JP4414828B2 - プローブカード - Google Patents
プローブカード Download PDFInfo
- Publication number
- JP4414828B2 JP4414828B2 JP2004201068A JP2004201068A JP4414828B2 JP 4414828 B2 JP4414828 B2 JP 4414828B2 JP 2004201068 A JP2004201068 A JP 2004201068A JP 2004201068 A JP2004201068 A JP 2004201068A JP 4414828 B2 JP4414828 B2 JP 4414828B2
- Authority
- JP
- Japan
- Prior art keywords
- guide plate
- hole
- probe
- tip
- inner diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 title claims description 64
- 239000004065 semiconductor Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 11
- 238000007747 plating Methods 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000007689 inspection Methods 0.000 description 5
- 238000007790 scraping Methods 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 208000032544 Cicatrix Diseases 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 230000037387 scars Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004201068A JP4414828B2 (ja) | 2004-07-07 | 2004-07-07 | プローブカード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004201068A JP4414828B2 (ja) | 2004-07-07 | 2004-07-07 | プローブカード |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006023177A JP2006023177A (ja) | 2006-01-26 |
| JP2006023177A5 JP2006023177A5 (https=) | 2007-08-09 |
| JP4414828B2 true JP4414828B2 (ja) | 2010-02-10 |
Family
ID=35796550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004201068A Expired - Lifetime JP4414828B2 (ja) | 2004-07-07 | 2004-07-07 | プローブカード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4414828B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4739269B2 (ja) * | 2007-04-09 | 2011-08-03 | 日本電子材料株式会社 | 垂直型プローブ |
| JP2010281790A (ja) * | 2009-06-08 | 2010-12-16 | Micronics Japan Co Ltd | コンタクトピンとそれを用いる電気的接続装置 |
| KR101415722B1 (ko) | 2010-06-25 | 2014-07-25 | 니혼 하츠쵸 가부시키가이샤 | 콘택트 프로브 및 프로브 유닛 |
-
2004
- 2004-07-07 JP JP2004201068A patent/JP4414828B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006023177A (ja) | 2006-01-26 |
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