JP4431497B2 - 光学撮像系、とくにカタディオプトリック縮小対物レンズ - Google Patents
光学撮像系、とくにカタディオプトリック縮小対物レンズ Download PDFInfo
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- JP4431497B2 JP4431497B2 JP2004535124A JP2004535124A JP4431497B2 JP 4431497 B2 JP4431497 B2 JP 4431497B2 JP 2004535124 A JP2004535124 A JP 2004535124A JP 2004535124 A JP2004535124 A JP 2004535124A JP 4431497 B2 JP4431497 B2 JP 4431497B2
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- Prior art keywords
- imaging system
- mirror
- deflecting mirror
- layer
- deflecting
- Prior art date
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- Expired - Fee Related
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- 238000012634 optical imaging Methods 0.000 title claims description 12
- 230000009467 reduction Effects 0.000 title description 5
- 239000010410 layer Substances 0.000 claims description 113
- 238000003384 imaging method Methods 0.000 claims description 29
- 238000002310 reflectometry Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000003989 dielectric material Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 238000010521 absorption reaction Methods 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminium flouride Chemical compound F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 claims description 2
- 229910001610 cryolite Inorganic materials 0.000 claims description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- QGJSAGBHFTXOTM-UHFFFAOYSA-K trifluoroerbium Chemical compound F[Er](F)F QGJSAGBHFTXOTM-UHFFFAOYSA-K 0.000 claims description 2
- TYIZUJNEZNBXRS-UHFFFAOYSA-K trifluorogadolinium Chemical compound F[Gd](F)F TYIZUJNEZNBXRS-UHFFFAOYSA-K 0.000 claims description 2
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 claims description 2
- 230000010287 polarization Effects 0.000 description 16
- 230000001419 dependent effect Effects 0.000 description 8
- 238000005286 illumination Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0892—Catadioptric systems specially adapted for the UV
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Optical Elements Other Than Lenses (AREA)
Description
2 エキシマレーザー
4 照射系
5 レンズ
6 装置
8 物平面(マスク平面)
9 移動方向
10 ウェーハ
11 像平面
12 装置
13 制御ユニット
15 対物レンズ
16 偏向鏡
17 凹面鏡
18 光軸
19 偏向鏡
20 対物レンズ
21 ビーム偏向装置
23、24 反射層
25 サイドアーム
27 入力光
Claims (17)
- 撮像系の物平面に配置されたパターンを撮像系の像平面に投影するための光学撮像系であって、
光軸を有し、
第1偏向鏡を有し、これが光軸に対して第1傾斜角で傾斜されていて、
第2偏向鏡を有し、これが光軸に対して第2傾斜角で傾斜されていて、
s偏光のための偏向鏡の反射率Rsとp偏光のための偏向鏡の反射率Rpの間の比Rspが、割り当てられた傾斜角を含む入射角範囲で、一方の偏向鏡について1より大きく、他方の偏向鏡について1より小さい光学撮像系。 - 前記光学撮像系がカタディオプトリック投影対物レンズである、請求項1に記載の光学撮像系。
- 第1傾斜角と第2傾斜角が、45°±15°の範囲にある請求項1又は2に記載の光学撮像系。
- 第1傾斜角と第2傾斜角が、45°±10°の範囲にある請求項1又は2に記載の光学撮像系。
- 比Rspが、割り当てられた傾斜角に対応する入射角で、一方の偏向鏡について0.9より小さい請求項1〜4のいずれか1項に記載の撮像系。
- 比R sp が、割り当てられた傾斜角に対応する入射角で、一方の偏向鏡について0.8より小さい請求項1〜4のいずれか1項に記載の撮像系。
- 光学撮像系が、カタディオプトリック投影対物レンズで構成され、そこで凹面鏡と第1偏向鏡を有するカタディオプトリック対物レンズ部が、物平面から来る放射を凹面鏡に向けて偏向させ又は凹面鏡から来る放射を像平面に向けて偏向させるように意図されていて、物平面と像平面の間に配置されている請求項1〜6のいずれか1項に記載の撮像系。
- 第2偏向鏡が、第1偏向鏡と垂直に配向されていて、物平面と像平面が互いに平行に並べられている請求項7に記載の撮像系。
- 偏向鏡の一方が、反射コーティングを有し、これが金属層と金属層に配置された誘電材料からなる誘電層を含み、偏向鏡の傾斜角を含む入射角範囲で比Rspが1よりも小さくなるように誘電層の層厚さdfが選択される請求項1〜8のいずれか1項に記載の撮像系。
- 金属層が本質的にアルミニウムからなる請求項9に記載の撮像系。
- 誘電層が単一層から構成される請求項9又は10に記載の撮像系。
- 誘電材料が撮像系の作動波長で本質的に吸収がなく、または誘電材料が撮像系の作動波長で僅かに吸収し、誘電材料の吸収係数kが作動波長で好ましくは0.6より小さい請求項9〜11のいずれか1項に記載の撮像系。
- 誘電材料が撮像系の作動波長で本質的に吸収がなく、または誘電材料が撮像系の作動波長で僅かに吸収し、誘電材料の吸収係数kが作動波長で0.01より小さい請求項9〜11のいずれか1項に記載の撮像系。
- 誘電層が、以下の材料のうちの1つ又はこれらの材料の組み合わせから本質的に構成される請求項9〜13のいずれか1項に記載の撮像系:
フッ化マグネシウム(MgF2)、フッ化アルミニウム(AlF3)、チオライト、氷晶石、フッ化ガドリニウム(GdF3)、二酸化ケイ素(SiO2)、酸化ハフニウム(HfO2)、酸化アルミニウム(Al2O3)、フッ化ランタン(LaF3)又はフッ化エルビウム(ErF3)。 - 260nm未満の波長を有する紫外光のために構成されている請求項1〜15のいずれか1項に記載の撮像系。
- 157nm、193nm又は248nmの作動波長のために構成されている請求項1〜15のいずれか1項に記載の撮像系。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10240598A DE10240598A1 (de) | 2002-08-27 | 2002-08-27 | Optisches Abbildungssystem, insbesondere katadioptrisches Reduktionsobjektiv |
PCT/EP2003/009253 WO2004025370A1 (de) | 2002-08-27 | 2003-08-21 | Optisches abbildungssystem, insbesondere katadioptrisches reduktionsobjektiv |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005537676A JP2005537676A (ja) | 2005-12-08 |
JP4431497B2 true JP4431497B2 (ja) | 2010-03-17 |
Family
ID=31895632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004535124A Expired - Fee Related JP4431497B2 (ja) | 2002-08-27 | 2003-08-21 | 光学撮像系、とくにカタディオプトリック縮小対物レンズ |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050254120A1 (ja) |
EP (1) | EP1532490B1 (ja) |
JP (1) | JP4431497B2 (ja) |
KR (1) | KR101045487B1 (ja) |
AU (1) | AU2003260438A1 (ja) |
DE (1) | DE10240598A1 (ja) |
WO (1) | WO2004025370A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10338983A1 (de) | 2003-08-20 | 2005-03-17 | Carl Zeiss Smt Ag | Projektionsobjektiv für die Mikrolithografie |
JP5159027B2 (ja) | 2004-06-04 | 2013-03-06 | キヤノン株式会社 | 照明光学系及び露光装置 |
WO2006053705A1 (de) * | 2004-11-17 | 2006-05-26 | Carl Zeiss Smt Ag | Verfahren zum schutz eines metallspiegels gegen degradation sowie metallspiegel |
DE102004058467A1 (de) * | 2004-11-25 | 2006-06-01 | Carl Zeiss Smt Ag | Wafer-Scanner und Projektionsobjektiv für die Mikrolithographie |
EP1726994A3 (de) | 2005-05-25 | 2007-08-08 | Carl Zeiss SMT AG | Lichtintegrator für ein Beleuchtungssystem, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
DE102006030757A1 (de) * | 2005-07-18 | 2007-02-01 | Carl Zeiss Smt Ag | Polarisationsoptimiertes Beleuchtungssystem |
DE102005041938A1 (de) * | 2005-09-03 | 2007-03-08 | Carl Zeiss Smt Ag | Mikrolithographische Projektionsbelichtungsanlage |
WO2008080534A1 (en) * | 2006-12-28 | 2008-07-10 | Carl Zeiss Smt Ag | Catadioptric projection objective with tilted deflecting mirrors, projection exposure apparatus, projection exposure method, and mirror |
JP2012181220A (ja) * | 2009-07-02 | 2012-09-20 | Asahi Glass Co Ltd | ArFリソグラフィ用ミラー、およびArFリソグラフィ用光学部材 |
WO2011020690A2 (en) * | 2009-08-07 | 2011-02-24 | Carl Zeiss Smt Gmbh | Method for producing a mirror having at least two mirror surfaces, mirror of a projection exposure apparatus for microlithography, and projection exposure apparatus |
DE102009048553A1 (de) * | 2009-09-29 | 2011-03-31 | Carl Zeiss Smt Gmbh | Katadioptrisches Projektionsobjektiv mit Umlenkspiegeln und Projektionsbelichtungsverfahren |
DE102009045170A1 (de) * | 2009-09-30 | 2011-04-07 | Carl Zeiss Smt Gmbh | Reflektives optisches Element und Verfahren zum Betrieb einer EUV-Lithographievorrichtung |
FR3041772B1 (fr) * | 2015-09-30 | 2018-09-21 | St Microelectronics Sa | Procede de fabrication d'un filtre spectral nanostructure |
ITUB20160719A1 (it) | 2016-02-12 | 2017-08-12 | St Microelectronics Srl | Gruppo specchio, in particolare per picoproiettore, comprendente microspecchi realizzati in tecnologia mems |
Family Cites Families (17)
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JPS5546706A (en) | 1978-09-29 | 1980-04-02 | Canon Inc | Phase difference reflecting mirror |
JPS60181704A (ja) * | 1984-02-29 | 1985-09-17 | Canon Inc | 真空紫外用反射ミラー |
JP2629693B2 (ja) * | 1987-02-26 | 1997-07-09 | 松下電器産業株式会社 | エキシマレーザ用ミラー |
US5220454A (en) * | 1990-03-30 | 1993-06-15 | Nikon Corporation | Cata-dioptric reduction projection optical system |
JPH09265005A (ja) * | 1996-03-27 | 1997-10-07 | Nikon Corp | エキシマレーザー用ミラー |
JP3799696B2 (ja) * | 1996-12-02 | 2006-07-19 | 株式会社ニコン | エキシマレーザー用ミラー |
US5850309A (en) * | 1996-03-27 | 1998-12-15 | Nikon Corporation | Mirror for high-intensity ultraviolet light beam |
JP3985346B2 (ja) | 1998-06-12 | 2007-10-03 | 株式会社ニコン | 投影露光装置、投影露光装置の調整方法、及び投影露光方法 |
DE19851749A1 (de) * | 1998-11-10 | 2000-05-11 | Zeiss Carl Fa | Polarisationsoptisch kompensiertes Objektiv |
AU7451600A (en) * | 1999-09-30 | 2001-04-30 | Nikon Corporation | Optical device with multilayer thin film and aligner with the device |
US7301605B2 (en) * | 2000-03-03 | 2007-11-27 | Nikon Corporation | Projection exposure apparatus and method, catadioptric optical system and manufacturing method of devices |
DE10010131A1 (de) * | 2000-03-03 | 2001-09-06 | Zeiss Carl | Mikrolithographie - Projektionsbelichtung mit tangentialer Polarisartion |
JP4453886B2 (ja) * | 2000-06-05 | 2010-04-21 | フジノン株式会社 | アルミ反射鏡の製造方法およびアルミ反射鏡 |
JP3678120B2 (ja) * | 2000-06-06 | 2005-08-03 | ウシオ電機株式会社 | 偏光光照射装置 |
TW575904B (en) * | 2001-08-21 | 2004-02-11 | Asml Us Inc | Optical projection for microlithography |
US20040075894A1 (en) * | 2001-12-10 | 2004-04-22 | Shafer David R. | Catadioptric reduction objective |
DE102006030757A1 (de) * | 2005-07-18 | 2007-02-01 | Carl Zeiss Smt Ag | Polarisationsoptimiertes Beleuchtungssystem |
-
2002
- 2002-08-27 DE DE10240598A patent/DE10240598A1/de not_active Withdrawn
-
2003
- 2003-08-21 KR KR1020057003409A patent/KR101045487B1/ko not_active IP Right Cessation
- 2003-08-21 WO PCT/EP2003/009253 patent/WO2004025370A1/de active Application Filing
- 2003-08-21 EP EP03794908A patent/EP1532490B1/de not_active Expired - Fee Related
- 2003-08-21 AU AU2003260438A patent/AU2003260438A1/en not_active Abandoned
- 2003-08-21 JP JP2004535124A patent/JP4431497B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-28 US US11/066,923 patent/US20050254120A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20050254120A1 (en) | 2005-11-17 |
AU2003260438A1 (en) | 2004-04-30 |
EP1532490B1 (de) | 2012-04-04 |
JP2005537676A (ja) | 2005-12-08 |
WO2004025370A1 (de) | 2004-03-25 |
KR101045487B1 (ko) | 2011-06-30 |
DE10240598A1 (de) | 2004-03-25 |
EP1532490A1 (de) | 2005-05-25 |
KR20050042169A (ko) | 2005-05-04 |
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