JP4377605B2 - Exposure method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical element forming substrate on which an optical element such as a black matrix layer of an RGB color filter is exposed and formed, and in particular, an exposure method for exposing and forming a plurality of optical elements on a substrate, and a plurality of optical elements The present invention relates to an optical element forming substrate on which elements are exposed.
[0002]
[Prior art]
With the activation of the distribution of liquid crystal optical elements (LCD), plasma displays, etc., it is strongly desired to accurately produce optical elements such as black matrix layers of color filters used in LCDs. For this reason, after exposing and forming a plurality of optical elements on a single substrate, the substrate on which a plurality of optical elements are formed remains (or cut into individual optical elements). A technique for improving productivity by attaching color filters is widely used.
[0003]
When optical elements are produced by such a method, it is important to accurately dispose each optical element with respect to the substrate in order to reliably obtain an accurate optical element. For this purpose, it is important to accurately grasp the relative positions between the optical elements exposed and formed on the substrate. In particular, when a plurality of optical elements are formed on a single substrate by a plurality of shots (multiple times) of exposure, the relative distance and the relative position are likely to vary between the optical elements formed by each exposure. For this reason, it is extremely important to accurately grasp the positional relationship between the optical elements exposed and formed on the substrate. Then, by grasping the relative position between each optical element, the relative position between the substrate and the exposure apparatus is adjusted to adjust the exposure formation position of the optical element with respect to the substrate, and the cutting position of each optical element is adjusted. And the individual optical elements can be more accurately arranged on the substrate. Thereby, a highly accurate optical element can be provided reliably.
[0004]
By the way, as a technique for detecting the relative position relationship between the optical elements formed on the substrate, for example, a technique as shown in FIG. 10 is widely used. This is a substrate 65 on which a plurality of optical elements 75a and 75b are formed, and vernier patterns 85a and 85b having a predetermined scale are exposed and formed so as to correspond to the optical elements 75a and 75b, as shown in FIG. A new substrate 65 is used. The so-called “vernier caliper principle” is used to detect the positional relationship (positional deviation) between the corresponding optical elements 75a and 75b by the measurer visually comparing the vernier patterns 85a and 85b. It is a technique to do. In the substrate 65 shown in FIG. 10, the first optical element 75a and the first vernier pattern 85a are formed by exposure by the first exposure shot, and the second optical element 75b and the second vernier pattern are formed by the second exposure shot. 85b is formed by exposure.
[0005]
[Problems to be solved by the invention]
In order to detect the positional relationship between a plurality of optical elements formed on a single substrate, it is possible to use a detection method using the above-mentioned caliper principle. However, when such a detection method using the caliper principle is used, the detection accuracy depends on the vernier pattern and the measurement staff, and it is difficult to stably provide a highly accurate detection result.
[0006]
That is, the predetermined scales of the vernier pattern formed on the substrate in order to use the caliper principle are generally provided at intervals of about 1 μm, and it is difficult to provide the predetermined scales at intervals smaller than that. This is because the pattern resolving power by the photosensitive material and the exposure apparatus has a certain limit, and it is very difficult to visually measure a deviation of a unit smaller than 1 μm. Therefore, when detecting the positional relationship between the optical elements based on such a vernier pattern, the positional relationship between the optical elements can be detected only with an accuracy of about 1 μm, and the finer than that. The positional relationship between the optical elements cannot be detected with accuracy.
[0007]
In addition, since the detection method using the caliper principle involves a very complicated technique, it is difficult to realize the detection method by an automatic detection system including an image processing apparatus and the like. Thus, the detection method is realized. Therefore, in the detection method using the caliper principle, the detection accuracy varies depending on each measurer, and the detection accuracy deteriorates due to fatigue of the measurer. Therefore, the positional relationship between the optical elements can be determined with a certain accuracy. It was difficult to detect.
[0008]
The present invention has been made in consideration of the above-described matters, and is a substrate on which a plurality of optical elements are formed by exposure of a plurality of shots, and the positional relationship between each optical element is obtained accurately and stably. It is an object of the present invention to provide a substrate that can be used and an exposure method that realizes such a substrate.
[0009]
[Means for Solving the Problems]
The present invention forms a plurality of optical elements and a position indicating pattern corresponding to each optical element on the substrate by performing a plurality of exposures on a substrate with a photosensitive material arranged at a predetermined exposure position. An exposure method, a step of placing a substrate with a photosensitive material at a first exposure position, exposing the substrate with a photosensitive material arranged at the first exposure position, a first optical element, and a Y direction A first position indicating pattern having a first X direction position indicating portion extending in the direction X and a first Y direction position indicating portion extending in the X direction, which is disposed at a predetermined position with respect to the first optical element. A first exposure step for forming the first optical element, a step for placing the substrate with the photosensitive material on which the first optical element and the first position indicating pattern are formed at the second exposure position, and a second exposure position. Expose the substrate with photosensitive material placed in A second position indicating pattern having a second optical element, a second X-direction position indicating portion extending in the Y direction, and a second Y-direction position indicating portion extending in the X direction, which is at a predetermined position with respect to the second optical element A second exposure process for forming a second position instruction pattern arranged to correspond to the first position instruction pattern, and a first X-direction position instruction section and a second X-direction position instruction section. The distance indicates the relative position in the X direction between the first optical element and the second optical element, and the distance between the first Y direction position indicating unit and the second Y direction position indicating unit is the same as that of the first optical element. An exposure method characterized by showing a relative position in the Y direction with respect to the second optical element.
[0010]
According to the present invention, a position where the relative positions of the first optical element and the second optical element can be detected based on the distance between the first position instruction pattern and the second position instruction pattern. The instruction pattern and the optical element can be exposed to the substrate with the photosensitive material.
[0011]
The optical element of the present invention refers to an element formed first by exposure, and is a concept including, for example, a black matrix element constituting a color filter and the like.
[0012]
In this case, the first position instruction pattern is formed on the substrate in a state where the first X-direction position instruction section and the first Y-direction position instruction section are combined, and the second position instruction pattern is the second X-direction position instruction section. It is preferable that the second Y-direction position indicating unit is formed on the substrate in a coupled state. In particular, the first position indication pattern is formed on the substrate in a state where the first X direction position indication portion and the first Y direction position indication portion are combined in an L shape, and the second position indication pattern is the second X direction position position. It is preferable that the indicator and the second Y-direction position indicator are formed on the substrate in an L-shaped state. The L-shape includes an L-shape that is vertically inverted, an L-shape that is inverted horizontally, and an L-shape having a predetermined inclination in addition to the normal L-shape. It is also possible to form the first position indication pattern and / or the second position indication pattern on the substrate in a state of being combined in a cross shape or a T shape.
[0013]
Further, it is preferable that the first position instruction pattern and the second position instruction pattern corresponding to the first position instruction pattern are formed on the substrate so as to be symmetrically arranged with respect to each other. In such a case, it is easy to compare the first position instruction pattern and the second position instruction pattern corresponding to the first position instruction pattern. Here, the symmetry includes various kinds of symmetry such as point symmetry and line symmetry.
[0014]
In the first exposure step, a plurality of first position indication patterns are formed on the substrate, and in the second exposure step, the second position indication pattern is made to correspond to each first position indication pattern. It is preferable to form a plurality of substrates on the substrate. In this case, a plurality of combinations of the first position instruction pattern and the second position instruction pattern corresponding to each other are formed, and the optical element corresponding to the first position instruction pattern and the first combination are formed based on the plurality of combinations. Thus, it is possible to provide a substrate capable of detecting the relative positional relationship in the rotation direction with the optical element corresponding to the position indicating pattern 2.
[0015]
The present invention is an optical element forming substrate on which a plurality of optical elements and a position indicating pattern corresponding to each optical element are formed by exposure, wherein the first optical element and the second optical element are formed. A first position indicating pattern having an element formation region, a first X-direction position indicating portion extending in the Y direction, and a first Y-direction position indicating portion extending in the X direction, the predetermined position with respect to the first optical element A second position indicating pattern having a first position indicating pattern disposed in the second X direction position indicating portion extending in the Y direction and a second Y direction position indicating portion extending in the X direction. A first position direction pattern forming region in which a second position instruction pattern arranged to correspond to the first position instruction pattern at a predetermined position with respect to the element is formed, and a first X direction position instruction Department and The distance between the 2X direction position indicating unit indicates the relative position in the X direction between the first optical element and the second optical element, and the distance between the first Y direction position indicating unit and the second Y direction position indicating unit is The optical element forming substrate is characterized by showing a relative position in the Y direction between the first optical element and the second optical element.
[0016]
In this case, the first position instruction pattern is formed in the instruction pattern formation region in a state where the first X direction position instruction section and the first Y direction position instruction section are combined, and the second position instruction pattern is the second X direction position position. It is preferable that the pointing portion and the second Y-direction position pointing portion are formed in the position pointing pattern forming region in a coupled state. In particular, the first position instruction pattern is formed in the position instruction pattern formation region in a state where the first X direction position instruction section and the first Y direction position instruction section are combined in an L shape, and the second position instruction pattern is: It is preferable that the second X-direction position indicating portion and the second Y-direction position indicating portion are formed in the position indicating pattern forming region in a state of being joined in an L shape. It is also possible to form the first position indication pattern and / or the second position indication pattern on the substrate in a state of being combined in a cross shape or a T shape.
[0017]
Further, the first position instruction pattern and the second position instruction pattern corresponding to the first position instruction pattern are formed in the position instruction pattern forming region so as to have a symmetrical arrangement with each other. Is preferred. Here, the symmetry includes various kinds of symmetry such as point symmetry and line symmetry.
[0018]
In addition, it is preferable that a plurality of first position instruction patterns are formed in the position instruction pattern formation region, and a plurality of second position instruction patterns are formed so as to correspond to the first position instruction patterns. .
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a case will be described in which each black matrix element (BM element) 70 constituting the RGB color filter is applied as an optical element of the present invention.
[0020]
A line for producing a color filter (color filter production line 1) (not shown) is generally installed so as to extend linearly on a horizontal installation surface and a plurality of substrate loading / unloading positions (substrate loading position 3 and substrate). A core device 7 having an unloading position 5) and a processing line connected to each substrate loading / unloading position are provided (see FIG. 1). In each processing line, various types of processing necessary for manufacturing a desired color filter are performed on the glass substrate 65 conveyed by the core device 7, for example, as shown in FIG. Such a black matrix element formation processing line (BM element formation processing line) 9 can be adopted as one of the processing lines.
[0021]
The BM element formation processing line 9 shown in FIG. 1 is a processing line for forming BM elements on the glass substrate 65, and is connected to the substrate loading / unloading position of the core device 7. Various devices constituting the BM element formation processing line 9 are arranged in an inverted U shape. Specifically, the cleaning mechanism 11, the photosensitive material coating device 13, the photosensitive material drying device 15, the exposure device 17, and the development. The device 19, the inspection mechanism 21, and the oven mechanism 23 are sequentially arranged from the substrate carry-in position 3 to the substrate carry-out position 5 of the core device 7.
[0022]
The cleaning mechanism 11 is a mechanism for cleaning the glass substrate 65 carried in from the substrate carry-in position 3 of the core device 7 and is configured to include the dehydration IR 11a in the present embodiment.
[0023]
The photosensitive material coating device 13 includes a cold plate (CP) 13a, and applies a predetermined photosensitive material (in this embodiment, a photosensitive material for a BM element) to a predetermined portion of the substrate.
[0024]
The photosensitive material drying device 15 includes a cold plate (CP) 15a and a hot plate (HP) 15b, and dries the photosensitive material applied to the glass substrate 65 and fixes it to the glass substrate 65. It has become.
[0025]
The exposure device 17 exposes the photosensitive material applied to the glass substrate 65 to form a plurality of BM elements 70 and a plurality of position indicating patterns 80 corresponding to the BM elements 70 on the glass substrate 65. It has become. Such an exposure apparatus 17 has a configuration as shown in FIG. 2, for example. That is, the exposure device 17 includes an exposure stage 25 on which the glass substrate 65 sent from the photosensitive material drying device 15 is placed, a light source 27 installed above the exposure stage 25, a light source 27, and the exposure stage 25. And a mask 29 that transmits only light at a predetermined position among the light emitted from the light source 27. The exposure stage 25 has a mechanism that can move vertically and horizontally, whereas the light source 27 and the mask 29 are provided in a fixed state.
[0026]
The light source 27 is provided as shown in FIG. 2 and has an ultrahigh pressure mercury lamp 31, a parabolic mirror 33, a cold mirror 34, a shutter 35, an integrator lens 37, and a spherical mirror 39. In the light source 27 having such a configuration, light emitted from the ultra-high pressure mercury lamp 31 is vertically incident and irradiated on the mask 29 and the glass substrate 65 disposed at the exposure position after being adjusted by various devices of the light source 27. It has the structure which does.
[0027]
On the other hand, the mask 29 is fixed via a mask stage 30 and, as shown in FIG. 3, two (plural) black matrix element forming light transmitting portions (BM elements) provided in the horizontal direction (X direction). Forming light transmitting portions) 41, and four (plural) L-shaped position indicating pattern forming light transmitting portions 43 disposed at predetermined positions with respect to each BM element forming light transmitting portion 41. Yes. In the present embodiment, the mask 29 is provided so that two position indicating pattern forming light transmitting portions 43 correspond to one BM element forming light transmitting portion 41, and each position indicating pattern forming light transmitting portion 43 is provided. Are formed on the upper side and the lower side of each BM element forming light transmitting portion 41 (see FIG. 3). The position indicating pattern forming light transmitting portions 43 formed on the upper side and the lower side of each BM element forming light transmitting portion 41 are provided so that the positions in the horizontal direction (X direction) are substantially the same, and the vertical direction ( The L-shaped shapes in the (Y direction) are provided so as to be opposite to each other (so as to be point-symmetric). When such a mask 29 is used, two BMs are emitted by light from the light source 27 that has passed through the two BM element forming light transmitting portions 41 and the four position indicating pattern forming light transmitting portions 43 in exposure per shot. The element 70 and the four position indicating patterns 80 corresponding to each BM element 70 are formed by exposure on the glass substrate 65. In the exposure apparatus 17 of the present embodiment, four BM elements 70 and eight position indicating patterns 80 corresponding to each BM element 70 are finally formed on one glass substrate 65 by an exposure method described later. Are formed by exposure.
[0028]
The developing device 19 develops the BM element 70 and the position indicating pattern 80 that are exposed and formed on the glass substrate 65 with a predetermined developer. Accordingly, as shown in FIG. 4, the optical element forming area in which the four BM elements 70 arranged in the vertical and horizontal directions 2 × 2 are formed, and the position indication pattern formation in which each position indication pattern 80 is formed. As a result, a glass substrate 65 (an optical element forming substrate) having the region 81 is provided.
[0029]
The inspection mechanism 21 has a configuration as shown in FIG. 5, and includes an inspection stage 45 for placing the sent substrate in the center, a stage controller 47 for adjusting the position of the inspection inspection stage 45, and an inspection inspection. An image acquisition mechanism 49 for acquiring, as image information, the BM element formation region 71 and the position indicating pattern formation region 81 formed on the glass substrate 65 placed on the stage 45, and the image information acquired by the image acquisition mechanism 49 An image processing device 51 for performing the image processing, a stage controller 47, an image acquisition mechanism 49, and an inspection control unit 53 for controlling the image processing device 51.
[0030]
The image acquisition mechanism 49 includes a lens 57, a CCD camera 55 that acquires an image via the lens 57, an AF unit 59 connected to the lens 57, a reflective illuminator 61, and a transmissive illuminator 63. The image information of the BM element forming region 71 and the position indicating pattern forming region 81 of the glass substrate 65 placed on the inspection inspection stage 45 whose position has been adjusted is acquired by the CCD camera 55, and the image information is acquired by the CCD camera 55. To the image processing apparatus 51.
[0031]
The image processing apparatus 51 uses the detection method described later to detect the BM element formation area 71 based on the image information of each BM element formation area 71 and the position indication pattern formation area 81 sent from the image acquisition mechanism 49 (CCD camera 55). The positional relationship between each other is detected.
[0032]
The oven mechanism 23 applies heat to the glass substrate 65 to dry the glass substrate 65, and fixes the developed BM element 70 and the position indicating pattern 80 on the glass substrate 65.
[0033]
Next, the operation of the present embodiment will be described.
[0034]
In the above-described color filter production line 1, the glass substrate 65 conveyed by the core device 7 is carried into each processing line from each substrate carry-in position 3 of the core device 7, and various processes are performed on each processing line. . The glass substrate 65 is unloaded from the processing line to the substrate unloading position 5 of the core apparatus 7 after being subjected to various processes, and is further sent to the subsequent stage by the core apparatus 7. A series of processing for such a glass substrate 65 is performed in each processing line disposed from the upstream side to the downstream side of the core device 7, whereby a plurality of desired RGB color filters are formed on the glass substrate 65. The Rukoto.
[0035]
By the way, in such a processing line, in the BM element formation processing line 9 shown in FIG. 1, the BM element 70 is formed on the glass substrate 65 as follows.
[0036]
First, the glass substrate 65 is sent from the substrate carry-in position 3 of the core device 7 to the cleaning mechanism 11 of the BM element formation processing line 9 and subjected to predetermined cleaning including dehydration processing by the dehydration IR 11a. As a result, the glass substrate 65 is cleaned, and a clean state in which impurities such as dust are not attached to the glass substrate 65 is ensured.
[0037]
Then, the cleaned glass substrate 65 is sent from the cleaning mechanism 11 to the photosensitive material coating device 13, and a predetermined photosensitive material is applied in the photosensitive material coating device 13. At this time, the predetermined photosensitive material is applied to a predetermined location on the glass substrate 65 corresponding to the position of the BM element 70 and the position indicating pattern 80 that are to be exposed and formed in an exposure process described later. . In the present embodiment, at least four BM elements 70 can be exposed and formed at predetermined positions of 2 × 2 in the vertical and horizontal directions, and eight position indicating patterns 80 are provided on the upper and lower sides of each BM element 70. A photosensitive material is applied to a predetermined location on the glass substrate 65 so that exposure can be formed at a predetermined position (see FIG. 4).
[0038]
Then, the glass substrate 65 coated with a predetermined photosensitive material is sent from the photosensitive material coating device 13 to the photosensitive material drying device 15, and the photosensitive material applied in the photosensitive material drying device 15 is dried. Thereby, the photosensitive material applied to the glass substrate 65 can be fixed to the glass substrate 65.
[0039]
The glass substrate 65 on which the applied photosensitive material has been dried is sent from the photosensitive material drying device 15 to the exposure device 17, and a plurality of shots (two shots) are exposed (exposure process) in the exposure device 17. . As a result, a plurality (four) of BM elements 70 and a plurality (eight) of position indicating patterns 80 corresponding to each BM element 70 are formed on the glass substrate 65 by exposure. Specifically, the glass substrate 65 is exposed according to the following exposure method.
[0040]
First, a glass substrate 65 (a substrate with a photosensitive material) on which a photosensitive material is applied is placed at the center of the exposure stage 25 and is disposed at a predetermined position (first exposure position) together with the exposure stage 25. (STEP A1 in FIG. 6). The first exposure position in the present embodiment is that two BM elements 70 (see FIG. 4) arranged on the upper side in the Y direction among the 2 × 2 vertical and horizontal BM elements 70 that are to be formed on the glass substrate 65. , And a position at which exposure is formed by light from the light source 27 that has passed through the BM element formation light transmitting portion 41 of the mask 29.
[0041]
And the glass substrate 65 arrange | positioned in the 1st exposure position is exposed with the light from the light source 27 (1st exposure process) (STEP A2). At this time, since the light emitted from the light source 27 is applied to the glass substrate 65 through the mask 29, the light that has passed through the BM element forming light transmitting portion 41 and the position indicating pattern forming light transmitting portion 43 of the mask 29. Only the glass substrate 65 is irradiated, and other light is blocked by the mask 29. Accordingly, the light that has passed through the two BM elements 70 (first BM element 70a) exposed by the light that has passed through the BM element forming light transmitting portion 41 of the mask 29 and the position indicating pattern forming light transmitting portion 43 of the mask 29. Four position instruction patterns 80 (first position instruction patterns 80a) exposed by the above are formed on the glass substrate 65. The first BM element 70a formed by exposure in the first exposure step is two BM elements arranged on the upper side in the vertical direction among the 2 × 2 BM elements 70 to be formed on the glass substrate 65. On the other hand, the four first position indicating patterns 80a formed in the first exposure process are formed on the upper side and the lower side of each of these BM elements 70 (see FIG. 4).
[0042]
The first position indicating pattern 80 a formed by exposure on the glass substrate 65 has a shape corresponding to the shape of the position indicating pattern forming light transmitting portion 43 of the mask 29. That is, each first position instruction pattern 80a includes a first X-direction position instruction portion 83a extending in the Y direction and a first Y-direction position instruction portion 83b extending in the X direction. The first Y-direction position indicating part 83b is exposed and formed on the glass substrate 65 in an L-shaped state. In addition, each of these first position indicating patterns 80a formed in the exposure process is arranged at a predetermined position with respect to the first BM element 70a. Further, the position indicating patterns 80 formed on the upper side and the lower side of each BM element 70 have an arrangement in which the upper and lower sides are inverted in a point-symmetric manner (see FIG. 4).
[0043]
Then, the glass substrate 65 with the BM photosensitive material on which the first BM element 70a and the first position indicating pattern 80a are formed is moved together with the exposure stage 25, and the second exposure is performed from the first exposure position. Placed in position (STEP A3). The second exposure position in the present embodiment is the two BM elements 70 arranged on the lower side in the Y direction among the 2 × 2 vertical and horizontal BM elements 70 scheduled to be formed on the glass substrate 65 (see FIG. 4). Indicates a position at which exposure is formed by light from the light source 27 that has passed through the BM element formation light transmitting portion 41 of the mask 29.
[0044]
And the glass substrate 65 arrange | positioned in a 2nd exposure position is exposed with the light from the light source 27 (2nd exposure process) (STEP A4). In the second exposure step, similarly to the first exposure step, the light from the light source 27 that enters the mask 29 and the glass substrate 65 substantially perpendicularly is irradiated to the glass substrate 65 through the mask 29, and Only the light that has passed through the BM element forming light transmitting portion 41 and the position indicating pattern forming light transmitting portion 43 of the mask 29 is irradiated onto the glass substrate 65. Accordingly, the light that has passed through the two BM elements 70 (second BM elements 70b) exposed by the light that has passed through the BM element forming light transmitting portion 41 of the mask 29 and the position indicating pattern forming light transmitting portion 43 of the mask 29. The four position indicating patterns 80 (second position indicating patterns 80b) exposed by the above are formed on the glass substrate 65. The second BM element 70b formed by exposure in the second exposure step is two BM elements arranged on the lower side in the vertical direction among the 2 * 2 vertical and horizontal BM elements 70 that are to be formed on the glass substrate 65. On the other hand, four second position indicating patterns 80b corresponding to the element 70 and formed in the second exposure step are formed on the upper side and the lower side of each BM element 70 (see FIG. 4).
[0045]
The second position indicating pattern 80b formed by exposure on the glass substrate 65 also has a shape corresponding to the shape of the position indicating pattern forming light transmitting portion 43 of the mask 29. That is, each second position indication pattern 80b has a second X-direction position indication portion 85a extending in the Y direction and a second Y-direction position indication portion 85b extending in the X direction, and the second X-direction position indication portion 85a and the second Y The glass substrate 65 is exposed and formed in a state where the direction position indicating portion 85b is coupled in an L shape. In addition, each of these second position indicating patterns 80b formed in the exposure process is disposed at a predetermined position with respect to the second BM element 70b. Further, the position indicating patterns 80 formed on the upper side and the lower side of each BM element 70 have an arrangement in which the upper and lower sides are inverted in a point-symmetric manner (see FIG. 4). The second position indicating pattern 80b formed on the upper side of the second BM element 70b and the first position indicating pattern 80a formed on the lower side of the first BM element 70a correspond to each other. Each position indicating pattern 80 is formed so as to be symmetrical (point symmetry) (see FIG. 4).
[0046]
Then, after the above-described second exposure step is completed, the exposure stage 25 is moved, and the glass substrate 65 placed on the exposure stage 25 is moved from the exposure device 17 to the development device installed downstream. 19 (STEP A5).
[0047]
The glass substrate 65 sent to the developing device 19 uses a predetermined developing solution in the developing device 19, and the BM element 70 and the position indicating pattern 80 formed by exposure in the exposure device 17 are developed. In the present embodiment, the BM elements 70 formed in a 2 × 2 arrangement on the glass substrate 65 and the position indicating pattern 80 corresponding to each BM element 70 are developed, and the glass substrate 65 as shown in FIG. 4 is developed. An optical element forming substrate can be obtained.
[0048]
The glass substrate 65 obtained through the exposure and development as described above is a glass substrate 65 on which four (plural) BM elements 70 and position indicating patterns 80 corresponding to the BM elements 70 are formed. BM element formation region 71 (optical element formation region) in which first BM element 70a and second BM element 70b (first optical element and second optical element) are formed, and position indicating pattern 80 (first A position instruction pattern forming region 81 in which one position instruction pattern 80a and a second position instruction pattern 80b) are formed. Since the first position instruction pattern 80a and the second position instruction pattern 80b are formed at predetermined positions with respect to the corresponding BM element 70, they are always arranged at a predetermined distance from the corresponding BM element 70. Has been. Therefore, the distance between the first X direction position indicating unit 83a and the second X direction position indicating unit 85a indicates the relative position in the X direction between the first BM element 70a and the second BM element 70b, and the first Y direction position. The distance between the instruction unit 83b and the second Y-direction position instruction unit 85b indicates the relative position in the Y direction between the first BM element 70a and the second BM element 70b. Furthermore, in the present embodiment, a plurality of combinations 90 of the position indication patterns 80 constituted by the first position indication pattern 80a and the second position indication pattern 80b corresponding to each other are X with respect to the glass substrate 65. The relative positional relationship between these combinations 90 indicates the relative position (θ) in the rotational direction between the first BM element 70a and the second BM element 70b. That is, when the first BM element 70a and the second BM element 70b are arranged at ideal positions and there is no positional deviation in the rotational direction, the X-direction between the combinations 90 of these position indicating patterns 80 Misalignment in the Y direction does not occur. On the other hand, when there is a positional deviation in the rotational direction between the first BM element 70a and the second BM element 70b, there is a deviation in the X direction and Y direction between the combinations 90 of these position indicating patterns 80. This will cause a deviation. Therefore, based on the positional relationship (position shift in the X direction and Y direction) between the combinations 90 of these position instruction patterns 80, the relative position in the rotational direction between the first BM element 70a and the second BM element 70b. (Θ) can be detected.
[0049]
Then, the glass substrate 65 on which the BM element 70 and the position indicating pattern 80 are exposed and developed is sent from the developing device 19 to the inspection mechanism 21, and the positional relationship of the BM elements 70 formed on the glass substrate 65 is detected. Is done. Specifically, the positional relationship between the BM elements 70 formed on the glass substrate 65 is detected according to the following detection method.
[0050]
First, the glass substrate 65 is placed on the inspection inspection stage 45 of the inspection mechanism 21 shown in FIG. Then, the position of the inspection / inspection stage 45 is adjusted by the stage controller 47, and the glass substrate 65 placed on the inspection / inspection stage 45 is arranged at a predetermined inspection position.
[0051]
Then, the BM element forming region 71 and the position indicating pattern forming region 81 of the glass substrate 65 arranged at the inspection position are acquired as image information by the image acquiring mechanism 49 (CCD camera 55). Then, the image information is sent from the image acquisition mechanism 49 (CCD camera 55) to the image processing device 51.
[0052]
The image processing device 51 detects the relative positional relationship between the BM elements 70 formed on the glass substrate 65 based on the image information sent from the image acquisition mechanism 49. In the present embodiment, as described above, the relative positional relationship between the first position indicating pattern 80a and the second position indicating pattern 80b is the relative positional relationship between the first BM element 70a and the second BM element 70b. Will be shown. That is, as described above, the relative positional relationship between the first BM element 70a and the second BM element 70b actually formed in the BM element formation region 71 of the glass substrate 65 (X direction, Y direction, θ direction). Is detected based on the relative positional relationship of the position indicating pattern 80 formed in the position indicating pattern forming region 81 of the glass substrate 65. On the other hand, when each BM element 70 is formed at an ideal position initially planned in the BM element formation region 71, each position indicating pattern 80 and the BM element 70 corresponding to each position indicating pattern 80 are This interval is kept constant. The image processing apparatus 51 of the present embodiment uses such a relationship to detect the relative positional relationship between the BM elements 70 according to the following method.
[0053]
First, the image processing apparatus 51 uses the first position instruction pattern 80a and the second position instruction pattern 80b formed to correspond to each other based on the image information sent from the image acquisition mechanism 49. An actual distance (interval) between the first X-direction position instruction unit 83a and the second X-direction position instruction unit 85a is obtained by image processing. In the image processing apparatus 51, the actual distance between the first X-direction position instruction unit 83a and the second X-direction position instruction unit 85a obtained by the image processing and each BM element 70 are formed at ideal positions. The relative distance between the first BM element 70a and the second BM element 70b is compared with the distance between the first X direction position indicating unit 83a and the second X direction position indicating unit 85a. Ask. Specifically, based on the difference ΔX between the actual interval and the ideal interval between the first X direction position indicating unit 83a and the second X direction position indicating unit 85a, The relative position (displacement with respect to the ideal state) in the X direction with respect to the position indicating pattern 80b is obtained. Then, the image processing apparatus 51, based on the relative position in the X direction between the first position instruction pattern 80a and the second position instruction pattern 80b obtained in this way, the first corresponding to each position instruction pattern 80. The relative positional relationship in the X direction between the BM element 70a and the second BM element 70b is obtained.
[0054]
Similarly, the image processing apparatus 51 includes a first position instruction pattern 80a and a second position instruction pattern 80b that are formed to correspond to each other based on the image information sent from the image acquisition mechanism 49. The actual distance between the first Y direction position indicating unit 83b and the second Y direction position indicating unit 85b is obtained by image processing. The actual distance in the Y direction between the first Y direction position indicating unit 83b and the second Y direction position indicating unit 85b and the ideal distance between the two when the BM elements 70 are formed at ideal positions, To obtain the relative position in the Y direction between the first BM element 70a and the second BM element 70b. Specifically, based on the difference ΔY between the actual interval and the ideal interval between the first Y direction position indicating unit 83b and the second Y direction position indicating unit 85b, the first position indicating pattern 80a and the second position indicating pattern 80a The relative position in the Y direction with respect to the position indicating pattern 80b (displacement with respect to the ideal state) is detected. The image processing apparatus 51 detects the first BM element corresponding to each position instruction pattern 80 based on the relative position in the Y direction between the first position instruction pattern 80a and the second position instruction pattern 80b thus obtained. The relative positional relationship in the Y direction between 70a and the second BM element 70b is obtained.
[0055]
Further, the image processing apparatus 51 compares the first BM element 70a with the first BM element 70a by comparing a plurality of combinations 90 constituted by the first position instruction pattern 80a and the second position instruction pattern 80b corresponding to each other. The relative position (θ) in the rotational direction with respect to the second BM element 70b is detected. In the present embodiment, for example, as shown in FIG. 4, two combinations 90 of the first position instruction pattern 80 a and the second position instruction pattern 80 b corresponding to each other provided in the X direction are compared. Is done. That is, among these combinations 90, the relative position (position shift = ΔX′1) in the X direction between the first BM element 70a and the second BM element 70b, which is obtained based on one combination 90, and the Y direction. Relative position (position deviation = ΔY′1), relative position in the X direction between the first BM element 70a and the second BM element 70b obtained based on the other combination 90 (position deviation = ΔX′2), and The relative position in the Y direction (position shift = ΔY′2) is compared. In the case where the first BM element 70a and the second BM element 70b are formed at ideal positions that were originally planned, there is no deviation in the rotational direction between them, and ΔX′1 = ΔX The relationship “2, ΔY′1 = ΔY′2” is established. On the other hand, if there is a rotational displacement between the two, the relationship ΔX′1 ≠ ΔX′2 and ΔY′1 ≠ ΔY′2 is established. Based on such a relationship, the image processing apparatus 51 determines the difference between ΔX′1 and ΔX′2 (ΔX′3 = ΔX), which is a deviation in the X direction between the combinations 90 of the corresponding position indicating patterns 80. '1-ΔX'2) and the difference (ΔY'3 = ΔY'1-ΔY'2) between ΔY′1 and ΔY′2, which is a deviation in the Y direction, is obtained. Then, the image processing apparatus 51 determines whether the first BM element 70a and the second BM element 70b are based on the deviation (ΔX′3, ΔY′3) in the X direction and the Y direction obtained in this way. The relative position (θ) in the rotation direction is detected.
[0056]
Then, the glass substrate 65 in which the relative positions (relative positions in the X direction, Y direction, and θ direction) between the BM elements 70 are detected as described above is sent from the inspection mechanism 21 to the oven mechanism 23. The glass substrate 65 sent to the oven mechanism 23 is heated, and the developed BM elements 70 and the position indicating pattern 80 of the glass substrate 65 are dried and fixed to the glass substrate 65.
[0057]
Thereafter, the glass substrate 65 is unloaded from the oven mechanism 23 to the substrate unloading position 5 of the core device 7 and sent to the subsequent stage of the color filter production line 1.
[0058]
As described above, according to the exposure method employed in the present embodiment, a plurality (four) of BM elements 70 are reliably formed at predetermined positions in the BM element formation region 71 on the glass substrate 65. In addition, the position indicating pattern 80 suggesting the positional relationship between the BM elements 70 can be reliably formed at a predetermined position of the position indicating pattern forming region 81 on the glass substrate 65. And according to such a glass substrate 65, based on the positional relationship between each position indication pattern 80, the positional relationship and positional deviation between each BM element 70 formed in the glass substrate 65 are detected reliably. be able to.
[0059]
Therefore, in consideration of the positional relationship between the BM elements 70 detected as described above, for example, a plurality of BM elements 70 formed on the glass substrate 65 are separated into individual BM elements 70 (cutting or the like). It is possible to finely adjust the exposure position of the glass substrate 65 in each exposure step. Therefore, by using such an exposure method and the glass substrate 65 (optical element forming substrate), not only can a large number of BM elements 70 (optical elements) be efficiently manufactured, but also have a desired shape and size. The BM element 70 can be manufactured with high accuracy. In particular, according to the position indicating pattern 80 as in the present embodiment, it is possible to detect even a very small position shift, for example, to detect a position shift between the BM elements 70 in units of 1 μm or less. Therefore, a highly accurate BM element can be manufactured.
[0060]
Also, the method for detecting the positional relationship between the BM elements 70 based on the position indicating pattern 80 as in the present embodiment can be realized relatively easily by using an image processing technique. It is possible to construct a system that automatically performs a detection method using processing technology. Therefore, according to the present embodiment, a large number of each BM element can be quickly and accurately compared with the case where the positional relationship between the BM elements 70 formed on the substrate is detected based on the visual observation of the measurer. The positional relationship between the 70 can be detected.
[0061]
In addition, since each position instruction pattern 80 includes the X direction position instruction parts 83a and 85a and the Y direction position instruction parts 83b and 85b, not only one of the X direction and the Y direction but also both directions are The positional relationship between the position indicating patterns 80 can be obtained, and the positional relationship between the BM elements 70 corresponding to the position indicating patterns 80 can be detected. Further, by forming a plurality of first position indicating patterns 80a and corresponding second position indicating patterns 80b on the glass substrate 65, the first position indicating pattern 80a and the second position indicating pattern 80b are arranged between the first BM element 70a and the second BM element 70b. The positional relationship in the rotation direction (θ direction) can also be detected. Therefore, according to the glass substrate 65 (optical element forming substrate) of the present invention, the positional relationship between the first BM element 70a and the second BM element 70b can be detected more accurately and in detail.
[0062]
Further, since each position instruction pattern 80 is formed on the glass substrate 65 in a state where the X direction position instruction parts 83a and 85a and the Y direction position instruction parts 83b and 85b are combined, an area for forming the position instruction pattern 80 is provided. Can be reduced to a compact one. In particular, by combining the X-direction position indicating portions 83a and 85a and the Y-direction position indicating portions 83b and 85b in an L shape, the first position indicating pattern 80a and the first position indicating pattern 80a are supported. By arranging the position indicating pattern 80 symmetrically (point-symmetric) with each other, the area for forming the position indicating pattern 80 can be made more compact.
[0063]
In addition, this invention is not limited to the above-mentioned embodiment, It is also possible to add various design changes etc. as needed.
[0064]
For example, the coupling state of the X direction position indicating units 83a and 85a and the Y direction position indicating units 83b and 85b is not limited to the L shape, but a T shape (reverse T) as shown in FIG. (Including a letter shape), a cross shape as shown in FIG. 7B, and other shapes as required. It is also possible to provide the glass substrate 65 with the X-direction position instruction section and the Y-direction position instruction section of each position instruction pattern 80 separated as shown in FIG.
[0065]
Further, the interval between the first position indicating pattern 80a and the second position indicating pattern 80b corresponding to each other can be set to an arbitrary distance. Further, the symmetry of the first position indicating pattern 80a and the second position indicating pattern 80b corresponding to each other is not limited to point symmetry, but may be line symmetry as shown in FIG. Is included.
[0066]
Further, not only a plurality of combinations 90 of the position instruction patterns 80 constituted by the first position instruction pattern 80a and the second position instruction pattern 80b are provided along the X direction, Each of the combinations 90 can be provided along the Y direction (see FIG. 9). Further, each of the plurality of combinations 90 can be provided not only in the X direction and the Y direction but also in various directions. Even in such a case, the positional relationship between these combinations 90 suggests the relative position (θ) in the rotational direction between the first BM element 70a and the second BM element 70b. When each of such a plurality of combinations 90 is provided along the X direction or the Y direction, the relative position (θ) in the rotational direction between the first BM element 70a and the second BM element 70b is set. It can be obtained relatively easily.
[0067]
Further, the number of BM elements 70 formed on one glass substrate 65 is not limited to four. Further, the exposure (exposure process) for one glass substrate 65 is not limited to two shots. If a plurality of BM elements are formed on a single substrate by a plurality of shot exposures (exposure process), the exposure method according to the present invention can be suitably applied.
[0068]
Further, the above description is made with respect to the BM element which is the first layer of the RGB color filter, but the present invention is intended for all optical elements. Therefore, the object of the present invention is not only when the BM element of the color filter is formed, but also when the optical element is patterned by the divided exposure method at the time of forming the first layer in the photolithography process of the plasma display or TFT display, for example. Items related to the measurement of positional accuracy between patterns can also be included.
[0069]
【The invention's effect】
As described above, according to the exposure method of the present invention, it is a substrate on which a plurality of optical elements are formed by exposure of a plurality of shots, and the positional relationship between the optical elements can be obtained accurately and stably. Such an optical element forming substrate can be provided.
[0070]
Further, according to the optical element forming substrate of the present invention, since a plurality of optical elements and position indicating patterns corresponding to the respective optical elements are formed on the optical element forming substrate, based on the distance between the position indicating patterns. The positional relationship between the optical elements can be obtained with high accuracy.
[Brief description of the drawings]
FIG. 1 is a diagram showing an outline of the overall configuration of a black matrix layer forming processing line constituting a color filter manufacturing line.
FIG. 2 is a block diagram showing an outline of an exposure apparatus.
FIG. 3 is a view showing an outline of a mask of an exposure apparatus.
FIG. 4 is a view showing a glass substrate having a BM element forming region and a position indicating pattern forming region.
FIG. 5 is a configuration diagram showing an outline of an inspection mechanism.
FIG. 6 is a flowchart showing an exposure method for a glass substrate with a photosensitive material.
FIGS. 7A and 7B are diagrams showing a modification example of the position instruction pattern, in which FIG. 7A shows a first modification example, FIG. 7B shows a second modification example, and FIG. 7C shows a third modification example; Indicates.
FIG. 8 is a diagram showing a modified example of a combination of a first position instruction pattern and a second position instruction pattern.
FIG. 9 is a view showing a modified example of a glass substrate having a BM element forming region and a position indicating pattern forming region.
FIG. 10 is a schematic view showing a conventional optical element forming substrate.
[Explanation of symbols]
1 Color filter production line
7 Core device
9 BM element formation processing line
11 Cleaning mechanism
13 Photosensitive material coating device
15 Photosensitive material drying device
17 Exposure equipment
19 Developer
21 Inspection mechanism
23 Oven mechanism
27 Light source
29 Mask
41 BM element formation light transmission part
43 Position Indication Pattern Forming Light Transmitting Section
49 Image acquisition mechanism
51 Image processing apparatus
65 glass substrate
70 BM element
71 BM element formation region
80 Position indication pattern
81 Position indicating pattern forming area

Claims (4)

A plurality of optical elements and a position indication pattern corresponding to each optical element are obtained by performing multiple exposures through a single mask on a substrate with a photosensitive material arranged at a predetermined exposure position. An exposure method to be formed
Moving the substrate with the photosensitive material in a state where a single mask is fixed and placing it at the first exposure position;
The substrate with the photosensitive material arranged at the first exposure position is exposed through the mask , and the first optical element, the first X-direction position indicator extending in the Y direction, and the first Y-direction position indicator extending in the X direction A first exposure step of forming a first position indication pattern having a portion and a first position indication pattern disposed at a predetermined position with respect to the first optical element;
Moving the substrate with the photosensitive material on which the first optical element and the first position indicating pattern are formed in a state where a single mask is fixed, and placing the substrate at the second exposure position;
The substrate with the photosensitive material arranged at the second exposure position is exposed through the mask , and the second optical element, the second X-direction position indicator extending in the Y direction, and the second Y-direction position extending in the X direction A second position indicating pattern having a pointing portion, wherein the second position indicating pattern is disposed at a predetermined position with respect to the second optical element so as to correspond to the first position indicating pattern. 2 exposure processes,
The distance between the first X direction position indicating unit and the second X direction position indicating unit indicates a relative position in the X direction between the first optical element and the second optical element, and the first Y direction position indicating unit and the second Y direction position. the distance between the indication unit indicates the relative position in the Y direction between the first optical element and second optical element,
The mask corresponds to the optical element forming light transmitting portion corresponding to each optical element, the first position indicating pattern forming light transmitting portion corresponding to the first position indicating pattern, the first position indicating pattern and the first position indicating pattern. A second position indicating pattern forming light transmitting portion provided to be point symmetric with respect to the position indicating pattern forming light transmitting portion;
The first position indication pattern formed by exposing the substrate with the photosensitive material through the mask and the second position indication pattern corresponding to the first position indication pattern are point-symmetric to each other. exposure method characterized in that it is disposed. The first position indicating pattern is formed on the substrate in a state where the first X direction position indicating unit and the first Y direction position indicating unit are coupled,
2. The exposure method according to claim 1, wherein the second position instruction pattern is formed on the substrate in a state where the second X-direction position instruction section and the second Y-direction position instruction section are combined. The first position instruction pattern is formed on the substrate in a state where the first X direction position instruction section and the first Y direction position instruction section are combined in an L shape,
3. The exposure method according to claim 2, wherein the second position instruction pattern is formed on the substrate in a state where the second X-direction position instruction section and the second Y-direction position instruction section are combined in an L shape. In the first exposure step, a plurality of first position indication patterns are formed on the substrate, and in the second exposure step, the second position indication pattern is made to correspond to each first position indication pattern on the substrate. the exposure method according to any one of claims 1 to 3, characterized in that a plurality of forming.

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