JP4414655B2 - 伝熱インターフェース - Google Patents

伝熱インターフェース Download PDF

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Publication number
JP4414655B2
JP4414655B2 JP2003009415A JP2003009415A JP4414655B2 JP 4414655 B2 JP4414655 B2 JP 4414655B2 JP 2003009415 A JP2003009415 A JP 2003009415A JP 2003009415 A JP2003009415 A JP 2003009415A JP 4414655 B2 JP4414655 B2 JP 4414655B2
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JP
Japan
Prior art keywords
heat transfer
pin
transfer body
pins
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003009415A
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English (en)
Japanese (ja)
Other versions
JP2003243583A (ja
JP2003243583A5 (enExample
Inventor
エル ベラディ クリスチャン
シー ピーターソン エリック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2003243583A publication Critical patent/JP2003243583A/ja
Publication of JP2003243583A5 publication Critical patent/JP2003243583A5/ja
Application granted granted Critical
Publication of JP4414655B2 publication Critical patent/JP4414655B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003009415A 2002-02-12 2003-01-17 伝熱インターフェース Expired - Fee Related JP4414655B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/074,642 US20030150605A1 (en) 2002-02-12 2002-02-12 Thermal transfer interface system and methods
US10/074642 2002-02-12

Publications (3)

Publication Number Publication Date
JP2003243583A JP2003243583A (ja) 2003-08-29
JP2003243583A5 JP2003243583A5 (enExample) 2006-03-02
JP4414655B2 true JP4414655B2 (ja) 2010-02-10

Family

ID=27659925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003009415A Expired - Fee Related JP4414655B2 (ja) 2002-02-12 2003-01-17 伝熱インターフェース

Country Status (2)

Country Link
US (2) US20030150605A1 (enExample)
JP (1) JP4414655B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7475175B2 (en) 2003-03-17 2009-01-06 Hewlett-Packard Development Company, L.P. Multi-processor module
US7082034B2 (en) * 2004-04-01 2006-07-25 Bose Corporation Circuit cooling
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
US7646608B2 (en) * 2005-09-01 2010-01-12 Gm Global Technology Operations, Inc. Heat transfer plate
US7212409B1 (en) 2005-12-05 2007-05-01 Hewlett-Packard Development Company, L.P. Cam actuated cold plate
US7449775B1 (en) 2006-05-22 2008-11-11 Sun Microsystems, Inc. Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion
US7397664B2 (en) * 2006-05-22 2008-07-08 Sun Microsystems, Inc. Heatspreader for single-device and multi-device modules
US8666235B2 (en) * 2007-02-14 2014-03-04 Battelle Memorial Institute Liquid fuel vaporizer and combustion chamber having an adjustable thermal conductor
CA2703963C (en) * 2007-10-25 2013-12-03 Nexxus Lighting, Inc. Apparatus and methods for thermal management of electronic devices
EP2247172B1 (de) * 2009-04-27 2013-01-30 Siemens Aktiengesellschaft Kühlsystem, Kühlplatte und Baugruppe mit Kühlsystem
US8776868B2 (en) 2009-08-28 2014-07-15 International Business Machines Corporation Thermal ground plane for cooling a computer
US9049811B2 (en) 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
WO2015045648A1 (ja) * 2013-09-30 2015-04-02 富士電機株式会社 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール
CN105716225B (zh) * 2014-12-22 2020-08-11 株式会社堀场Stec 流体加热器、加热块和汽化系统
US11997812B2 (en) 2022-10-12 2024-05-28 Lunar Energy, Inc. Cover for sealing a power module
US11889662B1 (en) 2022-10-12 2024-01-30 Lunar Energy, Inc. Thermal interface sandwich
US11849536B1 (en) 2022-10-12 2023-12-19 Lunar Energy, Inc. Gantry for thermal management
WO2024081005A1 (en) * 2022-10-12 2024-04-18 Lunar Energy, Inc. Gantry for thermal management

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4153107A (en) * 1977-06-30 1979-05-08 International Business Machines Corporation Temperature equalizing element for a conduction cooling module
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
US4449580A (en) * 1981-06-30 1984-05-22 International Business Machines Corporation Vertical wall elevated pressure heat dissipation system
US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
US5097385A (en) * 1990-04-18 1992-03-17 International Business Machines Corporation Super-position cooling
US5228502A (en) * 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
JPH06349989A (ja) * 1992-12-21 1994-12-22 Internatl Business Mach Corp <Ibm> 熱伝達冷却装置

Also Published As

Publication number Publication date
JP2003243583A (ja) 2003-08-29
US20030150605A1 (en) 2003-08-14
US20040173345A1 (en) 2004-09-09

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