JP4423027B2 - Wiring board manufacturing method - Google Patents

Description

The present invention is used for, for example, a mother board of a large computer called a main frame, a board for mounting electric elements, or a package for storing electric elements, and includes a wiring circuit layer composed of an insulating substrate containing an organic resin and a metal layer. a method of manufacturing a wiring board.

  Electronic devices are becoming smaller in size, but in recent years, with the development of portable information terminals and the spread of so-called mobile computing for carrying and operating computers, smaller, thinner and higher-definition wiring boards are required. In communication equipment applications, electronic devices capable of high-speed operation are widely used. For this reason, a wiring board having a high-speed switching function and a wiring structure with low transmission loss is required for high-frequency signals.

  In order to meet the demand for such high-density wiring, a build-up method has been conventionally used as a method for manufacturing a wiring board.

  The build-up method will be described below.

  First, a wiring circuit layer is formed on the surface of an insulating substrate made of a glass epoxy composite material, drilled with a drill, a through hole penetrating the insulating substrate is formed, and a conductor is embedded in the through hole, or by plating. A metal film is produced on the inner wall of the through hole to produce a core substrate.

  A photosensitive resin is applied to the surface of the core substrate to form an insulating layer. Then, the through hole is formed by exposing and developing the insulating layer made of the photosensitive resin. Next, a plating layer such as copper is formed on the entire surface of the insulating layer including the inner wall of the through hole. Then, a photosensitive resist is applied / exposed / developed / etched / resist removed on the surface of the plating layer to form a wiring circuit layer. Thereafter, the surface multilayer wiring circuit layer is formed by repeatedly forming the insulating layer and the wiring circuit layer by repeating the above steps as necessary.

Recently, the following semi-additive construction method has also been adopted. After pasting the uncured thermosetting resin on the surface of the core substrate, heat the thermosetting resin to cure, and then form a through-hole in the insulating layer made of thermosetting resin with carbon dioxide laser etc. To do. After the through holes are formed, electroless plating with a thickness of 2 to 3 μm is applied to the entire surface of the substrate, and resist coating / exposure / development is performed. Thereafter, electrolytic plating is performed using the electroless plating layer as a seed layer, and resist removal / etching is performed to form a wiring circuit layer. Next, the above process is repeated as necessary to obtain a multilayered wiring board in which a plurality of circuit boards are stacked on a core board (see Patent Document 1).
JP 2000-101247 A

However, in the wiring substrate manufactured in the prior art, longitudinal cross-sectional shape of the wiring circuit layer is formed by a rectangular or trapezoidal shape, also the wiring surfaces, improves the adhesion between the insulating layer, the reliability in environmental tests Since the surface is roughened to increase the level, some problems have occurred. First, in the semi-additive method, for example, a seed layer is formed on an insulating resin by electroless plating or sputtering in a manufacturing process. Thereafter, wiring is formed by resist application, exposure / development, electrolytic plating, resist stripping, and etching. At this time, in order to resist the growth electrolytic plated film in a vertical direction along the developed vertical cross-sectional shape of the wiring becomes a trapezoidal shape after rectangular or etching. When the cross-sectional shape of the wiring is rectangular or trapezoidal, high-frequency electrical signals flow more concentrated on the corners due to the skin effect that makes it easier to flow through the shallow part of the wiring circuit layer surface. Becomes larger.

  Further, when forming the unevenness by roughening the surface of the wiring circuit layer, if the unevenness is excessively large, the transmission loss increases due to the skin effect, which is not suitable as a high-frequency wiring board.

  Also, in the method of manufacturing a build-up substrate represented by the semi-additive method, if the adhesion between the resist for wiring processing and the underlying insulating resin is poor, the resist is particularly affected when the wiring width is 20 μm or less. Becomes easier to float. For this reason, there is a problem that short defects frequently occur, and fine processing with a line width of 20 μm or less cannot be performed. In addition, in order to prevent the resist from floating, when the adhesion of the resist to the substrate is increased, a part of the resist remains on the substrate when the resist is peeled off after development and electrolytic plating. It may cause problems such as short circuit failure.

  Further, in the wiring processing using a resist, when the line width or the space between the line and the space is 20 μm or less, the line shape is wavy due to the problem of the resolution of the resist, and there is a problem that short-circuit defects and open defects occur frequently. Further, if the resist substrate is uneven, there is a problem that the resist is not processed into a sharp shape because light rays are irregularly reflected during exposure.

  In addition, the build-up method uses dry film resist or resist developer for pattern formation, so there are many consumables and energy consumption in the process, which increases costs and increases the burden on the environment. There is.

The present invention has a fine pattern, and aims to provide a method for manufacturing a wiring board with improved electrical characteristics of the high-frequency.

A method for manufacturing a wiring board of the present invention, (a) to form a through hole in the resin sheet that Do and the insulating layer, and forming a conductor on the through hole, forming a through conductor, (b) the A step of adsorbing a coupling agent on the surface of the resin sheet, irradiating with ultraviolet rays through a photomask on which a test pattern is printed, selectively removing the coupling agent in the ultraviolet irradiation portion, and forming a pattern; (C) a step of adsorbing TiO ₂ colloid on the coupling agent formed in a pattern on the surface of the resin sheet; and (d) applying a solution containing metal ions on the TiO ₂ colloid on the coupling agent. after, irradiating ultraviolet radiation, said precipitated by reducing the metal of the metal ions in solution by the reducing action of the TiO ₂ colloid, and has a thickness of less than 5 [mu] m, it than the metal Forming a seed layer, by plating on the seed layer (e), the vertical sectional shape is substantially circular, substantially forming a wiring circuit layer in a semi-circular or substantially elliptical, in (f) (e) a step of a-chemical roughening treatment surface of the formed the wiring circuit layer, (g) formed in the step of said (a) ~ (f), the through hole, the seed layer and the wiring circuit layer the resin sheet is having, it characterized by comprising the steps of laminating crimped by aligning a predetermined number of layers.

According to the method for manufacturing a wiring board of the present invention, after processing a seed layer formed by selectively depositing a metal in a pattern shape on a coupling agent into a wiring circuit layer shape, the wiring circuit layer is formed by plating. Therefore, a hindrance to fine wiring processing due to the resist can be eliminated, and a wiring circuit layer having a wiring width of 30 μm or less can be formed.

A wiring board obtained by the method for manufacturing a wiring board according to the present invention includes, for example, an insulating layer 1 containing at least an organic resin and a wiring circuit layer 3 formed on at least one surface of the insulating layer 1 as shown in FIG. A wiring circuit layer 3 formed on the surface of the insulating layer 1 in a wiring board A comprising a through hole 5 formed through the insulating layer 1 and a through conductor 5a formed in the through hole 5. vertical cross-sectional shape substantially circular, in the form of substantially a semicircle or substantially elliptical.

Incidentally, a longitudinal cross section of the wiring circuit layer 3 among the cross section of the wiring circuit layer 3, is that the cross-section perpendicular to the current flowing in the wiring circuit layer 3.

  Here, as shown in FIG. 2A, the substantially circular shape has a cross section perpendicular to the direction in which a signal flows in the wiring circuit layer 3 and has a shape close to a circle with no corners other than an adhesive portion with the seed layer. As shown in FIGS. 2 (b) and 2 (c), the semi-circular shape and the elliptical shape also have no corners other than the portion to be bonded to the seed layer. The shape is close to.

  In other words, for example, it is shaped like a cylinder with a part missing.

  The wiring circuit layer 3 is formed on the main surface of the insulating layer 1 through a seed layer 3a made of a conductive material.

The vertical sectional shape of the wiring circuit layer 3, it is important that the substantially circular, a substantially semi-circular or substantially elliptical. Here, the substantially circular shape is desirable because it can increase the cross-sectional area and reduce the electrical resistance. Further, by less corners in the cross-sectional shape, i.e. may have four corners at the four corners in the vertical cross section If it is rectangular, by the presence of two corners in the seed layer contacting portion If it is generally circular, wire Highly reliable because the stress concentration caused by the difference in thermal expansion between the metal constituting the circuit layer 3 and the insulating resin 1 constituting the insulating layer 1 can be alleviated and cracks can be prevented in the thermal cycle during long-term use. A wiring board can be provided.

  The width of the low-resistance metal constituting the wiring circuit layer 3 is preferably 20 μm or less, and more preferably 10 μm or less. By making the width of the low-resistance metal smaller than 20 μm, the wiring interval can be reduced and high-density wiring can be realized.

  Further, the surface roughness of the wiring circuit layer of the wiring circuit layer 3 is preferably Ra = 0.5 μm or less and Rz = 5 μm or less, and preferably Ra = 0.3 μm or less and Rz = 3 μm or less. desirable. Since Ra is 0.5 μm or less and Rz is 5 μm or less, even if the high-frequency signal propagates near the surface due to the skin effect, the length of the propagation path of the high-frequency signal can be reduced to an extent that does not affect the transmission loss. A wiring board with a small transmission loss can be provided.

  The seed layer 3a shown in FIG. 1 is a thin metal film layer processed into a wiring circuit produced by a process of forming a thin film. This metal film layer becomes a seed layer 3a for increasing the wiring in the vertical direction by a plating method in a later step, and needs to be a uniform film.

  It is important that the width is 20 μm or less, and in particular, when the width is 10 μm or less, and further 5 μm or less, a high-density wiring board can be obtained. Further, the thickness is preferably 5 μm, and more preferably 1 μm or less and 0.5 μm or less, which is important for producing a wiring board that is flat and free from stacking faults. Moreover, by setting it as this range, manufacturing time can also be shortened.

  As the metal used for the seed layer 3a shown in FIG. 1, for example, a low resistance metal containing at least one of gold, silver, copper, aluminum, and nickel is preferably used. Of these, copper is the most desirable from the viewpoint of cost.

  In the wiring board A shown in FIG. 1, as a material constituting the insulating layer 1, epoxy resin, PPE (polyphenylene ether resin), BT resin (bismaleidotriazine), polyimide resin, fluororesin, polyaminobismaleimide resin, or liquid crystal Polymers, composite materials of thermosetting resins and inorganic fillers, and the like are preferably used.

  The through-hole conductor 5a is formed by filling the through-hole 5 with metal powder, or is electrically connected by plating.

Examples of the organic resin shown in the insulating layer 1 used in the present invention include an epoxy resin, A-PPE (allylated polyphenylene ether), and BT resin as thermosetting resins in order to propagate high-frequency signals at high speed and without loss. Resins selected from the group of (bismaleimide triazine), polyimide resin, and the like are desirable from the viewpoints of stackability and reliability. Further, when a thermoplastic resin is used for the insulating layer 1, a liquid crystal polymer is desirable from the viewpoint of electrical characteristics, heat resistance, and reliability. Further, when a composite material in which an inorganic filler is dispersed in the insulating layer 1 is used, SiO ₂ , Al ₂ O ₃ , SiC, SiN, AlN, etc. are preferable from the viewpoint of electrical characteristics, from the viewpoint of cost and ease of handling. SiO ₂ and Al ₂ O ₃ are desirable. As the shape of the filler, fibers, spheres, needles, plates, and the like can be used, and preferably, spherical particles having an average particle diameter of 10 μm or less are used. When a fibrous filler is used, when the via pitch is reduced, moisture migrates along the fiber and causes electromigration. Therefore, a spherical particle filler is more desirable. On the other hand, in order to give strength to the substrate, one or more layers containing a fibrous woven fabric or non-woven fabric may be included.

Further, as the electrical properties of the insulating layer 1, the relative dielectric constant is preferably 6 or less, preferably 4.5 or less, and the dielectric loss tangent (tan δ) is 350 × 10 ⁻⁴ or less, preferably 300 × 10 ⁻⁴ or less. Is desirable. By setting the relative dielectric constant to 6 or less, the signal transmission speed can be within a practically no problem range, and by setting the dielectric loss tangent (tan δ) to 350 × 10 ⁻⁴ or less, signal transmission loss can be reduced.

A method for manufacturing a wiring board according to the present invention will be described.

  First, as shown in FIG. 3A, the resin sheet 1a to be the insulating layer 1 is subjected to a drilling process such as a laser method to form a through hole 5 for electrically connecting the insulating layers 1 to each other. . In addition to the laser method, drilling may be performed by a mold or a photo method. Processing by the laser method is preferable in that a small-diameter hole can be formed. On the other hand, the mold and the photo method have good mass productivity.

  Next, as shown in FIG. 3 (b), in the through hole 5, a metal film is formed on the wall surface inside the through hole 5 by a plating method, or a conductive paste is embedded, so that an interlayer between the insulating layers 1 is formed. The through conductor 5a is formed on the substrate.

Next, as shown in FIG. 3B, a metallized pattern (seed layer 3a) having a thickness of 5 μm or less is preferably formed on the surface of the insulating layer 1. The patterning of the seed layer 3a is performed, for example, by treating the entire surface of the insulating layer 1 with a coupling agent and then irradiating the coupling agent with light rays such as ultraviolet rays through a photomask on which the pattern shape is printed. The coupling agent other than the portions is decomposed and removed, and then the TiO ₂ colloid is adsorbed on the coupling agent remaining on the surface of the insulating layer 1 in a pattern, thereby causing a solution containing metal ions to act. Next, the metal in the metal ion solution reduced by the reducing action of the TiO ₂ colloid is irradiated with ultraviolet rays to form a desired pattern shape with a thickness of 5 μm or less. The seed layer 3a formed in this manner is not suitable if the thickness is 5 μm or more because it takes time to form a metal film.

  The method of manufacturing the wiring board A of the present invention is greatly different from the conventional manufacturing method in that no resist is used when forming the wiring circuit layer 3. That is, conventionally, a rectangular wiring circuit layer is formed by using a resist when forming the wiring circuit layer.

  By forming the seed layer 3a by such a method, the seed layer 3a can be formed extremely thin, and the seed layer 3a having a width of 20 μm or less which is difficult to form by a conventional resist method is easily formed. can do.

  Further, if the width of the seed layer 3a exceeds 20 μm, the entire surface of the insulating layer 1 may be subjected to electroless plating, and then a resist is applied, exposed, developed, and etched. .

In order to form the wiring circuit layer 3 on the seed layer 3a thus manufactured, as shown in FIG. 3D, electrolytic plating or electroless plating is performed to increase the film thickness. The time vertical sectional shape of the wiring circuit layer 3 formed on the seed layer 3a, substantially circular, substantially to the semi-circular or substantially elliptical shape, to set the operating conditions of electrolytic plating or electroless plating. At this time, in order to increase the film forming speed, it is desirable in terms of mass productivity to form the film by electrolytic plating.

  Next, in order to improve the adhesion of the surface of the formed wiring circuit layer 3 to the other insulating layer 1 to be laminated, the surface of the wiring circuit layer 3 is chemically treated or roughened. In order to chemically treat the surface of the wiring circuit layer 3 with the other insulating layer 1 to be laminated, the surface treatment with a coupling agent or other chemicals is possible. The metal surface of the circuit layer 3 may be roughened using formic acid or the like, and the adhesive strength may be ensured by a physical anchor effect. However, when the adhesive strength is ensured by surface roughening, the surface roughness should be Ra = 0.5 μm or less, particularly Ra = 0.3 μm or less, Rz = 5 μm or less, particularly Rz = 3 μm or less. It is desirable to reduce transmission loss due to the skin effect when a high-frequency signal propagates.

  The resin sheet 1a to be the insulating layer 1 having the through conductor 5a and the wiring circuit layer 3 produced as described above is aligned and pressure-bonded by a predetermined number of layers to constitute a laminate. At this time, if the wiring circuit layer 3 is wider than the width of the seed layer 3a in the cross-sectional shape of the wiring circuit layer 3, the insulating resin of the insulating layer 1 located above the wiring circuit layer 3 is sufficiently wired circuit It is important that the layers 3 are laminated so as to be crimped so that there is no gap around the periphery of the layer 3. Further, it is possible to produce a laminated body by sequentially laminating a resin sheet 1a to be another insulating layer 1 on the insulating layer 1 on which the wiring circuit layer 3 is formed, and to cure the laminated body. In this case as well, it is important that the resin is sufficiently wrapped around the wiring circuit layer 3 so that a gap is not formed so as to form a gap. If the resin does not sufficiently wrap around the wiring circuit layer 3 and a gap is formed, moisture accumulates in the gap over a long period of time, which may cause the wiring circuit layer 3 to be oxidized or deteriorate the insulation.

Further , the wiring board A can be applied to a printed wiring board, a build-up wiring board, a batch curing wiring board, and the like. In addition, the wiring board A of the present invention can be produced without any problem in known production methods such as a sequential lamination method, a build-up lamination method, and a batch lamination method.

  In addition, by mounting an electrical element such as a semiconductor element on the wiring board A described above, an electrical device with significantly high frequency characteristics and high wiring density is obtained.

  In addition, this invention is not limited to the said form, A various change is possible in the range which does not change the summary of invention.

  First, in order to ensure the strength of the entire substrate, a base material in which glass fibers were impregnated with an epoxy resin was prepared as a core substrate. This core substrate has already been heat-treated to cure the resin.

Next, three types of insulating materials of an epoxy resin, a liquid crystal polymer, and a composite material in which SiO ₂ powder was impregnated in an A-PPE resin were thermocompression bonded to the surface of the core substrate. Note that all of these three types of insulating layers have a thickness of 100 μm. Of these, the liquid crystal polymer was inferior in adhesive strength with the epoxy resin of the core substrate, and was laminated with an epoxy adhesive layer in between. Then, it hold | maintained for 2 hours at the hardening temperature of each insulating resin, and it hardened | cured, heating and press-bonding with the press of a flat plate.

Next, after cleaning this insulating resin substrate, a coupling agent was adsorbed on the surface. A silane coupling agent was used as the coupling agent. The substrate subjected to the silane coupling treatment is dried at 90 ° C., washed with methanol, and then irradiated with ultraviolet light for 1 hour by a 140 W low-pressure mercury lamp power source through a photomask on which a test pattern is printed. The silane coupling agent in the irradiated part was selectively removed. The test pattern was formed by immersing the insulating resin substrate in a TiO ₂ colloid aqueous solution for 1 minute to adsorb TiO ₂ colloid particles. Further, a mixed solution of copper sulfate and methanol is applied to this substrate, and a 250 W low-pressure mercury lamp power source is irradiated through quartz glass for 1 hour, so that copper particles are deposited on the pattern by the reducing action of TiO ₂ colloid particles. I let you. By the above operation, a seed layer having a thickness of 0.3 μm and a width shown in Table 1 was formed.

  Furthermore, a wiring circuit layer having a different cross-sectional shape was formed on this seed layer by electrolytic plating by operating conditions of current density, plating solution concentration, processing time, and additives (accelerators, inhibitors).

Thus, substantially circular as a vertical cross-sectional shape of the wiring circuit layer, a substantially semi-circular (semi-cylindrical), in addition to the three types of substantially elliptical, separately as a comparative example, the semi-additive method described in the cited document 1 on an insulating substrate , vertical cross-sectional shape of the wiring is a test sample is a rectangle, to prepare a wiring width as 30 [mu] m.

  Moreover, a sample having a wiring width in the range of 0.1 μm to 30 μm was prepared mainly by manipulating the deposition time.

  Furthermore, the sample was immersed in a roughening treatment solution using formic acid, and a sample with a surface roughness of the wiring circuit layer in the range of Rz of 0.2 μm to 0.5 μm was produced.

  Next, a test sample substrate having a stripline structure in which a ground plane was formed on the front and back surfaces and wiring was formed on the inner layer using the insulating layer produced by the method described above and the wiring circuit layer was produced.

  In addition, since there is no through conductor in the test sample substrate manufactured by the above method, the formation method of the through conductor is not described. However, when forming the through conductor, the laser method, the photo method, or the gold method is used. After drilling by a method such as a mold method, a through conductor may be formed by taking electrical conduction by a conductive paste or a plating method as appropriate.

Evaluation Method The width of the wiring circuit layer of the test sample substrate was measured using an image dimension measuring machine. The surface roughness (Ra) of the wiring circuit layer was measured using an atomic force microscope (AFM).

The dielectric constant (εr) and dielectric loss tangent (tan δ) of the insulating layer were measured at 3 GHz by the cavity resonator method. The transmission loss (S ₂₁ ) was measured with a network analyzer at frequencies of 1 GHz, 5 GHz, and 10 GHz.

The transmission loss (S ₂₁ ) at a high frequency is a value obtained by adding the dielectric loss (S _d21 ) of the dielectric layer and the conductor loss (S _c21 ) of the wiring circuit layer. Accordingly, since the influence of the dielectric constant of the insulating layer in the transmission loss (S _{21) (εr)} and dissipation factor (tan [delta) is taken into account sufficiently, by measuring the transmission loss (S _21), test It was set as a criterion for judging the superiority or inferiority of each member constituting the sample substrate.

Shows the material of the insulating layer in Table 1, the longitudinal sectional shape of the wiring circuit layer, wiring width, the transmission loss in the case of changing the surface roughness (Ra) The results of (S _21).

Samples longitudinal sectional shape of the wiring circuit layer formed by semi-additive method outside the scope of the prior art of the present invention is rectangular No. In 15, the transmission loss of the 10GHz is -0.60dB / cm, and the wiring width is equal to the vertical cross section of substantially circular Sample No. 4, almost semicircular sample No. 10, substantially elliptical sample no. Transmission loss as compared with 14 is increased, in particular, the vertical cross section of substantially circular Sample No. It was about twice the value of 2.

Therefore, substantially circular longitudinal cross-sectional shape of the wiring circuit layer, substantially elliptical, that the substantially semicircular, when the wiring width is the same it is understood that it is possible to remarkably improve the electrical transmission properties.

  Hereinafter, the sample of the present invention will be described in detail.

Samples longitudinal cross section is substantially circular No. 1 to 6, the transmission loss (S ₂₁ ) at 10 GHz is −0.22 to −1.74 dB / cm. In No. 4, since the wiring width was 30 μm, the wiring density was slightly reduced, but the characteristic was as excellent as −0.22 dB / cm. In addition, the sample No. 3 was -0.42 dB / cm.

  As described above, when the wiring width is narrowed, the transmission characteristics are deteriorated. However, the tendency is the same in the case of the rectangular shape. Therefore, even if the rectangular wiring circuit layer having the same width can be formed, the wiring according to the present invention is used. It is clear that the substrate shows better electrical transmission characteristics.

In Sample No. longitudinal sectional shape of the wiring circuit layer has a substantially semi-circular 7 to 10, although the characteristics are slightly deteriorated as compared with the case of the substantially circular shape, the conventional rectangular sample Nos. Compared with 15, transmission loss could be reduced to about 2/3.

In Sample No. longitudinal sectional shape of the wiring circuit layer has a substantially elliptical shape In Nos. 11 to 14, the electrical transmission characteristics were excellent next to the sample having a substantially circular cross-sectional shape of the wiring circuit layer, and although it was slight, the result was better than that of the substantially semicircular case.

Sample No. using a liquid crystal polymer as the insulating layer. 16, sample No. using a composite material of A-PPE resin and SiO ₂ . In No. 17, since the non-dielectric constant of the insulating layer was low, the transmission characteristics could be improved.

It is a schematic sectional view for explaining an example of a wiring substrate. (A) is a cross-sectional view of a wiring substrate in the form of the wiring circuit layer has a substantially circular longitudinal cross-section, (b), the interruption of the wiring substrate in the form of the wiring circuit layer has a longitudinal cross-section of substantially elliptical rear view, (c), the wiring circuit layer is cross-sectional view of a wiring substrate in the form having substantially a semi-circular longitudinal section. It is sectional drawing which shows the manufacturing method of the wiring board of this invention.

Explanation of symbols

A ... Wiring board 1 ... Insulating layer 3 ... Wiring circuit layer 3a ... Seed layer 5 ... Through hole 5a ... Through conductor

Claims (1)

(A) a step to form a through hole in the resin sheet that Do and the insulating layer, and forming a conductor on the through hole to form a through conductor,
(B) A coupling agent is adsorbed on the surface of the resin sheet and irradiated with ultraviolet rays through a photomask on which a test pattern is printed, and the coupling agent in the ultraviolet light irradiated portion is selectively removed to form a pattern. And a process of
(C) a step of adsorbing TiO ₂ colloid on a coupling agent formed in a pattern on the surface of the resin sheet ;
(D) After applying a solution containing metal ions on the TiO ₂ colloid on the coupling agent , irradiating with ultraviolet rays , the metal in the metal ion solution is reduced and precipitated by the reducing action of the TiO ₂ colloid. Forming a seed layer made of the metal with a thickness of 5 μm or less;
(E) by plating on the seed layer, a step of longitudinal cross section to form a substantially circular, substantially semi-circular or the wiring circuit layers of substantially elliptical,
(F) a step of a-chemical roughening treatment surface of the formed the wiring circuit layer (e),
(G) a step of aligning a predetermined number of layers of the resin sheet having the through hole, the seed layer, and the wiring circuit layer formed in the steps (a) to (f), and laminating and pressing the resin sheet; ,
A method for manufacturing a wiring board, comprising:

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