JP4393857B2 - 記録媒体の作製方法 - Google Patents

記録媒体の作製方法 Download PDF

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Publication number
JP4393857B2
JP4393857B2 JP2003424174A JP2003424174A JP4393857B2 JP 4393857 B2 JP4393857 B2 JP 4393857B2 JP 2003424174 A JP2003424174 A JP 2003424174A JP 2003424174 A JP2003424174 A JP 2003424174A JP 4393857 B2 JP4393857 B2 JP 4393857B2
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JP
Japan
Prior art keywords
substrate
integrated circuit
thin film
display device
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003424174A
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English (en)
Japanese (ja)
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JP2004220587A (ja
JP2004220587A5 (enExample
Inventor
徹 高山
純矢 丸山
裕吾 後藤
由美子 大野
麻衣 秋葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2003424174A priority Critical patent/JP4393857B2/ja
Publication of JP2004220587A publication Critical patent/JP2004220587A/ja
Publication of JP2004220587A5 publication Critical patent/JP2004220587A5/ja
Application granted granted Critical
Publication of JP4393857B2 publication Critical patent/JP4393857B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group

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  • Credit Cards Or The Like (AREA)
  • Liquid Crystal (AREA)
JP2003424174A 2002-12-27 2003-12-22 記録媒体の作製方法 Expired - Fee Related JP4393857B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003424174A JP4393857B2 (ja) 2002-12-27 2003-12-22 記録媒体の作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002378803 2002-12-27
JP2003424174A JP4393857B2 (ja) 2002-12-27 2003-12-22 記録媒体の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006346310A Division JP4437555B2 (ja) 2002-12-27 2006-12-22 Ｉｃカードの作製方法

Publications (3)

Publication Number Publication Date
JP2004220587A JP2004220587A (ja) 2004-08-05
JP2004220587A5 JP2004220587A5 (enExample) 2007-02-15
JP4393857B2 true JP4393857B2 (ja) 2010-01-06

Family

ID=32911213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003424174A Expired - Fee Related JP4393857B2 (ja) 2002-12-27 2003-12-22 記録媒体の作製方法

Country Status (1)

Country Link
JP (1) JP4393857B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566001B2 (en) 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
JP2005100380A (ja) * 2003-08-29 2005-04-14 Semiconductor Energy Lab Co Ltd Ｉｃカード
EP1696368B1 (en) 2005-02-28 2011-11-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
JP4693439B2 (ja) * 2005-02-28 2011-06-01 株式会社東芝 アクティブマトリクス基板の製造方法
JP4900659B2 (ja) * 2005-02-28 2012-03-21 株式会社半導体エネルギー研究所 半導体装置
WO2006118293A1 (en) 2005-04-27 2006-11-09 Semiconductor Energy Laboratory Co., Ltd. Wireless chip
CN101385039B (zh) * 2006-03-15 2012-03-21 株式会社半导体能源研究所 半导体器件
JPWO2009041119A1 (ja) * 2007-09-27 2011-01-20 シャープ株式会社 アンテナ装置、表示装置基板、液晶表示ユニット、表示システム、アンテナ装置の製造方法、ならびに表示装置基板の製造方法

Also Published As

Publication number Publication date
JP2004220587A (ja) 2004-08-05

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