JP3573317B2 - Bonding wire evaluation method and evaluation instrument - Google Patents

Bonding wire evaluation method and evaluation instrument Download PDF

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Publication number
JP3573317B2
JP3573317B2 JP25678896A JP25678896A JP3573317B2 JP 3573317 B2 JP3573317 B2 JP 3573317B2 JP 25678896 A JP25678896 A JP 25678896A JP 25678896 A JP25678896 A JP 25678896A JP 3573317 B2 JP3573317 B2 JP 3573317B2
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wire
bond
pulling
bonding
pulled
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JPH10107057A (en
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康裕 柳沢
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/8512—Aligning
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    • H01L2924/14—Integrated circuits

Description

【０００１】
【発明の属する技術分野】
本発明は、例えばＩＣやトランジスタなどのワイヤボンディング工程を含む各種電子機器の製造工程、またはボンディングワイヤを開発製造する場合などにおいて、ボンディングされたワイヤの接合強度を測定し評価する時の引張方法に関する。
【０００２】
【従来の技術】
ＩＣチップをリードフレームに搭載する場合、リ−ドフレ−ム上に搭載したＩＣチップの端子部とリ−ドフレ−ムのインナ−リ−ド部とがワイヤボンディングされる。この作業は、先ずリ−ドフレ−ムのパッド部に配置されたＩＣチップの端子部にワイヤをボンディングする。引き続きワイヤをインナーリード先端部まで引き、インナーリード先端部に圧着する。
【０００３】
ボンディング状態が良好かどうかは組み上げた半導体装置の良否に直接的に影響する。このため、ボンディング後にボンド部の接合強度やワイヤ強度を評価することは重要なこととなっている。
【０００４】
このときのＩＣチップ側とインナーリード側の二つのボンド部の接合性やワイヤ強度を評価する方法として、図２や３に示すように、被評価部と反対側のボンド部近傍をハサミ、メス、カミソリ等でワイヤを切断し、切断したワイヤ近傍を挟持（ツイ−ザ）し引張測定していた。この方法では、切断時にワイヤを変形させたり、ワイヤに異なる応力を与えたりするため得られる測定値のバラツキが大きくなる。特に評価する者の個人差が大きく、測定装置が同様でも異なる結果となる場合が多い。
【０００５】
よって、例えば新規なボンディングワイヤを開発する場合、もしくはボンディングワイヤを用いて各種電子機器を製造する場合、ワイヤ強度及びボンド部の接合強度を正確に判定できず、経験則等に頼って評価することになる。その結果、往々にして過剰品質になりがちであり、材料コストや生産コストの適正化が図れないという不具合がある。
【０００６】
【発明が解決しようとする課題】
本発明は、ボンディングワイヤの性能及び適格に接合しているかを正確に評価することのできるワイヤボンド部の強度と接合性の評価方法を提供することを課題とする。
【０００７】
【課題を解決するための手段】
上記の目的を達成するために本発明によるボンド部の接合強度の評価方法は、以下のようにしたものである。
【０００８】
本発明に係るボンディングワイヤの評価方法は、ボンディングワイヤの２つのボンド部の接合性およびワイヤ強度を測定し評価する方法であって、ボンド面とワイヤを引き上げる方向とが略直角になるように一方のボンド部の近傍のワイヤを挟持して引き上げ破断させて、該一方のボンド部の測定を行い、該一方のボンド部の近傍で破断したワイヤを挟持したまま引き上げることにより前記ボンド部を移動させ、該ワイヤが他方のボンド部でボンド面と略直角となるようにした後、該ワイヤを引き上げ破断させて、他方のボンド部の測定を行うことを特徴とする。
具体的には、２つのボンド部を有する被評価物を上面に固定する可動テーブルと、該上面に略直角になるようにワイヤを引き上げ可能なワイヤ引き上げ具とを有する評価器具を用い、前記可動テーブルの上面に固定された被評価物のＩＣチップ側のボンド部近傍のワイヤを挟持して引き上げ破断させて、ＩＣチップ側のボンド部の接合性とワイヤ強度とを測定し、その後そのままワイヤを引き上げ、インナーリード側のボンド部のボンド面とワイヤを引き上げる方向が略直角となるようにして該ワイヤを引き上げ破断させて、インナーリード側ボンド部の接合性とワイヤ強度とを測定する。
また、本発明に係るボンディングワイヤの評価器具は、ループ形状のワイヤを２つのボンド部で接続した被評価物を上面に固定する可動テーブルと、該上面に略直角にワイヤを挟持して引き上げ破断させて、ボンド部の接合性およびワイヤ強度を測定するワイヤ引上げ具とからなり、前記可動テーブルが、該可動テーブルのスライド方向と前記ループの方向を同じにする回転機構と、前記被評価物の一方のボンド部に前記引上げ具を位置決めし、かつ、該一方のボンド部を測定する際に、前記引上げ具がワイヤを引き上げた距離に応じて、前記ワイヤのループ方向に可動テーブルを移動させるスライド機構とを有する。
【０００９】
【発明の実施の形態】
本発明では、あらかじめハサミ等でワイヤを切断せずに、まずＩＣチップ側のボンド部近傍をツイーザし、そのボンド部の破断強度を求め、次に連続しインナーリード側のボンド部の破断強度を測定する。このとき、ＩＣチップ側のボンド部が破断し、そして、可動テ−ブルを用いているため、ＩＣチップ側のボンド部の評価時に、引上げ具の引張りにより破断してワイヤが延びた分だけテ−ブルが移動する。これにより、インナーリード側のボンド部に影響がなく、格別の応力はかからない。
【００１０】
すなわち、最初に、ＩＣチップ側のボンド部の評価をするのは、当該部近傍のワイヤは通常ＩＣチップ側ボンド部のボンド面と略直角を成しているからである。
【００１１】
ＩＣチップ側のボンド部が、破断強度の測定で破断した後、引き続き挟持したワイヤをそのまま上方に引き上げると、被評価物が設けられた可動テーブルが移動し、ワイヤとインナーリード側ボンド部のボンド面と略直角になる。この後ボンド部に加重が掛けられ、ボンド部の破断強度及び破断モ−ドが測定される。
【００１２】
これにより、従来ボンディングワイヤのボンド部につながっているワイヤ他部をあらかじめハサミ等で切断し、その切断部近傍をツイ−ザし引っ張ることで破断強度等を測定していたが、本発明はワイヤをあらかじめハサミ等で切断すること無くかつ複数のボンド部を連続測定できる。
【００１３】
なお、市販のワイヤボンド用引張試験機にツイ−ザ治具と可動テ−ブルをセットし、引張軸を同期させながら可動テーブルと略直角になるようにツイ−ザ引張することも本発明の範疇である。
【００１４】
【実施例】
次に実施例を用いて本発明をさらに説明する。
【００１５】
（実施例１）
以下、本発明のボンディングワイヤの評価方法を図を用いて説明する。
【００１６】
本実施例で用いた被評価物はＩＣが搭載されたリードフレームであり、ＩＣチップとインナ−リ−ドとは、Ａｕワイヤでボンディングされている。この時のワイヤ長は４ｍｍ、ワイヤ高さは２５０μｍ、ワイヤ径は３０μｍφである。
【００１７】
本実施例では、ワイヤ強度を測定するため市販の引張試験機（株式会社ア−クテック製 商品名 「デイジ・ボンドテスタ−２４００」）に同社のツイ−ザ治具と被評価物を固定するテ−ブルを移動可能なテ−ブルに交換して用いた。この可動テ−ブルは、ツイ−ザ治具の移動距離と対応してスライドする機構とボンディングされたワイヤのル−プ方向とテ−ブルの移動方向を同じくする回転機構と被評価物を傾けることのできる傾斜機構を具備している。
【００１８】
この可動テ−ブルに被評価物を固定治具あるいは両面接着剤付きテ−プで固定し、可動方向とワイヤ４のル−プ方向を回転機構にて一致させた。次に第１図（ａ）に示すように、ツイ−ザ治具５を第一ボンディング部４ａの直上部に位置決めした後、ツイ−ザし引っ張り方向６に引っ張った。
【００１９】
その後、第１図（ｂ）に示すようにＩＣ側の第一ボンド部４ａの直上の再結晶部が破断され、引張およびテ−ブル移動が止まり、破断強度値がプリントアウトされた。その状態で再び引張操作を続けると、第１図（ｃ）に示したようにインナーリード側の第二ボンド部４ｂをツイ−ザ引っ張りした。
【００２０】
第４図に得られた結果を示した。
【００２１】
（従来法）
垂直方向にツイ−ザ引張するときに可動テ−ブル１を用いず、ワイヤを手動で立てから引っ張って引っ張り破断強度を求めた。
【００２２】
まず、図２のように第二ボンド部近傍のワイヤを切断し、ワイヤがボンド面と略直角になるように立て、ワイヤ先端を挟持し、上方に引っ張り第一ボンド部の破断強度を測定した。
【００２３】
次に図３のように別のボンディング部の第一ボンド部近傍のワイヤを切断し、ワイヤがボンド面と略直角になるように立て、ワイヤ先端を挟持し、上方に引っ張り第二ボンド部の破断強度を測定した。
【００２４】
得られた結果を図４に合わせて示した。
【００２５】
図４より以下のことがわかる。
【００２６】
従来方法は、ワイヤを切断する際の異なる応力で、引張破断部近傍が加工硬化あるいは劣化を生じるため、非常にバラツキの大きい測定値である。しかし本発明方法は、バラツキの非常に小さい安定した測定値が得られている。
【００２７】
すなわち操作の熟練期間を要せず、誰でも迅速に複数箇所をバラツキ無く測定できることであるので、非常に有効な方法である。
【００２８】
【発明の効果】
本発明によれば、ワイヤボンディング工程において、適正な評価が迅速に未熟練者でも可能であり、測定時間の短縮および過剰品質が無くなりコストダウンができる。よって、本発明を用いれば品質性および経済性が大幅に向上し、ニ−ズに合ったボンディング用金属ワイヤが開発製造できる。
【図面の簡単な説明】
【図１】本発明の一実施例のツイーザ引っ張りを示す図であり、（ａ）は第一ボンド部を狭持し引っ張っている状態を、（ｂ）は第一ボンド部の破断状態を、（ｃ）は第二ボンド部の引っ張り状態を示す。
【図２】従来の方法を示した図であり、第一ボンド部の測定手順を示す図である。
【図３】従来の方法を示した図であり、第二ボンド部の測定手順を示す図である。
【図４】本発明の実施例、従来例で得られた結果を示した図である。
【符号の説明】
１−−−可動テ−ブル ２−−−リ−ドフレ−ムのパッド部
３−−−ＩＣチップ ４−−−ボンディング金属ワイヤ
４ａ−−第一ボンド部 ４ｂ−−第二ボンド部
５−−−ツイ−ザ治具 ６−−−引張方向
７−−−テ−ブル移動方向 ８−−−固定テーブル[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a tensile method for measuring and evaluating the bonding strength of bonded wires in the manufacturing process of various electronic devices including wire bonding processes such as ICs and transistors, or in the case of developing and manufacturing bonding wires. .
[0002]
[Prior art]
When the IC chip is mounted on the lead frame, the terminal portion of the IC chip mounted on the lead frame and the inner lead portion of the lead frame are wire-bonded. In this operation, first, a wire is bonded to the terminal portion of the IC chip disposed on the pad portion of the lead frame. Continue to pull the wire to the tip of the inner lead and crimp it to the tip of the inner lead.
[0003]
Whether or not the bonding state is good directly affects the quality of the assembled semiconductor device. For this reason, it is important to evaluate the bonding strength and wire strength of the bond portion after bonding.
[0004]
As a method for evaluating the bondability and wire strength of the two bond portions on the IC chip side and the inner lead side at this time, as shown in FIGS. 2 and 3, the vicinity of the bond portion on the opposite side to the portion to be evaluated is scissors and female. The wire was cut with a razor or the like, and the vicinity of the cut wire was pinched (twisted) to measure the tension. In this method, variations in the measurement values obtained because the wire is deformed during cutting or different stresses are applied to the wire are increased. In particular, there are large individual differences among the persons being evaluated, and there are many cases where different results are obtained even if the measurement apparatus is the same.
[0005]
Therefore, for example, when developing a new bonding wire or manufacturing various electronic devices using the bonding wire, the wire strength and the bonding strength of the bond portion cannot be accurately determined, and evaluation is based on empirical rules. become. As a result, the quality tends to be excessive, and the material cost and production cost cannot be optimized.
[0006]
[Problems to be solved by the invention]
It is an object of the present invention to provide a method for evaluating the strength and bondability of a wire bond part, which can accurately evaluate the performance of a bonding wire and whether it is properly bonded.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the bond strength evaluation method according to the present invention is as follows.
[0008]
The method for evaluating a bonding wire according to the present invention is a method for measuring and evaluating the bondability and wire strength of two bond portions of a bonding wire, wherein the bond surface and the direction in which the wire is pulled up are substantially perpendicular to each other. The wire in the vicinity of the bond part is clamped and pulled to break, the one bond part is measured, and the bond part is moved by pulling up while holding the broken wire in the vicinity of the bond part. The wire is made substantially perpendicular to the bond surface at the other bond portion, and then the wire is pulled up and broken to measure the other bond portion.
Specifically, using the evaluation instrument having a movable table for fixing an object to be evaluated having two bond portions on the upper surface and a wire lifting tool capable of pulling up the wire so as to be substantially perpendicular to the upper surface, the movable device is used. The wire near the bond part on the IC chip side of the object to be evaluated fixed on the upper surface of the table is pinched and broken to measure the bondability and wire strength of the bond part on the IC chip side. The wire is pulled up and broken so that the bond surface of the bond portion on the inner lead side and the wire pulling direction are substantially perpendicular to each other, and the bondability and wire strength of the inner lead side bond portion are measured.
In addition, the bonding wire evaluation instrument according to the present invention includes a movable table for fixing an object to be evaluated, which has a loop-shaped wire connected by two bond portions, to the upper surface, and the wire is held at a substantially right angle to the upper surface to raise and break. And a wire puller that measures the bondability and wire strength of the bond portion, and the movable table has a rotating mechanism that makes the sliding direction of the movable table the same as the direction of the loop, and the object to be evaluated. A slide that moves the movable table in the loop direction of the wire in accordance with the distance that the pulling tool has pulled the wire when the pulling tool is positioned in one bond part and the one bond part is measured. Mechanism.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, without cutting the wire in advance with scissors or the like , first, the vicinity of the bond portion on the IC chip side is tweezered to determine the breaking strength of the bond portion, and then the breaking strength of the bond portion on the inner lead side is continuously determined. taking measurement. At this time, the bond portion on the IC chip side is broken and a movable table is used. Therefore, when the bond portion on the IC chip side is evaluated, the wire is extended by the breakage caused by pulling of the pulling tool. - Bull move. Thereby, there is no influence on the bond part on the inner lead side, and no special stress is applied.
[0010]
In other words, the bond part on the IC chip side is first evaluated because the wire in the vicinity of the part is generally perpendicular to the bond surface of the IC chip side bond part.
[0011]
After the bond part on the IC chip side is broken by the measurement of the breaking strength, when the wire that has been sandwiched is subsequently pulled up as it is, the movable table provided with the object to be evaluated moves, and the bond between the wire and the inner lead side bond part It becomes almost perpendicular to the surface. Thereafter, a load is applied to the bond portion, and the breaking strength and the breaking mode of the bond portion are measured.
[0012]
As a result , the other part of the wire connected to the bond part of the conventional bonding wire is cut in advance with scissors or the like, and the break strength and the like are measured by tweezering and pulling the vicinity of the cut part. Can be measured continuously without cutting with scissors or the like in advance .
[0013]
In addition, it is also possible to set a tweezer jig and a movable table on a commercially available tensile tester for wire bonding, and to perform the tweezer tension so that the movable shaft is substantially perpendicular to the movable table while synchronizing the tension axis. Category.
[0014]
【Example】
Next, the present invention will be further described using examples.
[0015]
Example 1
Hereinafter, the bonding wire evaluation method of the present invention will be described with reference to the drawings.
[0016]
The object to be evaluated used in this example is a lead frame on which an IC is mounted, and the IC chip and the inner lead are bonded with an Au wire. At this time, the wire length is 4 mm, the wire height is 250 μm, and the wire diameter is 30 μmφ.
[0017]
In the present example, in order to measure the wire strength, a tester for fixing the company's tweezer jig and an object to be evaluated to a commercially available tensile tester (trade name “Dage Bond Tester-2400” manufactured by Arctech Co., Ltd.). The bull was replaced with a movable table. This movable table tilts the object to be evaluated and a mechanism that slides corresponding to the moving distance of the tweezer jig, a rotating mechanism that has the same looping direction of the bonded wire as the moving direction of the table, and the object to be evaluated. A tilting mechanism that can be used.
[0018]
The object to be evaluated was fixed to the movable table with a fixing jig or a tape with a double-sided adhesive, and the movable direction and the loop direction of the wire 4 were matched by a rotating mechanism. Next, as shown in FIG. 1 (a), the twister jig 5 was positioned immediately above the first bonding portion 4a, and then twisted and pulled in the pulling direction 6.
[0019]
Thereafter, as shown in FIG. 1 (b), the recrystallized portion immediately above the first bond portion 4a on the IC side was broken, and the tensile and table movements were stopped, and the breaking strength value was printed out. When the pulling operation was continued again in this state, the second bond portion 4b on the inner lead side was pulled by a twister as shown in FIG. 1 (c).
[0020]
FIG. 4 shows the results obtained.
[0021]
(Conventional method)
When pulling the tweezers in the vertical direction, the tensile strength at break was obtained by manually pulling the wire from the stand without using the movable table 1.
[0022]
First, as shown in FIG. 2, the wire in the vicinity of the second bond portion was cut, the wire was placed so as to be substantially perpendicular to the bond surface, the wire tip was pinched, and the wire was pulled upward to measure the breaking strength of the first bond portion. .
[0023]
Next, as shown in FIG. 3, the wire in the vicinity of the first bond portion of another bonding portion is cut, the wire is set to be substantially perpendicular to the bond surface, the tip of the wire is sandwiched, and the upper end of the second bond portion is pulled upward. The breaking strength was measured.
[0024]
The obtained results are shown in FIG.
[0025]
The following can be seen from FIG.
[0026]
The conventional method is a measurement value having a very large variation because the vicinity of the tensile fracture part causes work hardening or deterioration due to different stresses when cutting the wire. However, according to the method of the present invention, stable measurement values with very small variations are obtained.
[0027]
In other words, it is a very effective method because it does not require an experienced period of operation and anyone can quickly measure a plurality of locations without variation.
[0028]
【The invention's effect】
According to the present invention, in the wire bonding process, proper evaluation can be performed quickly even by an unskilled person, and measurement time can be shortened and excessive quality can be eliminated, thereby reducing costs. Therefore, if this invention is used, quality and economical efficiency will improve significantly, and the metal wire for bonding suitable for needs can be developed and manufactured.
[Brief description of the drawings]
Figure 1 is a view showing a Ri tweezers pulling of one embodiment of the present invention, (a) represents the state of pulling to sandwich the first bonding portion, (b) the fracture state of the first bond portions (C) shows the tensile state of the second bond part.
FIG. 2 is a view showing a conventional method and showing a measurement procedure of a first bond portion.
FIG. 3 is a view showing a conventional method and showing a measurement procedure of a second bond portion.
FIG. 4 is a diagram showing results obtained in an example of the present invention and a conventional example.
[Explanation of symbols]
1 --- movable table 2 --- pad portion of lead frame 3 --- IC chip 4 --- bonding metal wire 4a--first bond portion 4b--second bond portion 5-- -Tweezer jig 6 --- Tensile direction 7 --- Table moving direction 8 ---- Fixed table

Claims (3)

ボンディングワイヤの２つのボンド部の接合性およびワイヤ強度を測定し評価する方法であって、ボンド面とワイヤを引き上げる方向とが略直角になるように一方のボンド部の近傍のワイヤを挟持して引き上げ破断させて、該一方のボンド部の測定を行い、該一方のボンド部の近傍で破断したワイヤを挟持したまま引き上げることにより前記ボンド部を移動させ、該ワイヤが他方のボンド部でボンド面と略直角となるようにした後、該ワイヤを引き上げ破断させて、他方のボンド部の測定を行うことを特徴とするボンディングワイヤの評価方法。 A method for measuring and evaluating the bondability and wire strength of two bond portions of a bonding wire, with the wire in the vicinity of one bond portion sandwiched so that the bond surface and the direction in which the wire is pulled up are substantially perpendicular to each other. The one bond part is measured by pulling up and breaking, and the bond part is moved by pulling up while holding the broken wire in the vicinity of the one bond part, and the wire is bonded to the bond surface at the other bond part. A method for evaluating a bonding wire , wherein the wire is pulled up and broken to measure the other bond portion . ２つのボンド部を有する被評価物を上面に固定する可動テーブルと、該上面に略直角になるようにワイヤを引き上げ可能なワイヤ引き上げ具とを有する評価器具を用い、前記可動テーブルの上面に固定された被評価物のＩＣチップ側のボンド部近傍のワイヤを挟持して引き上げ破断させて、ＩＣチップ側のボンド部の接合性とワイヤ強度とを測定し、その後そのままワイヤを引き上げ、インナーリード側のボンド部のボンド面とワイヤを引き上げる方向が略直角となるようにして該ワイヤを引き上げ破断させて、インナーリード側ボンド部の接合性とワイヤ強度とを測定することを特徴とするボンディングワイヤの評価方法。 An evaluation instrument having a movable table for fixing an object to be evaluated having two bond portions on the upper surface and a wire lifting tool capable of pulling up the wire so as to be substantially perpendicular to the upper surface is fixed to the upper surface of the movable table. The wire in the vicinity of the bond portion on the IC chip side of the evaluated object is clamped and broken to measure the bondability and wire strength of the bond portion on the IC chip side, and then the wire is pulled up as it is, and the inner lead side The bonding surface of the bonding portion and the strength of the wire are measured by measuring the bondability and the wire strength of the inner lead side bond portion by pulling and breaking the wire so that the direction in which the wire is pulled up is substantially perpendicular to the bond surface . Evaluation methods. ループ形状のワイヤを２つのボンド部で接続した被評価物を上面に固定する可動テーブルと、該上面に略直角にワイヤを挟持して引き上げ破断させて、ボンド部の接合性およびワイヤ強度を測定するワイヤ引上げ具とからなり、前記可動テーブルが、該可動テーブルのスライド方向と前記ループの方向を同じにする回転機構と、前記被評価物の一方のボンド部に前記引上げ具を位置決めし、かつ、該一方のボンド部を測定する際に、前記引上げ具がワイヤを引き上げた距離に応じて、前記ワイヤのループ方向に可動テーブルを移動させるスライド機構とを有するボンディングワイヤの評価器具。A movable table for fixing an object to be evaluated, which has a loop-shaped wire connected by two bond portions, to the upper surface, and a wire is held at a substantially right angle to the upper surface to be pulled and broken to measure the bondability and wire strength of the bond portion. A wire pulling tool, wherein the movable table positions the pulling tool at one of the bond portions of the object to be evaluated, a rotating mechanism that makes the sliding direction of the movable table the same as the direction of the loop, and A bonding wire evaluation instrument comprising: a slide mechanism that moves a movable table in a loop direction of the wire in accordance with a distance that the pulling tool has pulled the wire when measuring the one bond portion.
JP25678896A 1996-09-27 1996-09-27 Bonding wire evaluation method and evaluation instrument Expired - Fee Related JP3573317B2 (en)

Priority Applications (1)

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JP25678896A JP3573317B2 (en) 1996-09-27 1996-09-27 Bonding wire evaluation method and evaluation instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25678896A JP3573317B2 (en) 1996-09-27 1996-09-27 Bonding wire evaluation method and evaluation instrument

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JPH10107057A JPH10107057A (en) 1998-04-24
JP3573317B2 true JP3573317B2 (en) 2004-10-06

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