JP4451996B2 - Hollow semiconductor package and manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor package that needs to be sealed with a cap in order to maintain hermeticity after the semiconductor is mounted in a hollow package. Semiconductors that require such packages include optical communications, imaging, computing, and microwaves. Some of these semiconductor packages require a heat sink, sealing ring, or fiber insertion tube in addition to the metal terminals for electrical connection with the semiconductor. is there. The heat dissipation plate is intended to dissipate the heat generated from the semiconductor to the outside, the sealing ring plate is for bonding or welding the sealing lid with a metal brazing material, and the fiber insertion tube is a communication fiber Is used as a part for guiding the inside of the package.
[0002]
[Prior art]
Conventionally, these semiconductor packages are made by processing ceramic and metal in advance and forming a housing, and then connecting terminals, heat sinks, sealing ring plates, and fiber insertion cylinders to the functionally required semiconductors. It was manufactured by bonding parts with metal brazing material.
[0003]
[Problems to be solved by the invention]
As described above, in the conventional ceramic and metal packages, it is necessary to individually manufacture functionally necessary parts individually and assemble them with an adhesive such as a metal brazing material. As a problem of this assembly method, firstly, since the shape is complicated, it is difficult to process, and it cannot be integrally formed into a package shape at a low cost.
[0004]
Secondly, since the individual parts are assembled with an adhesive such as a metal brazing material, a heating process is required to solidify the adhesive, and the setting process of the package to the heating device and several tenths of heating time are also required. Productivity.
Third, in the case of ceramic, the maximum number of main casing (ceramic), connection terminal (metal), sealing ring (metal), heat sink (ceramic and metal), and fiber insertion tube (ceramic and metal) In the case of metal, the main housing (metal), connection terminal (metal), insulation between the connection terminals (metal) (ceramic, resin), heat sink (ceramic and metal) ), Up to five parts of the fiber insertion tube (ceramic and metal) are required, and an adhesive is also required, which increases the material cost of the package. The present invention solves the above problems.
[0005]
[Means for Solving the Problems]
The main housing part of the semiconductor package is made of resin, and functionally necessary parts in this formation process are integrally bonded to the resin, thereby simplifying the bonding process and reducing the number of parts. To do. That is, the present invention
[1] A hollow main casing made of a filler-containing resin and having an opening; a metal terminal for electrical connection with a semiconductor mounted in the hollow of the main casing; A metal sealing ring disposed on the opening of the main housing; a heat sink disposed on the bottom surface of the main housing; and a fiber insertion tube penetrating the main housing.
The main casing has a multilayer structure including an inner layer and an outer layer,
The hollow semiconductor package, wherein the inner layer covers an inner surface of the metal sealing ring, and the outer layer covers an outer surface of the heat sink .
[2] The inner layer of the main casing is formed in a stepped shape toward the hollow interior, and a part of the metal terminal for electrical connection with the semiconductor is exposed at the stepped flat portion. The hollow semiconductor package according to [1] .
[3] The hollow semiconductor package according to [1], wherein one or both of the heat radiating plate and the fiber insertion tube is a metal .
[4] The hollow semiconductor package according to [1], wherein one or both of the heat radiating plate and the fiber insertion tube is ceramic .
[5] The hollow semiconductor package according to [1], wherein the fiber insertion tube is a resin .
[6] The method for manufacturing the hollow semiconductor package according to [1],
A method for manufacturing a hollow semiconductor package, wherein the metal sealing ring, the heat radiating plate, and the fiber insertion tube are bonded to the main casing together with resin molding of the main casing .
[7] The method for manufacturing a hollow semiconductor package according to [6], wherein the main housing portion and the fiber insertion cylinder are integrally formed of resin . About.
In this way, the method of forming the main housing portion with resin is generally called resin molding, and the method of the present invention is used to bond and form components functionally necessary as a semiconductor package in the main housing portion resin molding process. It becomes possible to do. Also, by providing the mold with a fiber insertion cylinder shape in addition to the main casing shape, it is possible to form the main casing and fiber insertion cylinder at the same time, resulting in the number of functional parts constituting the semiconductor package. Can be reduced.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
The resin used in the present invention may be any of a thermosetting resin, a thermoplastic resin, and a resin containing these inorganic fillers, preferably an epoxy resin, a phenol resin, a polyimide, a fluororesin, polyamide, polysulfone, poly Ether sulfone, polyphenylene sulfide, polyarylate, polyamide imide, polyether imide, polyether ether ketone, liquid crystal polymer, polyamide and these inorganic filler compounded resin, more preferably epoxy resin, phenol resin and these inorganic filler compounded Resin.
Examples of the inorganic filler include fused silica, crystalline silica, spherical alumina, porous silica, glass fiber, and carbon fiber.
[0007]
The metal ring material for sealing is preferably Kovar, 42 alloy, stainless steel, Cu, Cu alloy, and more preferably Kovar, 42 alloy.
The heat radiating plate material is preferably Cu, Cu alloy, AlN, SiC, Al ₂ O ₃ , and more preferably Cu, Cu alloy, or AlN. A general ceramic can also be used as a material.
[0008]
The fiber insertion tube material is preferably Kovar, 42 alloy, stainless steel, Cu, Cu alloy, and more preferably Kovar, 42 alloy. A general ceramic can also be used as a material.
The basic structure of the semiconductor package of the present invention is shown in FIG. In FIG. 1, all the other functional components 3 to 5 except for the metal terminal 2 for electrical connection between the main casing 1 and the semiconductor are formed for convenience, but the shape manufactured in practical use is as follows. As described above, any other functional component may be formed in accordance with the purpose of use of the semiconductor.
[0009]
Details of the structure will be described with reference to FIGS. 1 and 2. FIG. The main housing portion 1 has a two-layer structure made of resins 9 and 10, and the metal terminal 2 is exposed to the hollow portion side and the outside by sandwiching the main housing portion 1. The metal sealing ring plate 3 is a sealing ring that is fused with a sealing lid in order to maintain airtightness in the hollow portion after the semiconductor is mounted in the hollow portion. The radiator plate 4 is a radiator plate for cooling the semiconductor, and the fiber insertion cylinder 5 is an insertion cylinder for guiding the fiber to the hollow portion. The heat sink may be provided with through holes or notches such as 7 and 8 for positioning during package mounting.
[0010]
The production method is described below. In order to form the resin main casing, first, the resin 9 forming the inner wall of the casing, the metal terminal 2, the sealing ring 3, and the fiber insertion cylinder 5 except for the heat radiating plate 4, are formed by using a molding die 11 in FIG. To form. This is because in the molding method using a mold, in order to form a hollow portion between the metal terminal and the heat radiating plate, it is necessary to form the main housing portion and the metal terminal before forming the heat radiating plate. . Next, 11 and the heat radiating plate 4 have the structure shown in FIG. 2 using different molding dies for the resin 10 forming the outer wall of the casing.
[0011]
In this process, it is preferable to adopt a structure in which the resin is formed like 13 and 14 on the side walls of the inner wall of the sealing ring and the outer wall of the heat sink, so that the adhesive strength between the resin, the sealing ring and the heat sink is increased. . The compositions of the resins 9 and 10 can be arbitrarily selected in consideration of the shape, resin fluidity, etc., and may be the same composition or different compositions.
[0012]
In the above manufacturing method, the process of forming the shape 11 and the process of forming the shape 11 and the heat sink 4 are required. A structure for further simplifying this process is shown in FIGS. 4 and 5. FIG. 5 shows a cross-sectional structure taken along the line CD in FIG. In FIGS. 4 and 5, there is no space between the internal metal terminal and the heat radiating plate 4 by providing a step 14 made of resin at the lower part of the metal terminal 2 on the hollow portion side. For this reason, the molding die which can form the main housing | casing 1, the metal terminal 2, the sealing ring 3, the fiber insertion cylinder 5, and the heat sink 4 simultaneously can be used, and a package formation process can be simplified.
The molding time using the mold can be 5 to 100 seconds.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a typical example of a hollow semiconductor package to which the present invention is applied. FIG. 2 is a cross-sectional view in the direction of a metal terminal in FIG. FIG. 4 is a cross-sectional view in the direction of a metal terminal in FIG. 3. FIG. 5 is a perspective view in which the present invention is applied and a resin step is provided at the bottom of the hollow inner terminal.
6 is a sectional view in the direction of a metal terminal in FIG.
DESCRIPTION OF SYMBOLS 1 Main housing part (resin), 2 Metal terminal, 3 Metal ring for sealing, 4 Heat sink, 5 Fiber insertion cylinder, 6 Hollow part, 7 Package positioning hole, 8 Package positioning notch, 9 Inner layer of main housing part (Resin), 10 main casing part outer layer (resin), 11 manufacturing process casing part, 12 resin step formed in the lower part of the hollow part terminal, 13 resin formed on the inner wall of the sealing ring, 14 formed on the outer wall of the heat sink Resin, 15 hollow inner terminal surface

Claims (7)

A hollow main casing made of a filler-containing resin and having an opening; a metal terminal for electrical connection with a semiconductor mounted in the hollow of the main casing; and the main casing A metal sealing ring disposed on the opening of the part; a heat dissipating plate disposed on the bottom surface of the main housing part; and a fiber insertion tube penetrating the main housing part,
The main casing has a multilayer structure including an inner layer and an outer layer,
The hollow semiconductor package, wherein the inner layer covers an inner surface of the metal sealing ring, and the outer layer covers an outer surface of the heat sink. The inner layer of the main housing part is formed in a stepped shape toward the hollow interior, and a part of the metal terminal for electrical connection with the semiconductor is exposed in the stepped flat portion, The hollow semiconductor package according to claim 1.   The hollow semiconductor package according to claim 1, wherein one or both of the heat radiating plate and the fiber insertion tube are made of metal.   The hollow semiconductor package according to claim 1, wherein one or both of the heat sink and the fiber insertion tube is ceramic.   The hollow semiconductor package according to claim 1, wherein the fiber insertion tube is a resin. It is a manufacturing method of the hollow semiconductor package according to claim 1,
A method for manufacturing a hollow semiconductor package, wherein the metal sealing ring, the heat radiating plate, and the fiber insertion tube are bonded to the main casing together with resin molding of the main casing.   The manufacturing method of the hollow semiconductor package of Claim 6 which integrally molds the said main housing part and the said fiber insertion cylinder with resin.

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