JP4436071B2 - Extra fine wire drawing method and drawing device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is an ultrafine wire comprising a base metal such as aluminum or copper or a base metal alloy such as an aluminum-silicon alloy, or a noble metal such as gold, silver or palladium, or a noble metal alloy such as a gold-silver alloy or gold-silver-copper alloy. The present invention relates to a wire drawing method and a wire drawing device, and more particularly to a wire drawing method and wire drawing device for a fine wire for a bonding wire of a semiconductor device.
[0002]
[Prior art]
In recent years, along with the development of electronic devices, ultrafine wires used for lead wires, coil windings, enamel wires, bonding wires and the like of semiconductor devices are often used having a wire diameter of 100 μm or less. In particular, ultrafine wires for bonding wires are subjected to wet drawing at a high speed of 50 to 1000 m / min on those with a wire diameter of 40 μm or less, and the formed ultrafine wires are wound in units of several hundred to several thousand meters. ing. For this reason, the accuracy of the hole shape of the finishing die is increased so that the wound ultrafine wire is not broken, bent or bent, and the positional relationship between the axis of the hole of the finishing die and the path of the ultrafine wire is increased. I was adjusting it.
[0003]
Among these methods, several methods are known as methods for adjusting the positional relationship between the hole axis of the latter finishing die (the axial center of the hole) and the traveling path of the fine wire. One of them is the method (hereinafter referred to as the first method) described in Japanese Utility Model Publication No. 63-50009 (Patent Document 1). In this first method, the fine wire is adjusted so that the fine wire can be positioned while the hole axis of the finishing die is fixed, thereby eliminating the bending of the fine wire and the drawback of curling. Specifically, at least two guide rollers that can move in the vertical direction and the front-rear direction are provided on the upstream and downstream sides of the finishing die, respectively, and the fine wires are alternately passed over the guide rollers. By adjusting the position of, the traveling path of the fine wire is adjusted while the hole axis of the finishing die is fixed. As a result, the ultrafine wire is inserted into the hole of the finishing die coaxially and in a tensile state, and final processing is performed.
[0004]
The other is a method (hereinafter referred to as a second method) described in JP-A-8-309426 (Patent Document 2). In the second method, the hole axis of the finishing die is adjusted so as to be positioned while the traveling path of the fine wire is fixed. Specifically, guide rollers are arranged on the upstream and downstream sides of the finishing die, and these guide rollers are attached to a pedestal that is movable in the vertical direction (vertical direction) and the horizontal direction, and the finishing die is provided with a V-shaped groove. It is supported on a holder that has. In this second method, the finishing die is made flexible to some extent, and the finishing die is made to follow the fluctuation of the fine wire at the time of wire drawing. However, it is possible to use a die that is greatly deviated from the center axis of the die.
[0005]
Further, there is a method (hereinafter referred to as a third method) described in Japanese Utility Model Publication No. 47-18437 (Patent Document 3). In the third method, the fine wire is drawn while the die holder is always held at the center of the fixed frame by the uniform tension of each coil spring. In the third method, the die is always held stably in response to a sudden change in the drawing force and a change in the direction of action that occur in the case of drawing.
[0006]
There is also a method (hereinafter referred to as a fourth method) described in JP-A-56-84118 (Patent Document 4). In the fourth method, an error in the straightness of the bar that has passed through the finishing die is measured, and the method from the initial zero setting is adjusted with high accuracy. This fourth method can keep the linearity error very small.
[0007]
[Patent Document 1]
Japanese Utility Model Publication No. 63-50009 (page 2, FIGS. 3 to 6)
[Patent Document 2]
JP-A-8-309426 (second page, FIGS. 1 and 2)
[Patent Document 3]
Japanese Utility Model Publication No. 47-18437 (FIGS. 1 and 7)
[Patent Document 4]
JP-A-56-84118 (FIG. 1)
[0008]
[Problems to be solved by the invention]
However, in the first method, if the wire diameter becomes an ultrafine wire of 100 μm or less, the ultrafine wire becomes difficult to see, and therefore, as shown in FIG. 5 of Japanese Utility Model Publication No. 63-50009, With the adjustment nut (28-31) and the adjustment nut (32-35), it is difficult to position the fine wire at the center of the final finishing die, and visual inspection is impossible with the fine wire having a wire diameter of 40 μm or less. It becomes.
In addition, the fourth method cannot be used in the first place because the fine wire that has passed through the finishing die will meander unless pulled.
[0009]
In the first method, the second method, and the fourth method, even if the hole axis of the finishing die can be set to perfectly match the traveling path of the fine wire, it is possible to always obtain high straightness. Can not. The reason is that if the fine wire fluctuates during wire drawing, the weight of the die will follow and follow the fine wire, resulting in twisting, bending or warping of the fine wire due to the changing hole shape of the fixed die. This is because defects such as the above appear. In particular, if the wire diameter of the ultrafine wire is reduced to 40 μm or less, subtle vibrations are likely to occur during wire drawing, and the ultrafine wire is directly affected by the internal shape of the finishing die. Therefore, even if the pulling stress applied to the ultrafine wire is slightly changed in the first method, the second method, or the fourth method, or the contact distance in the finished die hole is slightly changed, Defects such as bending and warping appear greatly, and if severe, it results in disconnection. Furthermore, the hole shape of the finish die is slightly different even if it is made accurately, and the diamond of the finish die becomes (100) surface as hundreds of thousands of m of ultrafine wire is drawn. As a result of uneven wear along the crystal orientation plane, the hole shape changes minutely. Therefore, in the first method, the second method, and the fourth method in which the finishing die is made to follow the fluctuation of the fine wire at the time of wire drawing, high straightness cannot always be obtained. For this reason, conventionally, the final winding speed at the time of wire drawing is reduced to make it easier to follow, or the winding diameter is reduced to suppress the generation of defective wires per piece, making it carefully one by one. It was.
[0010]
Further, in the third method, since the center of the hole of the finishing die constantly moves during wire drawing, defects such as torsion, bending, and warping appear greatly.
[0011]
The present invention always obtains high straightness even when the above-mentioned problems of the conventional wire drawing method or wire drawing device, that is, even when finishing dies are replaced or hundreds of thousands of m of ultra fine wires are drawn. Was made in view of the problem that it was difficult.
The present invention provides a wire drawing method and a wire drawing device that can always obtain high straightness while following the die to fluctuations in the fine wire during wire drawing even if the hole shape of the finishing die changes slightly. The purpose is to do.
In addition, even if the hole shape or the like of the finishing die changes slightly, the present invention always obtains high straightness by finely adjusting the hole axis of the finishing die by a predetermined angle with respect to the travel path of the fine wire. Another object of the present invention is to provide a wire drawing method and a wire drawing device capable of performing the above.
Further, the present invention relates to the adjustment of the angle of the hole axis of the finishing die with respect to the travel path of the fine wire by directly correlating with the measurement value such as the bending or warping of the fine wire immediately before being wound on the take-up spool, or the wire drawing. By calculating from the measured value of non-contact displacement sensor due to eddy current etc. attached to the die holder before being wound on the spool inside, the measured value of the load cell, the enlarged value of the change amount by the laser beam and the target plate, etc. Another object is to provide a wire drawing method and a wire drawing device that feed back those measured values to re-position the finishing die and continuously wind up a large number of fine wires.
Furthermore, the present invention provides a wire drawing method and a wire drawing device capable of continuously drawing an ultrafine wire having a wire diameter of 40 μm or less, which can be continuously drawn at a high speed of 50 to 1000 m / min. This is another purpose.
[0012]
[Means for Solving the Problems]
According to the present invention, the above object is achieved by the following technical means.
(1) An extra fine wire is inserted into the hole of a plurality of dies having a hole for reducing the diameter of the extra fine wire, a constant tension is applied to the extra fine wire by a take-up spool, and the tension is applied by at least a pair of guides. Insert the extra fine wire into the hole of the finishing die which has a hole for reducing the ultra fine wire to the final wire diameter. Is a drawing method of an ultrafine wire to obtain an ultrafine wire processed to the final wire diameter,
The finishing die is accommodated and held in a finishing die holder, one connecting pin is inserted into a hole on one side wall of the finishing die holder, and the hole on the other side wall of the finishing die holder is adjacent to the finishing die holder. The other connecting pin is inserted into the through hole of the L-shaped block, and the finishing die holder in which the fine wire forms a traveling path is suspended in the perpendicular direction, and the bottom of the L-shaped block can be rotated in a horizontal plane. Place it on a turntable,
A method of drawing an extra fine wire, wherein the angle of the hole axis of the finishing die is adjusted in the horizontal direction.
(2) An extra fine wire is inserted into the hole of a plurality of dies having a hole for reducing the diameter of the extra fine wire, a constant tension is applied to the extra fine wire by a take-up spool, and the tension is reduced by at least a pair of guides. Insert the extra fine wire into the hole of the finishing die which has a hole for reducing the ultra fine wire to the final wire diameter. Is a drawing method of an ultrafine wire to obtain an ultrafine wire processed to the final wire diameter,
The finishing die is received and held in a finishing die holder, one connecting pin is inserted into a hole on one side wall of the finishing die holder, and the hole adjacent to the finishing die holder is inserted into the hole on the other side wall of the finishing die holder. The other connecting pin is inserted into the through hole of the character block, and the finishing die holder in which the fine wire forms a traveling path in the perpendicular direction is suspended.
One end of a vertical fixing pin attached to the base through the other end of the vertical spring body contacting the other end of the swing plate sandwiched between the finishing die holder and the L-shaped block The finishing die holder and the swinging plate are integrated together so that the finishing die holder is suspended, and the finishing die hole shaft of the finishing die hole shaft is moved up and down by the vertical movable shaft that contacts one end of the swinging plate. An ultrafine wire drawing method characterized by performing vertical angle adjustment.
(3) Inserting the ultrafine wire into the holes of a plurality of dies having a hole for reducing the diameter of the ultrafine wire, applying a certain tension to the ultrafine wire by a take-up spool, and applying this tension by at least a pair of guides Insert the extra fine wire into the hole of the finishing die which has a hole for reducing the ultra fine wire to the final wire diameter. Is a drawing method of an ultrafine wire to obtain an ultrafine wire processed to the final wire diameter,
The finishing die is accommodated and held in a finishing die holder, one connecting pin is inserted into a hole on one side wall of the finishing die holder, and an L-shape in the hole on the other side wall of the finishing die holder and adjacent to the finishing die holder The other connecting pin is inserted into the through hole of the block, and the finishing die holder in which the fine wire forms a traveling path in the perpendicular direction is suspended, and the bottom of the L-shaped block is mounted on a turntable that can rotate horizontally. Let
One end of a vertical fixing pin attached to the base through the other end of the vertical spring body contacting the other end of the swing plate sandwiched between the finishing die holder and the L-shaped block The finishing die holder and the swinging plate are integrated together so that the finishing die holder is suspended, and the finishing die hole shaft of the finishing die hole shaft is moved up and down by the vertical movable shaft that contacts one end of the swinging plate. The angle adjustment in the vertical direction is performed, and the angle adjustment in the horizontal direction of the turntable is performed by the front and back of the horizontal movable shaft that is in contact with one end in the horizontal direction of the rotation plate fixed to the other end of the rotation shaft of the turntable. By performing, the angle adjustment of the horizontal direction and the vertical direction of the said finishing die hole axis | shaft is performed, The drawing method of the ultra fine wire characterized by the above-mentioned.
(4) The ultrafine wire drawing method according to any one of (1) to (3), wherein the ultrafine wire is processed so that a final wire diameter is 40 μm or less.
(5) At least a pair of a plurality of diameter reducing dies having a hole for reducing the diameter of the ultrafine wire, a finishing die having a hole for reducing the diameter of the ultrafine wire to the final wire diameter, and a traveling path of the ultrafine wire In the extra-fine wire drawing device comprising a guide and a take-up spool that applies tension to the extra-fine wire and winds up the extra-fine wire processed to the final wire diameter.
A finishing die holder for receiving and holding the finishing die; one connecting pin is inserted into a hole on one side wall of the finishing die holder; and the hole on the other side wall of the finishing die holder and the finishing die holder The other connecting pin is inserted into the through hole of the adjacent L-shaped block, and the finishing die holder that forms the path of the ultrafine wire in the perpendicular direction is suspended by the connecting pins on both side walls, and the bottom of the L-shaped block is An ultra-thin wire drawing device characterized in that it is placed on a turntable that can rotate in a horizontal plane.
[0013]
In this specification, “angle in the direction perpendicular to the travel path of the fine wire” means the finish when the hole center of the finishing die is the origin, and the hole axis direction of the finishing die is aligned with the travel path of the fine wire. This is the angle at which the vertical axis of the die is tilted to the travel path or reverse path of the fine wire. In addition, “the angle in the horizontal direction with respect to the travel path of the fine wire” means that the center of the hole of the finish die when the hole axis direction of the finish die is aligned with the travel path of the fine wire is the origin, and the finish die is extremely fine. The angle rotated around the path of the line. Usually, the finishing die is a disc and the hole shape is also cylindrical, but there are also cases where the conical dies are orthogonally combined.
As the “microfeeding means”, there is a method using a method using a micro screw structure, a method using a stepping motor or a linear motor, or the like.
[0014]
In the conventional wire drawing method and wire drawing device, since the finishing die is placed on the fixed base (FIG. 5 of Patent Document 1 and FIG. 1 of Patent Document 2), it is delicate at the time of wire drawing. When the finishing die tries to follow the vibrations, defects such as twisting, bending and warping appear in the ultrafine wire due to the weight of the finishing die.
On the other hand, in the ultrafine wire drawing method and the drawing apparatus according to the present invention, one end of the finishing die is held by the spring body with respect to the fixed base, so that the finish die is subjected to subtle vibration during drawing. Even if the other end tries to follow, the dead weight of the finishing die does not cause defects such as twisting, bending and warping in the fine wire. By finely adjusting the hole axis angle of the finishing die in the vertical and horizontal directions with respect to the travel path of the ultrafine wire in advance according to the material and diameter of the ultrafine wire and placing the finishing die at the most desirable position, Subtle vibrations can be controlled to a minimum, and straight line straightness can be obtained.
[0015]
Although it can not be directly measured during drawing values and distribution of reduced径応force Hairline receives from the periphery of the bore of the finishing die during wire drawing, bending of the wound electrode thin line for example to the take-up spool Shape parameters such as warpage can be measured after drawing. Therefore, by feeding back the measured values of the shape parameters such as bending and warping of the fine wire and finely adjusting the vertical and horizontal finish die hole axis angles before drawing, the straight line of the high fine wire goes straight every time. Sex can be obtained. At this time, based on the actual measurement values of the shape parameters such as bending and warping of the fine wire wound on the take-up spool, the vertical and horizontal finishing die hole axis angles are determined with respect to the next fine wire traveling path. By fine adjustment, the optimum hole position for the finishing die can be obtained.
[0016]
In particular, one end of a finishing die holder (hereinafter also simply referred to as a “die holder”) that stores and holds the finishing die is held by a spring body, and the other end of this die holder is extended and contracted by a microfeed means, so that the progress of the fine wire is progressed. By finely adjusting the vertical and / or horizontal angle with respect to the path, the spring body can further absorb or amplify subtle vibrations of the finishing die. In addition, the spring body contributes to simplification of work in a narrow space. At this time, the vertical and horizontal angles of the hole axis of the finishing die can be finely adjusted independently, and fine vibrations during wire drawing can be dispersed or diverged. Can be controlled while holding in a certain direction. Furthermore, the die holder and the swing plate are integrated so as to be swingable by a fixing pin, and the die holder is suspended in a direction perpendicular to the traveling path of the fine wire by a spring body and a minute feed means, for example, a screw structure. Is mounted on a turntable, one end of the turntable is held by a spring body, and the other end is extended and retracted in parallel with the spring body by a microfeed means, for example, a screw structure, so that If the angle is finely adjusted, the fine adjustment in the vertical direction and the horizontal direction can be performed in a narrow space, and vibration during wire drawing can be effectively dispersed or diverged.
[0017]
Furthermore, in the case of extra fine wires with a wire diameter of 40 μm or less, the shrinkage stress in the hole of the finishing die at the time of wire drawing is directly applied to the extra fine wire, and the elastic force of the extra fine wire itself is small. It tends to bend, warp, bend, and break. In addition, it is difficult to see the ultrafine wire itself, and since the ultrafine wire is tensioned at the time of wire drawing, it is difficult to find a warp or a bend. This is thought to be due to the fact that the reduced diameter stress applied to the fine wire from the periphery of the hole in the finish die is not uniform, so the fine stress applied to the fine wire can be reduced by finely adjusting the angle of the finished die. can do. The cause of the defect cannot be observed with the naked eye when the wire diameter is 40 μm or less, and the wire is wound on the take-up spool by finely adjusting the vertical or horizontal angle with respect to the travel path of the wire. It is important to obtain processing information at the time of wire drawing from actual measured values of shape parameters such as bending and warping of extra fine wires.
[0018]
In the vertical angle adjusting mechanism or horizontal angle adjusting mechanism in the wire drawing method and wire drawing device of the present invention, one end of the die holder is held by a spring body, and the other end of the die holder is a screw structure in a microfeed means, for example, a micrometer head The screw structure can be extended and contracted. If this screw structure of the micrometer head is used, it can be moved by several tens of mm in increments of 0.02 mm, and angle adjustment from 0 to 45 degrees is possible.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
An ultrafine wire drawing apparatus according to an embodiment of the present invention includes at least a plurality of diameter reducing dies having a hole for reducing the diameter of the ultrafine wire, and a hole for reducing the ultrafine wire to a final wire diameter. And a take-up spool that applies tension to the fine wire and winds up the fine wire processed to the final wire diameter. Here, the finishing die, which is the main part, and its peripheral mechanism will be described in detail.
[0020]
1, 2, 3, 4 and 5, a front view finish die and the mechanism of its periphery is a main part of a drawing device hairline according to this embodiment, a flat view, a side view, They are shown in a perspective view and an exploded perspective view, respectively.
Referring to FIGS. 1 to 5, the fine wire is indicated by L, and the traveling path of the fine wire L is determined by a pair of guides (guide rolls and the like) not shown. The finishing die 10 is disk-shaped and has a hole 11 for reducing the diameter to the final wire diameter at the center. The finishing die 10 is detachably accommodated in the accommodating portion of the open die holder 12 and is sandwiched by the spring 13 from behind the finishing die 10. At this time, a V-shaped groove or a U-shaped groove (hereinafter simply referred to as “V-shaped groove”) as shown in FIG. 2 of Patent Document 2 is provided in the die holder 12, and the V-shaped groove is finished. When the die 10 is placed, the center of the hole of the finishing die 10 with respect to the die holder 12 can be easily positioned. As the spring 13, an inverted U-shaped or fork-shaped leaf spring is used. In this embodiment that has a plate spring of inverted U-shaped (Fig. 5). However, leaf spring as used herein is intended for pressing the finishing die 10 to one of the inner wall of the die holder 12. The die holder 12 is suspended by two connecting pins 16a and 16b extending from a pedestal (not shown). One of the connecting pin 16a penetrates the L-shaped block 17 is L-shaped block 17 and the die holder 12 are communicated with each other contact. A disk 18 is screwed to the bottom of the L-shaped block 17, and one end of a rotating shaft 19 is fixed to the back surface of the disk 18, and a rotating plate 20 is fixed to the other end of the rotating shaft 19.
[0021]
A horizontal movable shaft 22 protruding from the micrometer horizontal angle adjusting screw head 21 abuts on one end of the rotating plate 20 in the horizontal direction, and a horizontal pin 23 is embedded in one end of the rotating plate 20 in the perpendicular direction. Parallel to the mounting et al is a horizontal spring member 24 and the horizontal moving shaft 22 in the horizontal pin 23 (FIG. 5), a horizontal fixed pin 25 the other end of the horizontal spring 24 is mounted on a pedestal (not shown) Is retained. The main body of the micrometer horizontal angle adjusting screw head 21 is fixed to a pedestal (not shown).
[0022]
On the other hand, a vertical movable shaft 27 protruding from the micrometer vertical angle adjusting screw head 26 is brought into contact with one end in the perpendicular direction on the upper surface of the swing plate 15 and perpendicular to the other end in the right direction on the upper surface of the swing plate 15. One end of the spring body 28 is in contact. The other end of the vertical spring body 28 is held by one end of a vertical fixing pin 29 attached to a pedestal (not shown), and the other end of the vertical fixing pin 29 passes through the hole 30 of the swing plate 15. Yes.
[0023]
The travel path of the ultrafine wire L is determined by guide members such as guide pulleys provided on the left and right sides of the finishing die 10, and adjustment is performed so that the center of the hole 11 of the finishing die 10 comes to this travel path. The traveling path can be determined more precisely by using the alignment die than by providing the guide pulley with the V groove.
[0024]
In the preferred embodiment of the present invention described above, the die holder 12 is held by the vertical spring body 28 and the vertical movable shaft 27 via the swing plate 15, and the finishing die 10 is mounted on the pedestal as in the conventional apparatus. It is not directly attached. Therefore, the vibration of the pedestal (not shown) is dispersed or diverged by the vertical spring body 28 and is not directly transmitted to the finishing die 10. Further, since the die holder 12 is suspended like a seesaw by the two connecting pins 16a and 16b, even if subtle vibrations occur in the fine wire L, the spring constant of the vertical spring body 28 is appropriately set. By selecting, subtle vibrations can be dispersed or diverged. In addition, the spring body contributes to simplification of work in a narrow space. Accordingly, the weight of the finishing die 10 or the die holder 12 is not directly applied to the fine wire L as in the conventional apparatus. Therefore even if wire diameter of fine wire L is became thinner to 40μm or less, bending twisting and hole axis angle and hairline L of the finishing die 10, Rukoto adjusting the precise relationship between the shape defect such as warp Can now.
[0025]
In the preferred embodiment of the present invention described above, when the micrometer vertical angle adjusting screw head 26 is rotated, the vertical movable shaft 27 is moved up and down, and the finishing die 10 is moved with respect to the traveling direction of the fine wire L via the swing plate 15. Move back and forth. Since the vertical movable shaft 27 has a micrometer structure, it can be expanded and contracted steplessly. Similarly, the horizontal movable shaft 27 can be expanded and contracted steplessly. Since the vertical spring body 28 of the vertical movable shaft 27 and the horizontal spring body 24 of the horizontal movable shaft 22 are independent, the hole axis angle of the finishing die 10 and shape defects such as twisting, bending, and warping of the fine wire L are caused. can you to independently adjust the relationship.
[0026]
The fine wire drawing apparatus according to the present embodiment is first adjusted as follows. First, both ends of the fine wire L are brought into a state of being linearly pulled by a guide member (not shown). Next, the finishing die 10 is mounted on the die holder 12 so that the hole axis of the finishing die 10 matches the traveling path of the ultrafine wire L. This operation removes a large stress load that breaks the ultrafine wire immediately after drawing, but slight bending and twisting cannot be removed because it is judged visually. Therefore, a trial wet wire drawing process is performed at a high speed of 600 m / min from a fine wire having a wire diameter of 140 μm to an ultrafine wire having a wire diameter of 15 μm.
[0027]
Next, the second adjustment is performed. The second adjustment is perpendicular to the travel path of the fine wire L based on the measured value after drawing of the shape parameter such as the bending and warping of the first adjustment wound on a take-up spool (not shown). The hole axis angle of the finishing die 10 in the horizontal and horizontal directions is finely adjusted by the micrometer vertical angle adjusting screw head 26 and the micrometer horizontal angle adjusting screw head 21. Thereafter, whenever necessary, the shape parameters such as the bending and warping of the fine wire L are measured every time a lot is completed, and the vertical and horizontal hole axis angles of the finishing die 10 are finely adjusted. FIG. 6 shows a state of angle adjustment in the horizontal direction, and FIG. 7 shows a state of angle adjustment in the vertical direction.
[0028]
As a result of the fine adjustment as described above, a high speed of 300 m / min from a fine gold wire having a wire diameter of 40 μm, a gold-15% silver alloy wire, a pure copper wire and an aluminum-silicon alloy wire to a fine wire having a wire diameter of 15 μm. Wet wire drawing treatment was performed to produce 20 lots of 5,000 m. Furthermore, one lot of 20,000 m winding was produced. When these ultrafine wires were used as bonding wires for semiconductor devices, there were no bends or breaks.
[0029]
【The invention's effect】
As described above, according to the drawing method and drawing apparatus for extra fine wire according to the present invention, the fine wire at the time of drawing is drawn by the spring body and the fine feed means of the vertical angle adjustment mechanism and / or the horizontal angle adjustment mechanism. Straightness can be obtained by making the finishing die follow the fluctuation.
In addition, even if the hole shapes of the finishing dies differ slightly from each other and may adversely affect the linearity of the fine wire, actual measurement of the shape parameters such as bending and warping of the fine wire wound on the take-up spool Since the vertical angle and horizontal angle of the hole axis of the finishing die can be finely adjusted based on the values, such adverse effects can be suppressed. As a result, since the straightness of the very fine wire is always obtained, it can be performed at a high speed not only in the wet wire drawing process but also in the dry wire drawing process. In particular, even if the wire diameter of the ultrafine wire becomes 40 μm or less and is directly affected by the internal shape of the finishing die, the subtle vibration applied to the ultrafine wire is absorbed or amplified by the spring body. The wire can be drawn at high speed without receiving subtle vibrations.
[Brief description of the drawings]
FIG. 1 is a front view of an essential part of a wire drawing apparatus for ultra fine wires according to an embodiment of the present invention.
FIG. 2 is a plan view of a main part of a wire drawing apparatus for ultra fine wires according to an embodiment of the present invention.
FIG. 3 is a side view of a main part of a wire drawing apparatus for extra fine wires according to an embodiment of the present invention.
FIG. 4 is a perspective view of a main part of a wire drawing device for extra fine wires according to an embodiment of the present invention.
FIG. 5 is an exploded perspective view of a main part of a wire drawing apparatus for extra fine wires according to an embodiment of the present invention.
FIG. 6 is a plan view showing a state of angle adjustment in the horizontal direction of the finishing die.
FIG. 7 is a side view showing a state of angle adjustment in the vertical direction of the finishing die.
[Explanation of symbols]
L Extra fine wire 10 Finishing die 11 Reduction diameter hole 12 Open die holder 13 Spring 15 Oscillating plates 16a and 16b Connecting pin 17 L-shaped block 18 Disk 19 Rotating shaft 20 Rotating plate 21 Micrometer horizontal angle adjusting screw head 22 Horizontally movable Shaft 23 Horizontal pin 24 Horizontal spring body 25 Horizontal fixing pin 26 Micrometer vertical angle adjusting screw head 27 Vertical movable shaft 28 Vertical spring body 29 Vertical fixing pin 30 Oscillating plate hole

Claims (5)

An extra fine wire is inserted into the holes of a plurality of dies having a hole for reducing the extra fine wire, a constant tension is applied to the extra fine wire by a take-up spool, and the tension is applied by at least a pair of guides. By defining the travel path of the wire and placing it in the hole of the finishing die having a hole for reducing the ultrafine wire to the final wire diameter, which is arranged upright in the traveling direction of the ultrafine wire, A method of drawing an ultrafine wire to obtain an ultrafine wire processed into a wire diameter,
The finishing die is accommodated and held in a finishing die holder, one connecting pin is inserted into a hole on one side wall of the finishing die holder, and the hole on the other side wall of the finishing die holder is adjacent to the finishing die holder. The other connecting pin is inserted into the through hole of the L-shaped block, and the finishing die holder in which the fine wire forms a traveling path is suspended in the perpendicular direction, and the bottom of the L-shaped block can be rotated in a horizontal plane. A method of drawing an ultrathin wire, which is mounted on a turntable and performs horizontal angle adjustment of the hole axis of the finishing die. An extra fine wire is inserted into the holes of a plurality of dies having a hole for reducing the extra fine wire, a constant tension is applied to the extra fine wire by a take-up spool, and the tension is applied by at least a pair of guides. By defining the travel path of the wire and placing it in the hole of the finishing die having a hole for reducing the ultrafine wire to the final wire diameter, which is arranged upright in the traveling direction of the ultrafine wire, A method of drawing an ultrafine wire to obtain an ultrafine wire processed into a wire diameter,
The finishing die is received and held in a finishing die holder, one connecting pin is inserted into a hole on one side wall of the finishing die holder, and the hole adjacent to the finishing die holder is inserted into the hole on the other side wall of the finishing die holder. The other connecting pin is inserted into the through hole of the character block, and the finishing die holder in which the fine wire forms a traveling path in the perpendicular direction is suspended.
One end of a vertical fixing pin attached to the base through the other end of the vertical spring body contacting the other end of the swing plate sandwiched between the finishing die holder and the L-shaped block The finishing die holder and the swinging plate are integrated together so that the finishing die holder is suspended, and the finishing die hole shaft of the finishing die hole shaft is moved up and down by the vertical movable shaft that contacts one end of the swinging plate. An ultrafine wire drawing method characterized by performing vertical angle adjustment. An extra fine wire is inserted into the holes of a plurality of dies having a hole for reducing the extra fine wire, a constant tension is applied to the extra fine wire by a take-up spool, and the tension is applied by at least a pair of guides. By defining the travel path of the wire and placing it in the hole of the finishing die having a hole for reducing the ultrafine wire to the final wire diameter, which is arranged upright in the traveling direction of the ultrafine wire, A method of drawing an ultrafine wire to obtain an ultrafine wire processed into a wire diameter,
The finishing die is accommodated and held in a finishing die holder, one connecting pin is inserted into a hole on one side wall of the finishing die holder, and an L-shape in the hole on the other side wall of the finishing die holder and adjacent to the finishing die holder The other connecting pin is inserted into the through hole of the block, and the finishing die holder in which the fine wire forms a traveling path in the perpendicular direction is suspended, and the bottom of the L-shaped block is mounted on a turntable that can rotate horizontally. Let
One end of a vertical fixing pin attached to the base through the other end of the vertical spring body contacting the other end of the swing plate sandwiched between the finishing die holder and the L-shaped block The finishing die holder and the swinging plate are integrated together so that the finishing die holder is suspended, and the finishing die hole shaft of the finishing die hole shaft is moved up and down by the vertical movable shaft that contacts one end of the swinging plate. The angle adjustment in the vertical direction is performed, and the angle adjustment in the horizontal direction of the turntable is performed by the front and back of the horizontal movable shaft that is in contact with one end in the horizontal direction of the rotation plate fixed to the other end of the rotation shaft of the turntable. By performing, the angle adjustment of the horizontal direction and the vertical direction of the said finishing die hole axis | shaft is performed, The drawing method of the ultra fine wire characterized by the above-mentioned.   The ultrafine wire drawing method according to any one of claims 1 to 3, wherein the ultrafine wire is processed so that a final wire diameter is 40 µm or less. A plurality of diameter-reducing dies having holes for reducing the ultrafine wire; a finishing die having a hole for reducing the ultrafine wire to the final wire diameter; and at least a pair of guides for defining a path of the ultrafine wire; In addition to applying tension to the ultrafine wire, and drawing the ultrafine wire with a take-up spool that winds the ultrafine wire processed to the final wire diameter,
A finishing die holder for receiving and holding the finishing die; one connecting pin is inserted into a hole on one side wall of the finishing die holder; and the hole on the other side wall of the finishing die holder and the finishing die holder The other connecting pin is inserted into the through hole of the adjacent L-shaped block, and the finishing die holder that forms the path of the ultrafine wire in the perpendicular direction is suspended by the connecting pins on both side walls, and the bottom of the L-shaped block is An ultra-thin wire drawing device characterized in that it is placed on a turntable that can rotate in a horizontal plane.

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