JP4369522B1 - Substrate transport apparatus and substrate transport method - Google Patents

Abstract

A substrate transport apparatus and a substrate transport method capable of appropriately bonding a semiconductor die or the like to a substrate are provided.
A direction perpendicular to the conveyance direction A along an upper claw member 40, a lower claw member 50, and a bonding stage 2 on an X-axis table 30 movable in the conveyance direction A by driving by an X-axis moving device 20. And a driving device 70 for moving the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 up and down. When bonding to the substrate F, when the substrate F is pressed against the bonding stage 2 by the substrate pressing member 60 in a state where the substrate F is sandwiched between the upper nail member 40 and the lower nail member 50, While releasing the sandwiching of the substrate F by the upper nail member 40 and the lower nail member 50, the substrate pressing member 60 is greatly raised and when the substrate F is transported, the substrate F is sandwiched by the upper nail member 40 and the lower nail member 50. In this state, the substrate pressing member 60 is slightly raised.
[Selection] Figure 2

Description

  The present invention relates to a substrate transfer apparatus and a substrate transfer method for transferring a substrate to be bonded in a transfer direction.

Conventionally, a substrate transport device mounted on a bonding apparatus is provided with an upper claw member and a lower claw member that sandwich a substrate to be bonded from above and below, and by sandwiching the substrate with the upper claw member and the lower claw member, The substrate is taken out from the loader and transported to the bonding stage. After the semiconductor die is bonded to the substrate on the bonding stage, the substrate is transported and stored in the unloader (see, for example, Patent Documents 1 to 3).
Patent No. 3768472 Japanese Patent No. 3967648 US Pat. No. 6,783,552

  However, in general, in the bonding apparatus, when the substrate is transported to the bonding stage, the substrate is heated to about 50 ° C. by a heater or the like in order to facilitate the bonding of the semiconductor die to the substrate. For this reason, when the substrate is transported to the bonding stage, the substrate is bent and warped by the heat of the heater, so that there is a problem that the semiconductor die cannot be bonded to the substrate appropriately.

  Therefore, an object of the present invention is to provide a substrate transport apparatus and a substrate transport method that can appropriately bond a semiconductor die or the like to a substrate.

A substrate transport apparatus according to the present invention is a substrate transport apparatus that transports a substrate to be bonded on a bonding stage in a transport direction, and includes an upper claw member and a lower claw member that sandwich the substrate from above and below, and a substrate that is a bonding stage. A substrate pressing member that is pressed against the upper claw member, a moving device that integrally moves the upper claw member, the lower claw member, and the substrate pressing member in the transport direction, and a drive device that moves the upper claw member, the lower claw member, and the substrate pressing member up and down. Including .

According to the substrate transfer apparatus according to the present invention, sandwiching the substrate by driving the upper claw member and lower claw member by the drive unit from the upper and lower surfaces, the upper claw member and lower claw member is moved in the conveying direction by the moving device The substrate can be transported in the transport direction, and the substrate pressing member is driven by the driving device to press the substrate against the bonding stage, whereby the substrate bent by heat or the like can be corrected into a flat plate shape. The moving device integrally moves the upper claw member, the lower claw member, and the substrate pressing member in the transport direction, so that the position of the substrate pressed by the substrate pressing member becomes constant regardless of the substrate transport position. A semiconductor die or the like can be stably bonded to the substrate.

In this case, the drive device includes a vertical movement cam that moves the upper claw member, the lower claw member, and the substrate pressing member up and down, and a single rotational drive source that rotates the vertical movement cam. , upper claw member and lower claw member so that movement of the upper finger member and lower claw member to the first pawl member position sandwiching the substrate and the substrate pressed against the first substrate pressing member position the substrate pressing member presses the substrate to the bonding stage The first rotation angle range in which the member is moved, and the upper claw member and the lower claw member are moved to the second claw member position where the substrate is not sandwiched between the upper claw member and the lower claw member, and the substrate pressing member moves the substrate to the bonding stage. A second rotation angle range in which the substrate pressing member is moved to a position where the second substrate pressing member is not pressed against, and an upper claw member and a lower claw member are moved to the first claw member position, and the first substrate pressing member position is 2 substrate pressing And a third third rotational angle range for moving the substrate pressing member to the substrate pressing member position between the timber position.

According to this board conveying device, the upper claw member, the lower claw member, and the board pressing member are driven by a single rotational drive source by using the vertical movement cam that moves the upper claw member, the lower claw member, and the board pressing member up and down. Can be moved up and down independently. In addition, by using the vertical movement cam having the first rotation angle range, the second rotation angle range, and the third rotation angle range, the upper claw member, the lower claw member, and the substrate pressing member can be moved by a single rotation drive source. Therefore, the positional relationship between the upper claw member, the lower claw member, and the substrate pressing member can be changed in accordance with the conveyance or bonding of the substrate.

Then, the rotational drive source, when bonded to the substrate is performed, it is preferable to rotate the vertical movement cam to the first rotation angle range. According to this substrate transport apparatus, when bonding is performed on the substrate, the substrate is sandwiched between the upper claw member and the lower claw member by rotating the vertical movement cam to the first rotation angle, and the substrate pressing member Is pressed against the bonding stage, the bent substrate can be corrected into a flat plate shape, and a semiconductor die or the like can be appropriately bonded to the substrate.

Further, when the substrate is held by the upper claw member and the lower claw member , after the vertical movement cam is rotated to the second rotation angle range by the rotation drive source , the upper claw member, the lower claw member, and the substrate pressing member are moved by the moving device. It is preferable that the vertical movement cam is rotated to the first rotation angle range by the rotation drive source by moving the movement integrally . According to this substrate transport apparatus, when the substrate is gripped by the upper nail member and the lower nail member, the substrate is held between the upper nail member and the lower nail member by rotating the vertical movement cam to the second rotation angle range. After releasing the substrate pressing member from the substrate pressing stage by the substrate pressing member , the upper claw member, the lower claw member and the substrate pressing member are moved together, and then the substrate is sandwiched between the upper claw member and the lower claw member. At the same time, since the substrate is pressed by the substrate pressing member , the upper nail member, the lower nail member and the substrate pressing member can be held by the upper nail member and the lower nail member without interfering with the substrate.

  Moreover, when the said rotation drive source conveys a board | substrate by an upper nail | claw member and a lower nail | claw member, it is preferable to rotate a vertical motion cam to the 3rd rotation angle range. According to this substrate transport apparatus, when the substrate is transported by the upper nail member and the lower nail member, the substrate is sandwiched between the upper nail member and the lower nail member by rotating the vertical movement cam to the third rotation angle range. In this state, the pressing of the substrate to the bonding stage by the substrate pressing member can be released. Thereby, since the contact resistance between the substrate and the bonding stage is reduced, it is possible to reduce the rubbing of the substrate due to the contact with the bonding stage when the substrate is transported. Moreover, in this case, the movement distance of the substrate pressing member can be shortened by moving the substrate pressing member to the third substrate pressing member position between the first substrate pressing member position and the second substrate pressing member position. Therefore, the substrate can be transported quickly.

Further, an auxiliary substrate pressing member is disposed in front of the substrate pressing member in the conveying direction and moves up and down to press the substrate against the bonding stage, and the driving device moves the auxiliary substrate pressing member up and down in synchronization with the substrate pressing member. It is preferable. Immediately after the bonding, the bending of the substrate due to heat or the like is not sufficiently restored, and the bonding strength between the semiconductor die and the substrate is weak. For this reason, the substrate at the bonded position can be corrected into a flat plate shape by pressing the substrate against the bonding stage by the auxiliary substrate pressing member in front of the substrate pressing member in the conveying direction. From the substrate of the bonded semiconductor die Peeling can be suppressed.

A substrate transport method according to the present invention is a substrate transport method for transporting a substrate to be bonded on a bonding stage in a transport direction, and is moved up and down with a bonding stage for bonding to a substrate transported in the transport direction. The upper claw member and the lower claw member that sandwich the substrate from the upper and lower surfaces, the substrate pressing member that moves up and down to press the substrate against the bonding stage, and the upper claw member, the lower claw member, and the substrate pressing member are moved together in the transport direction. A step of preparing a substrate transfer device having a moving device and a driving device for moving the upper and lower claw members, the lower claw member, and the substrate pressing member up and down; and when the substrate is bonded, the driving device sandwiches the substrate. the first pawl member position by moving the upper claw member and lower claw member, the substrate on the first substrate pressing member position for pressing the substrate to the bonding stage A bonding operation step of moving the biasing member, when changing grasp the substrate with upper claw member and lower claw member, the driving device moves the upper claw member and lower claw member to the second pawl member position not caught a substrate, And the substrate pressing member is moved to the second substrate pressing member position where the substrate is not pressed against the bonding stage, and then the upper claw member, the lower claw member and the substrate pressing member are moved together by the moving device, by the drive unit, the first pawl member position by moving the upper claw member and lower claw member, and the operation steps dimensional worlds Before moving the substrate pressing member on the first substrate pressing member position, by upper claw member and lower claw member during the transport of the substrate, by a driving device, the first pawl member position by moving the upper claw member and lower claw member, and the third substrate between the first substrate pressing member position and a second substrate pressing member position A conveying step of moving the substrate pressing member the biasing member position,
including.

According to the substrate transport method of the present invention, when bonding to the substrate, the substrate is sandwiched between the upper nail member and the lower nail member and the substrate is pressed against the bonding stage by the substrate pressing member in the bonding preparation operation step. Since the bent substrate can be corrected into a flat plate shape, a semiconductor die or the like can be appropriately bonded to the substrate. Also, when changing grasp the substrate with upper claw member and lower claw members, the switching operation step, thereby releasing the pinching of the substrate by the upper claw member and lower claw members, the pressing of the bonding stage of the substrate by the substrate pressing member After the release , the upper nail member, the lower nail member and the board pressing member are moved together, and then the upper nail member and the lower nail member are sandwiched between the upper nail member and the lower nail member. The claw member and the substrate pressing member can be held by the upper claw member and the lower claw member without interfering with the substrate. Further, when the substrate is transported by the upper nail member and the lower nail member, the substrate is sandwiched by the upper nail member and the lower nail member and the pressing of the substrate to the bonding stage by the substrate pressing member is released by the transport step. Can do. Thereby, since the contact resistance between the substrate and the bonding stage is reduced, when the substrate is transported, the substrate can be transported while reducing the friction of the substrate due to the contact with the bonding stage. Moreover, in this case, the movement distance of the substrate pressing member can be shortened by moving the substrate pressing member to the third substrate pressing member position between the first substrate pressing member position and the second substrate pressing member position. Therefore, the substrate can be transported quickly.

  According to the present invention, a semiconductor die or the like can be appropriately bonded to a substrate.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a substrate carrying apparatus and a substrate carrying method according to the present invention will be described in detail with reference to the drawings. The substrate transfer apparatus according to this embodiment is applied to a bonding apparatus that bonds a semiconductor die to a substrate. In the drawings, the same or corresponding parts are denoted by the same reference numerals.

[First Embodiment]
FIG. 1 is a view showing a part of a bonding apparatus equipped with the substrate transfer apparatus according to the first embodiment, and FIG. 2 is a view showing the substrate transfer apparatus shown in FIG.

  As shown in FIG. 1, the bonding apparatus 1 bonds a semiconductor die to a substrate F transported to a bonding stage 2. The substrate transport device 10 mounted on the bonding apparatus 1 transports the substrate F supplied from a loader side magazine (not shown) to the bonding stage 2, and after the semiconductor die is bonded to the substrate at the bonding stage, The substrate is transferred and stored in an unloader side magazine (not shown). In the present embodiment, the direction in which the substrate F is transported by the substrate transport apparatus 10 is defined as a transport direction A.

  First, the substrate F transported by the substrate transport apparatuses 10a and 10b will be described. FIG. 3 is a diagram showing the configuration of the substrate F. As shown in FIG. As shown in FIG. 3, the substrate F is a thin lead frame formed in a long rectangular sheet shape, and is formed of a glass epoxy resin. The substrate F is formed with a bonding region b to which a semiconductor die is bonded, and the plurality of bonding regions b collectively constitute one block B. In FIG. 3, 12 (4 rows × 4 columns) bonding regions b are configured as one block B. On the substrate F, a plurality of blocks B are aligned along the longitudinal direction, and are arranged at equal intervals with a predetermined space S therebetween.

  As shown in FIGS. 1 and 2, in the bonding apparatus 1, a pair of rails 3 a and 3 b serving as a transport path for the substrate F extend along the transport direction A. The pair of rails 3a and 3b are disposed substantially the same as or slightly wider than the width of the substrate F, and are formed in a U-shape in which the recesses face each other in order to support both ends of the substrate F in the width direction. ing. The substrate F is placed on the inner lower surfaces of the rails 3a and 3b, and the movement in the width direction is restricted on the inner side surfaces of the rails 3a and 3b, and is transported in the transport direction A.

  The bonding stage 2 is arranged between the pair of rails 3a and 3b and spaced apart from the rails 3a and 3b by a predetermined distance, and the upper surface thereof is installed at the same height as the inner lower surface of the rails 3a and 3b. Has been. The bonding stage 2 has a plurality of suction ports (not shown). When bonding a semiconductor die to the substrate F, these suction ports are brought into a vacuum state (generating suction force), The conveyed substrate F is attracted to the bonding stage 2. A heater (not shown) for heating the substrate F to about 50 ° C. is provided below the bonding stage 2 so that the semiconductor die can be easily bonded to the substrate F.

  The bonding apparatus 1 is equipped with a substrate transfer device 10 for transferring the substrate F. The substrate transport apparatus 10 transports the substrate F in the transport direction A by moving in the transport direction A. In the present embodiment, two substrate transfer apparatuses 10 a and 10 b arranged along the transfer direction A (in series) are mounted on the bonding apparatus 1. Note that two substrate transfer apparatuses 10a and 10b are mounted (in series) along the transfer direction A in order to shorten the bonding processing time. However, since both have the same configuration, only one may be used. Three or more may be sufficient. For this reason, in the following description, unless otherwise specified, the substrate transfer device 10a and the substrate transfer device 10b will be collectively described as the substrate transfer device 10 without being separated.

  The substrate transport apparatus 10 has an X-axis table 30 that can be moved in the transport direction A by driving by the X-axis moving device 20 on the opposite side of the bonding stage 2 with respect to the rail 3a (upper side of the rail 3a in FIG. Is provided.

  The X-axis moving device 20 includes a motor 21 fixed to the bonding device 1, a ball screw 22 connected to the output shaft of the motor 21 and extending in the conveying direction A, and an X-axis table 30 fixed to the ball screw 22. It is comprised by the ball spline 23 used as a bearing. The movement of the X-axis table 30 in the transport direction A is performed by the ball spline 23 moving in the transport direction A due to the rotation of the ball screw 22 accompanying the rotational drive of the motor 21. The motor 21 is configured by a stepping motor or the like, and is a motor that can finely adjust the rotation angle, the number of rotations, and the like.

  FIG. 4 is a side view showing the configuration of the upper claw member and the lower claw member. As shown in FIGS. 1, 2, and 4, the upper claw member 40 is attached to the X-axis table 30 so as to be vertically movable, and presses the substrate F from the upper surface. Therefore, the upper claw member 40 includes an arm portion 41 that is moved up and down by the driving device 70 and an upper claw portion 42 that is attached to the tip of the arm portion 41 and presses the substrate F.

  The arm portion 41 extends over the rail 3a from above and extends in a direction perpendicular to the transport direction A. One end portion of the arm portion 41 extends to the driving device 70, and the other end portion is the rail of the substrate F to be transported. It extends to the end on the 3a side. A roller 43 that is pivotally supported on a shaft facing the transport direction A is rotatably attached to one end of the arm portion 41. The arm portion 41 is inserted with a linear motion guide 31 erected in the vertical direction on the X-axis table 30, and can move up and down along the linear motion guide 31.

  The upper claw portion 42 is fixed to the other end portion of the arm portion 41 and is formed in an elongated plate shape extending in the transport direction A. And the upper nail | claw part 42 presses the rail 3a side edge part of the board | substrate F from the upper surface in the lower surface, when the arm part 41 descend | falls along the guide 31 for linear motion.

  The lower claw member 50 is attached to the X-axis table 30 so as to be movable up and down, and presses the substrate F from the lower surface. For this reason, the lower claw member 50 includes an arm portion 51 that is moved up and down by the drive device 70 and a lower claw portion 52 that is attached to the tip of the arm portion 51 and presses the substrate F.

  The arm 51 extends from the lower side in the direction perpendicular to the transport direction A across the rail 3a, and its one end extends to the driving device 70 and the other end thereof is the rail of the substrate F to be transported. It extends to the end on the 3a side. A roller 53 that is pivotally supported by a shaft facing the transport direction A is rotatably attached to one end of the arm portion 51. The arm portion 51 is inserted with a linear motion guide 32 erected in the vertical direction on the X-axis table 30, and can move up and down along the linear motion guide 32.

  The lower claw portion 52 is fixed to the other end portion of the arm portion 51 and is formed in an elongated plate shape extending in the transport direction A. And the lower nail | claw part 52 presses the rail 3a side edge part of the board | substrate F from the lower surface on the upper surface, when the arm part 51 raises along the guide 31 for linear motion.

  FIG. 5 is a side view showing the configuration of the substrate pressing member. As shown in FIGS. 1, 2, and 5, the substrate pressing member 60 is attached to the X-axis table 30 so as to be movable up and down, and presses the substrate F against the bonding stage 2. For this reason, the substrate pressing member 60 includes an arm portion 61 that is moved up and down by the driving device 70 and a pair of pressing portions 62a and 62b that are attached to the tip of the arm portion 61 and press the substrate F against the bonding stage 2. It is configured.

  The arm portion 61 extends over the rail 3a from above and extends in a direction perpendicular to the transport direction A. One end portion of the arm portion 61 extends to the driving device 70, and the other end portion is the rail of the substrate F to be transported. It extends to the end on the 3a side. A roller 63 that is pivotally supported on a shaft facing the transport direction A is rotatably attached to one end of the arm portion 61. Further, the arm portion 61 is bifurcated from one end portion to the other end portion in the central portion, and the branched end portion has a branch width up to the interval of the blocks B formed on the substrate F. It has been spread. For this reason, a pair of other end parts branched in the arm part 61 are arrange | positioned in the position corresponding to a pair of space S arrange | positioned at both sides in the conveyance direction A of one block B. The arm portion 61 is inserted with linear motion guides 33a and 33b standing vertically in the X-axis table 30 at the center portion bifurcated, and is vertically moved along the linear motion guides 33a and 33b. It is possible to move.

  The pressing portions 62 a and 62 b are fixed to the other ends of the arm portions 61, respectively, and are formed in an elongated plate shape that extends in the direction perpendicular to the transport direction A along the bonding stage 2. Then, the pressing portions 62a and 62b move the substrate F along the direction perpendicular to the transport direction A on the lower surface thereof when the arm portion 61 moves down along the linear motion guides 33a and 33b. Press on.

  As shown in FIGS. 1, 2, 4, and 5, the driving device 70 is fixed to the X-axis table 30 to move the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 up and down. The motor 71 includes a cam shaft 72 that is connected to the output shaft of the motor 71 and extends in the transport direction A, and vertical movement cams 73 to 75 that are fitted into the cam shaft 72.

  The motor 71 is configured by a stepping motor or the like, similar to the motor 21 of the X-axis moving device 20, and is a motor capable of finely adjusting the rotation angle, the rotation speed, and the like.

  The camshaft 72 is a shaft into which the vertically moving cams 73 to 75 are fitted, and these vertically moving cams 73 to 75 are rotated integrally (synchronously).

  The vertical movement cam 73 is disposed at a position corresponding to the roller 43 of the upper claw member 40, and moves the upper claw member 40 up and down by its rotation. The roller 43 is urged against the vertical movement cam 73 by an urging means (not shown).

  The vertical movement cam 74 is disposed at a position corresponding to the roller 53 of the lower claw member 50, and moves the lower claw member 50 up and down by its rotation. The roller 53 is urged to the vertical movement cam 74 by an urging means (not shown).

  The vertical movement cam 75 is disposed at a position corresponding to each of the rollers 63 of the substrate pressing member 60, and moves the substrate pressing member 60 up and down by its rotation. The roller 63 is urged to the vertical movement cam 75 by an urging means (not shown).

  FIG. 6 is a cam curve diagram showing the shape of the vertical motion cam with respect to the rotation angle of the vertical motion cam. FIG. 6A is a cam curve diagram of the vertical motion cam that moves the substrate pressing member up and down. ) Is a cam curve diagram of a vertically moving cam for moving the upper claw member up and down, and FIG. 6C shows a cam curve diagram of a vertically moving cam for moving the lower claw member up and down. In FIG. 6, the height of the vertically moving cams 73 and 74 when the substrate F is sandwiched (that is, the height of the upper claw member 40 and the lower claw member 50) is set to 0 mm, and the substrate F is pressed against the bonding stage 2. The height of the vertical movement cam 75 (that is, the height of the substrate pressing member 60) is set to 0 mm. When the rotation angle of the cam shaft 72 is θ, the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 move up and down as follows by the rotation of the vertical movement cams 73 to 75.

  As shown in FIG. 6B, when the rotation angle θ of the vertical movement cam 73 is 0 °, the height of the upper claw member 40 is the second upper claw member position of 2.2 mm. Then, when the rotation angle θ is 0 ° to 30 °, the height of the upper claw member 40 is maintained at the second upper claw member position of 2.2 mm, and when the rotation angle θ is 30 ° to 90 °, the upper claw member 40 is maintained. Is lowered from 2.2 mm to 0 mm to become the first upper claw member position, and the upper claw member 40 is maintained at the first upper claw member position where the height of the upper claw member 40 is 0 mm from 90 ° to 180 °. Thus, the height of the upper claw member 40 is lowered from 0 mm to -0.1 mm when the rotation angle θ is 180 ° to 200 °, and the height of the upper claw member 40 is changed from 200 ° to 260 °. Decreases from −0.1 mm to −0.6 mm, the rotation angle θ increases from 260 ° to 330 °, the height of the upper claw member 40 increases from −0.6 mm to 2.2 mm, and the second upper claw member Returning to the position, when the rotation angle θ is 330 ° to 360 °, the height is 2. It is maintained at the second upper claw member position in mm.

  As shown in FIG. 6C, when the rotation angle θ of the vertical cam 74 is 0 °, the lower claw member 50 is at the second lower claw member position where the height of the lower claw member 50 is −1.3 mm. Then, when the rotation angle θ is from 0 ° to 60 °, the height of the lower claw member 50 is increased from −1.3 mm to 0 mm to become the first lower claw member position, and the rotation angle θ is from 60 ° to 180 °, The height of the lower claw member 50 is maintained at the first lower claw member position of 0 mm, the rotation angle θ is lowered from 180 ° to 200 °, and the height of the lower claw member 50 is lowered from 0 mm to −0.1 mm. When the rotation angle θ is 200 ° to 360 °, the height of the lower claw member 50 is lowered from −0.1 mm to −1.3 mm and returned to the second lower claw member position.

  As shown in FIG. 6A, when the rotation angle θ of the vertical movement cam 75 is 0 °, the height of the substrate pressing member 60 is the second substrate pressing member position of 6 mm. The substrate pressing member 60 is maintained at the second substrate pressing member position where the rotation angle θ is 0 ° to 30 °, and the height of the substrate pressing member 60 is increased when the rotation angle θ is 30 ° to 135 °. Is lowered to 0 mm to become the first substrate pressing member position, and the rotation angle θ is maintained at the first substrate pressing member position where the height of the substrate pressing member 60 is 0 mm from 135 ° to 260 °. From 260 ° to 330 °, the height of the substrate pressing member 60 increases from 0 mm to 6 mm and returns to the second substrate pressing member position, and the height of the substrate pressing member 60 increases from the rotation angle θ to 330 ° to 360 °. Is maintained at the second substrate pressing member position of 6 mm. When the rotation angle θ is in the range of 30 ° to 135 °, the height of the substrate pressing member 60 is the third substrate pressing member position between the first substrate pressing member position and the second substrate pressing member position.

  Next, the operation of the substrate transfer apparatus 10 will be described with reference to FIG. FIG. 7 is a flowchart for explaining the operation of the substrate transfer apparatus.

  As shown in FIG. 7, the substrate transport apparatus 10 first performs a substrate acquisition operation to obtain the substrate F supplied to the transport path constituted by the rails 3 a and 3 b (Step S <b> 1). FIG. 8 is a diagram for explaining the substrate acquisition operation of the substrate transfer apparatus. As shown in FIG. 8, first, in the substrate acquisition operation, the motor 71 of the driving device 70 is rotationally driven to rotate the rotation angle θ of the camshaft 72 to 0 ° (see FIG. 8A). At this time, the upper claw member 40 is at the second upper claw member position, the lower claw member 50 is at the second lower claw member position, and the substrate pressing member 60 is at the second substrate pressing member position. Then, the motor 21 of the X-axis moving device 20 is rotationally driven so that the pressing portions 62a and 62b of the substrate pressing member 60 correspond to the positions corresponding to the spaces S arranged forward and backward in the transport direction A of the block B to be bonded. The X-axis table 30 is moved until it becomes. At this time, since the substrate F is heated to about 50 ° C. by the heater installed below the bonding stage 2, the substrate F is bent and is bent in a convex shape. Thereafter, the motor 71 of the driving device 70 is driven to rotate, and the rotation angle θ of the camshaft 72 is rotated to 135 °. Then, when the rotation angle θ is 0 ° to 60 °, first, the lower claw member 50 is raised to the first lower claw member position, the upper claw member 40 is lowered, and the substrate pressing member 60 is lowered (FIG. 8 ( b)). Then, when the rotation angle θ is 60 ° to 90 °, the upper claw member 40 is lowered to the first upper claw member position, and the substrate pressing member 60 is lowered (see FIG. 8C). Thereby, although the board | substrate F is inserted | pinched from the up-and-down surface by the upper nail | claw member 40 and the lower claw member 50, the board | substrate F is not pressed to the bonding stage 2 by the board | substrate pressing member 60. FIG. Then, the substrate pressing member 60 descends within the range of the third substrate pressing member position when the rotation angle θ is 90 ° to 135 ° (see FIG. 8D). As a result, the substrate pressing member 60 gradually presses the substrate F against the bonding stage 2. When the rotation angle θ reaches 135 °, the substrate pressing member 60 becomes the first substrate pressing member position. Therefore, in addition to the substrate F being sandwiched between the upper claw member 40 and the lower claw member 50, the substrate pressing member 60 The substrate F is completely pressed against the bonding stage 2, and the bent substrate F is corrected into a flat plate shape (see FIG. 8E).

  Next, the substrate transport apparatus 10 performs a substrate transport operation for transporting the substrate F in the transport direction A (step S2). FIG. 9 is a diagram for explaining the substrate transfer operation of the substrate transfer apparatus. As shown in FIG. 8, in the substrate transfer operation, first, the motor 71 of the driving device 70 is rotationally driven to rotate the rotation angle θ of the camshaft 72 to any angle in the range of 90 ° to 135 ° ( (See FIGS. 9A and 9B). Then, in a state where the substrate F is sandwiched between the upper claw member 40 and the lower claw member 50, the substrate pressing member 60 slightly rises to the third substrate pressing member position. As a result, the pressing of the substrate F against the bonding stage 2 by the pressing portions 62a and 62b of the substrate pressing member 60 is alleviated, so that the flexure of the substrate F is slightly restored, and the space between the substrate F and the bonding stage 2 is reduced. A gap is created. Thereafter, the motor 21 of the X-axis moving device 20 is rotationally driven, and the X-axis table 30 is moved in the transport direction A until the bonding area b to be bonded becomes the bonding position. Thereafter, the motor 71 of the driving device 70 is rotationally driven to rotate the rotational angle θ of the camshaft 72 to 135 ° (see FIG. 9C). As a result, the substrate pressing member 60 completely presses the substrate F against the bonding stage 2, so that the bent substrate F is corrected into a flat plate shape.

  Next, the substrate transfer apparatus 10 stands by until the semiconductor die is bonded to the bonding region b of the substrate F by the bonding apparatus 1 (step S3).

  Then, when the semiconductor die is bonded to the predetermined bonding region b, the substrate transfer apparatus 10 determines whether or not the semiconductor die is bonded to all the bonding regions b in the block B (step S4).

  If the semiconductor die is not bonded to all the bonding regions b in the block B, the process returns to step S2 and the above operation is repeated.

  On the other hand, when the semiconductor die is bonded to all the bonding regions b in the block B, the substrate is changed from the position where the substrate is sandwiched between the upper claw member 40 and the lower claw member 50 to the position corresponding to the block B to be bonded next. A gripping operation is performed (step S5). FIG. 10 is a diagram for explaining the substrate holding operation of the substrate transfer apparatus. As shown in FIG. 10, in the substrate gripping operation, first, the motor 71 of the driving device 70 is rotationally driven, and the rotation angle θ of the camshaft 72 is changed from 135 ° to 0 ° (or from 135 ° to 30 ° to 0 °). Reverse rotation (° range). Then, when the rotation angle θ is 135 ° to 90 °, only the substrate pressing member 60 is raised from the first substrate pressing member position to the third substrate pressing member position (see FIGS. 10A and 10B). The pressing of the substrate F to the bonding stage 2 by the pressing member 60 is gradually eased. As the rotation angle θ increases from 90 ° to 60 °, the upper claw member 40 rises from the first upper claw member position, and the substrate pressing member 60 rises (see FIG. 10C). Accordingly, the sandwiching of the substrate F is released by the upper claw member 40 and the lower claw member 50, and the pressing of the substrate F on the bonding stage 2 by the substrate pressing member 60 is released. When the rotation angle θ is 60 ° to 0 ° (or from 60 ° to 30 ° to 0 °), the upper claw member 40 is raised, the lower claw member 50 is lowered from the first lower claw member position, and the substrate is pressed. The member 60 rises (see FIG. 10D). When the rotation angle θ reaches 0 °, the upper claw member 40 is at the second upper claw member position, the lower claw member 50 is at the second lower claw member position, and the substrate pressing member 60 is at the second substrate pressing member position. Become. Thereafter, the motor 21 of the X-axis moving device 20 is rotationally driven so that the pressing portions 62a and 62b of the substrate pressing member 60 sandwich the block B to be bonded next, and are arranged forward and backward in the transport direction A of the block B. The X-axis table 30 is moved until it reaches a position corresponding to the space S. Then, as described in step S1 and FIG. 8, the motor 71 of the driving device 70 is rotationally driven to rotate the rotational angle θ of the camshaft 72 to 135 °, and the upper claw member 40 and the lower claw member 50 The substrate F is sandwiched and the substrate F is pressed against the bonding stage 2 by the substrate pressing member 60 (see FIGS. 8A to 8E).

  Then, the substrate transfer apparatus 10 repeats the above operation until the semiconductor die is bonded to all the blocks B of the substrate F (step S6).

  Thus, according to the substrate transport apparatus 10 according to the present embodiment, the upper claw member 40 and the lower claw member 50 are driven by the driving device 70 to sandwich the substrate F from the upper and lower surfaces, and the upper claw is moved by the X-axis moving device 20. By moving the member 40 and the lower claw member 50 in the transport direction, the substrate F can be transported in the transport direction A. Further, the substrate pressing member 60 is driven by the driving device 70 to bring the substrate F into the bonding stage 2. By pressing, the substrate F bent by heat or the like can be corrected into a flat plate shape. The X-axis moving device 20 moves the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 together in the transport direction A, so that the position of the substrate F pressed by the substrate pressing member 60 is the substrate F. Therefore, the semiconductor die or the like can be stably bonded to the substrate F.

  Moreover, since the upper claw member 40, the lower claw member 50, and the board | substrate pressing member 60 can be moved up and down by the single motor 71, the number of parts of the board | substrate conveyance apparatus 10 can be reduced, and cost reduction is aimed at. Can do.

  And the upper nail member 40, the lower nail member 50, and board | substrate pressing are carried out by the single motor 71 by using the vertical motion cams 73-75 which move the upper nail member 40, the lower nail member 50, and the board | substrate pressing member 60 up and down. The member 60 can be moved up and down independently.

  In this case, by using the vertical motion cams 73 to 75 having the rotation angle range shown in FIG. 6, the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 are moved to three different positions by a single motor 71. The positional relationship between the upper claw member 40 and the lower claw member 50 and the substrate pressing member 60 can be changed according to the conveyance of the substrate F, bonding, and the like.

  When bonding is performed on the substrate F, the substrate is sandwiched between the upper claw member 40 and the lower claw member 50 by rotating the rotation angle θ of the vertical movement cams 73 to 75 to 135 °, and the substrate pressing member. Since the substrate F is pressed against the bonding stage 2 by 60, the bent substrate F can be corrected into a flat plate shape, and a semiconductor die or the like can be appropriately bonded to the substrate F.

Further, when the substrate F is to be grasped by the upper claw member 40 and the lower claw member 50, the upper claw member 40 is rotated by rotating the vertical movement cams 73 to 75 to 0 ° (or a range of 30 ° to 0 °). After the nipping of the substrate F by the lower claw member 50 is released and the pressing of the substrate F to the bonding stage 2 by the substrate pressing member 60 is released , the upper claw member 40, the lower claw member 50 and the substrate pressing member 60 are integrated. Then, the substrate F is sandwiched by the upper claw member 40 and the lower claw member 50 and the substrate F is pressed by the substrate pressing member 60. Therefore, the upper claw member 40, the lower claw member 50 and the substrate pressing member 60 are moved to the substrate F. The substrate F can be held by the upper claw member 40 and the lower claw member 50 without interfering with each other.

  Further, when the substrate F is transported by the upper claw member 40 and the lower claw member 50, the upper claw member 40 and the lower claw member 50 are rotated by rotating the vertical movement cams 73 to 75 in the range of 90 ° to 135 °. In a state where the substrate F is sandwiched, the pressing of the substrate F to the bonding stage 2 by the substrate pressing member 60 can be released. Thereby, since the contact resistance between the substrate F and the bonding stage 2 is reduced, it is possible to reduce rubbing of the substrate F due to the contact with the bonding stage 2 when the substrate F is transported. In addition, in this case, by moving the substrate pressing member 60 to the third substrate pressing member position between the first substrate pressing member position and the second substrate pressing member position, the movement distance of the substrate pressing member 60 is shortened. Therefore, the substrate F can be transported quickly.

[Second Embodiment]
Next, a substrate transfer apparatus according to the second embodiment will be described with reference to FIG.

  FIG. 11 is a diagram illustrating a substrate transfer apparatus according to the second embodiment. As shown in FIG. 11, the substrate transport apparatus 100 according to the second embodiment is basically the same as the substrate transport apparatus 10 according to the first embodiment. The substrate transport apparatus 100 is different from the substrate transport apparatus 10 only in that an auxiliary substrate pressing member 80 is added. For this reason, below, only the point which is different from 1st Embodiment is demonstrated, and other description is abbreviate | omitted.

  As shown in FIG. 11, in the substrate transport apparatus 100, an auxiliary substrate pressing member 80 is attached to the substrate pressing member 60. The auxiliary substrate pressing member 80 presses the bonded substrate F against the bonding stage 2. For this reason, the auxiliary board pressing member 80 includes an auxiliary arm portion 81 and an auxiliary pressing portion 82.

  One end of the auxiliary arm portion 81 is attached to the central portion of the arm portion 61 of the substrate pressing member 60 on the opposite side of the bonding stage 2 with respect to the rail 3a. The auxiliary arm portion 81 extends forward in the transport direction A from the arm portion 61 and is bent toward the rail 3a side. The auxiliary arm portion 81 further extends in the direction perpendicular to the transport direction A across the rail 3a from above, and the other end portion extends to the end portion on the rail 3a side of the substrate F to be transported. The other end portion of the auxiliary arm portion 81 is arranged in the conveying direction A so as to be separated from the pressing portion 62a by the length of one block B. For this reason, the other end portion of the auxiliary arm portion 81 corresponds to the position of the next space S in the transport direction A of the space S of the substrate F pressed by the pressing portion 62a. Since the auxiliary arm portion 81 is connected to the arm portion 61, it moves up and down as the arm portion 61 moves up and down.

  The auxiliary pressing portion 82 is fixed to the other end portion of the auxiliary arm portion 81 and is formed in an elongated plate shape extending in the direction perpendicular to the transport direction A along the bonding stage 2. Then, the auxiliary pressing unit 82 presses the substrate F against the bonding stage 2 along the direction perpendicular to the transport direction A on the lower surface thereof when the auxiliary arm unit 81 descends as the arm unit 61 descends. .

  In the substrate transport apparatus 100 configured as described above, when the substrate pressing member 60 is lowered by rotating the motor 71 of the driving device 70, the auxiliary substrate pressing member 80 is also lowered as the substrate pressing member 60 is lowered. To do. Then, as shown in FIG. 3, the auxiliary pressing portion 82 of the auxiliary substrate pressing member 80 presses the space S one forward in the transport direction A of the space S pressed by the pressing portion 62 a of the substrate pressing member 60. Therefore, the space S on both sides in the transport direction A of the bonded block B is pressed against the bonding stage 2 by the auxiliary pressing portion 82 of the pressing portion of the auxiliary substrate pressing member 80 and the pressing portion 62a of the substrate pressing member 60. The block B is corrected into a flat plate shape.

  Thus, according to the substrate transfer apparatus 100 according to the present embodiment, in addition to the above-described effects, the following effects are further obtained. That is, immediately after the semiconductor die is bonded to the substrate F, the bending of the substrate F due to heat or the like is not sufficiently restored, and the bonding strength between the semiconductor die and the substrate F is weak. Therefore, an auxiliary substrate pressing member 80 extending from the arm portion 61 in the substrate pressing member 60 in the transport direction A is provided, and the substrate F is pressed against the bonding stage 2 by the auxiliary substrate pressing member 80, whereby the semiconductor die is bonded to the block. B can be corrected into a flat plate shape, and peeling of the bonded semiconductor die from the substrate F can be suppressed.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. For example, in the above embodiment, the movement of the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 in the transport direction A is performed by moving the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 to the X-axis table 30. Although it has been described that this is performed by driving the X-axis table 30 with the X-axis moving device 20, the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 are integrally moved in the transport direction A. If it is possible, it may be moved by any configuration and means.

  In the above embodiment, the vertical movement of the upper claw member 40, the lower claw member 50, and the board pressing member 60 is performed at the positions corresponding to the upper claw member 40, the lower claw member 50, and the board pressing member 60. 75, and a single motor 71 rotates the vertical cams 73 to 75. However, the upper claw member 40, the lower claw member 50, and the substrate pressing member 60 are moved up and down independently. As long as it can be moved, it may be moved up and down by any configuration and means.

  Moreover, in the said embodiment, although the vertical motion cams 73-75 were demonstrated as what is the shape shown in FIG. 6, the shape which makes the upper nail member 40, the lower nail member 50, and the board | substrate pressing member 60 move up and down independently. Any shape can be used.

  In the above embodiment, the pressing unit 62 and the auxiliary pressing unit 82 have been described as extending in the direction perpendicular to the transport direction A along the bonding stage 2, but the substrate F is pressed against the bonding stage 2. Any shape / structure is possible as long as it is possible. For example, it may be a shape bent in an L shape along the bonding stage 2 or a square shape surrounding the periphery of one or a plurality of bonding regions b or one or a plurality of blocks B.

It is the figure which showed a part of bonding apparatus carrying the board | substrate conveyance apparatus which concerns on 1st Embodiment. It is the figure which showed the board | substrate conveyance apparatus shown in FIG. It is the figure which showed the structure of the board | substrate. It is a side view which shows the structure of an upper nail | claw member and a lower claw member. It is a side view which shows the structure of a board | substrate pressing member. It is a cam curve diagram showing the shape of the vertical motion cam with respect to the rotational position of the vertical motion cam, (a) is a cam curve diagram of the vertical motion cam that moves the substrate pressing member up and down, (b) is the vertical movement of the upper claw member A cam curve diagram of the vertically moving cam to be moved, (c) is a cam curve diagram of the vertically moving cam that vertically moves the lower claw member. It is a flowchart for demonstrating operation | movement of a board | substrate conveyance apparatus. It is a figure for demonstrating the board | substrate acquisition operation | movement of a board | substrate conveyance apparatus. It is a figure for demonstrating the board | substrate conveyance operation | movement of a board | substrate conveyance apparatus. It is a figure for demonstrating the board | substrate holding | gripping operation | movement of a board | substrate conveyance apparatus. It is the figure which showed the board | substrate conveyance apparatus which concerns on 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Bonding device, 2 ... Bonding stage, 3a, 3b ... Rail, 10, 10a, 10b ... Substrate conveyance device, 20 ... X axis movement device, 21 ... Motor, 22 ... Ball screw, 23 ... Ball spline, 30 ... X Shaft table 31, 32, 33a, 33b ... linear motion guide, 40 ... upper claw member, 41 ... arm part, 42 ... upper claw part, 43 ... roller, 50 ... lower claw member, 51 ... arm part, 52 ... lower Claw part, 53 ... roller, 60 ... substrate pressing member, 61 ... arm part, 62a, 62b ... pressing part, 63 ... roller, 70 ... drive device, 71 ... motor, 72 ... camshaft, 73-75 ... vertical motion cam , 80: Auxiliary substrate pressing member, 81: Auxiliary arm unit, 82: Auxiliary pressing unit, 100: Substrate transport device, A: Transport direction, B: Block, b: Bonding area, F: Substrate, S: Space θ ... angle of rotation.

Claims (7)

A substrate transfer apparatus for transferring a substrate to be bonded on a bonding stage in a transfer direction,
An upper claw member and a lower claw member that sandwich the substrate from the upper and lower surfaces;
A substrate pressing member that presses the substrate against the bonding stage;
A moving device that integrally moves the upper claw member, the lower claw member, and the substrate pressing member in the transport direction;
A driving device for moving the upper claw member, the lower claw member and the substrate pressing member up and down;
A substrate transfer device including: The drive device
A vertically moving cam for vertically moving the upper claw member, the lower claw member and the substrate pressing member;
A single rotational drive source for rotating the vertical cam;
Including
The vertical motion cam
Upper claw member and lower claw member so that movement of the upper finger member and lower claw member to the first pawl member position sandwiching the substrate and the substrate pressing member on the first substrate pressing member position the substrate pressing member presses the substrate to the bonding stage A first rotation angle range for moving
The upper claw member and the lower claw member are moved to the second claw member position where the substrate is not sandwiched by the upper claw member and the lower claw member, and the substrate pressing member does not press the substrate against the bonding stage. A second rotation angle range for moving the pressing member;
The upper claw member and the lower claw member are moved to the first claw member position, and the substrate pressing member is moved to the third substrate pressing member position between the first substrate pressing member position and the second substrate pressing member position. The substrate transfer apparatus according to claim 1, including a three rotation angle range. Rotary drive source, when bonded to the substrate is performed, rotating the vertical movement cam to the first rotation angle range, the substrate transport apparatus of claim 2. When the substrate is held by the upper and lower claw members, the upper and lower claw members, and the substrate pressing member are integrated by the moving device after rotating the vertical movement cam to the second rotation angle range by the rotation drive source. The substrate transfer apparatus according to claim 2, wherein the vertical movement cam is rotated to a first rotation angle range by a rotation drive source . Rotary drive source, when carrying substrate by upper claw member and lower claw member to rotate the vertical movement cam to the third rotational angle range, the substrate transport apparatus of claim 2. It further includes an auxiliary substrate pressing member that is disposed in front of the substrate pressing member in the transport direction and moves up and down to press the substrate against the bonding stage
Drive, the auxiliary substrate pressing member is moved up and down in synchronization with the substrate pressing member, the substrate transport apparatus of claim 1. A substrate carrying method for carrying a substrate to be bonded on a bonding stage in a carrying direction,
A bonding stage for bonding to a substrate conveyed in the conveying direction, an upper claw member and a lower claw member that move up and down to sandwich the substrate from the upper and lower surfaces, a substrate pressing member that moves up and down and presses the substrate against the bonding stage, A substrate transport device having a moving device that integrally moves an upper claw member, a lower claw member, and a substrate pressing member in a transport direction, and a drive device that moves the upper claw member, the lower claw member, and the substrate pressing member up and down is prepared. Steps,
When bonded to the substrate is performed by the drive unit, the first pawl member position sandwiching the substrate to move the upper claw member and lower claw member, the substrate pressing member on the first substrate pressing member position for pressing the substrate to the bonding stage A bonding operation step to move;
When changing grasp the substrate with upper claw member and lower claw member, the driving device moves the upper claw member and lower claw member to the second pawl member position not caught the substrate and the not pressed against the substrate to the bonding stage 2 Move the board pressing member to the board pressing member position , then move the upper claw member, the lower claw member and the board pressing member together by the moving device, and then move it to the first claw member position by the driving device. moving the upper claw member and lower claw member, and the operation steps dimensional worlds Before moving the substrate pressing member on the first substrate pressing member position,
During the transport of the substrate by upper claw member and lower claw member, by the drive unit, the first pawl member position by moving the upper claw member and lower claw member and the first substrate pressing member position and a second substrate pressing member A transport step for moving the substrate pressing member to a third substrate pressing member position between the positions;
A substrate transfer method including:

Images