JP4439963B2 - 電着膜形成方法及び半導体装置 - Google Patents

電着膜形成方法及び半導体装置 Download PDF

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Publication number
JP4439963B2
JP4439963B2 JP2004089542A JP2004089542A JP4439963B2 JP 4439963 B2 JP4439963 B2 JP 4439963B2 JP 2004089542 A JP2004089542 A JP 2004089542A JP 2004089542 A JP2004089542 A JP 2004089542A JP 4439963 B2 JP4439963 B2 JP 4439963B2
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JP
Japan
Prior art keywords
electrodeposition
film
hole
electrodeposition film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004089542A
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English (en)
Japanese (ja)
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JP2005036306A5 (enExample
JP2005036306A (ja
Inventor
正樹 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004089542A priority Critical patent/JP4439963B2/ja
Priority to US11/014,678 priority patent/US7052991B2/en
Publication of JP2005036306A publication Critical patent/JP2005036306A/ja
Publication of JP2005036306A5 publication Critical patent/JP2005036306A5/ja
Application granted granted Critical
Publication of JP4439963B2 publication Critical patent/JP4439963B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Paints Or Removers (AREA)
JP2004089542A 2003-06-23 2004-03-25 電着膜形成方法及び半導体装置 Expired - Fee Related JP4439963B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004089542A JP4439963B2 (ja) 2003-06-23 2004-03-25 電着膜形成方法及び半導体装置
US11/014,678 US7052991B2 (en) 2003-06-23 2004-12-17 Electrodeposition film forming method, and semiconductor apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003178121 2003-06-23
JP2004089542A JP4439963B2 (ja) 2003-06-23 2004-03-25 電着膜形成方法及び半導体装置

Publications (3)

Publication Number Publication Date
JP2005036306A JP2005036306A (ja) 2005-02-10
JP2005036306A5 JP2005036306A5 (enExample) 2007-05-17
JP4439963B2 true JP4439963B2 (ja) 2010-03-24

Family

ID=34220136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004089542A Expired - Fee Related JP4439963B2 (ja) 2003-06-23 2004-03-25 電着膜形成方法及び半導体装置

Country Status (2)

Country Link
US (1) US7052991B2 (enExample)
JP (1) JP4439963B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4508054B2 (ja) * 2005-09-12 2010-07-21 パナソニック株式会社 電極部材の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0657496A (ja) 1992-08-12 1994-03-01 Kansai Paint Co Ltd カチオン電着塗装方法
US5948232A (en) * 1995-06-19 1999-09-07 Lynntech, Inc. Method of manufacturing passive elements using conductive polypyrrole formulations
US6552555B1 (en) * 1998-11-19 2003-04-22 Custom One Design, Inc. Integrated circuit testing apparatus
US6334965B1 (en) * 1999-09-07 2002-01-01 Lynntech, Inc. Electronically conductive polymers
AU6317001A (en) * 2000-05-15 2001-11-26 Univ Pennsylvania Spontaneous pattern formation of functional materials

Also Published As

Publication number Publication date
US7052991B2 (en) 2006-05-30
JP2005036306A (ja) 2005-02-10
US20050092612A1 (en) 2005-05-05

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