held by the holding surfaces 11a of the eight suction nozzles 11 included in the head unit 100 are lowered by the imaging camera 23 via the reflecting mirrors 21 and 22, respectively. It is possible to take an image from the side (that is, the direction along the axis of the suction nozzle 11).

  In the component imaging device 20, a plurality of illumination units that can irradiate light along the optical axis of the imaging camera 23 and irradiate the electronic component 1 sucked and held by the suction nozzle 11. In the state where these illumination units are turned on, images of the respective electronic components 1 are taken.

  As shown in FIG. 1, the head unit 100 includes a control unit 9 that controls the operation of the component imaging apparatus 20. In the component imaging apparatus 20, the control unit 9 controls the imaging operation of the imaging camera 23, including the lighting / extinguishing operation control of each illumination unit and the imaging timing control, the driving operation of the drive motor 28, and the respective linear guide rails 25. It is possible to control the operation of the slide drive unit 27 including the detection of the slide movement position of the imaging frame 24 above.

  Next, FIG. 4 is a schematic enlarged partial cross-sectional view of the component imaging device 20 with respect to the configuration of an illumination unit (illumination device) that irradiates light necessary for capturing an image of the electronic component 1 included in the component imaging device 20. 4 will be described with reference to FIG. 5 which is a view taken along line AA in FIG.

  As shown in FIG. 4, the component imaging device 20 has each suction nozzle having an optical axis T as an axis different from the axis S of each suction nozzle 11 provided in the head unit 100 (that is, an axis that does not match each other). The image in the direction along the axis S of the electronic component 1 attracted and held by 11 is reflected in the direction along the optical axis T by the reflection mirror 21 via the reflection mirror 22 and incident along the optical axis T. , An imaging camera 23 for capturing each image is provided.

  In addition, the electronic component 1 sucked and held by each suction nozzle 11 may have a lower surface that is a mounting surface to the circuit board (a plane perpendicular to the axis S and a mounting plane). ) As Q, the image is picked up by the image pickup camera 23. At the time of the image pickup, light is irradiated from a plurality of directions in order to give the mounting surface Q illuminance necessary for image pickup. Become. As an illuminating unit for irradiating such light, light slightly inclined from the horizontal direction (light in a substantially horizontal direction) with respect to the mounting surface Q of the electronic component 1 is passed through the reflection mirrors 21, 22 and the like. Without irradiating the electronic component 1 directly with the horizontal light irradiating unit 61 and the vicinity of the imaging camera 23, the light substantially irradiating the optical axis T is radiated, and the light passes through the reflecting mirrors 21 and 22 to the axis. Reflected in the direction along the center S and irradiates the light in a substantially vertical direction with respect to the mounting surface Q of the electronic component 1, and the horizontal with respect to the component imaging surface Q of the electronic component 1. A main irradiating unit 62 which is an example of an inclined light irradiating unit that directly irradiates the electronic component 1 with light inclined at a substantially intermediate angle between the vertical direction and the vertical direction without passing through the reflecting mirrors 21, 22, etc. The component imaging device 20 is provided. The horizontal light irradiation unit 61 can irradiate the mounting surface Q with light inclined at, for example, about 10 to 20 degrees, and the vertical light irradiation unit 60 can apply the light to the mounting surface Q, for example, The main irradiation part 62 can irradiate light inclined about 40 to 50 degrees with respect to the mounting surface Q. Further, as shown in FIG. 4, the horizontal light irradiation unit 61 and the main irradiation unit 62 are attached and fixed to the imaging frame 24 so as to be arranged in the vicinity of the mounting surface Q, so that the vertical light irradiation is performed. The unit 60 is attached and fixed to the imaging frame 24 so as to be disposed in the vicinity of the imaging camera 23.

  As shown in FIGS. 4 and 5, the main irradiating unit 62 includes a plurality of illuminations arranged symmetrically and facing each other with the axis S of the suction nozzle 11 in an imageable state as the axis of symmetry. The horizontal light irradiating unit 61 includes a plurality of illuminating units 61a arranged symmetrically and facing each other with the axis as a symmetric axis. (For example, it is comprised by LED etc.). As shown in FIG. 5, each of the illuminating units 61 a and 62 a has a light passing region U in a substantially vertical direction by the vertical light irradiation unit 60 formed on and around the axis S of the suction nozzle 11, in other words, The electronic component 1 is arranged in the vicinity of the outer periphery of the passage area U of the image of the mounting surface Q of the electronic component 1. Specifically, as shown in FIG. 5, the main irradiating unit 62 includes, for example, two sets of the illuminating units 62a that are symmetrical and face each other (that is, a total of four illuminating units 62a). The horizontal light irradiation unit 61 includes, for example, two sets of the illuminating units 61a that are symmetrical and face each other (that is, a total of four illuminating units 61a). Further, on the plane along the mounting surface Q, the respective illumination units 62a of the main irradiating unit 62 are arranged in the X-axis direction and the Y-axis direction in the drawing, and are approximately 45 with respect to the X-axis direction in the drawing. Each set of illuminating units 61a of the horizontal light irradiating unit 61 is arranged in each of the directions inclined at a predetermined angle. That is, the illumination part 62a of the main irradiation part 62 and the illumination part 61a of the horizontal light irradiation part 61 are alternately arranged at an angle pitch of approximately 45 degrees. In FIG. 5, the height position of the upper end of each illumination unit 62 a arranged in the X-axis direction in the figure is the mounting surface Q of the electronic component 1 held by suction by the suction nozzle 11 in an imageable state. Therefore, even if the component imaging device 20 and each suction nozzle 11 are moved relative to each other in the X-axis direction in the drawing, each electronic component 1 and each illumination are provided. Interference with the part 62a does not occur. In other words, the electronic component 1 can be picked up by the component imaging device 20 and has a formation height that does not cause the interference with the component imaging device 20. It can also be said.

Further, as shown in FIG. 4 , the vertical light irradiation unit 60 has a hole 60b formed in the center so that an image along the optical axis T can pass through, and around the hole 60b. A plurality of illumination units 60a (for example, configured by LEDs or the like) are installed. In FIG. 4, a mirror image of the reflection mirror 21 and the vertical light irradiation unit 60 is shown by a virtual line (two-dot chain line) below the imaging frame 24. Each of the reflection mirrors 21 and 22 is capable of reflecting light emitted from the vertical light irradiation unit 60 evenly and reflecting the image of the electronic component 1 on the mounting surface Q evenly. Is formed.

  Further, in the control unit 9, based on the images of the respective electronic components 1 captured by the component imaging device 20, the electrons generated by the respective suction nozzles 11 along the direction substantially orthogonal to the axis of the respective suction nozzles 11. The suction holding posture of the component 1 can be recognized. In addition, the control part 9 can control the raising / lowering operation | movement of each raising / lowering apparatus 53 with which the head part 100 is provided, and the rotation operation | movement of each rotating apparatus 54. FIG. Further, the control unit 9 changes the light irradiation / irradiation stop operation by the horizontal light irradiation unit 61, the main irradiation unit 62, and the vertical light irradiation unit 60 to the movement operation of the imaging frame 24 during the above imaging. It is possible to control in relation to each other.

  Further, in the head unit 100, a board mark (an example of a predetermined position on the circuit board) serving as a reference for determining the mounting position of the electronic component 1 on the circuit board and an image of the mounting position of the electronic component 1 are displayed. There is provided a board imaging device capable of recognizing the mounting position based on the picked up image of the board mark and the image of the mounting position itself. By providing such a board imaging device in the head unit 100, the electronic component 1 in which the board mark or the like on the circuit board is reliably recognized and the suction holding posture to each suction nozzle 11 is recognized. Can be securely mounted at the mounting position. FIG. 6 shows a partially enlarged schematic diagram of the head unit 100 in a state in which such a substrate imaging device is provided. Note that FIG. 6 is a diagram mainly illustrating the configuration of the board imaging apparatus, and thus is a schematic diagram in which the component imaging apparatus 20 provided in the head unit 100 and other configurations are omitted.

As shown in FIG. 6, the left and right ends of the head frame 52 of the head unit 100 are each provided with a first substrate imaging camera 41 that is an example of a first substrate imaging device and a second substrate imaging device. A second board imaging camera 42, which is an example of the board imaging apparatus, is fixedly attached. The schematic diagram of the head unit 100 in FIG. 1 omits the illustration of the first board imaging camera 41 of the first board imaging camera 41 and the second board imaging camera 42, and shows the component imaging device 20. It is a schematic diagram clearly showing the configuration.

  Each of the first substrate imaging camera 41 and the second substrate imaging camera 42 has an optical axis substantially parallel to the axis of each suction nozzle 11 provided in the head unit 100, that is, the electronic component. The circuit board disposed below the figure is attached to the head frame 52 so as to be imaged so as to be substantially orthogonal to the mounting surface of the circuit board held on the stage of the mounting apparatus.

  Further, the first substrate imaging camera 41 attached to the head frame 52 on the left side in FIG. 6 has a narrower field of view than the second substrate imaging camera 42 attached to the head frame on the right side in FIG. The second substrate imaging camera 42 has a wider field of view than the first substrate imaging camera 41, and its resolution is high. The resolution is low.

  That is, the first board imaging camera 41 requires high mounting accuracy (for example, mounting accuracy is within about ± 25 μm) as the mounting accuracy of the electronic component 1 to be mounted using the function of the narrow visual field and high resolution. It is preferable to be used for the imaging of the circuit board to be processed. Such a first board imaging camera 41 is, for example, a narrow adjacent mounting of electronic components as a high density mounting with a small mounting (mounting) interval pitch of each electronic component 1 to be mounted, or an electrode of the electronic component 1 For the recognition of the above-mentioned board mark on a circuit board, which is a flip chip mounting method in which bumps are formed with high melting point solder and each of the bumps is bonded to an electrode on the circuit board with eutectic solder. Can be used for imaging.

  On the other hand, the second substrate imaging camera 42 does not require the above high mounting accuracy as the mounting accuracy of the electronic component 1 to be mounted using its high field of view and low resolution function, and the manufacturing accuracy is also high. It is used for the above imaging of circuit boards that do not have accuracy. That is, it is preferably used when stability is required in the recognition processing of the mounting position of the circuit board, etc., rather than the mounting accuracy of the electronic component 1. Such a second board imaging camera 42 is used for a general circuit board or the like that is not mounted with high precision such as the narrow adjacent mounting or the C4 mounting. The substrate may be held in a tilted state or in a state in which the holding position is shifted in the electronic component mounting apparatus because the manufacturing accuracy is not high, but the second substrate imaging camera 42 has a high field of view. Thus, even in such a case, the substrate mark or the like can be recognized by the imaging.

  Further, as shown in FIG. 6, the imaging operation in each of the first substrate imaging camera 41 and the second substrate imaging camera 42 can be controlled by the control unit 9. In the control unit 9, data such as mounting accuracy of the electronic component 1 required for the circuit board supplied to the electronic component mounting apparatus provided with the head unit 100 is input in advance or together with the supply. Based on the data, one of the first substrate recognition camera 41 and the second substrate recognition camera 42 is selected, and the imaging operation for the selected substrate imaging camera is controlled.

  Further, in the control unit 9, based on the image of the board mark imaged by each of the first board imaging camera 41 and the second board imaging camera 42, the actual circuit board mounting device on the circuit board is actually mounted. The holding position is recognized, and the mounting position of each electronic component 1 on the circuit board can be recognized based on the recognition result.

  In the head unit 100 including the first substrate imaging camera 41 and the second substrate imaging camera 42, the substrate mark recognition accuracy based on the image captured by the first substrate imaging camera 41 is ± 4 μm. Moreover, it has a recognition accuracy of about ± 10 μm as a substrate mark recognition accuracy based on an image captured by the second substrate imaging camera 42.

  Here, a detailed configuration of the first substrate imaging camera 41 will be described with reference to a schematic explanatory diagram shown in FIG. Although the second substrate imaging camera 42 is different in terms of field of view and resolution, the basic structure is the same as that of the first substrate imaging camera 41, and thus the description of the structure is omitted. .

  As shown in FIG. 7, the first board imaging camera 41 includes an illumination device 110 that irradiates the imaging target with a light amount necessary for imaging. The illuminating device 110 has a cylindrical shape whose lower surface is open, and has a case 111 whose inner surface is unified with a reflective color such as white or metallic color. A large number of directional light sources 112, diffused light sources 113, and diffuser plates 114, which are LEDs or the like, are housed in the case 111 as light irradiators. The diffusing plate 114 is annularly arranged on the lower surface side of the case 111, and on the upper side thereof, an opaque fixing plate 115 having a directional light source 112 attached to the upper surface and a diffused light source 113 attached to the lower surface is arranged. ing. Further, the inner surface (side end surface) of the ceiling wall 116 of the case 111 is formed with a reflecting surface as an annular reflecting plate 117 for reflecting light emitted from the directional light source 112 downward. . The annular diffusion plate 114 and the reflection plate 117 are not limited to being formed in an annular shape, and may be polygonal.

  In addition, as shown in FIG. 7, a through hole 118 as a detection hole is provided at the center of the ceiling wall 116 that functions as the reflection plate 117, and an imaging target is provided above the through hole 118 via a lens 119. An imaging camera 120 for imaging an object is arranged. The optical axis of the imaging camera 120 passes through the center of the through hole 118. Further, in order to make the reflected light from the imaging object enter the imaging camera 120 through the diffusion plate 114 and the fixing plate 115, the through hole 118 of the case 111 is also provided in the center of the fixing plate 115 and the diffusion plate 114. And coaxial through holes 121 and 122 are formed. The directional light source 112 and the diffused light source 113 are annularly arranged on the upper and lower surfaces of the fixed plate 115 so as to surround the central through hole 121. In addition, the height position of the lower surface of the diffusion plate 114 is set to a height position substantially the same as the height position of the tip of each suction nozzle 11.

  According to the head unit 100 having such a configuration, the electronic component 1 is attracted and held by the respective suction nozzles 11, the images of the respective electronic components 1 are captured by the component imaging device 20, and each of these images is used. It is possible to recognize the suction holding posture of the electronic component 1 and mount each electronic component 1 on the circuit board based on the recognition result. Further, the positioning of the suction nozzle 11 for such mounting and the component mounting position on the circuit board can be performed based on the recognition result of the images captured using the first board imaging cameras 41 and 42. . In particular, by properly using the first substrate imaging cameras 41 and 42 according to the field of view and resolution, it is possible to perform imaging for more accurate and efficient image recognition.

  Moreover, in the head unit 100 having such a configuration, the illuminance of the illumination device included in the component imaging device 20 is periodically measured, and based on the measurement result, an illuminance abnormality warning is output, an illuminance adjustment operation is performed, and the like. Illuminance measurement processing that can be prompted is performed. Here, before describing the specific procedure of such illuminance measurement processing, the configuration of the control unit 9 for performing the illuminance measurement processing will be described below with reference to the control block diagram shown in FIG. . In the control block diagram of FIG. 8, only the main configuration of the control unit 9 is illustrated.

  As shown in FIG. 8, the control unit 9 has an input / output unit 91 that exchanges signals and data with an external device, and a memory that stores and holds data input from the input / output unit 91 in a readable manner. And a memory unit 94 which is an example of a unit. The input / output unit 91 includes, for example, a monitor unit 95 that is an example of an information display unit that displays transmitted data and the like so as to be recognizable by an operator of the component mounting apparatus, and an imaging camera 23 of the component imaging apparatus 20. It is connected.

  The imaging camera 23 can capture an image formed by light emitted from the illumination device of the component imaging device 20 in an illuminance measurement process that will be described in detail later. The image thus captured can be input to the input / output unit 91 as image data. Further, the control unit 9 detects the illuminance detection unit 92 (which is an example of illuminance measurement means) that can perform illuminance detection (illuminance measurement) based on the image data input in this manner, and is detected in this way. The illuminance measurement result data is compared with the reference illuminance reference range data 96 to determine whether the illuminance state is good or not, and an illuminance comparison unit 93 (illuminance abnormality warning output that outputs a warning based on the determination result) It is an example of means). Such illuminance reference range data 96 is input in advance through the input / output unit 91 and stored in the memory unit 94.

  Next, specific contents of the illuminance measurement process performed in the head unit 100 including the control unit 9 having such a configuration will be described below with reference to the flowchart shown in FIG. In addition, each operation | movement in this illumination intensity measurement process is performed by being controlled comprehensively, linked | related with each other by the control part 9 with which the head part 100 is provided. In addition, the slide drive unit 27 that slides the imaging frame 24 along the arrangement direction of the suction nozzles 11 in the head unit 100 is provided in the first substrate imaging camera 41 so that the illumination measurement process described later can be performed. The slide movement range of the imaging frame 24 is set so that the component imaging apparatus 20 can be positioned at a position below the second board imaging camera 42 and a position below the second board imaging camera 42.

  First, in step S1 of the flowchart of FIG. 9, the component imaging device 20 is moved so that the component imaging device 20 is positioned at a position below the first board imaging camera 41. Specifically, as shown in the schematic explanatory diagram of FIG. 12, the image pickup frame 24 is moved by the slide drive unit 27, thereby positioning the component image pickup device 20 at a position below the first board image pickup camera 41. Positioning.

  Here, FIG. 14 is a schematic diagram showing an arrangement relationship between the first board imaging camera 41 and the component imaging apparatus 20. As shown in FIG. 14, in the state where the above movement and positioning are performed, the component imaging device 20 is positioned below the annular portion of the diffusion plate 114 that is the lower surface of the illumination device 110. . That is, as shown in FIG. 14 which is a BB line arrow view in the illumination device 110 of FIG. 14, the imaging field R of the component imaging device 20 is circular so as to avoid the through hole 122 of the diffusion plate 114. It is set as the state arrange | positioned at a part of annular surface. The position (that is, the positioned position) having such an arrangement relationship is an illuminance measurement position P1 (imaging position) where the illuminance of the illumination device included in the component imaging device 20 is measured.

  Next, in step S <b> 2 of the flowchart of FIG. 9, light is irradiated from the illumination device included in the component imaging device 20 to the diffusion plate 114 in the illumination device 110 of the first board imaging camera 41. The state where light irradiation is performed in this way is the state shown in FIG. Specifically, the horizontal light irradiation unit 61, the vertical light irradiation unit 60, and the main irradiation unit 62 included in the component imaging device 20 are turned on, so that light emitted from each direction is transmitted to the diffusion plate 114. Irradiate. The light W1 thus irradiated is reflected so as to be diffused by the diffusion plate 114, and becomes diffused light W2. Of the diffused light W2, the diffused light W2 along the axis S of the suction nozzle 11 is reflected in the direction along the optical axis T by the reflection mirrors 22 and 21 of the component imaging device 20 and is incident on the imaging camera 23. It will be. As a result, the image formed by the diffused light W <b> 2 reflected by the diffusion plate 114 is captured by the imaging camera 23. In the present embodiment, such a diffusion plate 114 is an example of a reflecting member for illuminance measurement.

  Further, since the height position of the lower surface of the diffusion plate 114 is located at substantially the same height position as the height position of the tip of each suction nozzle 11, it is sucked and held by the suction nozzle 11 by the component imaging device 20. The image formed by the reflected light emitted by the illumination device can be captured in substantially the same state as when capturing an image of the electronic component 1 in the suction holding posture. Thereby, in the component imaging device 20, the image acquisition for the illuminance measurement can be performed in the same state as the image capturing state for component recognition.

  Next, the illuminance of the illumination device of the component imaging device 20 is measured based on the captured image. Specifically, image data captured by the imaging camera 23 is input to the control unit 9 through the input / output unit 91 and stored and held in the memory unit 94, for example. Thereafter, the control unit 9 inputs the image data stored in the memory unit 94 to the illuminance detection unit 92, and the illuminance detection unit 92 detects the illuminance based on the image data (step S3). Specifically, based on the image data captured in the imaging field R of the imaging camera 23, the average value of the illuminance of the entire imaging field R is detected as the illuminance measurement result.

  Thereafter, the illuminance reference range data 96 stored and held in advance in the memory unit 94 is read to the illuminance comparison unit 93, and the illuminance measurement result data by the illuminance detection unit 92 is stored in the illuminance reference range data 96 in the illuminance comparison unit 93. A comparison is made as to whether or not it is present (step S4). Here, the illuminance reference range data 96 refers to the illuminance of the illumination device that can capture an image necessary for surely and accurately recognizing the suction holding posture of the electronic component 1 in the component imaging device 20. It is.

  If it is determined in step S4 that the illuminance measurement result data is included in the illuminance reference range data 96, the component mounting operation by the head unit 100 can be started in step S5, and the illuminance measurement process ends. To do.

  On the other hand, if it is determined in step S4 that the illuminance measurement result data is not included in the illuminance reference range data 96, an illuminance remeasurement warning is output from the input / output unit 91. On the monitor unit 95, it is displayed so that it can be recognized by the operator (step S6).

  Based on such a warning, for example, the operator causes the suction nozzle 11 to hold the reflecting plate (not shown) by suction, and the illuminance is measured again using the reflecting plate (step S7). Specifically, after moving and positioning the imaging frame 24 so that the component imaging device 20 is positioned below the attracted and held reflecting plate, the reflecting plate is irradiated with light. An image formed by the reflected light is captured by the imaging camera 23, and the illuminance is remeasured by the control unit 9 based on the image data.

  Thereafter, in step S8, the illuminance remeasurement result data and the illuminance reference range data 96 are compared (performed by the illuminance comparison unit 93), and the remeasurement result data is included in the illuminance reference range data 96. If it is determined that the component mounting operation can be started in step S5, the illuminance measurement process ends.

  On the other hand, if it is determined in step S8 that the remeasurement result data is not included in the illuminance reference range data 96, an LED replacement warning in the lighting device is output and displayed on the monitor unit 95 from the input / output unit 91, for example. The illuminance measurement process ends.

  In the description of the procedure of the illuminance measurement process, the illuminance reference range data 96 used in the determination of the measurement result using the diffusion plate 114 in step S4 and the re-measurement result determination using the reflection plate in step S8. Although the case where the illuminance reference range data 96 used in the above is the same data has been described, different illuminance reference range data may be used based on the characteristics of the diffusing plate 114 and the reflecting plate and the difference in usage. It may be a case.

  Since the reflecting plate has a function of reflecting most of the irradiated light in a direction corresponding to the irradiation direction without diffusing most of the irradiated light, the irradiation is performed based on an image formed by the reflected light. It can be used to measure the absolute amount of light (ie, the absolute value of illuminance). On the other hand, since the diffusion plate 114 has a function of reflecting the light irradiated on the surface while diffusing, an image formed by a part of the reflected light is captured. Therefore, when the diffusion plate 114 is used, not to measure the absolute amount of light, but to measure the relative light amount (that is, the relative value of illuminance) with respect to the light amount in a certain reference state. It is preferable to be used.

  From such a point of view, in the illumination device of the component imaging device 20, in the state where the illuminance adjustment is performed, the respective steps from Step S1 to Step S3 in FIG. The measurement is performed, and the measurement result is stored and held in the memory unit 94 as the illuminance reference range data 96. The stored and held illuminance reference range data 96 is used as the illuminance determination reference when the diffusion plate 114 is used. It is preferable. In the illuminance measurement process performed thereafter, the illuminance measurement result actually measured using the diffusion plate 114 is used as reference data for the above-described illumination device in the state where the illuminance adjustment is performed. This is because a reasonable judgment can be made.

  On the other hand, when re-measurement of illuminance is performed by causing the suction nozzle 11 to suck and hold the reflecting plate, as the illuminance reference range data, an absolute value reference of illuminance possessed by the illuminating device can be used. However, instead of such a case, a case where relative illuminance reference range data is used as in the case of using the diffusion plate 114 may be used.

  The illuminance measurement process is not limited to the content described above, and various other methods can be applied. For example, the illuminance of each of the three illumination units included in the illumination device of the component imaging device 20, that is, the vertical light illumination unit 60, the horizontal light illumination unit 61, and the main illumination unit 62 is individually measured, and individually It is also possible to determine whether the illuminance state is good or bad. Such an illuminance measurement method will be described below as an illuminance measurement process according to the first modification of the present embodiment with reference to the flowchart shown in FIG. Note that the illuminance measurement processing of the first modification is performed by the head unit 100 under comprehensive control by the control unit 9.

  First, in step S11 of the flowchart of FIG. 10, the component imaging device 20 is positioned at the illuminance measurement position P1. Thereafter, light is emitted from the vertical light illumination unit 60 in the illumination device of the component imaging device 20 to the diffusion plate 114, and an image formed by the diffusely reflected light is captured by the imaging camera 23 (step S12). ). The captured vertical light image data is stored and held in the memory unit 94 through the input / output unit 91. Thereafter, light irradiation by the vertical light illumination unit 60 is stopped.

  Next, light is emitted from the main illumination unit 62 to the diffuser plate 114, and an image formed by the diffusely reflected light is captured by the imaging camera 23 (step S13). The captured main light image data is stored and held in the memory unit 94 through the input / output unit 91. Thereafter, light irradiation by the main illumination unit 62 is stopped. Further, in the same procedure, the horizontal light illuminating unit 61 irradiates light to the diffuser plate 114 to acquire horizontal light image data formed by the diffusely reflected reflected light, and the memory unit 94. (Step S14). Thereafter, the irradiation of light by the horizontal light illumination unit 61 is stopped. Note that the order of acquisition of the respective image data from steps S12 to S14 is not limited to the above-described case, and various orders may be adopted.

  When the acquisition of individual image data for each illumination unit is completed, in step S15, the illuminance detection unit 92 of the control unit 9 detects the illuminance measurement result based on the vertical light image data, and the illuminance measurement based on the main light image data. The detection of the result and the detection of the illuminance measurement result based on the horizontal light image data are sequentially performed.

  Thereafter, in step S <b> 16, the illuminance comparison unit 93 determines whether each illuminance measurement result data is included in the illuminance reference range data 96 stored and held in the memory unit 94. For such comparison and determination, the memory unit 94 includes, for example, vertical light illuminance reference range data for relatively evaluating the illuminance of vertical light, and main data for relatively evaluating the illuminance of main light. The illuminance reference range data for light and the illuminance reference range data for horizontal light for relatively evaluating the illuminance of horizontal light are respectively acquired and stored in advance. Therefore, an individual comparison judgment is made as to whether or not each illuminance measurement result data is within each illuminance reference range data.

  As a result of the comparison determination in step S16, when it is determined that all the illuminance measurement result data are included in the illuminance reference range data, the component mounting operation can be started in step S17, and the illuminance measurement is performed. Processing is complete.

  On the other hand, as a result of the comparison determination in step S16, when it is confirmed that some or all of the illuminance measurement result data is not included in the illuminance reference range data, in step S18, it is included in the reference range data. The illuminance re-measurement warning for the illumination unit that is determined not to be output is output to the monitor unit 95, for example, through the input / output unit 91, so that the operator can recognize it.

  In step S19, the operator who has received the warning causes the suction nozzle 11 to suck and hold the reflection plate, individually irradiates the reflection plate with light from the illumination unit that has received the re-measurement warning, and reflects the reflection. An image formed by light is individually captured. Based on the captured image data, the illuminance is remeasured in the illumination unit that has received the warning.

  Thereafter, in step S20, it is individually determined whether the result of the remeasurement is within the illuminance reference range. When it is determined that all the results of the remeasurement are within the illuminance reference range, the component mounting operation is enabled in step S17, and the illuminance measurement process is completed. On the other hand, if it is determined that there is a part that is not within the illuminance reference range, an LED replacement warning is output to the monitor unit 95 so that the illuminating unit determined to be out of the range can be specified. The measurement process is complete.

  Next, the illuminance measurement processing according to the second modification of the present embodiment will be described with reference to the flowchart shown in FIG. The illuminance measurement processing of the second modified example uses two board imaging cameras 41 and 42 by utilizing the fact that the head unit 100 includes the first board imaging camera 41 and the second board imaging camera 42. The image pick-up for illuminance measurement is performed individually.

  First, in step S31 of the flowchart of FIG. 11, as shown in the schematic explanatory diagram of FIG. 12, the component imaging device 20 has an illuminance measurement position P <b> 1 that is a position below the first board imaging camera 41 (in this case, the first Positioning is performed by moving to an illuminance measurement position P1). After this positioning, in step S32, the illumination device of the component imaging device 20 emits light to the diffusion plate 114 of the first board imaging camera 41, and an image formed by the diffusely reflected reflected light is displayed. Obtained as first image data. The acquired first image data is stored and held in the memory unit 94 of the control unit 9.

  Next, in step S33, as shown in the schematic explanatory diagram of FIG. 13, the positioning in which the component imaging device 20 is moved to the second illuminance measurement position P2, which is a position below the second board imaging camera 42, is performed. Done. After this positioning, in step S34, the diffusing plate (that is, the second diffusing plate) of the second board imaging camera 42 is irradiated with light from the illuminating device of the component imaging device 20, and is diffusely reflected. An image formed by the reflected light is acquired as second image data. The acquired second image data is stored and held in the memory unit 94 of the control unit 9.

  Thereafter, in step S35, the illuminance detection unit 92 of the control unit 9 individually detects the illuminance measurement result based on the acquired first image data and second image data. Next, in step S36, a comparison determination is made as to whether or not each detected illuminance measurement result is included in the illuminance reference range data 96 stored and held in the memory unit 94.

  If it is determined in step S36 that both are within the reference range data 96, the component mounting operation can be started in step S37, and the illuminance measurement process is completed.

  On the other hand, if it is determined in step S36 that one or both of the illuminance measurement results are not included in the illuminance reference range data 96, an illuminance remeasurement warning is given to the monitor unit 95 in step S38. Is displayed. The operator who has recognized the warning causes the suction nozzle 11 to suck and hold the reflecting plate, and remeasures the illuminance (step S39). In step S40, it is determined whether or not the re-measured illuminance is within the reference range. If it is determined that the illuminance is within the reference range, the component mounting operation can be started in step S37. The illuminance measurement process is completed.

  On the other hand, if it is determined in step S40 that the remeasured illuminance measurement result is not within the reference range, an LED replacement warning or the like for the illumination device is output and displayed on the monitor unit 95 in step S41. The illuminance measurement process is completed.

  In each of the above explanations, the case where the head unit 100 includes two board imaging cameras, the first board imaging camera 41 and the second board imaging camera 42, has been described. Except for the illuminance measurement process shown in the flowchart, the illuminance measurement process can be performed if one substrate imaging camera is provided.

  In addition, as illustrated in FIG. 15, the case has been described in which the imaging field of view R of the imaging camera 23 of the component imaging device 20 can be reliably ensured on the lower surface of the diffusion plate 114 included in the first board imaging camera 41. Depending on the size and shape of the diffusing plate 114, the imaging field of view R may not be ensured in this way. In such a case, for example, the imaging field of view R is divided into a plurality of areas, and each of the divided areas (divided imaging areas) is sequentially positioned on the surface of the diffusion plate 114 to obtain the divided imaging areas. An image formed by the reflected light is obtained by individually irradiating light. After that, the illuminance measurement result is detected based on each acquired image data. For example, when the illuminance standard is satisfied in all the divided imaging regions, it is determined that the illuminance state is good. Illuminance measurement processing can be performed. Alternatively, the average value of the illuminance of each divided imaging region may be calculated, and the quality of the illuminance state may be determined based on whether or not the calculated average illuminance value satisfies the illuminance standard.

  Further, in each of the above illuminance measurement processes, when the illuminance measurement is performed again and it is determined that the illuminance standard is not satisfied from the remeasurement result, an LED replacement warning is output and displayed (for example, step S9). It may replace with such a case and the case where illuminance adjustment of an illuminating device is implemented using the reflecting plate attracted and hold | maintained at the suction nozzle 11 may be sufficient.

  In the above description, the case where illuminance measurement is performed using the diffusion plate 114 included in the board imaging camera 41 has been described. However, the illuminance measurement processing of the present embodiment is limited only to such a case. It is not a thing. In place of such a case, for example, a reflector or a diffuse reflector is installed in the moving range of the component imaging device 20 in the head unit 100, and illuminance measurement processing is performed using those reflectors. It may be.

  In the above description, the case where the diffusion plate 114 included in the substrate imaging camera 41 has a substantially annular shape has been described. However, various shapes can be adopted as the shape of the diffusion plate 114. For example, a diffusion plate having a square outer shape of 40 mm × 40 mm and a circular hole having a diameter of 10 mm at the center can be used. In such a diffuser plate, for example, a 15 mm square imaging field of view R can be arranged on the surface portion other than the circular hole. For example, the viewing angle of the substrate imaging camera 41 is 4.5 mm, the viewing angle of the imaging camera 23 is 10 mm, and if the imaging field R of 15 mm square on the diffusion plate is used, the illuminance measurement is sufficient. Can be done.

  According to the above embodiment, the following various effects can be obtained.

  First, the illuminance, luminance, and light quantity of the illumination device (that is, the vertical light irradiation unit 60, the horizontal light irradiation unit 61, and the main irradiation unit 62) included in the component imaging device 20 that uses an LED as its light source. In such a case, the illumination device is positioned at the illuminance measurement position P1, which is a position below the first board imaging camera 41, and the diffusion board 114 included in the first board imaging camera 41 is placed. On the other hand, by irradiating light and capturing an image formed by the diffuse reflected light with the imaging camera 23, illuminance measurement can be performed based on the image. Therefore, in the head unit 100, as in the conventional measurement method, it is not necessary to make the suction nozzle 11 suck and hold the reflecting plate and perform illuminance measurement using the reflecting plate, and it is simpler and more efficient to measure the illuminance. It can be performed.

  In addition, by arranging substantially the entire imaging field of view R of the imaging camera 23 of the component imaging device 20 on the lower surface of the diffusion plate 114 included in the first board imaging camera 41, an image of the entire imaging field of view R is acquired. The illuminance can be measured over substantially the entire imaging field of view R. In particular, an LED used as a light source has a characteristic that its life varies, so that it is not possible to determine the overall illuminance with a partial image of the imaging field of view R as in the past. The reliability of measurement will be reduced, but by measuring the illuminance in almost the entire imaging field of view R as in this embodiment, stable and reliable illuminance measurement can be realized with a simpler configuration. Can do.

  In addition, by using the diffusion plate 114 included in the board imaging camera 41 that is generally provided in the head unit 100 as a member that reflects light used for performing such illuminance measurement processing, It can be realized by a hardware and software configuration of the control unit 9 without providing a new facility configuration for the illuminance measurement process.

  In addition, as a member that reflects the light, a diffusing plate 114 that performs diffuse reflection is used, so that an illumination device that irradiates light from various directions, specifically, the horizontal light irradiation unit 61 or the main irradiation. Illuminance measurement for the unit 62 can be realized. In particular, the surface roughness of the surface of the diffusion plate 114 that is irradiated with light (that is, the lower surface in FIG. 14) is set to a range of, for example, 50 to 400 s, so that the imaging camera 23 can be measured for illuminance. Sufficient diffusive light can be made incident, and it is possible to realize reliable illuminance measurement with respect to light irradiation from such various directions.

  Further, by using such a diffusion plate 114, it may be difficult to perform absolute value illuminance measurement, but the illuminance measurement processing by the lighting device immediately after the illuminance adjustment is performed, By storing the illuminance measurement result data obtained as a result in the memory unit 94 of the control unit 9 as illuminance reference range data, it is possible to determine whether the relative illuminance is acceptable or not and to realize reliable illuminance diagnosis Can do.

  Further, as a result of the illuminance diagnosis using such a diffuser plate 114, the illuminance as performed by causing the suction nozzle 11 to suck and hold a reflection plate that has been conventionally used for an illuminating device that is determined to have an illuminance abnormality. By performing the re-measurement, it is possible to perform a reliable and accurate measurement on the illuminating device in which the illuminance is suspected, and to finally diagnose the illuminance. In addition, since the illuminance measurement is performed in two stages as described above, periodic illuminance measurement can be made efficient.

  Furthermore, the illuminance unit in which the illuminance abnormality has occurred is concretely performed by separately performing illuminance measurement on the vertical light irradiation unit 60, the horizontal light irradiation unit 61, and the main irradiation unit 62 included in the illumination device. Therefore, appropriate illuminance adjustment can be efficiently performed.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

It is a typical side sectional view of the head part concerning one embodiment of the present invention. It is a schematic cross section along the plane orthogonal to the arrangement direction of the suction nozzle of the head part of FIG. It is a partial expanded schematic cross section of the component imaging device in the said head part. It is a partial expanded side view of a component imaging device. It is an AA arrow directional view in the component imaging device of FIG. It is a partial expansion schematic diagram of a head part in the state provided with the 1st substrate imaging camera and the 2nd substrate imaging camera. It is a schematic diagram which shows the structure of a 1st board | substrate imaging camera. It is a control block diagram which shows the structure of the control part in a head part. It is a flowchart which shows the procedure of the illumination intensity measurement process with respect to the illuminating device of the components imaging device in a head part. It is a flowchart which shows the procedure of the illumination intensity measurement process concerning a 1st modification. It is a flowchart which shows the procedure of the illumination intensity measurement process concerning a 2nd modification. It is a model explanatory view of a head part for explaining the above-mentioned illuminance measurement processing, and is a figure of the state where a parts imaging device is located in the 1st illuminance measurement position. It is a model explanatory view of a head part for explaining the above-mentioned illuminance measurement processing, and is a figure of the state where a parts imaging device is located in the 2nd illuminance measurement position. It is a schematic explanatory drawing of the state in which light irradiation is performed with respect to a diffuser plate from an illuminating device. It is a BB arrow directional view of the diffusion plate of FIG. It is a schematic diagram which shows the structure for the illumination intensity measurement of the illumination unit in the conventional component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 9 Control part 11 Adsorption nozzle 20 Component imaging devices 21 and 22 Reflection mirror 23 Camera part 24 Imaging frame 25 Linear guide rail 26 Linear guide slider 27 Slide drive part 28 Drive motor 29 Drive belt 41 1st board | substrate imaging camera 42 Second substrate imaging camera 51 Shaft portion 52 Head frame 53 Lifting device 54 Rotating device 60 Vertical light irradiation unit 61 Horizontal light irradiation unit 62 Main irradiation unit 91 Input / output unit 92 Illuminance detection unit 93 Illuminance comparison unit 94 Memory unit 95 Monitor unit 96 Illuminance reference range data 100 Head unit 110 Illuminating device 111 Case 114 Diffuser

Claims (14)

In a component mounting head for arranging and arranging a plurality of component holding members for releasably holding components and mounting the components held by the respective component holding members on a circuit board,
An illumination device that irradiates light from the direction along the axis of the component holding member with respect to the components held by each of the component holding members;
A component imaging device capable of imaging an image of each of the components formed by the light irradiated by the illumination device in a direction along the axis of the component holding member;
It is arranged adjacent to the component holding member at one end in the arrangement direction of the respective component holding members, and is formed by reflected light of light emitted by the illumination device in a direction along the axis of the component holding member. A reflective member that reflects the light so that an image can be captured in the imaging field of view of the component imaging device;
An imaging moving device that integrally moves the component imaging device and the illumination device between the imaging position of the reflecting member and the imaging position of the component held by the component holding member at the other end;
The illumination device and the component imaging device can be controlled so that an image of the reflecting member formed by the reflected light of the irradiated light can be captured, and the reflected light is reflected based on the captured image. Compares the illuminance measurement means that measures illuminance with the illuminance measurement result by the illuminance measurement means and the illuminance reference range data, and outputs an illuminance abnormality warning when the measurement result exceeds the illuminance reference range data A component mounting head comprising: a control device having an illuminance abnormality warning output means. 2. The component mounting head according to claim 1, wherein the illuminance measuring unit measures the illuminance of the reflected light in the entire imaging field based on the captured image. A board imaging device for taking an image on the component mounting surface of the circuit board in a direction along the axis of the component holding member;
The substrate imaging device is
A light irradiation unit that irradiates light for imaging the component mounting surface of the circuit board that is the imaging target;
A diffusion plate that is disposed between the light irradiation unit and the imaging target, diffuses the irradiated light, and transmits the light to irradiate the imaging target;
The component mounting head according to claim 1, wherein the diffusion plate is used as the reflecting member. The said diffusion plate has a reflective area | region of the magnitude | size which can reflect the light irradiated from the said illuminating device in the said imaging position in the said whole imaging visual field of the said component imaging member. Parts mounting head.   The control device measures the adjusted illuminance using the reflecting member by the illuminance measuring means with respect to the illuminating device in which the illuminance is adjusted, and the illuminance measurement result is obtained as the illuminance reference range data. The component mounting head according to any one of claims 1 to 4, further comprising a storage unit that stores the storage unit as a storage unit. In the above control device,
The illuminance measuring means can calculate an average value of illuminance in the entire imaging field as the measurement result of the illuminance,
The storage unit can store, as the illuminance reference range data, an average value of the adjusted illuminance in the entire imaging field calculated by the illuminance measurement unit,
The illuminance abnormality warning output means determines whether or not the illuminance reference range data is exceeded by comparing the average illuminance calculated by the illuminance measurement means with the average illuminance value in the illuminance reference range data. The component mounting head according to claim 5. The lighting device is
A first light irradiation unit that irradiates a first light along a direction along the axis of the component holding member;
A second light irradiation unit that emits second light along a direction inclined from the direction along the axis,
The control device includes a first image formed by reflected light of the first light emitted from the component imaging device toward the diffusion plate by the first light irradiation unit, and the second image. The second image formed by the reflected light of the second light irradiated toward the diffusion plate by the light irradiation unit is individually captured, and the captured first image and second Based on the image, the illuminance measurement means measures the illuminance of each reflected light, and the illuminance abnormality warning output means either illuminance measurement result exceeds the illuminance reference range data. The component mounting head according to claim 3, wherein the illuminance abnormality warning is output. A plurality of component holding members that are arranged and held releasably, and illumination that irradiates light from the direction along the axis of the component holding member with respect to the components held by the respective component holding members. Using a component mounting head comprising a device and a component imaging device capable of imaging an image of each component formed by light irradiated by the illumination device in a direction along the axis of the component holding member, By integrally moving the illumination device and the component imaging device along the arrangement direction of the respective component holding members, an image of each of the components is captured, and based on the imaging result, the components of the respective components are captured. In the component mounting method of mounting the above components on the circuit board while correcting the holding posture,
With respect to the reflecting member disposed adjacent to the component holding member at one end in the arrangement direction of the respective component holding members, the light irradiated by the illumination device in the direction along the axis of the component holding member Capture an image formed by reflected light,
Based on the captured image, measure the illuminance of the reflected light,
Compare the measurement result of the illuminance with the illuminance reference range data, and output an illuminance abnormality warning when the measurement result exceeds the illuminance reference range data,
A component mounting method, wherein when the measurement result is within the illuminance reference range data, the component mounting head can start the component mounting operation. When imaging an image formed by reflected light of light emitted by the illumination device, the entire imaging field of view of the component imaging device is imaged,
Based on the captured image, measure the illuminance of the reflected light in the entire imaging field,
The component mounting method according to claim 8, wherein the measurement result is compared with the illuminance reference range data. The component mounting head further includes a substrate imaging device that captures an image on the component mounting surface of the circuit board in a direction along the axis of the component holding member,
The substrate imaging device is
A light irradiation unit that irradiates light for imaging the component mounting surface of the circuit board that is the imaging target;
A diffusion plate that is disposed between the light irradiation unit and the imaging target, diffuses the irradiated light, and transmits the light to irradiate the imaging target;
The component mounting according to claim 8 or 9, wherein the illuminance of the reflected light of the diffuser plate is measured by irradiating the diffuser plate with light using the diffuser plate as the reflective member. Method.   The illuminance of which the illuminance is adjusted is measured by taking the image using the reflecting member to measure the adjusted illuminance, and the illuminance measurement result is used as the illuminance reference range data. Item 11. The component mounting method according to any one of Items 8 to 10. Irradiation by the lighting device in a direction along the axis of the component holding member with respect to the first reflecting member arranged adjacent to the component holding member at one end in the arrangement direction of the respective component holding members. Capturing the first image formed by the reflected light of the reflected light in the entire imaging field of view of the component imaging device,
At the same time, in the direction along the axial center of the component holding member, the second reflecting member disposed adjacent to the component holding member at the other end in the arrangement direction of the respective component holding members. The second image formed by the reflected light of the light irradiated by the illumination device is imaged in the entire imaging field of view of the component imaging device,
Based on the captured first image and second image, the illuminance of the reflected light of the first reflecting member and the illuminance of the reflected light of the second reflecting member in the entire imaging field are measured. ,
12. The illuminance abnormality warning is output when the respective illuminance measurement results and the illuminance reference range data are compared and both of the measurement results exceed the illuminance reference range data. The component mounting method according to claim 1. Based on the output of the illuminance abnormality warning, adjust the illuminance in the lighting device,
The component mounting method according to any one of claims 8 to 12, wherein after the adjustment is completed, the mounting operation of the respective components on the circuit board by the component mounting head can be started. When the illuminance abnormality warning is output, hold the reflector on the component holding member,
Irradiate light in the direction along the axis by the lighting device to the held reflector,
Taking an image formed by the reflected light on the reflector,
The component mounting method according to any one of claims 8 to 12, wherein the illuminance of the lighting device is measured again based on the image.

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