JP4654816B2 - Extra fine wire passing jig - Google Patents

Description

  The present invention relates to a wire rod that enables efficient insertion of a tip into a die, and particularly relates to a very fine wire die passing jig.

  Extra fine wires such as IC wires are manufactured by wire drawing in which a wire supplied from a previous process is sequentially passed from a thick die to a thin die in a drawing machine called a drawing machine. At this time, the operation of passing the wire through each die is performed by the operator on each die after the tip of the wire is formed into a taper shape by etching or squeaking.

However, the wire to be drawn is thin and has low rigidity, the die hole is small and almost invisible to the naked eye, and there is a step between the die mounting material and the processed part, so that the wire tip is accurately processed For this reason, a certain period of training is required to carry out the work. In addition to this, the ultra-thin wires that have been demanded in recent years have made the rigidity weaker and the work has become more difficult.
Nevertheless, there are no achievements in applications and documents to solve this difficulty, and some workers have attempted to use magnifying lenses. While the number of experienced people has decreased due to the fluidization of power, problems such as not being able to improve productivity by this work have occurred.

  The present invention has been made in view of the actual situation as described above. The object of the present invention is to allow even an unskilled person to easily pass the tip of a wire through a die in a wire drawing process such as a gold wire. An object of the present invention is to provide a wire rod die passing jig that makes it possible.

  In order to achieve this object, a die passing jig for a wire rod according to the present invention is a die capable of holding a die detachably and moving the die in an XY direction within a plane perpendicular to the central axis of a processing hole of the die. Holding means, a support base integrally formed with the die holding means, and a slidably mounted on the support base to guide the workpiece wire on the center axis of the processing hole and the processing A guide means having a tip portion capable of entering into the entrance portion of the hole, a position for rotatably supporting the die holding means or the support base, and a position where the entrance of the machining hole can be seen from above the die holding means and the support base. And a base having a stopper that can be held at a position where the back surface of the die faces upward.

  According to the present invention, the guide means includes a guide groove for guiding the workpiece wire and a detachable pressing plate for placing the workpiece wire in the guide groove.

  Moreover, the die passing jig of the wire rod according to the present invention further includes a monitor camera capable of observing the front and back surfaces of the die by magnifying from above and a monitor connected to the camera.

  According to the present invention, in the drawing process of ultrafine wires such as wire rods, particularly gold wires, even an unskilled person can easily and efficiently perform the wire drawing work, and the operation rate of the apparatus can be improved. A die passing jig for a wire can be provided.

Hereinafter, embodiments of the present invention will be described based on illustrated examples.
FIG. 1 is a schematic configuration diagram of an embodiment of a wire passing die according to the present invention, and FIG. 2 is an enlarged perspective view of a wire guide portion shown by cutting a part of the die.

  As shown in FIGS. 1 and 2, the die passing jig includes a die holder 3 that can hold the processing hole 2 of the die 1 obliquely upward, and a die presser that can detachably attach the die 1 to the die holder 3. 4 and a guide groove 6 of a wire (wire to be processed) 5, a wire guide plate 7 formed so as to be able to sink into a conical recess 1 a called an entrance part of the die 1, and a guide groove 6 The wire upper guide 8 whose tip attached to the wire guide plate 7 is molded in the same manner as the tip of the wire guide plate 7 so that the inner wire 5 does not buckle, and the wire 5 is temporarily placed on the wire guide plate 7. The wire retainer 9 that can be fixed, the slide table 10 that carries the wire guide plate 7, and the slide table 10 can be moved along the center axis of the machining hole 2 of the die 1. A die for supporting the die holder 3 so as to be movable in the XY direction within a plane orthogonal to the central axis of the wire 5 through a well-known ball screw mechanism having a support base 11 and adjusting knobs 12a and 12b. A holder table 12, a support plate 13 that supports the support base 11 and the die holder table 12 so as to form a unit, a base 14 that rotatably supports the support base 11, and a planting on the base 14 A stopper 15a that contacts the support plate 13 and can hold the support table 11 and the die holder table 12 in the position shown in FIG. 1, and the support table 11 and the die holder table 12 in the horizontal position shown in FIG. Is a stopper 15b that can be held at a position that can be seen from above.

  Above the unit, a pair of monitor cameras 16a and 16b set at a position where the front and back surfaces of the dice 1 can be confirmed are provided. The monitor cameras 16a and 16b are positioned so that the operator can easily see them. A placed monitor 17 is connected.

  The guide groove 6 is formed so that the wire 5 can be guided on the central axis of the machining hole 2 of the die 1. In order to support the die holder table 12 so as to be movable in the XY direction within a plane orthogonal to the central axis of the wire 5, a known rack and pinion mechanism is used instead of the ball screw mechanism. May be. Further, instead of the support base 11, the die holder table 12 may be configured to be rotatably supported by the base 14.

Next, the operation of the above apparatus will be described.
As shown in FIG. 3, the tip 5a of the wire to be drawn is processed into a tapered shape by etching and ironing, and this wire 5 is connected to the wire guide plate 7 and the upper guide plate 8 from the tip. It is inserted into the guide groove 6 on the guide plate 7 and the rear end of the wire is fixed on the wire guide plate 7 by the wire presser 9 at a position where the tip protrudes from the tip of the wire guide plate 7 by the thickness of the die 1 ( (See FIG. 2).

  In this state, the wire guide plate 7 is moved in the direction of the dice 1 while watching the enlarged image on the monitor 17 through the monitor camera 16a. In this way, the tip of the wire 5 is inserted into the processing hole 2 in the die 1. At this time, if a position shift occurs due to the shape of the processing hole 2 of the die 1 or bending of the tip of the wire 5, an adjustment knob. 12a and 12b are appropriately rotated, and the die holder table 12 is moved in the XY direction with respect to the wire 5 to adjust the position.

  After confirming that the wire 5 has been inserted into the machining hole 2 in the die 1 in this way, the slide table 10 is fixed to the support base 11 by a well-known method (not shown). The die holder table 12 is integrally rotated clockwise to a position where the support plate 13 contacts the stopper 15b (see FIG. 4).

  Thereafter, while observing the back surface of the die 1 with the monitor 17 via the monitor camera 16b, the tapered tip portion 5a of the wire 5 on the back surface is pinched with the tweezers 18 and pulled upward.

  In this state, the wire 5 and the die 1 are removed from the die holder 3 and set in a die positioning part of a well-known wire drawing machine (not shown) to perform wire drawing.

  When further wire drawing is performed, the tip of the wire is again formed into a taper shape, and the above operation is repeated using a die having a smaller hole diameter. Thus, it is possible to provide a fine wire having a desired diameter.

It is a schematic block diagram of one Example of the die passing jig | tool which concerns on this invention. It is an expansion perspective view of the wire guide part which fractures | ruptures and shows a part of die | dye. It is a side view of the wire which processed the front end in the taper shape. It is a side view which shows the state which rotated the die passing jig | tool shown in FIG. 1 to the predetermined position clockwise.

Explanation of symbols

1 dice
2 Processing hole in the die
3 Dice holder
4 Die presser
5 wires
5a Wire tip
6 Guide groove
7 Wire guide plate
8 Wire guide
9 Wire retainer
10 Slide table
11 Support base
12 Dice holder table
12a, 12b Adjustment knob
13 Support plate
14 base
15a, 15b stopper
16a, 16b Monitor camera
17 Monitor
18 Tweezers

Claims (3)

  A die holding means capable of holding the die detachably and moving the die in the XY direction within a plane orthogonal to the center axis of the processing hole of the die; and a support base configured integrally with the die holding means A guide means which is slidably mounted on the support base, guides the workpiece wire on the center axis of the machining hole, and has a tip portion which can enter the entrance portion of the machining hole, and the die A base having a stopper which rotatably supports the holding means or the support base and can hold the die holding means and the support base at a position where the entrance of the machining hole can be seen from above and a position where the back surface of the die faces upward. Wire rod die jig with a base.   2. The wire rod die passing jig according to claim 1, wherein the guide means includes a guide groove for guiding the workpiece wire and a detachable pressing plate for placing the workpiece wire in the guide groove. 3. The wire passing die die jig according to claim 1 , further comprising a monitor camera capable of magnifying and observing the front and back surfaces of the die from above and a monitor connected to the camera.