JP4391090B2 - Integrated package - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an integrated packaging product for collectively selling a plurality of products composed of a packaging bag in which contents such as food are individually packaged.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, instant foods such as instant noodles, sprinkles, and instant miso soup are contained in pillow-type, three-way, or four-side seal-type packaging bags and are widely marketed. In addition, a predetermined number of these products are collected and packaged by being stored in an outer bag or wrapped with a shrink film or the like, and are widely marketed as virtue goods.
[0003]
The sales form as a virtue article has the advantage of increasing the sales volume for the seller, and the advantage that the purchase price per unit is reduced for the purchaser. The number of sales forms is increasing.
[0004]
However, such a packaging form has a problem that there is a feeling of excessive packaging, and an exterior bag and shrink film for collecting and packaging leads to an increase in the amount of dust.
[0005]
Therefore, there is a demand for an integrated packaging form that does not feel excessive packaging and can suppress an increase in the amount of garbage, and various integrated packaging bodies that meet this demand have been proposed (for example, Patent Document 1, (See 2, 3, 4)
[0006]
However, the integrated package described in any patent document is also an integrated package that can be integrated and packaged with a tape such as an adhesive tape, and certainly has no feeling of excessive packaging, and can suppress the amount of dust. Further, another material such as a tape is necessary, and it is difficult to say that the appearance is preferable.
[0007]
[Patent Document 1]
Utility Model Registration No. 3087209 [Patent Document 2]
Japanese Utility Model Publication No. 5-663 [Patent Document 3]
Japanese Patent Laid-Open No. 11-342974 [Patent Document 4]
JP2002-19826
[0008]
[Problems to be solved by the invention]
Then, this invention is providing the integrated package which is excellent in the display effect, without using another materials, such as a tape.
[0009]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the inventor of the present invention is characterized in that the integrated package of the present invention comprises a base material layer made of a stretched film and a first thermal adhesive property on one surface of the base material layer. A laminate comprising a resin layer and a second heat-adhesive resin layer on at least the outermost layer of the other surface of the base material layer, wherein the first heat-adhesive resin layer is exposed to the laminate. Two or more packaging bags having the same shape and the same size, in which the contents are stored and sealed by the peripheral heat-bonded portion thermally bonded by the second heat- adhesive resin layer, correspond to the peripheral heat-bonded portion. The heat-adhesive resin layers are heat-bonded so as to be peeled from each other , and the second heat-adhesive resin layer is made of a resin having a lower temperature adhesiveness than the resin forming the first heat-adhesive resin layer. It is what.
[0010]
With the configuration according to claim 1, it is possible to obtain an integrated package excellent in display effect without using another material .
[0012]
DETAILED DESCRIPTION OF THE INVENTION
The above-described present invention will be described in detail below with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of an integrated packaging body according to the present invention, FIG. 2 is a perspective view of the packaging bag before accumulation in FIG. 1, and FIG. 3 is an embodiment of the layer structure of the packaging bag shown in FIG. FIG. 4 is a perspective view showing another embodiment of the integrated packaging body according to the present invention, in which 1 and 1 ′ are integrated packaging bodies, 2 is a standing pouch, and 3 is a peripheral edge. Thermal bonding part, 3 ′ is a top thermal bonding part, 3 ″ is a peelable thermal bonding part, 4 is a four-pillar type gusset bag, 20 is a laminate, 21 is a first thermal adhesive resin layer, and 22 is a substrate. Reference numerals 23 and 23 respectively denote second heat-adhesive resin layers.
[0013]
FIG. 1 is a perspective view showing an embodiment of an integrated packaging body according to the present invention, FIG. 2 is a perspective view of the packaging bag before being integrated in FIG. 1, and the integrated packaging body 1 is a content (not shown). 2 bags of standing pouches 2 and 2 of the same size having a gusset folding part (not shown) at the well-known bottom part sealed and sealed by the peripheral thermal adhesive part 3, the peripheral thermal adhesive part of the standing pouches 2 and 2 3 and 3, the top heat bonding portions 3 ′ and 3 ′ are opposed to each other, and the top heat bonding portions 3 ′ and 3 ′ are peelable from each other. Although the top thermal bonding portions 3 'and 3' are formed wide (label seal shape) in Fig. 1, they are formed narrow but not shown. It may be.
[0014]
As shown in FIG. 2, the laminate for forming the standing pouch 2 has a base material layer 22 provided with a first thermal adhesive resin layer 21 on one surface, and the other surface of the base material layer 22. Of the laminate 20 having the second heat-adhesive resin layer 23 at least on the outermost layer, and the peripheral heat-adhering portion 3 so that the first heat-adhesive resin layer 21 is exposed to the laminate 20. The standing pouch 2 can be formed by sealing.
[0015]
As the base material layer 22 constituting the laminate 20, a film stretched in a uniaxial or biaxial direction such as polypropylene, polyester, polyamide or the like is suitable. Moreover, as said 1st thermoadhesive resin layer 21 formed in the surface used as the exposed surface when it is set as the bag of the said base material layer 22, the peripheral heat-bonding part which heat-bonds so that peeling is possible, for example, the above-mentioned top part As long as it is formed at least on the exposed surface of the heat bonding portions 3 ′ and 3 ′, it can be peeled off when the base material layer 22 is used as a packaging bag (standing pouch 2 in FIG. 1). A peripheral thermal bonding part, for example, a part formed on the exposed surface of the top thermal bonding part 3 ′, 3 ′, or a packaging bag of the base material layer 22 (in FIG. 1) It is possible to take any one of the surfaces to be the exposed surface when the standing pouch 2) is used, and the first heat-adhesive resin layer 21 is made of resin constituting the base material layer 22. The resin to be formed can be selected and used as appropriate is there.
[0016]
When the first thermal adhesive resin layer 21 is partially formed, a beautiful printed layer is usually provided on the surface of the base material layer 22 opposite to the surface on which the first thermal adhesive resin layer 21 is formed. It is necessary to form the printed layer in register with the printed layer. Usually, the printed layer is formed by an inline gravure printing method simultaneously with the printed layer. For example, when the base material layer 22 is polypropylene, it can be formed using a well-known part coat agent such as chlorinated polypropylene, and when the base material layer 22 is polyester or polyamide, aqua It can be formed using a known part coat agent such as Tex EC-1700 [Chuo Rika Kogyo Co., Ltd .: trade name]. The first heat-adhesive resin layer 21 does not peel unless the conscious operation of separating the two bags of the standing pouches 2 and 2 is performed. The layer 22 only needs to have an adhesive strength that can be smoothly separated without breaking, and the adhesive strength is generally 1 to 10 N / 15 mm width, preferably 3 to 6 N / 15 mm width, It is possible to obtain an adhesive strength in the above range by controlling by the application amount of the first heat-adhesive resin, or by controlling the heat and pressure when two bags are accumulated and thermally bonded. it can. Further, the peelable heat bonding part 3 ″ is formed by heat bonding using a seal bar having a concave part and a seal bar having a convex part engaging with the concave part, if necessary. In addition, the substrate layer 22 may be formed by forming through holes in a plurality of stacked bags at the same time as being thermally bonded. An appropriate easy-adhesion treatment such as corona discharge treatment or anchor agent coating can be applied to the surface or both surfaces.
[0017]
Further, when the first thermal adhesive resin layer 21 is formed on the entire surface of the base material layer 22, the first thermal adhesive resin layer 21 is formed of the same resin as when the first thermal adhesive resin layer 22 is partially formed. However, it has been put on the market in consideration of the fact that it can be easily peelably bonded and the cost. For example, HS-OP [made by Tosero Co., Ltd .: trade name], FOH [made by Nimura Chemical Industry Co., Ltd.] : Trade name], or Melinex 850 [Mitsui Deyupon Polychemical Co., Ltd. product name] can be preferably used.
[0018]
Further, the outermost layer on the opposite side of the surface of the base material layer 22 on which the first heat-adhesive resin layer 21 is formed, in fact, the innermost layer when used as a packaging bag (standing pouch 2 in FIG. 1). The second heat-adhesive resin layer 23 to be formed is only required to be formed of a thermoplastic resin that can be reliably sealed with heat and pressure when used as a packaging bag (standing pouch 2 in FIG. 1). However, it is preferably a resin having a lower temperature adhesiveness than the resin forming the first thermal adhesive resin layer 21, and should be appropriately selected depending on the resin forming the first thermal adhesive resin layer 21. For example, linear low density polyethylene, more preferably an ethylene-α-olefin copolymer (linear low density polyethylene) polymerized using a single site catalyst or a single layer formed by filming them. It can be mentioned.
[0019]
Further, the laminate 20 may be provided between the base material layer 22 and the second heat-adhesive resin layer 23 according to the required physical properties when used as a packaging bag (standing pouch 2 in FIG. 1). For the purpose of imparting or improving mechanical toughness, bending resistance, puncture resistance, impact resistance, cold resistance, heat resistance, chemical resistance, barrier properties, etc., for example, polyester-based, polyamide-based In addition, a stretched or unstretched film made of a polypropylene-based resin or the like, or an unstretched film or a water vapor or oxygen gas barrier layer such as aluminum, silicon oxide, aluminum oxide, or polyvinylidene chloride on at least one surface thereof. Use an intermediate layer (not shown) made of aluminum foil or saponified ethylene-vinyl acetate copolymer. Can.
[0020]
In addition, as a lamination | stacking method of the said laminated body 20, the method of carrying out the melt lamination extrusion of polyethylene etc. using a T-die extruder and carrying out sandwich lamination of each layer, or the method of carrying out dry lamination using urethane type adhesives etc. Any known appropriate lamination method can be used.
[0021]
In the case where the standing pouch 2 is composed of a laminated body in which the body portion and the bottom portion of the pouch are different (so-called two-piece specifications), the laminated body used for the bottom portion is the first thermal adhesive resin layer 21. It is appropriate to provide a configuration that does not provide the Up to now, the integrated packaging body 1 of the present invention has been described with a standing pouch. However, the integrated packaging body 1 of the present invention is not limited to a standing pouch. For example, a pillow type, a three-side seal or a four-side seal The present invention can also be applied to gusset bags, gusset bags, four pillar type gusset bags in which four ridges of the gusset bags are thermally bonded, or blister packs that are shallowly drawn. Further, the number of accumulated packages of the present invention has been described so far as two bags, but the present invention is not particularly limited to this, and it is only necessary to accumulate as much as possible, as shown in FIG. In the case of such an integrated form, 2 to 5 bags are suitable for practical use. In addition, the position for heat-bonding in a peelable manner to form an integrated package may be an appropriate position (appropriate peripheral heat-bonding part) depending on the form of the packaging bag, as described in FIG. It is not limited to the top heat bonding part (position indicated by reference numeral 3 'in FIG. 1) and is not shown in the figure. For example, the peripheral edge is located at an opposing position such as a pillow type, a three-way seal or a four-side seal type. In the packaging bag having the thermal bonding portion, one peripheral thermal bonding portion of the nth packaging bag and the other peripheral thermal bonding portion of the (n + 1) th packaging bag are thermally bonded in a peelable manner. It is good also as an integrated package body of a continuous form, and it is good also as a chain-shaped (chain-shaped) integrated package body, and also the peripheral thermal bonding which heat-bonded four ridgelines of a gusset bag, etc. as shown in FIG. 4 pillar type gusset bag 4 sealed at section 3 is heat bonded to the top 3 bags are alternately stacked, and the peripheral heat bonding portions 3 that are in contact with each other at the peripheral heat bonding portions 3 in which the four ridge lines are heat bonded to each other can be peeled off by the heat bonding portion 3 ″. 4 may be used as a heat-bonded integrated package 1 ', although an example in which three bags are alternately stacked is shown in Fig. 4, this is an example, and the number of bags to be stacked is What is necessary is just to decide suitably.
[0022]
【The invention's effect】
As described above, the integrated package of the present invention is formed without the use of another material such as a tape because the exposed surface of the packaging bag is formed of the first heat-adhesive resin layer having heat-adhesiveness. In addition to being able to accumulate easily by simply overlapping the packaging bags and applying heat and pressure to a predetermined location, it is possible to accumulate without using different materials such as tape. There is an effect that it is excellent also in the exhibition effect.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of an integrated package according to the present invention.
FIG. 2 is a perspective view of the packaging bag before accumulation in FIG.
3 is a diagram schematically showing an embodiment of a layer structure of the packaging bag shown in FIG. 2. FIG.
FIG. 4 is a perspective view showing another embodiment of the integrated package according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1,1 'Accumulation package body 2 Standing pouch 3 Peripheral thermal bonding part 3' Top thermal bonding part 3 "Peelable thermal bonding part 4 4 pillar type gusset bag 20 Laminate body 21 1st thermal adhesive resin layer 22 Base material Layer 23 Second thermal adhesive resin layer

Claims (1)

A base material layer made of a stretched film, a first thermal adhesive resin layer on one surface of the base material layer, and a second thermal adhesive resin layer on at least the outermost layer of the other surface of the base material layer The laminated body is sealed by storing the contents in a peripheral heat-bonded portion thermally bonded by the second heat- adhesive resin layer so that the first heat-adhesive resin layer is exposed. Two or more packaging bags of the same shape and the same size are thermally bonded so as to be peelable between the first thermal adhesive resin layers corresponding to the peripheral thermal adhesive portions , and the second thermal adhesive resin layer is An integrated package comprising a resin having a lower temperature adhesiveness than a resin forming the first thermal adhesive resin layer .

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