JP4441552B2 - ダイヤモンドコンディショナ - Google Patents
ダイヤモンドコンディショナ Download PDFInfo
- Publication number
- JP4441552B2 JP4441552B2 JP2007191691A JP2007191691A JP4441552B2 JP 4441552 B2 JP4441552 B2 JP 4441552B2 JP 2007191691 A JP2007191691 A JP 2007191691A JP 2007191691 A JP2007191691 A JP 2007191691A JP 4441552 B2 JP4441552 B2 JP 4441552B2
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- diamond abrasive
- conditioner
- bonded
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910003460 diamond Inorganic materials 0.000 title claims description 335
- 239000010432 diamond Substances 0.000 title claims description 335
- 239000006061 abrasive grain Substances 0.000 claims description 166
- 238000005498 polishing Methods 0.000 claims description 134
- 239000002245 particle Substances 0.000 claims description 86
- 230000002093 peripheral effect Effects 0.000 claims description 83
- 239000004744 fabric Substances 0.000 claims description 70
- 239000000758 substrate Substances 0.000 claims description 55
- 239000004065 semiconductor Substances 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 description 19
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000007730 finishing process Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007191691A JP4441552B2 (ja) | 2006-07-31 | 2007-07-24 | ダイヤモンドコンディショナ |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006228412 | 2006-07-31 | ||
| JP2006228411 | 2006-07-31 | ||
| JP2007191691A JP4441552B2 (ja) | 2006-07-31 | 2007-07-24 | ダイヤモンドコンディショナ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008055593A JP2008055593A (ja) | 2008-03-13 |
| JP2008055593A5 JP2008055593A5 (enExample) | 2009-04-16 |
| JP4441552B2 true JP4441552B2 (ja) | 2010-03-31 |
Family
ID=39238928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007191691A Expired - Fee Related JP4441552B2 (ja) | 2006-07-31 | 2007-07-24 | ダイヤモンドコンディショナ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4441552B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4604122B2 (ja) * | 2009-02-12 | 2010-12-22 | 本田技研工業株式会社 | 再研磨方法 |
| JP5502987B2 (ja) * | 2009-03-24 | 2014-05-28 | サンーゴバン アブレイシブズ，インコーポレイティド | 化学機械平坦化パッドコンディショナとして使用するための研磨工具 |
| KR101052325B1 (ko) * | 2009-04-06 | 2011-07-27 | 신한다이아몬드공업 주식회사 | Ｃｍｐ 패드 컨디셔너 및 그 제조방법 |
| GB201121637D0 (en) * | 2011-12-16 | 2012-01-25 | Element Six Ltd | Polycrystalline cvd diamond wheel dresser parts and methods of utilizing the same |
| JP2014147993A (ja) * | 2013-01-31 | 2014-08-21 | Shin Etsu Handotai Co Ltd | ドレッシングプレート及びドレッシングプレートの製造方法 |
| KR102304574B1 (ko) * | 2014-03-21 | 2021-09-27 | 엔테그리스, 아이엔씨. | 세장형 절삭 에지를 갖는 화학 기계 평탄화 패드 컨디셔너 |
| GB201701246D0 (en) | 2017-01-25 | 2017-03-08 | Fives Landis Ltd | Machine tools and methods of operation thereof |
-
2007
- 2007-07-24 JP JP2007191691A patent/JP4441552B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008055593A (ja) | 2008-03-13 |
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