JP2002270707A - Hollow semiconductor package and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simple manufacturing step in mass production at low cost, by molding functional parts necessary for a semiconductor package with a resin body. SOLUTION: In the hollow semiconductor storing device (semiconductor package) for mounting a semiconductor, a heat radiating plate 4 for radiating heat, a metallic ring plate 3 for air-tightness (sealing), and an inserting tube 5 for inserting an optical fiber as well as a metallic terminal 2 for electrical connection with the semiconductor are molded in one body by using resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package which needs to be sealed with a cap to maintain airtightness after a semiconductor is mounted in a hollow package. Semiconductors requiring such a package include those for optical communication, imaging, arithmetic, and microwave.
Some of these semiconductor packages require that a heat sink, a sealing ring, or a fiber insertion tube be formed in addition to metal terminals for electrical connection with the semiconductor. is there. The heat radiating plate is for dissipating heat from the semiconductor to the outside, the sealing ring plate is for bonding or welding the sealing lid with a metal brazing material, and the fiber insertion tube is for communication fiber. Is used as a part for guiding the inside of the package.

[0002]

2. Description of the Related Art Conventionally, these semiconductor packages are formed by processing ceramic and metal in advance to form a housing.
Functionally required connection terminals for semiconductors, heat sinks,
It was manufactured by bonding parts of a sealing ring plate and a fiber insertion tube with a metal brazing material.

[0003]

As described above, in the conventional ceramic and metal packages, it is necessary to individually produce functionally necessary parts in advance and to assemble them with an adhesive such as a metal brazing material. As a problem of this assembling method, firstly, there is a problem that processing is difficult due to its complicated shape, and it cannot be integrally formed into a package shape at low cost.

Secondly, a heating step for solidifying the adhesive is required to assemble the individual parts with an adhesive such as a metal brazing material, and the time and labor required for setting the package to the heating device and for several tens of minutes are required. And the productivity of the solidification step. Third, in the case of ceramic, a maximum of 5 parts for the main housing (ceramic), connection terminals (metal), sealing ring (metal), heat sink (ceramic and metal), and fiber insertion tube (ceramic and metal) In the case of metal, the main housing part (metal), the connection terminal (metal), the insulator between the connection terminal (metal) (ceramic, resin), and the heat sink (ceramic and metal) ), The fiber insertion tube (ceramic and metal) requires a maximum of five parts and also requires an adhesive, so that the material cost for forming the package is high. The present invention solves the above problem.

[0005]

A main housing portion of a semiconductor package is formed of a resin, and components necessary for the function in the forming process are integrally bonded to the resin, thereby simplifying the bonding process and reducing the number of components. Is characterized in that the amount can be reduced. That is, the present invention provides: (1) a metal (terminal) for electrical connection with a semiconductor, a metal sealing ring, a heat radiating plate, or a fiber insertion for airtightness (sealing) with the main housing. A hollow semiconductor package comprising at least one component selected from a cylinder, wherein the main housing portion is made of a resin containing a filler. (2) The hollow semiconductor package according to (1), wherein the main housing has a multilayer structure. (3) A part of the inner wall of the main housing is stepped toward the center, and a part of a metal (terminal) for electrical connection with the semiconductor is exposed at the stepped flat portion. The hollow semiconductor package according to (1) or (2), which is formed as follows. (4) The hollow semiconductor package according to any one of (1) to (3), wherein a resin is formed on a side surface on the hollow portion side of the metal sealing ring. (5) The hollow semiconductor package according to any one of (1) to (4), wherein a resin is formed on an outer peripheral side surface of the heat sink. (6) The hollow semiconductor package according to any one of (1) to (5), wherein the heat sink and the fiber insertion tube are made of metal. (7) The hollow semiconductor package according to any one of (1) to (5), wherein the heat sink and the fiber insertion tube are made of ceramic. (8) The hollow semiconductor package according to any one of (1) to (5), wherein the fiber insertion tube is made of resin. (9) Connection of at least one component selected from a metal sealing ring, a heat radiating plate, or a fiber insertion tube for the purpose of airtightness (sealing) with the main housing portion is integrally performed with the molding of the main housing portion. (1) The method for manufacturing a hollow semiconductor package according to (1). (10) The method for manufacturing a hollow semiconductor package according to (9), wherein the main housing portion and the fiber insertion tube are integrally formed of resin. About. The method of forming the main housing portion with a resin in this way is generally called resin molding, and the method of the present invention is used to bond and form components necessary for a semiconductor package functionally in the main housing portion resin molding process. It is possible to do. In addition, by providing the mold with a fiber insertion tube shape in addition to the main housing portion shape, the main housing portion and the fiber insertion tube portion can be formed at the same time. As a result, the number of functional parts constituting the semiconductor package can be increased. Can be reduced.

[0006]

Embodiments of the present invention will be described below. The resin used in the present invention may be any of a thermosetting resin, a thermoplastic resin and a resin containing these inorganic fillers, but is preferably an epoxy resin, a phenol resin, a polyimide, a fluororesin, a polyamide, a polysulfone, or a polystyrene. Ether sulfone, polyphenylene sulfide, polyarylate, polyamide imide,
Polyetherimides, polyetheretherketones, liquid crystal polymers, polyamides, and resins containing these inorganic fillers are more preferable, and epoxy resins, phenol resins, and resins containing these inorganic fillers are more preferable. Examples of the inorganic filler include fused silica, crystalline silica, spherical alumina, porous silica, glass fiber, and carbon fiber.

The metal ring material for sealing is preferably Kovar, 42 alloy, stainless steel, Cu, Cu alloy, and more preferably Kovar, 42 alloy. Preferably, Cu, Cu alloy, AlN, SiC, A
l ₂ O ₃ , more preferably Cu, Cu alloy or AlN. Note that general ceramics can also be used as a material.

The fiber insertion tube is preferably Kovar, 42 alloy, stainless steel, Cu, Cu alloy, and more preferably Kovar, 42 alloy. Note that general ceramics can also be used as a material. FIG. 1 shows the basic structure of the semiconductor package of the present invention. In FIG. 1, all of the other functional components 3 to 5 except for the metal terminal 2 for electrical connection between the main housing 1 and the semiconductor are formed for convenience. As described above, any other functional component may be formed in accordance with the purpose of use of the semiconductor.

Details of the structure will be described with reference to FIGS.
1 shows a cross section taken along the line AB in FIG. The main housing 1 has a two-layer structure made of resins 9 and 10 and has metal terminals 2.
Are sandwiched between the main housing 1 and exposed to the hollow side and outside.
The metal sealing ring plate 3 is a sealing ring that is fused to a sealing lid in order to maintain airtightness in the hollow portion after the semiconductor is mounted in the hollow portion. The radiator plate 4 is a radiator plate for cooling the semiconductor, and the fiber insertion tube 5 is an insertion tube for guiding the fiber to the hollow portion. The heat sink may be provided with through holes or cutouts such as 7 and 8 for positioning during package mounting.

The manufacturing method will be described below. To form the resin main housing, first, the resin 9 and the metal terminals 2, the sealing ring 3, and the fiber insertion tube 5, which form the housing inner wall, excluding the heat radiation plate 4.
Is formed as shown in FIG. 3 using a molding die. This is because in the molding method using a mold, in order to form a hollow portion between the metal terminal and the heat sink, it is necessary to form the main housing and the metal terminal before forming the heat sink. . Next, 11 and the heat radiating plate 4 are formed into a structure shown in FIG.

In this process, by adopting a structure in which the resin is formed on the side surfaces of the inner wall of the sealing ring and the outer wall of the heat radiating plate, such as 13 and 14, the adhesive strength between the resin and the sealing ring and the heat radiating plate is improved. It is preferable because it increases. In addition, resin 9.1
The composition 0 can be arbitrarily selected in consideration of the shape, resin fluidity, etc., and may be the same composition or a different composition.

In the above manufacturing method, a process for forming the shape 11 and a process for forming the shape 11 and the heat sink 4 are required.
FIGS. 4 and 5 show a structure for further simplifying this step. FIG. 5 shows a cross-sectional structure taken along the line CD of FIG. In FIGS. 4 and 5, since a step 14 made of resin is provided below the hollow portion of the metal terminal 2, no space exists between the internal metal terminal and the heat sink 4. For this reason, it is possible to use a molding die capable of simultaneously forming the main housing 1, the metal terminal 2, the sealing ring 3, the fiber insertion tube 5, and the heat sink 4,
The package forming process can be simplified. The molding time using a mold can be 5 to 100 seconds.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a typical example of a hollow semiconductor package to which the present invention is applied.

FIG. 2 is a cross-sectional view in the direction of a metal terminal in FIG. 1;

FIG. 3 is a perspective view showing a manufacturing process of a hollow semiconductor package to which the present invention is applied.

FIG. 4 is a sectional view in the direction of a metal terminal in FIG. 3;

FIG. 5 is a perspective view in which the present invention is applied and a resin step is provided below a hollow inner terminal.

FIG. 6 is a sectional view in the direction of the metal terminal in FIG. 5;

[Explanation of symbols]

1 Main housing (resin), 2 Metal terminal, 3 Metal ring for sealing, 4 Heat sink, 5 Fiber insertion tube,
6 hollow portion, 7 package positioning hole, 8 package positioning notch, 9 main housing portion inner layer (resin), 10 main housing portion outer layer (resin), 11 manufacturing process housing portion, 12 hollow terminal formed below the terminal 13 resin step formed on the inner wall of the sealing ring, 14
Resin formed on the outer wall of heat sink, 15 Hollow inner terminal surface

Claims (10)

[Claims] 1. A metal (terminal) for electrical connection with a semiconductor, a metal sealing ring, a heat radiating plate or a fiber insertion tube for airtightness (sealing) with a main housing. A hollow semiconductor package comprising at least one component, wherein the main housing portion is made of a resin containing a filler. 2. The hollow semiconductor package according to claim 1, wherein said main housing has a multilayer structure. 3. A part of an inner wall of the main housing portion is formed in a stepped shape toward a center, and a part of a metal (terminal) for electrical connection with a semiconductor is formed on a stepped flat portion. The hollow semiconductor package according to claim 1, wherein the hollow semiconductor package is formed to be exposed. 4. The hollow semiconductor package according to claim 1, wherein a resin is formed on a side surface on the hollow portion side of the metal sealing ring. 5. The hollow semiconductor package according to claim 1, wherein a resin is formed on an outer peripheral side surface of the heat sink. 6. The hollow semiconductor package according to claim 1, wherein the heat sink and the fiber insertion tube are made of metal. 7. The hollow semiconductor package according to claim 1, wherein the heat sink and the fiber insertion tube are made of ceramic. 8. The hollow semiconductor package according to claim 1, wherein the fiber insertion tube is made of a resin. 9. Adhesion of at least one component selected from a metal sealing ring, a heat radiating plate, or a fiber insertion tube for the purpose of airtightness (sealing) with the main housing portion is integrated with molding of the main housing portion. The method according to claim 1, wherein the method is performed. 10. The method for manufacturing a hollow semiconductor package according to claim 9, wherein the main housing portion and the fiber insertion tube are integrally formed of resin.