JP2004344901A - Wire-drawing method and wire-drawing device for ultra-fine wire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wire-drawing method in which high rectilinear propagation performance can always be achieved by making a die follow the change of an ultra-fine wire during wire-drawing even if the hole shape or the like of a finishing die is subtly changed, and a wire-drawing device therefor. <P>SOLUTION: The wire-drawing method for the ultra-fine wire is composed as follows. The ultra-fine wire is inserted into holes of a plurality of dies having the holes for reducing the diameter of the ultra-fine wire L. Constant tensile force is applied to the ultra-fine wire with a winding spool. A progress route of the ultra-fine wire, to which the tensile force is applied, is determined with at least a pair of guides. The ultra-fine wire is inserted into the hole of the finishing die 10 having the hole 11 for reducing the diameter of the ultra-fine wire to a final wire diameter. Accordingly, the ultra-fine wire is processed to the final wire diameter. Horizontal and/or vertical one end of the finishing die is held with a spring body of a horizontal angle adjusting mechanism and/or a vertical angle adjusting mechanism. On the other hand, the horizontal and/or vertical other end of the finishing die is brought into contact with the tip of a finely feeding means. As a result, the angle adjustment of the horizontal and/or vertical direction of the hole axis of the finishing die can be conducted. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a base metal such as aluminum or copper or a base metal alloy such as an aluminum-silicon alloy, or a fine wire composed of a noble metal such as gold, silver or palladium or a noble metal alloy such as a gold-silver alloy or a gold-silver-copper alloy. In particular, the present invention relates to a method and an apparatus for drawing an ultrafine wire for a bonding wire of a semiconductor device.
[0002]
[Prior art]
In recent years, with the development of electronic devices, ultrafine wires used for lead wires, coil windings, enamel wires, bonding wires, and the like of semiconductor devices often have a wire diameter of 100 μm or less. In particular, ultrafine wires for bonding wires having a wire diameter of 40 μm or less are subjected to wet drawing at a high speed of 50 to 1000 m / min, and the formed ultrafine wires are wound up in units of several hundred to several thousand m. ing. For this reason, the precision of the hole shape of the finishing die is improved, and the positional relationship between the axis of the hole of the finishing die and the travel path of the fine wire is adjusted so that the wound fine wire does not break, bend or bend. I was making adjustments.
[0003]
Among them, several methods are known as methods for adjusting the positional relationship between the hole axis of the finishing die (the axis of the hole) and the traveling path of the extra fine line. One of them is a method (hereinafter, referred to as a first method) described in Japanese Utility Model Publication No. 63-50009 (Patent Document 1). In the first method, the fine wire is adjusted so that the fine wire can be positioned while the hole axis of the finishing die is fixed, thereby eliminating the disadvantages of bending and curling of the fine wire. Specifically, at least two guide rollers are provided on the upstream and downstream sides of the finishing die, which are movable left and right, up and down, and back and forth. By adjusting the position, the traveling path of the extra fine line is adjusted while the hole axis of the finishing die is fixed. Thus, the ultrafine wire is inserted coaxially and tensilely into the hole of the finishing die, and the final processing is performed.
[0004]
The other is a method (hereinafter, referred to as a second method) described in JP-A-8-309426 (Patent Document 2). In the second method, the hole axis of the finishing die is adjusted so as to be positionable while the traveling path of the extra fine wire is fixed. Specifically, guide rollers are arranged on the upstream and downstream sides of the finishing dies, respectively, and these guide rollers are mounted on a pedestal that can be moved in the vertical direction (vertical direction) and the horizontal direction. It is supported on a holder. In the second method, the finishing die is made free to some extent, and the finishing die is made to follow the fluctuation of the extra fine line at the time of wire drawing. However, it is also possible to use a die which is largely displaced from the center axis of the die.
[0005]
In addition, there is a method (hereinafter, referred to as a third method) described in Japanese Utility Model Publication No. 47-18437 (Patent Document 3). In the third method, a very fine wire is drawn while the die holder is always held at the center of the fixed frame by the uniform tension of each coil spring. According to the third method, the die is always kept stable in response to a sudden change in the drawing force and a change in the direction of action that occur in the case of drawing.
[0006]
There is also a method described in Japanese Patent Application Laid-Open No. 56-84118 (Patent Document 4) (hereinafter, referred to as a fourth method). In the fourth method, an error in the linearity of a bar passing through a finishing die is measured, and the deviation from the initial zero setting is adjusted with high accuracy. This fourth method can keep the linearity error very small.
[0007]
[Patent Document 1]
Japanese Utility Model Publication No. 63-50009 (Page 2, FIG. 3 to FIG. 6)
[Patent Document 2]
JP-A-8-309426 (page 2, FIG. 1, FIG. 2)
[Patent Document 3]
Japanese Utility Model Publication No. 47-18437 (FIGS. 1 and 7)
[Patent Document 4]
JP-A-56-84118 (FIG. 1)
[0008]
[Problems to be solved by the invention]
However, in the first method, when the wire diameter becomes an ultra-fine wire of 100 μm or less, the ultra-fine wire becomes difficult to see. Therefore, as shown in FIG. It is difficult to position the ultrafine wire at the center of the final finishing die by adjustment with the adjustment nut (28-31) or the vertical adjustment nut (32-35). It becomes.
Further, since the ultrafine wire that has passed through the finishing die is meandered unless pulled, the fourth method cannot be used in the first place.
[0009]
Further, in the first method, the second method, and the fourth method, it is possible to always obtain high straightness even if the hole axis of the finishing die can be set to completely match the traveling path of the extra fine line. Can not. This is because if the ultrafine wire fluctuates during wire drawing, the weight of the die will follow the ultrafine wire, and as a result the twisting, bending and warping of the ultrafine wire will occur due to the changing hole shape of the fixed die. This is because defects such as appear. In particular, when the wire diameter of the ultrafine wire is reduced to 40 μm or less, delicate vibration is likely to occur during wire drawing, and the ultrafine wire is directly susceptible to the internal shape of the finishing die. Therefore, in the first method, the second method, and the fourth method, even if the drawing stress applied to the ultrafine wire slightly changes, or even if the contact distance in the finishing die hole slightly changes, the twisting or the twisting can be prevented. Defects such as bending and warping appear greatly, and severe cases result in disconnection. Furthermore, even if the hole shape of the finishing die is made with high accuracy, each one is slightly different, and the diamond of the finishing die becomes (100) face etc. as the ultrafine wire is drawn hundreds of thousands of meters. As a result of uneven wear along the crystal orientation plane, the shape of the holes changes delicately every moment. For this reason, the first method, the second method, and the fourth method in which the finishing die follows the fluctuation of the extra fine line at the time of drawing cannot always obtain high straightness. For this reason, in the past, the final winding speed at the time of drawing was reduced to make it easier to follow, or the winding diameter was reduced to suppress the amount of defective wires per piece, and carefully made one by one winding Was.
[0010]
Further, in the third method, since the center of the hole of the finishing die constantly moves during drawing, defects such as twisting, bending, and warping are rather large.
[0011]
The present invention has been made to solve the above-described problems of the conventional wire drawing method or wire drawing apparatus, that is, to obtain a high straightness even if the finishing die is replaced or even if the ultrafine wire is drawn hundreds of thousands of meters. Was made in view of the difficulties and other issues.
The present invention provides a wire drawing method and a wire drawing device that can always obtain high straightness while following the change of a fine wire at the time of wire drawing even if the hole shape or the like of the finishing die is slightly changed. The purpose is to do.
In addition, the present invention always obtains high straightness by finely adjusting the hole axis of the finishing die by a predetermined angle with respect to the traveling path of the extra fine line even if the hole shape of the finishing die is slightly changed. Another object of the present invention is to provide a wire drawing method and a wire drawing device that can perform the above-described steps.
In addition, the present invention relates to the adjustment of the angle of the hole axis of the finishing die with respect to the traveling path of the ultrafine wire, by directly relating the measurement of the bending or warpage of the ultrafine wire immediately before being wound onto the take-up spool, or by drawing. Calculated from the measured value of the non-contact type displacement sensor due to eddy current etc. attached to the die holder before winding on the spool inside, the measured value of the load cell, the enlarged value of the change due to the laser beam and the target plate, etc. Another object of the present invention is to provide a wire drawing method and a wire drawing apparatus for feeding back those measured values to re-determine the position of the finishing die and winding up a large number of ultrafine wires continuously.
Further, the present invention provides a wire drawing method and a wire drawing device capable of continuously drawing lots of continuously deformable ultrafine wires having a wire diameter of 40 μm or less at a high speed of 50 to 1000 m / min. That is yet another purpose.
[0012]
[Means for Solving the Problems]
According to the present invention, the above object is achieved by the following technical means.
(1) Insert a micro wire into a plurality of dies having holes for reducing the diameter of the micro wire, apply a constant tension to the micro wire by a take-up spool, and apply the tension by at least a pair of guides. Inserting the ultrafine wire into the hole of a finishing die having a hole for reducing the diameter of the ultrafine wire to the final wire diameter, which is defined in the traveling direction of the ultrafine wire by defining a traveling path of the added ultrafine wire. By the method of drawing an ultra-fine wire to obtain an ultra-fine wire processed to the final wire diameter,
A horizontal angle adjusting mechanism for adjusting the angle of a hole axis of the die in a horizontal direction and / or a vertical direction with respect to a traveling path of an extra fine line, and / or a vertical angle adjusting mechanism having a spring body for holding the finishing die with respect to a fixed base. As the angle adjusting mechanism, a mechanism having fine feed means having a horizontal movable axis and / or a vertical movable axis whose fulcrum is aligned with the center point of the finishing die is used, and the horizontal and / or vertical direction of the finishing die is used. One end is held by a spring body of the horizontal angle adjustment mechanism and / or the vertical angle adjustment mechanism, and the other end in the horizontal direction and / or the vertical direction of the finishing die is a horizontal movable axis and / or a vertical movable axis of the fine feeding means. And a horizontal and / or vertical angle adjustment of a hole axis of the finishing die is performed.
(2) The finishing die is housed and held in a finishing die holder, and one connecting pin is inserted into a hole in one side wall of the finishing die holder, and a hole in the other side wall of the finishing die holder and the finishing die holder. The other connecting pin is inserted into the through hole of the L-shaped block adjacent to the above, the finishing die holder is suspended in a direction perpendicular to the traveling path of the extra fine wire, and the bottom of the L-shaped block is placed on the turntable. The fine wire drawing method according to (1), wherein the angle of the hole axis of the finishing die is adjusted in the horizontal direction.
(3) The finishing die holder and the swinging plate are swingably integrated with a fixing pin, and the finishing die holder is suspended in a direction perpendicular to the traveling path of the extra fine wire, so as to be perpendicular to the hole axis of the finishing die. (1) or (2), wherein the angle adjustment is performed.
(4) The method for drawing an ultrafine wire according to any one of (1) to (3), wherein the ultrafine wire is processed so that the final wire diameter is 40 μm or less.
(5) a plurality of diameter reducing dies having holes for reducing the diameter of the ultrafine wire;
A finishing die having a hole for reducing the ultrafine wire to the final wire diameter,
At least a pair of guides that define the traveling path of the extra fine line,
In the ultrafine wire drawing device including a take-up spool that applies a tension to the ultrafine wire and winds the ultrafine wire processed to the final wire diameter,
A horizontal angle adjustment mechanism and / or a vertical angle adjustment mechanism for horizontally and / or vertically adjusting the hole axis of the finishing die with respect to the traveling path of the extra fine line,
The horizontal angle adjustment mechanism and / or the vertical angle adjustment mechanism may include a spring body that holds one end of the finishing die in a horizontal direction and / or a vertical direction with respect to a fixed base, and a fulcrum positioned at a center point of the finishing die. A micro-feeding means having a matched horizontal movable axis and / or vertical movable axis, and having a fine feed means whose tip abuts on the other end of the horizontal movable axis and / or vertical movable axis of the finishing die. Wire drawing equipment.
(6) It has a finishing die holder for accommodating and holding the finishing die. One connecting pin is inserted into a hole in one side wall of the finishing die holder, and the finishing die holder and the hole are formed in the other side wall. The other connecting pin is inserted into the through hole of the L-shaped block adjacent to the die holder, the finishing die holder is suspended in a direction perpendicular to the traveling path of the fine wire, and the bottom of the L-shaped block is placed on the turntable. The ultrafine wire drawing device according to the above (5), wherein the wire is drawn.
(7) The above (5) or wherein the finishing die holder and the swing plate are swingably integrated with a fixing pin and the finishing die holder is suspended in a direction perpendicular to the traveling path of the extra fine wire. The ultrafine wire drawing apparatus according to (6).
(8) The spring body is mounted between the fixing base and the finishing die mechanism, and applies a horizontal force to the finishing die mechanism, and / or the fixing base and the finishing. The extension of the ultrafine wire according to any one of (5) to (7), further comprising a second spring body mounted between the die mechanisms and applying a vertical force to the finishing die mechanism. Line equipment.
[0013]
In the present specification, "the angle in the vertical direction with respect to the traveling path of the fine line" refers to the finish when the hole axis direction of the finishing die is made to coincide with the traveling path of the extra fine line, with the origin being the hole center of the finishing die. It refers to the angle at which the vertical axis of the die is inclined to the traveling path or the backward path of the extra fine line. The term “horizontal angle with respect to the traveling path of the extra fine line” refers to the origin of the center of the hole of the finishing die when the hole axis direction of the finishing die matches the traveling path of the extra fine line. The angle rotated about the path of the line. Usually, the finishing die is a disk, and the hole shape is also a column shape. However, there are cases where elliptical dies are orthogonally combined.
As the "small feeding means", there is a method using a method using a micro screw structure, a method using a stepping motor or a linear motor, or the like.
[0014]
In the conventional ultrafine wire drawing method and wire drawing apparatus, the finishing dies are mounted on a fixed base (FIG. 5 of Patent Document 1 and FIG. 1 of Patent Document 2), so that the delicate process during drawing is difficult. When the finishing die attempts to follow the vibration, the fine wire has defects such as twist, bend, and warp due to its own weight.
On the other hand, in the method and the apparatus for drawing an ultrafine wire according to the present invention, since one end of the finishing die is held by a spring body with respect to the fixed base, the finishing die is subjected to delicate vibration during drawing. Even if the other end attempts to follow, no defect such as twist, bend, or warp appears on the ultrafine wire due to the weight of the finishing die. Fine-adjust the hole axis angle of the finishing die in the vertical and horizontal directions with respect to the travel path of the fine wire in advance according to the material and diameter of the fine wire, and place the finishing die at the most desirable position, when drawing Can be controlled to a minimum, and straightness of a very fine line can be obtained.
[0015]
It is not possible to directly measure the value and distribution of the diameter reduction stress applied to the ultrafine wire from the periphery of the hole of the finishing die at the time of wire drawing, but for example, the ultrafine wire just before being wound on the winding spool can be measured. Can be measured after the wire is drawn. Therefore, by feeding back the measured values of the shape parameters such as bending and warping of the fine wire, and finely adjusting the vertical and horizontal finishing die hole axis angles before drawing, the straight fine wire goes straight each time. Sex can be obtained. At this time, based on the actual measured values of the shape parameters such as bending and warping of the extra fine wire wound on the take-up spool, the vertical and horizontal finishing die hole axis angles with respect to the traveling path of the next extra fine wire are determined. Fine adjustment will determine the optimal hole location for the finishing die.
[0016]
Particularly, one end of a finishing die holder (hereinafter, also simply referred to as a die holder) for storing and holding the finishing dies is held by a spring body, and the other end of the die holder is extended and contracted by a minute feeding means to advance a fine wire. By finely adjusting the vertical and / or horizontal angles with respect to the path, it becomes possible for the spring body to further absorb or amplify subtle vibrations of the finishing die. In addition, the spring body contributes to simplifying work in a narrow space. At this time, the vertical and horizontal angles of the hole axis of the finishing die can be fine-tuned independently of each other, and fine vibrations during wire drawing can be dispersed or diverged. Can be controlled while maintaining in a certain direction. Further, the die holder and the swinging plate are swingably integrated by a fixing pin, and the die holder is suspended in a direction perpendicular to the traveling path of the extra fine wire by a spring body and minute feeding means, for example, a screw structure. Is placed on a turntable, and one end of the turntable is held by a spring body, and the other end is minutely fed by means of fine feed means, for example, a screw structure, which can be extended and contracted in parallel with the spring body, so that the turntable in the horizontal direction with respect to the traveling path of the extra fine wire is If the angle is finely adjusted, fine adjustment in the vertical direction and the horizontal direction can be performed in a narrow space, and vibration during wire drawing can be effectively dispersed or diverged.
[0017]
Further, in the case of an ultrafine wire having a wire diameter of 40 μm or less, the diameter reduction stress in the hole of the finishing die at the time of drawing is applied to the ultrafine wire as it is, and the elastic force of the ultrafine wire itself is small. It is easy to bend, warp, bend, break, etc. In addition, the ultrafine wire itself is difficult to visually observe, and since the ultrafine wire is tensioned during drawing, it is difficult to find a warp or a bend. This is thought to be due to uneven diameter reduction stress applied to the extra fine wire from the periphery of the hole in the finishing die. can do. With a fine wire having a wire diameter of 40 μm or less, the cause of the defect cannot be observed with the naked eye at the time of drawing, and the angle in the vertical or horizontal direction with respect to the traveling path of the fine wire is finely adjusted and wound on a take-up spool. It is important to obtain processing information at the time of drawing from an actual measurement value of a shape parameter such as bending or warpage of the extra fine line.
[0018]
In the vertical angle adjusting mechanism or the horizontal angle adjusting mechanism in the wire drawing method and the wire drawing apparatus of the present invention, one end of the die holder is held by a spring body, and the other end of the die holder is a screw structure in a minute feeding means, for example, a micrometer head. Can be expanded and contracted by the screw structure. When the screw structure of the micrometer head is used, the micrometer head can be moved by tens of mm in steps of 0.02 mm, and the angle can be adjusted from 0 to 45 degrees.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the accompanying drawings.
An ultrafine wire drawing apparatus according to an embodiment of the present invention includes at least a plurality of diameter reducing dies having holes for reducing the diameter of the ultrafine wire, and a hole for reducing the diameter of the ultrafine wire to a final wire diameter. And a take-up spool that applies tension to the ultrafine wire and winds the ultrafine wire processed to the final wire diameter. Here, the finishing die which is a main part and its peripheral mechanism will be described in detail.
[0020]
FIGS. 1, 2, 3, 4, and 5 show a plan view, a front view, a side view, and a perspective view of a finishing die which is a main part of the ultrafine wire drawing apparatus according to the present embodiment and a mechanism around the finishing die. This is shown in the drawings and an exploded perspective view, respectively.
Referring to FIGS. 1 to 5, an extra fine line is indicated by L, and a traveling path of the extra fine line L is determined by a pair of guides (guide rolls or the like) not shown. The finishing die 10 is disk-shaped and has a hole 11 at the center thereof for reducing the diameter to the final wire diameter. The finishing die 10 is removably housed in a housing of the open die holder 12 and is held by a spring 13 from behind the finishing die 10. At this time, a V-shaped groove or a U-shaped groove (hereinafter, simply referred to as a “V-shaped groove”) as shown in FIG. 2 of Patent Document 2 is provided in the die holder 12, and the V-shaped groove is finished. When the die 10 is placed, the center of the hole of the finishing die 10 with respect to the die holder 12 is easily positioned. As the spring 13, an inverted U-shaped or fork-shaped leaf spring or the like is used. In this embodiment, an inverted U-shaped leaf spring is used. However, the leaf spring used here is for pressing the finishing die 10 against one of the inner walls of the die holder 12. The die holder 12 is suspended by two connecting pins 16a and 16b extending from a pedestal (not shown). One connecting pin 16a penetrates the L-shaped block 17, and the L-shaped block 17 and the die holder 12 are connected. A disk 18 is screwed to the bottom of the L-shaped block 17, one end of a rotating shaft 19 is fixed to the back surface of the disk 18, and a rotating plate 20 is fixed to the other end of the rotating shaft 19.
[0021]
A horizontal movable shaft 22 protruding from a micrometer horizontal angle adjusting screw head 21 abuts on one end of the rotating plate 20 in the horizontal direction, and a horizontal pin 23 is embedded in one end of the rotating plate 20 in the right angle direction. A horizontal spring body 24 is attached to the horizontal pin 23 in parallel with the horizontal movable shaft 22, and the other end of the horizontal spring body 24 is held by a horizontal fixed pin 25 attached to a pedestal (not shown). The main body of the micrometer horizontal angle adjusting screw head 21 is fixed to a pedestal (not shown).
[0022]
On the other hand, a vertical movable shaft 27 protruding from a micrometer vertical angle adjusting screw head 26 abuts on one end in the right angle direction on the upper surface of the rocking plate 15, and is perpendicular to the other end in the right direction on the upper surface of the rocking plate 15. One end of the spring body 28 is in contact. The other end of the vertical spring body 28 is held by one end of a vertical fixing pin 29 attached to a pedestal (not shown), and the other end of the vertical fixing pin 29 passes through the hole 30 of the swing plate 15. I have.
[0023]
The travel path of the extra fine line L is determined by guide members such as guide pulleys provided on the left and right sides of the finishing die 10, and the center of the hole 11 of the finishing die 10 is adjusted to this traveling path. The traveling path can be determined more accurately by using an alignment die than by providing a V-groove in the guide pulley.
[0024]
In the preferred embodiment of the present invention described above, the die holder 12 is held by the vertical spring body 28 and the vertical movable shaft 27 via the rocking plate 15, and the finishing die 10 is mounted on the pedestal as in the conventional apparatus. Not directly attached. Therefore, the vibration of the pedestal (not shown) is dispersed or diverged by the vertical spring body 28 and is not directly transmitted to the finishing die 10. In addition, since the die holder 12 is suspended like a seesaw by the two connecting pins 16a and 16b, the spring constant of the vertical spring body 28 can be appropriately adjusted even if a minute vibration occurs in the extra fine line L. Subtle vibrations can be dispersed or diverged by selection. In addition, the spring body contributes to simplifying work in a narrow space. Therefore, the weight of the finishing die 10 or the die holder 12 is not directly applied to the fine wire L unlike the conventional apparatus. Therefore, even if the wire diameter of the fine wire L is reduced to 40 μm or less, it is possible to measure a precise relationship between the hole axis angle of the finishing die 10 and shape defects such as twist, bend, and warpage of the fine wire L. Now you can.
[0025]
In the preferred embodiment of the present invention described above, when the micrometer vertical angle adjusting screw head 26 is rotated, the vertical movable shaft 27 moves up and down, and the finishing die 10 is moved via the rocking plate 15 with respect to the traveling direction of the extra fine line L. It can move back and forth. Since the vertical movable shaft 27 has a micrometer structure, it can be continuously expanded and contracted. Similarly, the horizontal movable shaft 27 can also expand and contract in a stepless manner. Since the vertical spring body 28 of the vertical movable shaft 27 and the horizontal spring body 24 of the horizontal movable shaft 22 are independent of each other, the angle of the hole axis of the finishing die 10 and the shape defect such as twisting, bending, and warping of the extra fine line L are not affected. Relationships can be measured independently.
[0026]
The first adjustment of the ultrafine wire drawing apparatus according to the present embodiment is performed as follows. First, both ends of the ultrafine wire L are linearly pulled by a guide member (not shown). Next, the finishing die 10 is mounted on the die holder 12, and the hole axis of the finishing die 10 and the traveling path of the ultrafine line L are matched. This operation removes a large stress load that would break the ultrafine wire immediately after the wire drawing, but it is impossible to remove a slight bend or twist due to visual judgment. Therefore, a trial wet drawing process is performed at a high speed of 600 m / min from a fine wire having a wire diameter of 140 μm to an extremely fine wire having a wire diameter of 15 μm.
[0027]
Next, a second adjustment is performed. The second adjustment is performed in a direction perpendicular to the traveling path of the ultrafine line L based on a measured value of a shape parameter such as bending or warpage of the ultrafine line L of the first adjustment wound on a winding spool (not shown). The hole axis angle of the finishing die 10 in the horizontal direction is finely adjusted by the micrometer vertical angle adjustment screw head 26 and the micrometer horizontal angle adjustment screw head 21. Thereafter, the shape parameters such as bending and warping of the extra fine line L are measured each time each lot is completed, and the vertical and horizontal hole axis angles of the finishing die 10 are finely adjusted as necessary. FIG. 6 shows how the angle is adjusted in the horizontal direction, and FIG. 7 shows how the angle is adjusted in the vertical direction.
[0028]
As a result of the fine adjustment as described above, a high speed of 300 m / min from a fine wire of a pure gold wire having a wire diameter of 40 μm, a gold-15% silver alloy wire, a pure copper wire, and an aluminum-silicon alloy wire to a fine wire having a wire diameter of 15 μm. , To produce 20 5,000-m winding lots. Further, one lot of 20,000 m winding was produced. When these ultrafine wires were used as bonding wires for a semiconductor device, there was no bending or breakage.
[0029]
【The invention's effect】
As described above, according to the method and apparatus for drawing an ultrafine wire according to the present invention, the spring body and the fine feed means of the vertical angle adjustment mechanism and / or the horizontal angle adjustment mechanism allow the ultrafine wire to be drawn at the time of drawing. By making the finishing die follow the fluctuation, straightness can be obtained.
In addition, even if the hole shape of the finishing die is slightly different from each other and may adversely affect the linearity of the ultrafine wire, the actual measurement of shape parameters such as bending and warpage of the ultrafine wire wound on the winding spool Since the vertical angle and the horizontal angle of the hole axis of the finishing die can be finely adjusted based on the values, such adverse effects can be suppressed. As a result, high straightness of the ultrafine wire can always be obtained, so that not only wet wire drawing but also dry wire drawing can be performed at a high speed. In particular, even if the diameter of the extra fine wire becomes 40 μm or less and is directly affected by the internal shape of the finishing die, the fine vibration applied to the extra fine wire is absorbed or amplified by the spring body. Wire drawing can be performed at high speed without receiving subtle vibrations.
[Brief description of the drawings]
FIG. 1 is a front view of a main part of an ultrafine wire drawing apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view of a main part of an ultrafine wire drawing apparatus according to one embodiment of the present invention.
FIG. 3 is a side view of a main part of an ultrafine wire drawing apparatus according to an embodiment of the present invention.
FIG. 4 is a perspective view of a main part of an ultrafine wire drawing apparatus according to an embodiment of the present invention.
FIG. 5 is an exploded perspective view of a main part of an ultrafine wire drawing apparatus according to an embodiment of the present invention.
FIG. 6 is a plan view showing how a horizontal angle of a finishing die is adjusted.
FIG. 7 is a side view showing how the vertical angle of the finishing die is adjusted.
[Explanation of symbols]
L Extra-fine wire 10 Finishing die 11 Reducing hole 12 Opening die holder 13 Spring 15 Swinging plates 16a, 16b Connecting pin 17 L-shaped block 18 Disk 19 Rotating shaft 20 Rotating plate 21 Micrometer horizontal angle adjusting screw head 22 Horizontally movable Axis 23 Horizontal pin 24 Horizontal spring body 25 Horizontal fixing pin 26 Micrometer vertical angle adjusting screw head 27 Vertical movable axis 28 Vertical spring body 29 Vertical fixing pin 30 Hole in rocking plate

Claims (8)

An ultrafine wire is inserted into the plurality of dies having holes for reducing the diameter of the ultrafine wire, a constant tension is applied to the ultrafine wire by a take-up spool, and the tension is applied by at least a pair of guides. By defining the traveling path of the line and vertically arranging it in the traveling direction of the ultrafine wire, inserting the ultrafine wire into the hole of the finishing die having a hole for reducing the ultrafine wire to the final wire diameter, An ultrafine wire drawing method for obtaining an ultrafine wire processed to a wire diameter,
A horizontal angle adjusting mechanism for adjusting the angle of a hole axis of the die in a horizontal direction and / or a vertical direction with respect to a traveling path of an extra fine line, and / or a vertical angle adjusting mechanism having a spring body for holding the finishing die with respect to a fixed base. As the angle adjusting mechanism, a mechanism having fine feed means having a horizontal movable axis and / or a vertical movable axis whose fulcrum is aligned with the center point of the finishing die is used, and the horizontal and / or vertical direction of the finishing die is used. One end is held by a spring body of the horizontal angle adjustment mechanism and / or the vertical angle adjustment mechanism, and the other end in the horizontal direction and / or the vertical direction of the finishing die is a horizontal movable axis and / or a vertical movable axis of the fine feeding means. And a horizontal and / or vertical angle adjustment of a hole axis of the finishing die is performed. The finishing die is accommodated and held in a finishing die holder, and one connecting pin is inserted into a hole in one side wall of the finishing die holder, and is adjacent to the finishing die holder in a hole in another side wall of the finishing die holder. Inserting the other connecting pin into the through hole of the L-shaped block, suspending the finishing die holder in a direction perpendicular to the traveling path of the fine wire, placing the bottom of the L-shaped block on a turntable, 2. The method for drawing an ultrafine wire according to claim 1, wherein a horizontal angle of a hole axis of the finishing die is adjusted. The finishing die holder and the swing plate are swingably integrated with a fixed pin, and the finishing die holder is suspended in a direction perpendicular to the traveling path of the extra fine wire, and the angle of the hole axis of the finishing die in the vertical direction is adjusted. 3. The method for drawing an ultrafine wire according to claim 1, wherein The method for drawing an ultrafine wire according to any one of claims 1 to 3, wherein the ultrafine wire is processed so as to have a final wire diameter of 40 µm or less. A plurality of diameter reducing dies having holes for reducing the diameter of the ultrafine wire,
A finishing die having a hole for reducing the ultrafine wire to the final wire diameter,
At least a pair of guides that define the traveling path of the extra fine line,
In the ultrafine wire drawing device including a take-up spool that applies a tension to the ultrafine wire and winds the ultrafine wire processed to the final wire diameter,
A horizontal angle adjustment mechanism and / or a vertical angle adjustment mechanism for horizontally and / or vertically adjusting the hole axis of the finishing die with respect to the traveling path of the extra fine line,
The horizontal angle adjustment mechanism and / or the vertical angle adjustment mechanism may include a spring body that holds one end of the finishing die in a horizontal direction and / or a vertical direction with respect to a fixed base, and a fulcrum positioned at a center point of the finishing die. A micro-feeding means having a matched horizontal movable axis and / or vertical movable axis, and having a fine feed means whose tip abuts on the other end of the horizontal movable axis and / or vertical movable axis of the finishing die. Wire drawing equipment. The finishing die has a finishing die holder that holds and holds, and one connecting pin is inserted into a hole of one side wall of the finishing die holder, and is inserted into a hole of another side wall of the finishing die holder and the finishing die holder. The other connecting pin is inserted into the through-hole of the adjacent L-shaped block, the finishing die holder is suspended in the direction perpendicular to the traveling path of the fine wire, and the bottom of the L-shaped block is placed on the turntable. The wire drawing apparatus for an ultrafine wire according to claim 5, characterized in that: 7. The finishing die holder and the swinging plate are swingably integrated by a fixing pin, and the finishing die holder is suspended in a direction perpendicular to a traveling path of a fine wire. Extra fine wire drawing equipment. The spring body is mounted between the fixed base and the finishing die mechanism, and a first spring body that applies a horizontal force to the finishing die mechanism, and / or the first base and the finishing die mechanism. The wire drawing apparatus according to any one of claims 5 to 7, further comprising a second spring body mounted between the two and applying a vertical force to the finishing die mechanism.

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