JP4380616B2 - Electronic component mounting substrate and manufacturing method thereof, sensor device and manufacturing method thereof - Google Patents

Description

The present invention relates to an electronic component mounting substrate and a manufacturing method thereof, and sensor devices such as proximity sensors and photoelectric sensors and a manufacturing method thereof .

  In general, in a sensor device, a surface mount component is mounted on a metal-wired mounting board to configure a necessary circuit and realize its function. Such sensor devices are often used in factory automation. However, in semiconductor manufacturing equipment that has been improved in performance due to semiconductor miniaturization, it has been incorporated from the viewpoint of stable operation of equipment and detection of faults before they occur. The number of sensor devices to be used is increasing.

  By the way, the semiconductor manufacturing equipment itself and the equipment such as the clean room for installing it are very expensive equipment, so the limited area can be effectively utilized by saving the space of the semiconductor manufacturing equipment to be installed. By doing so, we are proceeding to improve production efficiency. For this reason, there is an increasing demand for miniaturization of sensor devices to be incorporated.

  In order to meet this demand, in the structural aspect of the sensor device, the mounting substrate is made thinner, the mounting density of the electronic components is increased, and further, the electronic component package is reduced in size.

  On the other hand, since the semiconductor manufacturing apparatus is controlled based on a signal from the sensor device, the sensor device is required to have a high function and high reliability.

  However, in order to improve the performance of sensor devices, it is necessary to increase the chip size of the IC and to add an input system discrete device to stably drive the IC. These are factors that hinder downsizing of the sensor device. It becomes.

  In addition, when the mounting density is increased, the stress applied to the joint between the mounting board and the electronic component due to the bending or twisting of the board increases, but this problem is not solved in order to ensure the reliability of the sensor device. Also need to be addressed.

  As a result, a sensor device that satisfies all of these demands in the market has not been realized. High performance and high reliability must be sacrificed when thinning down is prioritized, and thinning down must be sacrificed when high performance and high reliability are prioritized. Currently.

In addition, there exists patent document 1 (Unexamined-Japanese-Patent No. 2001-31462) as what disclosed the flip-chip mounting mentioned later.
JP 2001-31462 A

  Therefore, the inventors have studied packageless mounting of an IC having the largest mounting volume among components constituting the sensor device, that is, flip chip mounting of a bare chip IC, as one means for improving the mounting density.

  As a general flip chip mounting not limited to a sensor device, several methods for connecting a mounting substrate and a bare chip IC have been established. For example, solder is provided on the electrodes of the mounting substrate, gold electrodes are driven into the bare chip IC and connected to the above solder, a method of bonding with a metal-based conductive paste, ultrasonic waves while the mounting substrate and the bare chip IC are in close contact with each other For example, there is a method of bonding by applying.

  In the method of connecting with solder, it is necessary to attach the solder to the bare chip IC. In general, aluminum is used for the electrode of the bare chip IC, so it cannot be joined to solder. Therefore, a ball-shaped solder is formed after forming a metal film, for example, a nickel film, to be bonded to the solder on the surface of aluminum. The solder of this IC chip and the solder placed on the mounting substrate are joined.

  Since this connection method is the same kind of metal connection between solders, the bonding property is excellent. Further, since it can be mounted simultaneously with other discrete surface mount devices and package ICs, it has excellent versatility. However, since extra processing to the bare chip IC is required, there are problems of cost increase including dedicated equipment cost and lead time increase.

  On the other hand, the method of connecting with solder and gold requires processing of gold bumps on the electrode surface of the bare chip IC, but this can be processed with general general-purpose equipment, so special technology and equipment are not required, and cost is reduced. Can be processed while. In addition, solder and gold have the advantage of easy joining. On the other hand, however, there is a problem that the alloy of solder and gold is very brittle and inferior in reliability.

  The bonding using the conductive paste is expensive in the conductive paste itself, and because of the bonding, the bonding property and quality between the mounting substrate and the bare chip IC are inferior. In addition, since discrete surface mount devices and package ICs are solder-connected, there is a problem in that the number of processes increases and costs and lead times increase.

  Also in the case of connecting with ultrasonic waves, electrode processing on the bare chip IC and dedicated equipment for that are required. In addition, since discrete surface mount devices and package ICs are connected by soldering in separate processes, the number of processes is increased, resulting in a problem of increased costs.

  Any of the above flip chip mounting methods is applied to a mounting substrate that is sufficiently thick (for example, 1.0 mm or more) and hardly receives the influence of external stress, or a mounting substrate that hardly generates stress from the substrate such as a flexible substrate. However, if a thin mounting board having a certain degree of rigidity is used in order to reduce the size of the sensor device, problems such as contact failure due to twisting of the thin mounting board occur.

  In particular, the electrode size of the bare chip IC is about several tens to several hundreds of μm, which is very small compared to electrodes of discrete surface mount devices, package ICs and the like. For this reason, the bonding strength of the bare chip IC after flip chip mounting is very weak compared to discrete surface mount devices, package ICs and the like. For this reason, when a flip chip mounted bare chip IC and a discrete surface mount device or package IC are mixedly mounted on a thin mounting substrate, the thin mounting substrate is bent or twisted, so that the flip chip bonding portion having the weakest bonding strength is obtained. There is a problem of poor contact.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component mounting board, a manufacturing method thereof, a sensor device, and a manufacturing method thereof that are both compact and highly reliable.

  According to the sensor device according to the present invention, an input unit including a power input and an output unit including a detection circuit are provided, and the input unit and the output unit are electronic components including a discrete surface mount device, a package IC, and a bare chip IC. In the configured sensor device, the discrete surface mounting device, the package IC, and the bare chip IC are connected to the main surface of the mounting substrate by soldering and mounted in a mixed manner.

  The input unit may be configured by an electronic component including the discrete surface mount device, and the output unit may be configured by an electronic component including the bare chip IC. The package IC may be a multi-chip package IC in which a plurality of discrete elements are built in the package. The discrete element may include at least a transistor and a diode.

  In this way, discrete surface mount devices, package ICs and bare chip ICs can be mounted on the main surface of the mounting board by soldering, and these functions can be realized on a single board. It can be downsized. On the other hand, as one means for realizing such mixed mounting in a sensor device, the following high reliability in flip chip mounting has been achieved.

  In order to solve the problem of improving the reliability of flip chip mounting, the inventor paid attention to a connection method between a mounting substrate and a bare chip IC, and investigated in detail a method of ensuring reliability by joining with solder and gold. As a result, it has been found that the bonding force between the gold and the solder is related to the electrode area of the mounting substrate and the electrode area of the bare chip IC, and the solder volume and the volume of gold as the electrode of the bare chip IC.

  It is generally known that solder and gold are familiar and have excellent bonding properties, and gold is used as an anti-oxidation film for electrodes of mounting substrates and package ICs. However, when gold is diffused into the solder and alloyed, the metallic strength is lowered, so that the bonding reliability between the mounting substrate and the bare chip IC deteriorates. Therefore, the combination of gold and solder has not been used except for the use of an antioxidant film. As described above, the conventional solder-gold joint has not been investigated due to the fixed idea that the reliability becomes low when gold diffuses in the solder.

  Bonding using solder and gold is performed by connecting the solder placed on the mounting substrate and the gold deposited on the bare chip IC. In this case, solder and gold are diffused to form an alloy layer of AuxSny (x and y are different variables depending on the gold diffusion ratio). Therefore, structurally, the mounting substrate and the bare chip IC are connected by the above alloy layer. This alloy layer has low strength against expansion and contraction stress, and diffusion proceeds even at a temperature and stress of about 150 ° C., so that an unstable state is easily formed and reliability is low.

  By the way, the electrode on the mounting substrate has an important role of joining with solder or an alloy layer of solder and gold. Generally, copper is used for the electrodes of the mounting board. Since copper is familiar with solder or an alloy of solder and gold, when these metals are attached, they diffuse violently in the lateral direction and spread to the side surface of the copper electrode. Therefore, it is larger than the designed solder printing area, and in many cases, the entire area of the electrode. As a result, the area of the alloy layer is increased and the thickness is reduced, so that the resistance to expansion and contraction stress is lowered, and the bonding reliability between the electrode and the alloy layer is lowered.

  The present invention has been made on the basis of such new knowledge. In addition to incorporating a metal for stress buffering into the alloy layer, the thickness of the alloy layer can be controlled by controlling the area to which the solder on the electrode on the mounting substrate can be attached. Controlling the thickness, we achieved strength, prevention of low-temperature diffusion, and stress resistance.

  Specifically, the bare chip IC is mounted on the mounting substrate by flip chip mounting. In this case, preferably, the mounting substrate is formed by connecting the solder disposed on the electrode provided on the mounting substrate and the gold electrode disposed on the electrode provided on the bare chip IC. Connect to. At this time, the area of the region on the mounting substrate where the solder can be attached is 100% or more and 500% or less of the area of the corresponding electrode of the bare chip IC, and the volume of the gold electrode provided in the bare chip IC. Is preferably 70% or more of the volume of the solder formed on the corresponding electrode of the mounting substrate. Furthermore, it is preferable to cover the outer periphery of the electrode on the mounting substrate with a solder-resistant film.

  As described above, the volume of gold bonded to the solder is controlled to be 70% or more of the solder volume, so that the gold is sufficiently diffused in the solder and the diffusion does not proceed further due to heat or stress. Can be formed. Also, by controlling the volume of gold within the above range, all the gold does not diffuse and a part remains in the gold state, so the gold remains in the bare chip IC, and this gold is utilized as a stress buffer metal. be able to. Since gold is less deteriorated with time and strong against expansion and contraction stress, it is excellent in strength, so that stable strength can be ensured for a long period of time.

  Further, the required bonding strength can be ensured by controlling the area of the mounting board where the electrodes can be attached to the solder to 100% or more and 300% or less of the solder area. Moreover, by covering the outer periphery of the electrode with a solder-resistant film, the area where the electrode can be soldered can be easily controlled.

  The sensor device according to the present invention can achieve both downsizing and high reliability.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. FIG. 1 is a side view showing the structure of a mounting board on which electronic components are mounted in the present embodiment.

  As shown in FIG. 1, in the sensor device of the present embodiment, a bare chip IC 101, a package IC 102, and a discrete surface mounting device 103 flip-mounted on both surfaces of a thin mounting substrate 100 are joined and soldered together with solder 104.

  As an example to the last, in the thin mounting substrate 100 shown in FIG. 1, one bare chip IC 101, one package IC 102, and two discrete surface mounting devices 103 are mounted on one surface, and one surface is mounted on the other surface. A bare chip IC 101, one package IC 102, and two discrete surface mount devices 103 are mounted. The number and arrangement of these electronic components can be variously changed.

  FIG. 2 is a flowchart showing the process of mixed mounting. In the mixed mounting, first, solder 104 is printed in a prescribed pattern on one main surface 100a of the thin mounting substrate 100 in which the electrodes 106 are previously arranged at predetermined positions by a solder printer. Here, Sn—Ag—Cu-based general lead-free solder is used as the solder 104.

  Next, a required number of discrete surface mount devices 103 having a large bonding area are mounted. Here, as the discrete surface mounting device 103, a small component having a size of 0603 (0.6 mm × 0.3 mm) to 2125 (2.1 mm × 2.5 mm) is mounted.

  Subsequently, after mounting the package IC 102 and further mounting the bare chip IC 101 to be flip-chip mounted, a reflow process is performed. In the reflow process, heating is performed at a peak temperature of 240 ° C. for about 5 seconds. Further, a sealant 105 is applied and cured between the bare chip IC 101 flip-chip mounted and the thin mounting substrate 100.

  Next, also on the other main surface 100b, a discrete surface mounting device 103 having a large bonding area, a package IC 102, and a bare chip IC 101 to be flip chip mounted are mounted in this order, and a reflow process is performed.

  The reason why the electronic components having the large bonding area are mounted in this order is as follows. When an electronic component is mounted on the thin mounting substrate 100, vibration occurs when the electronic component hits the thin mounting substrate 100. Due to this vibration, a shift occurs in the mounting position of the already mounted electronic component. The positional deviation due to the vibration has less influence as the bonding area between the thin mounting substrate 100 and the electronic component is larger. Therefore, the discrete surface mounting device 103 having a larger bonding area is first mounted, and components having a smaller bonding area are mounted in order. By doing in this way, the influence of the vibration at the time of mounting of an electronic component can be minimized.

  FIG. 3 is a side view showing a structure of a mounting substrate on which a bare chip IC using flip chip mounting is mounted only on one main surface. As shown in FIG. 3, when the bare chip IC 101 is mounted only on one main surface of the thin mounting substrate 100 by flip chip mounting, the electronic component is first mounted on the main surface on which the bare chip IC 101 is mounted.

  When electronic components are mounted on the thin mounting substrate 100, the flatness of the surface opposite to the mounting surface may be impaired due to the thinness of the thin mounting substrate 100. By mounting the electronic component including the bare chip IC 101 having a small bonding area first, the influence of deterioration of flatness can be avoided. In addition, the mounting order of the electronic components on each main surface of the thin mounting substrate 100 is performed from the electronic components having a large bonding area as described above.

  FIG. 4 is a block diagram of a circuit constituting the sensor device of the present embodiment. A typical sensor device has a circuit as shown in FIG. That is, a detection circuit including a light receiving element, a comparison circuit that compares a detected signal with a predetermined signal, an output circuit that outputs the result, and a display circuit that displays the result according to the output of the output circuit And a power supply circuit constituting the power supply of these circuits. When these are classified, the power supply circuit is classified as an input system, and the other circuits are classified as an output system.

  Here, the input system is composed of electronic components including the discrete surface mount device 103, and the output system is composed of electronic components including the bare chip IC 101.

  FIG. 5 is a schematic diagram showing the arrangement of electronic components inside the multichip package IC of the present embodiment. As shown in FIG. 5, the discrete surface mount device 103 may be incorporated in a package IC 102 and the package IC 102 may be a multichip package IC. Examples of the discrete element incorporated in the multichip package IC include a diode such as an LED and a transistor. As the sealing resin of the multichip package IC, a black resin and a transparent resin are properly used according to necessity. When an optical device such as an LED is incorporated, a transparent resin is used as the sealing resin.

  Various arrangements of electronic components in the multi-chip package IC are possible as shown in FIGS. 5A and 5B. In FIG. 5A, in addition to the IC chip, two diodes and one LED are incorporated. In FIG. 5B, in addition to the IC chip, one diode, one LED, and one transistor are incorporated. A plurality of IC chips may be built in the package.

  FIG. 6 is a schematic diagram showing the arrangement of discrete elements inside the package. The discrete surface mounting device 103 to be mounted on the surface of the thin mounting substrate 100 may be built in one package as shown in FIG. 6 and this package may be mounted on the thin mounting substrate 100.

  By incorporating the discrete element into the package as described above, the lead time in the mounting process can be reduced.

  Next, the connection of the bare chip IC 101 using flip chip mounting in the present embodiment will be described in detail. The flip chip mounted bare chip IC 101 is a logic IC for determining ON / OFF of the sensor device, and the size of each side is 3.5 mm. The size of the electrodes 108 of the bare chip IC 101 was a square having a side of 100 μm, and the number of electrodes was 50 in the peripheral arrangement.

The thin mounting substrate 100 on which the bare chip IC 101 is mounted has a thickness of 0.4 mm, and the single-side mounting area is 100 mm ² . Electronic components were mounted on both surfaces of the thin mounting substrate 100. The thin mounting board means a board having a thickness of about 0.8 mm or less.

  Specifically, as the discrete surface mount device 103, a device having a size of 0603 to 2125 for controlling voltage and current supplied from an external power source was used. Twenty of these were mounted on both sides of the thin mounting substrate 100. The package IC 102 constitutes a sensor and an output system circuit. Here, three multichip package ICs each including a plurality of IC chips and discrete elements are mounted on both surfaces of the thin mounting substrate 100. Since this multi-chip package IC is an optical application constituting a sensor, a transparent resin is used as a sealing material. The package IC that is not used for optical purposes uses a general black resin.

  FIG. 7 is a cross-sectional view showing the structure of the bare chip IC electrode and the mounting board electrode to be flip-chip connected, and FIG. 8 is a plan view showing the structure of the mounting board electrode. As shown in FIG. 7, a protruding gold electrode 121 was formed by a wire bonder on the electrode 108 of the bare chip IC 101 to be flip-chip mounted. On the other hand, solder 107 was adhered to the surface of the electrode 106 formed on the main surface of the thin mounting substrate 100. The solder 107 is attached by printing.

  As described above, it is necessary to control the area of the solder-attachable region of the electrode 106 of the thin mounting substrate 100 within a predetermined range with respect to the electrode 108 of the bare chip IC 101. In addition, the gold provided on the bare chip IC is also controlled. The volume of the electrode 121 needs to be controlled within a predetermined range with respect to the volume of the solder formed on the corresponding electrode 106 of the thin mounting substrate 100.

  The printing area of the solder 107 is designed based on the area of the electrode 108 of the bare chip IC 101 to be flip-chip mounted and the arrangement interval between them. Generally, the printing area of the solder 107 is set to 100 to 200% with respect to the area of the electrode 108 of the bare chip IC 101 according to the printing capability of the solder printing apparatus. Therefore, the area of the opening 106a of the electrode 106 of the thin mounting substrate 100 was changed with the area of the electrode 108 of the bare chip IC 101 as a fixed value. In the present specification, the solder printing area means the area of the solder pattern in the printing mask when the solder is attached to the electrode by printing.

  Specifically, in order not to impair the electrical characteristics of the sensor device, the electrode area of the thin mounting substrate is sufficiently large in advance, and the outer periphery of the electrode 106 is covered with a solder-resistant film 109 as shown in FIGS. Thus, the opening area of the electrode 106 (the area of the region where the electrode can be soldered) was adjusted. The solder-resistant film 109 that prevents the diffusion of the solder 107 is made of a solder resist.

  Further, by changing the volume of the gold electrode 121, the volume of the gold electrode relative to the volume of the solder 107 provided on the electrode 106 of the thin mounting substrate 100 was controlled.

In order to obtain these optimum values, the following experiment was conducted.
FIG. 9 is a diagram showing the relationship between the ratio of the electrode opening area of the mounting substrate to the electrode area of the bare chip IC and the peel strength. The peel strength was measured by a lateral pressing shear test method. As described above, the solder printing area is determined in relation to the area of the electrode 108 of the bare chip IC 101. Therefore, as apparent from FIG. 9, when the opening area of the electrode 106 of the thin mounting substrate 100 is 100% or less with respect to the area of the electrode 108 of the bare chip IC 101, the solder 107 rises high, so that the bonding with the gold electrode 121 is performed. The area is insufficient and sufficient bonding strength cannot be obtained. On the other hand, if it exceeds 650%, the solder 107 diffuses over the entire opening 106a of the electrode 106, so that the thickness of the solder 107 is insufficient and sufficient bonding strength cannot be obtained.

  FIG. 10 is a diagram showing the relationship between the ratio of the electrode opening area of the mounting substrate to the electrode area of the bare chip IC and the yield rate after the reliability test. Here, a thermal shock test was performed as a reliability test. The thermal shock test changes the temperature in the range of −55 ° C. to 125 ° C. The process of leaving at −55 ° C. and 125 ° C. for 30 minutes was defined as one cycle, and after 1000 cycles were applied, the electrical characteristics were measured and compared by the yield rate.

  As is apparent from FIG. 10, the reliability is lowered in the range where the ratio of the opening area of the electrode 106 of the thin mounting substrate 100 to the area of the electrode 108 of the bare chip IC 101 is less than 70% and more than 500%. This is because if the area is less than 70%, the bonding area is small and the stress during the thermal shock cycle cannot be withstood. If it exceeds 500%, the thickness of the solder 107 or the solder 107 and the gold electrode 121 is not sufficient. This is presumably because the alloy layer is too thin to withstand expansion and contraction stress.

  As a result, it was found that the electrode area on the thin mounting substrate relative to the solder printing area is preferably in the range of 100% to 500%. More preferably, the yield can be expected to be further improved by setting it to 150% or more and 400% or less.

  FIG. 11 is a diagram showing the relationship between the ratio of the gold electrode volume to the solder volume and the peel strength. In the experiment, the opening area of the electrode 106 of the thin mounting substrate 100 was fixed to 360% of the area of the electrode 108 of the bare chip IC 101. In this experiment, the volume of the solder electrode 107 was kept constant, and the volume of the gold electrode 121 was changed.

  The gold electrode 121 was formed on the bare chip IC 101 with a wire bonder, and its volume was changed by adjusting bonding conditions. The peel strength was measured by a lateral pressing shear test method. The peel strength decreases when the volume of the gold electrode 121 with respect to the volume of the solder 107 is 50% or less. This is probably because the gold electrode 121 does not diffuse into the solder 107, and the bonding strength is lowered because the base metal of the gold electrode 121 and the solder 107 are not bonded. Further, even when the gold electrode 121 does not completely diffuse into the solder 107, the gold electrode 121 is thinned and joined by the alloy layer of the solder 107 and the gold electrode 121 having poor joint strength. Is thought to have declined.

  FIG. 12 is a diagram showing the relationship between the ratio of the volume of the gold electrode to the solder volume and the yield rate after the reliability test. Reliability was evaluated by a thermal shock test. The conditions and method of the thermal shock test are the same as the thermal shock test described above.

  From FIG. 12, it can be seen that the ratio of the volume of the gold electrode to the solder volume needs to be 70% or more in order to ensure sufficient reliability. If this is 70% or more, even if the gold electrode 121 is diffused into the solder 107, the gold electrode 121 having a sufficient thickness remains, and the gold electrode 121 functions as a metal for stress buffering to expand and contract. This is thought to be for enduring stress. There is no particular upper limit on the physical characteristics of the ratio of the volume of the gold electrode to the solder volume, but in consideration of the cost of gold, about 200% is practically the upper limit.

  In order to improve the yield, it is more preferable that the ratio of the volume of the gold electrode to the solder volume is 80% or more in consideration of manufacturing variations. Considering the use of a generally used wire bonder, it is more preferable to set it to 140% or less.

  By the above experiment, by controlling the electrode opening area of the mounting substrate with respect to the electrode area of the bare chip IC to be within a predetermined range, and controlling the ratio of the volume of the gold electrode to the solder volume to be within the predetermined range, It was proved that sufficient durability can be obtained in flip chip mounting using gold and solder, which was considered to be inferior in durability.

  As a result, flip chip mounting of bare chip ICs on thin mounting substrates is possible, and by mounting package ICs and discrete surface mounting devices on thin mounting substrates in addition to bare chip ICs, miniaturization and high reliability can be achieved. It became possible to construct a compatible sensor device.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the claims. Further, all modifications within the meaning and scope equivalent to the scope of the claims are included.

It is a side view which shows the structure of the mounting substrate which mounted the electronic component in embodiment based on this invention. It is a flowchart which shows the process of the mixed mounting in embodiment based on this invention. It is a side view which shows the structure of the mounting board | substrate which mounted the bare chip IC which used flip chip mounting only in the one main surface in embodiment based on this invention. It is a block diagram of the circuit which comprises the sensor apparatus in embodiment based on this invention. It is a schematic diagram which shows arrangement | positioning of the electronic component inside the multichip package IC in embodiment based on this invention. It is a schematic diagram which shows arrangement | positioning of the discrete element in the inside of the package in embodiment based on this invention. It is sectional drawing which shows the structure of the electrode of the bare chip IC and the electrode of a mounting board which are flip-chip connected in embodiment based on this invention. It is a top view which shows the structure of the electrode of the mounting board | substrate in embodiment based on this invention. It is a figure which shows the relationship between the ratio of the electrode opening area of the mounting substrate with respect to the area of the electrode of the bare chip IC in embodiment based on this invention, and peeling strength. It is a figure which shows the relationship between the ratio of the electrode opening area of the mounting substrate with respect to the area of the electrode of the bare chip IC in embodiment based on this invention, and the yield rate after a reliability test. It is a figure which shows the relationship between the ratio of the volume of the gold electrode with respect to the solder volume and peeling strength in embodiment based on this invention. It is a figure which shows the relationship between the ratio of the volume of the gold electrode with respect to the solder volume in embodiment based on this invention, and the yield rate after a reliability test.

Explanation of symbols

  100 thin mounting substrate, 101 bare chip IC, 102 package IC, 103 discrete surface mounting device, 104, 107 solder, 106 mounting substrate electrode, 106a opening, 108 bare chip IC electrode, 109 solder-resistant film, 121 gold electrode.

Claims (9)

The electronic components including the base Achippu IC, and implemented by connecting by soldering to the main surface of the mounting substrate, an electronic component mounting board,
The bare chip IC is mounted on the mounting substrate by flip chip mounting,
The bare chip IC is connected to the mounting substrate by connecting a solder provided on the electrode provided on the mounting substrate and a gold electrode provided on the electrode provided on the bare chip IC. And
The area of the electrode on the mounting substrate where the solder can be attached is 100% or more and 500% or less of the area of the electrode corresponding to the bare chip IC,
The electronic component mounting substrate, wherein the volume of the gold electrode disposed on the electrode of the bare chip IC is 70% or more of the volume of the solder disposed on the corresponding electrode of the mounting substrate . A discrete surface mount device and a package IC, which are mounted and connected to the main surface of the mounting substrate with solder;
The electronic component mounting board according to claim 1, wherein an input unit including a power input and an output unit including a detection circuit are configured by electronic components including the discrete surface mount device, the package IC, and the bare chip IC. The volume of the gold electrode disposed on the electrode of the bare chip IC is 200% or less of the volume of the solder disposed on the corresponding electrode of the mounting substrate. Electronic component mounting board. 4. The area according to claim 1, wherein an area of the electrode on the mounting substrate where solder adhesion is possible is 150% or more and 400% or less of an area of the electrode corresponding to the bare chip IC. Electronic component mounting board. The volume of the gold electrode disposed on the electrode of the bare chip IC is 80% or more and 140% or less of the volume of the solder disposed on the corresponding electrode of the mounting substrate. 4. The electronic component mounting board according to any one of 4 above. A sensor device comprising an input unit including a power input and an output unit including a detection circuit, wherein the input unit and the output unit are configured by electronic components including a discrete surface mount device, a package IC, and a bare chip IC,
The discrete surface mount device, package IC and bare chip IC are mounted in a mixed manner by connecting to the main surface of the mounting substrate with solder,
The bare chip IC is mounted on the mounting substrate by flip chip mounting,
The bare chip IC is connected to the mounting substrate by connecting a solder provided on the electrode provided on the mounting substrate and a gold electrode provided on the electrode provided on the bare chip IC. And
The area of the electrode on the mounting substrate where the solder can be attached is 100% or more and 500% or less of the area of the electrode corresponding to the bare chip IC,
The sensor device, wherein the volume of the gold electrode disposed on the electrode of the bare chip IC is 70% or more of the volume of the solder disposed on the corresponding electrode of the mounting substrate. An electronic component mounting substrate manufacturing method, wherein an electronic component including a bare chip IC is connected to a main surface of a mounting substrate by soldering and mounted,
The area of the electrode on the mounting substrate where solder can be attached is 100% or more and 500% or less of the area of the corresponding electrode of the bare chip IC, and the gold disposed on the electrode of the bare chip IC Preparing a bare chip IC and a mounting substrate such that the volume of the electrode is 70% or more of the volume of solder disposed on the corresponding electrode of the mounting substrate;
The bare chip IC is flip-chip mounted on the mounting substrate by connecting the solder disposed on the electrode provided on the mounting substrate and the gold electrode disposed on the electrode provided on the bare chip IC. A method for manufacturing an electronic component mounting board, comprising: a mounting step . An input unit including a power input and an output unit including a detection circuit, wherein the input unit and the output unit are configured by electronic components including a discrete surface mount device, a package IC, and a bare chip IC, and the discrete surface mount device and the package IC And a manufacturing method of a sensor device in which the bare chip IC is connected to the main surface of the mounting substrate by soldering and mounted in a mixed manner,
The area of the electrode on the mounting substrate where solder can be attached is 100% or more and 500% or less of the area of the corresponding electrode of the bare chip IC, and the gold disposed on the electrode of the bare chip IC Preparing a bare chip IC and a mounting substrate such that the volume of the electrode is 70% or more of the volume of solder disposed on the corresponding electrode of the mounting substrate;
The bare chip IC is flip-chip mounted on the mounting substrate by connecting solder disposed on the electrode provided on the mounting substrate and a gold electrode disposed on the electrode provided on the bare chip IC. A method for manufacturing a sensor device, including a step of mounting . An input unit including a power supply input and an output unit including a detection circuit, wherein the input unit and the output unit are configured by electronic components including a discrete surface mount device, a package IC, and a bare chip IC;
The discrete surface mounting device, the package IC and the bare chip IC are connected to the main surface of the mounting substrate with solder and mounted in a mixed manner,
An oscillation circuit for forming magnetic flux;
The sensor device is a proximity sensor for detecting a change in the magnetic flux due to the metal object to be detected, sensor equipment.

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