JP4453635B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP4453635B2 JP4453635B2 JP2005262945A JP2005262945A JP4453635B2 JP 4453635 B2 JP4453635 B2 JP 4453635B2 JP 2005262945 A JP2005262945 A JP 2005262945A JP 2005262945 A JP2005262945 A JP 2005262945A JP 4453635 B2 JP4453635 B2 JP 4453635B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting surface
- led chip
- transparent electrode
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Led Device Packages (AREA)
- Led Devices (AREA)
Description
(実施形態1)
本実施形態の発光装置1は、図1,図2に示すように一面に電極用の金属板2を接合し、他面を発光面としたLEDチップ3と、このLEDチップ3の発光面に圧着により接合される板状の波長変換体5とで構成され、発光面の中央に設けた透明電極4を波長変換体5の中央に設けられた開口窓6に臨ませ、透明電極4にボンディングされたワイヤーWを開口窓6から外部へ導出している。そしてLEDチップ3の金属板2を実装基板B上の電極パターンE1上に接合し、ワイヤーWの他端を実装基板B上の電極パターンE2にボンディングしている。
(実施形態2)
実施形態1では波長変換体5を2つの分割片50で構成しているが、本実施形態は図3に示すように4つの分割片50で構成したもので、各分割片50に形成する切欠51の形状は円形を4等分した形としている。
2 金属板
3 LEDチップ
4 透明電極
5 波長変換体
50 分割片
51 切欠
W ワイヤー
6 開口窓
Claims (1)
- 一面に電極用金属板を接合し、他面にワイヤーボンディング用の透明電極を設けて該他面を発光面としたLEDチップと、
波長変換物質を樹脂中に分散させて形成され、前記発光面を覆うように発光面上に接合される板状の波長変換体とからなるものであって、
前記波長変換体は複数片に分割され、夫々分割片を記発光面上に接合して各分割片を突き合わせたときに、前記透明電極を臨ますとともに該透明電極にボンディングされているワイヤーを外部へ導出する一つの開口窓を形成する切欠を各分割片の対応部位に設けていることを特徴とする発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005262945A JP4453635B2 (ja) | 2005-09-09 | 2005-09-09 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005262945A JP4453635B2 (ja) | 2005-09-09 | 2005-09-09 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007080876A JP2007080876A (ja) | 2007-03-29 |
JP4453635B2 true JP4453635B2 (ja) | 2010-04-21 |
Family
ID=37940908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005262945A Expired - Fee Related JP4453635B2 (ja) | 2005-09-09 | 2005-09-09 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4453635B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5158472B2 (ja) | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
JP5255421B2 (ja) * | 2008-12-15 | 2013-08-07 | 株式会社小糸製作所 | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
JP5450680B2 (ja) * | 2012-02-01 | 2014-03-26 | スタンレー電気株式会社 | 半導体発光装置 |
CN103254889B (zh) * | 2012-02-16 | 2015-12-09 | 赛恩倍吉科技顾问(深圳)有限公司 | 荧光粉薄膜制作方法及相应的发光二极管封装方法 |
JP5698808B2 (ja) * | 2013-07-26 | 2015-04-08 | スタンレー電気株式会社 | 半導体発光装置 |
JP6098439B2 (ja) | 2013-08-28 | 2017-03-22 | 日亜化学工業株式会社 | 波長変換部材、発光装置、及び発光装置の製造方法 |
JP6244784B2 (ja) | 2013-09-30 | 2017-12-13 | 日亜化学工業株式会社 | 発光装置 |
-
2005
- 2005-09-09 JP JP2005262945A patent/JP4453635B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007080876A (ja) | 2007-03-29 |
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